JPH0226252U - - Google Patents
Info
- Publication number
- JPH0226252U JPH0226252U JP1988103834U JP10383488U JPH0226252U JP H0226252 U JPH0226252 U JP H0226252U JP 1988103834 U JP1988103834 U JP 1988103834U JP 10383488 U JP10383488 U JP 10383488U JP H0226252 U JPH0226252 U JP H0226252U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- hole
- sealed
- sealing area
- sealing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103834U JPH0226252U (enExample) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1988103834U JPH0226252U (enExample) | 1988-08-04 | 1988-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226252U true JPH0226252U (enExample) | 1990-02-21 |
Family
ID=31335015
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1988103834U Pending JPH0226252U (enExample) | 1988-08-04 | 1988-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226252U (enExample) |
-
1988
- 1988-08-04 JP JP1988103834U patent/JPH0226252U/ja active Pending