JPH0226259U - - Google Patents

Info

Publication number
JPH0226259U
JPH0226259U JP10505688U JP10505688U JPH0226259U JP H0226259 U JPH0226259 U JP H0226259U JP 10505688 U JP10505688 U JP 10505688U JP 10505688 U JP10505688 U JP 10505688U JP H0226259 U JPH0226259 U JP H0226259U
Authority
JP
Japan
Prior art keywords
semiconductor element
element pellet
lid
pair
main electrode
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP10505688U
Other languages
Japanese (ja)
Other versions
JPH0617316Y2 (en
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1988105056U priority Critical patent/JPH0617316Y2/en
Publication of JPH0226259U publication Critical patent/JPH0226259U/ja
Application granted granted Critical
Publication of JPH0617316Y2 publication Critical patent/JPH0617316Y2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は実施例の断面図、第２図はこの考案の
対象となる半導体装置の等価回路図、第３図は第
２図のものの波形図、第４図は従来例の断面図で
ある。 １…樹脂、４…樹脂ケース、６…半導体素子ペ
レツト、８，１０，２１，２２…主電極板、Ｃ，
Ｅ…端子。 Fig. 1 is a cross-sectional view of the embodiment, Fig. 2 is an equivalent circuit diagram of a semiconductor device to which this invention is applied, Fig. 3 is a waveform diagram of the one shown in Fig. 2, and Fig. 4 is a cross-sectional view of a conventional example. . DESCRIPTION OF SYMBOLS 1... Resin, 4... Resin case, 6... Semiconductor element pellet, 8, 10, 21, 22... Main electrode plate, C,
E...Terminal.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 金属基板に固着された半導体素子ペレツトと、
この半導体素子ペレツトを取り囲む側壁と蓋体と
からなる樹脂ケースを備え、この樹脂ケース内で
前記半導体素子ペレツトに一対の外部引出用の主
電極板が一端にてそれぞれ接続され、他端はそれ
ぞれ前記蓋体を通つて外部に引き出されてなるも
のにおいて、前記一対の外部引出用の主電極板が
その間に絶縁板を介挿して互いに密着されると共
に、前記蓋体の外表面上にて各他端が反対方向に
折り曲げられていることを特徴とする半導体装置
。 A semiconductor element pellet fixed to a metal substrate,
A resin case including a side wall and a lid body surrounding the semiconductor element pellet is provided, and within this resin case, a pair of main electrode plates for external extraction are connected to the semiconductor element pellet at one end, and the other end is connected to the semiconductor element pellet, respectively. In the device that is drawn out to the outside through the lid, the pair of external lead-out main electrode plates are brought into close contact with each other with an insulating plate interposed therebetween, and each other is placed on the outer surface of the lid. A semiconductor device characterized in that its ends are bent in opposite directions.
JP1988105056U 1988-08-09 1988-08-09 Semiconductor device Expired - Lifetime JPH0617316Y2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (en) 1988-08-09 1988-08-09 Semiconductor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1988105056U JPH0617316Y2 (en) 1988-08-09 1988-08-09 Semiconductor device

Publications (2)

Publication Number Publication Date
JPH0226259U true JPH0226259U (en) 1990-02-21
JPH0617316Y2 JPH0617316Y2 (en) 1994-05-02

Family

ID=31337331

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1988105056U Expired - Lifetime JPH0617316Y2 (en) 1988-08-09 1988-08-09 Semiconductor device

Country Status (1)

Country Link
JP (1) JPH0617316Y2 (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393126A (en) * 1986-10-08 1988-04-23 Fuji Electric Co Ltd Semiconductor device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6393126A (en) * 1986-10-08 1988-04-23 Fuji Electric Co Ltd Semiconductor device

Also Published As

Publication number Publication date
JPH0617316Y2 (en) 1994-05-02

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