JPH02261614A - In-mold transfer foil - Google Patents
In-mold transfer foilInfo
- Publication number
- JPH02261614A JPH02261614A JP8458189A JP8458189A JPH02261614A JP H02261614 A JPH02261614 A JP H02261614A JP 8458189 A JP8458189 A JP 8458189A JP 8458189 A JP8458189 A JP 8458189A JP H02261614 A JPH02261614 A JP H02261614A
- Authority
- JP
- Japan
- Prior art keywords
- layer
- heat
- transfer
- mold
- transfer foil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011888 foil Substances 0.000 title claims abstract description 37
- 239000010410 layer Substances 0.000 claims abstract description 84
- 238000002347 injection Methods 0.000 claims abstract description 30
- 239000007924 injection Substances 0.000 claims abstract description 30
- 239000011347 resin Substances 0.000 claims abstract description 24
- 229920005989 resin Polymers 0.000 claims abstract description 24
- 239000012790 adhesive layer Substances 0.000 claims abstract description 20
- 238000007639 printing Methods 0.000 claims description 10
- 239000012948 isocyanate Substances 0.000 claims description 7
- 150000002513 isocyanates Chemical class 0.000 claims description 7
- 229920001169 thermoplastic Polymers 0.000 claims description 5
- 239000004416 thermosoftening plastic Substances 0.000 claims description 5
- 238000010030 laminating Methods 0.000 claims description 3
- 239000000463 material Substances 0.000 abstract description 19
- JOYRKODLDBILNP-UHFFFAOYSA-N Ethyl urethane Chemical compound CCOC(N)=O JOYRKODLDBILNP-UHFFFAOYSA-N 0.000 abstract description 3
- 230000000740 bleeding effect Effects 0.000 abstract 1
- 239000000976 ink Substances 0.000 description 16
- -1 polyethylene terephthalate Polymers 0.000 description 9
- 238000000034 method Methods 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 6
- 230000001070 adhesive effect Effects 0.000 description 6
- 239000000853 adhesive Substances 0.000 description 5
- 238000007646 gravure printing Methods 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 238000000576 coating method Methods 0.000 description 4
- 239000012778 molding material Substances 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 229920000728 polyester Polymers 0.000 description 4
- 238000007740 vapor deposition Methods 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 238000001746 injection moulding Methods 0.000 description 3
- 229920000139 polyethylene terephthalate Polymers 0.000 description 3
- 239000005020 polyethylene terephthalate Substances 0.000 description 3
- 229920000098 polyolefin Polymers 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000004677 Nylon Substances 0.000 description 2
- 239000004698 Polyethylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920001778 nylon Polymers 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- IVSZLXZYQVIEFR-UHFFFAOYSA-N 1,3-Dimethylbenzene Natural products CC1=CC=CC(C)=C1 IVSZLXZYQVIEFR-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 206010011224 Cough Diseases 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- VGGSQFUCUMXWEO-UHFFFAOYSA-N Ethene Chemical compound C=C VGGSQFUCUMXWEO-UHFFFAOYSA-N 0.000 description 1
- 239000005977 Ethylene Substances 0.000 description 1
- 239000005058 Isophorone diisocyanate Substances 0.000 description 1
- 239000004640 Melamine resin Substances 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- 229920002978 Vinylon Polymers 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002301 cellulose acetate Polymers 0.000 description 1
