JPH0226246U - - Google Patents
Info
- Publication number
- JPH0226246U JPH0226246U JP10425588U JP10425588U JPH0226246U JP H0226246 U JPH0226246 U JP H0226246U JP 10425588 U JP10425588 U JP 10425588U JP 10425588 U JP10425588 U JP 10425588U JP H0226246 U JPH0226246 U JP H0226246U
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- wafer transfer
- transfer device
- transfer plate
- coated
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000001681 protective effect Effects 0.000 claims 1
Landscapes
- Specific Conveyance Elements (AREA)
- Feeding Of Articles By Means Other Than Belts Or Rollers (AREA)
Description
第１図は、この考案の一実施例に係るウエハ搬
送装置のウエハ搬送板の部分の一例を示す斜視図
である。第２図は、第１図の線―に沿う拡大
断面図である。第３図は、従来のウエハ搬送装置
のウエハ搬送板の部分を示す斜視図である。
２……ウエハ、６……ウエハ搬送板、８……ウ
エハ支持部。
FIG. 1 is a perspective view showing an example of a wafer transfer plate portion of a wafer transfer apparatus according to an embodiment of the present invention. FIG. 2 is an enlarged sectional view taken along the line - in FIG. 1. FIG. 3 is a perspective view showing a wafer transfer plate portion of a conventional wafer transfer device. 2...Wafer, 6...Wafer transfer plate, 8...Wafer support section.
Claims (1)
、当該ウエハ搬送板の表面に、ウエハを局所的に
支持するウエハ支持部を複数設け、かつ少なくと
も各ウエハ支持部のウエハとの接触面を、搬送す
るウエハと同等以上の硬度を有する保護膜で被覆
したことを特徴とするウエハ搬送装置。 In a wafer transfer device having a wafer transfer plate, a plurality of wafer support parts for locally supporting the wafer are provided on the surface of the wafer transfer plate, and at least the contact surface of each wafer support part with the wafer is connected to the wafer to be transferred. A wafer transfer device characterized by being coated with a protective film having a hardness equal to or higher than that of the wafer transfer device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10425588U JPH0226246U (en) | 1988-08-05 | 1988-08-05 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10425588U JPH0226246U (en) | 1988-08-05 | 1988-08-05 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0226246U true JPH0226246U (en) | 1990-02-21 |
Family
ID=31335812
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10425588U Pending JPH0226246U (en) | 1988-08-05 | 1988-08-05 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0226246U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100316712B1 (en) * | 1999-06-22 | 2001-12-12 | 윤종용 | Pedestal of loadcup for loading and unloading wafers to a chemical mechanical polishing apparatus |
-
1988
- 1988-08-05 JP JP10425588U patent/JPH0226246U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100316712B1 (en) * | 1999-06-22 | 2001-12-12 | 윤종용 | Pedestal of loadcup for loading and unloading wafers to a chemical mechanical polishing apparatus |