- HGAZMNJKRQFZKS-UHFFFAOYSA-N chloroethene;ethenyl acetate Chemical compound ClC=C.CC(=O)OC=C HGAZMNJKRQFZKS-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000012792 core layer Substances 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 125000005442 diisocyanate group Chemical group 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- UHESRSKEBRADOO-UHFFFAOYSA-N ethyl carbamate;prop-2-enoic acid Chemical compound OC(=O)C=C.CCOC(N)=O UHESRSKEBRADOO-UHFFFAOYSA-N 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 238000007756 gravure coating Methods 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- NIMLQBUJDJZYEJ-UHFFFAOYSA-N isophorone diisocyanate Chemical compound CC1(C)CC(N=C=O)CC(C)(CN=C=O)C1 NIMLQBUJDJZYEJ-UHFFFAOYSA-N 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- 238000007645 offset printing Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001230 polyarylate Polymers 0.000 description 1
- 229920001748 polybutylene Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- QCTJRYGLPAFRMS-UHFFFAOYSA-N prop-2-enoic acid;1,3,5-triazine-2,4,6-triamine Chemical compound OC(=O)C=C.NC1=NC(N)=NC(N)=N1 QCTJRYGLPAFRMS-UHFFFAOYSA-N 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- DVKJHBMWWAPEIU-UHFFFAOYSA-N toluene 2,4-diisocyanate Chemical compound CC1=CC=C(N=C=O)C=C1N=C=O DVKJHBMWWAPEIU-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
- B29C45/14811—Multilayered articles
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
- B29C45/14836—Preventing damage of inserts during injection, e.g. collapse of hollow inserts, breakage
- B29C2045/14844—Layers protecting the insert from injected material
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Mechanical Engineering (AREA)
- Decoration By Transfer Pictures (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
Description
【発明の詳細な説明】 〔産業上の利用分野〕 本発明はインモールド転写箔に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to an in-mold transfer foil.
近年、基材上に絵柄層、金属蒸着層等からな、る転写層
と感熱接着剤層を順次積層して構成した転写箔であって
、射出成形金型内に載置して成形材料としての溶融樹脂
を射出充填して成形を行い、脱型した後に基材を剥離す
ることにより、射出成形品の表面に所望の転写層を転写
させることができるインモールド転写箔が使用されてい
る。In recent years, transfer foils have been developed by sequentially laminating a transfer layer, such as a pattern layer, a metal vapor deposition layer, etc., and a heat-sensitive adhesive layer on a base material, and are used as a molding material when placed in an injection mold. In-mold transfer foils are used that can transfer a desired transfer layer to the surface of an injection molded product by injecting and filling a molten resin into the mold, removing the mold, and then peeling off the base material.
この種インモールド転写箔は実際に転写を行った場合、
特に熔融樹脂を2金型内に注入させるためのゲート部に
相当する位置にある転写層や接着剤層の一部が、該ゲー
ト部から注入される溶融樹脂の熱と射出圧力によって“
インキ流れ”を起こしてしまい、その結果、所定の転写
を行うことができないという不具合があった。When this type of in-mold transfer foil is actually transferred,
Particularly, a part of the transfer layer and adhesive layer located at a position corresponding to the gate part for injecting the molten resin into the two molds is damaged by the heat and injection pressure of the molten resin injected from the gate part.
There was a problem that "ink flow" occurred, and as a result, it was impossible to perform the desired transfer.
そこで従来、上記のような転写時におけるインキ流れを
防止させるために、転写層及び感熱接着剤層を比較的ガ
ラス転移温度が高い樹脂材質にて形成してなるインモー
ルド転写箔が知られているが、この転写箔は特に各層に
おけるインキの塗工後の乾燥が不充分である場合、ゲー
ト部付近に相当する層において依然としてインキ流れが
発生してしまうものであった。Therefore, in order to prevent ink flow during transfer as described above, in-mold transfer foils have been known in which a transfer layer and a heat-sensitive adhesive layer are formed of a resin material with a relatively high glass transition temperature. However, with this transfer foil, particularly if the drying of the ink in each layer after application is insufficient, ink still flows in the layer corresponding to the vicinity of the gate portion.
本発明は上記の点に鑑みなされたもので、転写時の特に
ゲート部近辺における転写層等のインキ流れを抑制する
ことができ、ひいては転写相当箇所の全域にわたって所
望通りの転写を安定して行うことが可能なインモールド
転写箔を提供することを目的とする。The present invention has been developed in view of the above points, and is capable of suppressing the flow of ink on the transfer layer, etc., especially near the gate portion during transfer, thereby stably performing the desired transfer over the entire area corresponding to transfer. The purpose of the present invention is to provide an in-mold transfer foil that can be used as an in-mold transfer foil.
即ち本発明は、
(1) 基材ソイ5ルム上に少なくとも転写層及び感
熱接着剤層を順次積層してなる転写箔であって、射出成
形金型内に載置して感熱接着剤層側より溶融樹脂を射出
充填して成形を行い、射出成形品表面に上記転写層を転
写させるインモールド転写箔において、基材フィルムと
感熱接着剤層との層間の少なくとも射出成形金型のゲー
ト部に相当する位置に耐熱層を設けたことを特徴とする
インモールド転写箔。That is, the present invention provides: (1) A transfer foil formed by sequentially laminating at least a transfer layer and a heat-sensitive adhesive layer on a base material soy 5lum, which is placed in an injection mold so that the heat-sensitive adhesive layer side In the in-mold transfer foil, in which the transfer layer is transferred to the surface of the injection-molded product by injection-filling with a molten resin, at least the gate part of the injection mold is formed between the base film and the heat-sensitive adhesive layer. An in-mold transfer foil characterized by having a heat-resistant layer provided at corresponding positions.
(2)耐熱層の輪郭部がぼかし印刷にて形成された請求
項1記載のインモールド転写箔。(2) The in-mold transfer foil according to claim 1, wherein the outline of the heat-resistant layer is formed by blur printing.
(3)耐熱層を、射出成形品の成形絞り性が必要となる
コーナー部に相当する位置には設けない請求項1又は2
記載のインモールド転写箔。(3) Claim 1 or 2 in which the heat-resistant layer is not provided at a position corresponding to a corner portion of the injection molded product where drawability is required.
In-mold transfer foil as described.
(4)耐熱層を、イソシアネートを添加して耐熱性を付
与した熱可塑性ビヒクルにて形成してなる請求項1〜3
のいずれかに記載のインモールド転写箔。(4) Claims 1 to 3 in which the heat-resistant layer is formed from a thermoplastic vehicle to which isocyanate is added to impart heat resistance.
The in-mold transfer foil described in any of the above.
を要旨とするものである。The main points are as follows.
C実施例〕 以下、本発明の実施例を図面に基き説明する。C Example] Embodiments of the present invention will be described below with reference to the drawings.
第1図は本発明の一実施例を示すもので、本発明のイン
モールド転写Fi 1は基本的に、基材フィルム2と、
該フィルム2上に少なくとも順次積層して設けられる転
写層3及び感熱接着剤層4と、基材フィルム2と感熱接
着剤層4の層間の所定箇所に設けられる耐熱層5から構
成される0図中6は剥離層を示し、この剥離層により転
写時の基材フィルム2の剥離は該フィルム2と剥離層6
との間で成される。FIG. 1 shows an embodiment of the present invention, and the in-mold transfer Fi 1 of the present invention basically includes a base film 2,
The film shown in FIG. 6 indicates a release layer, and this release layer allows the base film 2 to be peeled off during transfer between the film 2 and the release layer 6.
It is done between.
上記基材フィルム2は、通常の転写箔の基材として利用
されている離型性を有するものであればよく、例えば絞
りの浅い形状の成形品表面に寸法精度の高い転写槽を転
写する目的ではポリエチレンテレフタレート、ポリカー
ボネート、ポリイミド、ボリアリレート、ポリエーテル
エーテルケトン、酢酸セルロース等の熱や応力で寸法変
化し難い樹脂フィルムよりなるものが好ましい、また絞
りの深い形状の成形品の場合には、ポリ塩化ビニル、ポ
リアミド(例えば、6−ナイロン、6.6−ナイロン等
)、ビニロン、ポリエチレンやポリプロピレン等のポリ
オレフィン、ポリエチレンテレフタレート/イソフタレ
ート共重合体、ポリブチレンチレフクレート等の低結晶
性ポリエステル等、可撓性を有する熱可塑性樹脂フィル
ムあるいは、これらの積層体が好ましい、フィルム2の
厚みは通常5〜200μmであり、好ましくは12〜5
0μmである。The base film 2 may be any film that has mold releasability and is used as a base material for ordinary transfer foils, for example, for the purpose of transferring a transfer tank with high dimensional accuracy to the surface of a molded product with a shallow drawing shape. Therefore, it is preferable to use a resin film made of polyethylene terephthalate, polycarbonate, polyimide, polyarylate, polyether ether ketone, cellulose acetate, etc., which does not easily change dimensions due to heat or stress. Vinyl chloride, polyamides (e.g. 6-nylon, 6.6-nylon, etc.), vinylon, polyolefins such as polyethylene and polypropylene, low-crystalline polyesters such as polyethylene terephthalate/isophthalate copolymers, polybutylene lenticulate, etc. A flexible thermoplastic resin film or a laminate thereof is preferred, and the thickness of the film 2 is usually 5 to 200 μm, preferably 12 to 5 μm.
It is 0 μm.
剥離層6は基材フィルム2との剥離を容易ならしめ、転
写後において転写N3を隠蔽させない表面保護機能を果
たすものである。剥離層6は例えば、アクリル樹脂、塩
化ビニル−酢酸ビニル共重合体、ポリエチレンタン、エ
ポキシ等の樹脂材料を用い、この樹脂材料をグラビアコ
ート、ロールコート等のコーティング法やスクリーン印
刷、グラビア印刷等の印刷法により塗布することにより
形成される。The peeling layer 6 facilitates peeling from the base film 2 and performs a surface protection function to prevent the transfer N3 from being hidden after transfer. The release layer 6 is made of, for example, a resin material such as acrylic resin, vinyl chloride-vinyl acetate copolymer, polyethylene, or epoxy. It is formed by coating using a printing method.
転写層3は、被転写材となる射出成形品に意匠性等を付
与させるための機能を果たす層であり、具体的には、絵
柄層、着色層、金属蒸着層等が挙げられ、これらの1種
又は2種以上を適宜組み合わせて構成されるものである
。また転写層3は全面的に設けても部分的に設けてもよ
い。The transfer layer 3 is a layer that performs the function of imparting design properties to the injection molded product that is the material to be transferred, and specifically includes a pattern layer, a colored layer, a metal vapor deposition layer, etc. It is constructed by appropriately combining one type or two or more types. Further, the transfer layer 3 may be provided entirely or partially.
転写層3としての絵柄層等は、例、えば、アクリル系、
塩化ビニル−酢酸ビニル系、アミノアルキッド系、セル
ロース系等のインキが用いられる。The pattern layer etc. as the transfer layer 3 may be made of, for example, acrylic,
Vinyl chloride-vinyl acetate, aminoalkyd, cellulose, etc. inks are used.
絵柄層等の形成に当たってはグラビア印刷、シルクスク
リーン印刷、オフセット印刷等の印刷方法が採用される
。In forming the pattern layer, etc., printing methods such as gravure printing, silk screen printing, and offset printing are employed.
転写層3としての金属蒸着層は、アルミニウム、クロム
、ニッケル等の金属を用いて真空薄着法やスパッタリン
グ法等にて形成される。この金属蒸着層を設ける場合は
、特にアンカー層を先に設けてから該層上に形成するこ
とが望ましい。The metal vapor deposition layer as the transfer layer 3 is formed using a metal such as aluminum, chromium, or nickel by a vacuum thin deposition method, a sputtering method, or the like. When providing this metal vapor deposition layer, it is particularly desirable to provide the anchor layer first and then form it on the layer.
感熱接着剤層4は、射出成形品を構成する成形材料に対
して接着性を有する感熱接着剤にて形成され、感熱接着
剤としてはアクリル、ポリオレフィン、塩素化ポリオレ
フィン、ゴム系、ポリ塩化ビニル、塩化ビニル/酢酸ビ
ニル共重合体、エチレン/ビニルアルコール共重合体等
の樹脂からなるものが挙げられる。接着剤層はグラビア
コート、ロールコート等のコート法や、グラビア印刷、
シルクスクリーン印刷等の印刷法にて形成することがで
きる。The heat-sensitive adhesive layer 4 is formed of a heat-sensitive adhesive that has adhesive properties to the molding material constituting the injection molded product, and examples of the heat-sensitive adhesive include acrylic, polyolefin, chlorinated polyolefin, rubber-based, polyvinyl chloride, Examples include those made of resins such as vinyl chloride/vinyl acetate copolymer and ethylene/vinyl alcohol copolymer. The adhesive layer can be coated using coating methods such as gravure coating, roll coating, gravure printing,
It can be formed by a printing method such as silk screen printing.
耐熱層5は、上記基材フィルム2と感熱接着剤層4との
層間、即ち、剥離層6と転写層3の間、転写層3と接着
剤層4の間等の少なくとも射出成形金型のゲート部7(
第2図)に相当する位置に設けられる。特に、第1図に
示すように感熱接着剤4側に設けることが好ましい。耐
熱層5は通常、上記所定箇所にパターン状に設けられる
ことが多く、この際該N5の輪郭部は塗布量が中心部か
ら周辺部にかけて連続的に低下してゆく所謂ぼかし印刷
にて形成し、耐熱層5と咳N5が形成されていない部分
との区別がつきにくい状態とする。また耐熱層5は成形
絞り性の大きな部位に相当する位置には、該耐熱層の存
在により転写層等に発生する虞れがある微少亀裂を防止
するために設けないことが望ましく、特に射出成形品の
コーナー部8(第2図)に相当する位置には設けない。The heat-resistant layer 5 is provided between the base film 2 and the heat-sensitive adhesive layer 4, that is, between the release layer 6 and the transfer layer 3, between the transfer layer 3 and the adhesive layer 4, etc. at least in the injection mold. Gate part 7 (
(Fig. 2). In particular, it is preferable to provide it on the heat-sensitive adhesive 4 side as shown in FIG. The heat-resistant layer 5 is usually provided in a pattern at the above-mentioned predetermined locations, and in this case, the outline of the N5 is formed by so-called blur printing in which the amount of coating decreases continuously from the center to the periphery. , the heat-resistant layer 5 and the part where the cough N5 is not formed are in a state where it is difficult to distinguish. In addition, it is preferable that the heat-resistant layer 5 is not provided at a position corresponding to a region with high forming drawability in order to prevent microcracks that may occur in the transfer layer etc. due to the presence of the heat-resistant layer 5. It is not provided at a position corresponding to the corner portion 8 (Fig. 2) of the product.
耐熱層5の材質としては、耐熱性に優れた樹脂材質を用
いることができ、例えば、ウレタン系、アクリルウレタ
ン系、ニトロセルロース、ポリエステル等を主成分に含
むものである。As the material of the heat-resistant layer 5, a resin material having excellent heat resistance can be used, and for example, a resin material containing urethane type, acrylic urethane type, nitrocellulose, polyester, etc. as a main component can be used.
また、電離放射線硬化性樹脂、ポリシロキサン等が挙げ
られる。中でもイソシアネートを添加して耐熱性を付与
した熱可塑性ビヒクル(例えば、ウレタン系樹脂など)
が好ましく、この場合、イソシアネートの添加量は熱可
塑性ビヒクルに対して1〜15wt%がよい、添加量が
1wt%未満では耐熱層としての耐熱性が不充分なもの
となり、逆に15wt%を越えると当接する層との密着
不良の原因となる。上記イソシアネートとしては、トリ
レンジイソシアネート、メタキシレンジイソシアネート
、コキサメチレンジイソシアネート、イソホロンジイソ
シアネート等が挙げられる。上記電離放射線硬化性樹脂
としてはウレタンアクリレート系樹脂、ポリエステルア
クリレート系樹脂、メラミンアクリレート系樹脂等を用
いることができる。Further examples include ionizing radiation-curable resins, polysiloxanes, and the like. Among them, thermoplastic vehicles (e.g., urethane resins) that have been added with isocyanate to provide heat resistance.
In this case, the amount of isocyanate added is preferably 1 to 15 wt% based on the thermoplastic vehicle. If the amount added is less than 1 wt%, the heat resistance as a heat-resistant layer will be insufficient, and on the contrary, if it exceeds 15 wt%. This may cause poor adhesion between the layer and the layer it comes into contact with. Examples of the isocyanate include tolylene diisocyanate, metaxylene diisocyanate, coxamethylene diisocyanate, isophorone diisocyanate, and the like. As the ionizing radiation curable resin, urethane acrylate resin, polyester acrylate resin, melamine acrylate resin, etc. can be used.
耐熱層5は上述の樹脂材料を用いて公知の印刷方法等に
て印刷形成することができ、また耐熱層5の厚さは0.
5〜2μmが好ましい。The heat-resistant layer 5 can be formed by printing using the above-mentioned resin material by a known printing method, and the thickness of the heat-resistant layer 5 is 0.
5 to 2 μm is preferable.
上記の如き構成からなる本発明転写箔1を用いて転写を
行うに当たっては、第2図に示すようにまず転写箔1を
射出成形金型9にキャビテイ面に基材フィルム2側を対
峙させて装着載置する0次いで、公知の射出成形法の手
順に基づき、金型9のゲート部7から成形材料としての
溶融樹脂10を注入充填し、該樹脂を固化又は硬化させ
て成形を行った後、射出成形品11を金型から取り出し
て基材フィルム2を剥離、除去する。以上の工程により
転写N3等が射出成形品11の表面に転写される。When performing transfer using the transfer foil 1 of the present invention having the above-described configuration, first the transfer foil 1 is placed in an injection mold 9 with the base film 2 side facing the cavity surface, as shown in FIG. Next, based on the procedure of the known injection molding method, molten resin 10 as a molding material is injected and filled from the gate part 7 of the mold 9, and the resin is solidified or hardened to perform molding. , the injection molded product 11 is taken out from the mold, and the base film 2 is peeled off and removed. Through the above steps, the transfer N3 and the like are transferred to the surface of the injection molded product 11.
本発明の転写箔によれば、ゲート部9に相当する位置に
は必ず耐熱層が存在しているため、ゲート部9から溶融
樹脂が注入される際のインキ流れを防止することができ
る。According to the transfer foil of the present invention, since the heat-resistant layer is always present at the position corresponding to the gate portion 9, it is possible to prevent ink from flowing when molten resin is injected from the gate portion 9.
本発明の転写箔を適用することができる射出成形品の成
形材料は、従来から射出成形用として用いられているも
のであれば特に限定されない。The molding material for injection molded products to which the transfer foil of the present invention can be applied is not particularly limited as long as it is conventionally used for injection molding.
以下、具体的実施例を挙げて本発明を更に詳細に説明す
る。Hereinafter, the present invention will be explained in more detail by giving specific examples.
実施例1
ポリエチレンテレフタレートフィルム(東し製:’r−
6o、#25)に、メラミン系樹脂(昭和インク類)を
塗布して剥離層を形成し、次いでこの上にアクリル系樹
脂からなるインキ(昭和インク類)をグラビア印刷法に
て印刷して絵柄層を形成した後、射出成形金型のゲート
部に相当する位置に、イソシアネートを5wt%添加し
た硬化型ポリウレタンからなる塗料(昭和インク類)を
グラビア印刷法にてベタ印刷して耐熱層を形成し、更に
表面にアクリル系樹脂からなる感熱接着剤(昭和インク
類)を塗布して接着剤層を形成し、しかる後、上記耐熱
層を充分に硬化させるため40°Cで3日間養生させ、
インモールド転写箔とした。Example 1 Polyethylene terephthalate film (manufactured by Toshi: 'r-
6o, #25) is coated with melamine resin (Showa Inks) to form a release layer, and then an ink made of acrylic resin (Showa Inks) is printed using the gravure printing method to create a pattern. After forming the layer, a heat-resistant layer is formed by printing a paint (Showa Ink) made of curable polyurethane containing 5 wt% isocyanate at a position corresponding to the gate part of the injection mold using a gravure printing method. Then, a heat-sensitive adhesive made of acrylic resin (Showa Ink) was applied to the surface to form an adhesive layer, and then cured at 40°C for 3 days to fully cure the heat-resistant layer.
It was made into an in-mold transfer foil.
この転写箔を射出成形金型内に所定通りに装着しく耐熱
層がゲート部位置に相応するように)、溶融させたAB
S樹脂を射出充填して成形を行った後、脱型してからフ
ィルムを剥離して転写を行ったところ、射出成形品には
インキ流れが全く生じていない美麗な絵柄層を転写する
ことができた。Place this transfer foil in the injection mold as specified so that the heat-resistant layer corresponds to the gate position), then melt the AB.
After injection filling with S resin and molding, we removed the mold, peeled off the film, and performed transfer. As a result, a beautiful pattern layer with no ink flow was transferred to the injection molded product. did it.
実施例2
耐熱層を、ポリエステルアクリレート系の紫外線硬化性
樹脂(大日精化工業■製:PHC)を用いてグラビア印
刷法にて、ゲート部周辺(金型エツジ部に相当する付近
は塗布薄となるように)にぼかし印刷し、出力160w
7cmの高圧水銀燈にて2秒間対照を行って硬化させて
形成した他は、実施例1と同様にしてインモールド転写
箔を作成した。Example 2 A heat-resistant layer was formed by gravure printing using a polyester acrylate-based ultraviolet curable resin (manufactured by Dainichiseika Chemical Co., Ltd.: PHC), with a thin coat around the gate area (corresponding to the mold edge area). ), output 160w
An in-mold transfer foil was prepared in the same manner as in Example 1, except that it was cured using a 7 cm high-pressure mercury lamp for 2 seconds.
得られた転写箔を用いて実施例1と同様に転写を行った
ところ、射出成形品には、インキ流れが生じない美麗な
絵柄層を転写することができた。When transfer was carried out in the same manner as in Example 1 using the obtained transfer foil, it was possible to transfer a beautiful pattern layer to the injection molded product without causing ink flow.
以上説明したように、本発明のインモールド転写箔は基
材フィルムと感熱接着剤層との層間の少なくとも射出成
形金型のゲート部に相当する位置に耐熱層を設けて構成
してなるため、射出成形に際してゲート部から射出注入
される熔融樹脂によりインキ流れが起こる慮れば確実に
解消され、その結果、インキ流れによる支障がない所期
通りの転写層等を射出成形品に転写することができる。As explained above, the in-mold transfer foil of the present invention is constructed by providing a heat-resistant layer between the base film and the heat-sensitive adhesive layer at least at a position corresponding to the gate part of the injection mold. If ink flow occurs due to the molten resin injected from the gate part during injection molding, it will be reliably eliminated, and as a result, the desired transfer layer etc. can be transferred to the injection molded product without any problems caused by ink flow. can.
また上記耐熱層の輪郭部をぼかし印刷にて形成すること
により耐熱層と核層のない部分との境界がぼかされ、耐
熱層の存在による意匠性等の低下を招くことがない、し
かも、上記耐熱層を射出成形品のコーナー部等の成形絞
り性の大きい部位に相当する位置に設けないよう構成す
ることにより、該耐熱層によるクラック発生、成形不良
等の問題を誘発する虞れもなくなる。更に上記耐熱層を
イソシアネートを適宜添加した熱可塑性ビヒクルにて形
成することにより耐溶剤性(耐薬品性)の上昇等の利点
がある。In addition, by forming the outline of the heat-resistant layer by blur printing, the boundary between the heat-resistant layer and the portion without the core layer is blurred, and the presence of the heat-resistant layer does not cause deterioration in design, etc. By configuring the above-mentioned heat-resistant layer so that it is not provided at a position corresponding to a location where molding drawability is large, such as a corner portion of an injection molded product, there is no possibility that the heat-resistant layer will cause problems such as cracks and molding defects. . Further, by forming the heat-resistant layer using a thermoplastic vehicle to which an isocyanate is appropriately added, there are advantages such as an increase in solvent resistance (chemical resistance).
第1図は本発明インモールド転写箔の一例を示す縦断面
図、第2図、第3図は本発明転写箔を用いて射出成形品
に転写を行う工程例を示す要部断面図である。
l・・・インモールド転写箔
2・・・基材フィルム 3・・・転写層4、・・・感
熱接着剤N 5・・・耐熱層7・・・ゲート部
8・・・コーナー部
9・・・溶融樹脂
11・・・射出成形品
10・・・溶融樹脂FIG. 1 is a vertical cross-sectional view showing an example of the in-mold transfer foil of the present invention, and FIGS. 2 and 3 are cross-sectional views of essential parts showing an example of the process of transferring to an injection molded product using the transfer foil of the present invention. . l... In-mold transfer foil 2... Base film 3... Transfer layer 4,... Heat sensitive adhesive N 5... Heat resistant layer 7... Gate portion 8... Corner portion 9. ... Molten resin 11 ... Injection molded product 10 ... Molten resin
Claims (4)
剤層を順次積層してなる転写箔であって、射出成形金型
内に載置して感熱接着剤層側より溶融樹脂を射出充填し
て成形を行い、射出成形品表面に上記転写層を転写させ
るインモールド転写箔において、基材フィルムと感熱接
着剤層との層間の少なくとも射出成形金型のゲート部に
相当する位置に耐熱層を設けたことを特徴とするインモ
ールド転写箔。(1) A transfer foil formed by sequentially laminating at least a transfer layer and a heat-sensitive adhesive layer on a base film, which is placed in an injection mold and filled with molten resin by injection from the heat-sensitive adhesive layer side. In the in-mold transfer foil in which the transfer layer is transferred to the surface of the injection molded product, a heat-resistant layer is provided between the base film and the heat-sensitive adhesive layer at least at a position corresponding to the gate part of the injection mold. An in-mold transfer foil characterized by:
項1記載のインモールド転写箔。(2) The in-mold transfer foil according to claim 1, wherein the outline of the heat-resistant layer is formed by blur printing.
コーナー部に相当する位置には設けない請求項1又は2
記載のインモールド転写箔。(3) Claim 1 or 2 in which the heat-resistant layer is not provided at a position corresponding to a corner portion of the injection molded product where drawability is required.
In-mold transfer foil as described.
与した熱可塑性ビヒクルにて形成してなる請求項1〜3
のいずれかに記載のインモールド転写箔。(4) Claims 1 to 3 in which the heat-resistant layer is formed from a thermoplastic vehicle to which isocyanate is added to impart heat resistance.
The in-mold transfer foil described in any of the above.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8458189A JPH02261614A (en) | 1989-04-03 | 1989-04-03 | In-mold transfer foil |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8458189A JPH02261614A (en) | 1989-04-03 | 1989-04-03 | In-mold transfer foil |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02261614A true JPH02261614A (en) | 1990-10-24 |
Family
ID=13834642
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP8458189A Pending JPH02261614A (en) | 1989-04-03 | 1989-04-03 | In-mold transfer foil |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02261614A (en) |
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04101587U (en) * | 1991-02-13 | 1992-09-02 | アルプス電気株式会社 | In-mold lighting plate |
US6245182B1 (en) * | 1997-08-12 | 2001-06-12 | Nissha Printing Co., Ltd. | Transfer material, surface-protective sheet, and process for producing molded article |
JP2009255467A (en) * | 2008-04-21 | 2009-11-05 | Fujicopian Co Ltd | In-mold transfer film |
JP2010247493A (en) * | 2009-04-20 | 2010-11-04 | Nissha Printing Co Ltd | Method of manufacturing in-mold decorative molded product, molded product manufactured thereby and decorative sheet |
WO2012176593A1 (en) * | 2011-06-20 | 2012-12-27 | ソニー株式会社 | Molded article and in-mold transfer foil |
JP2015199199A (en) * | 2014-04-04 | 2015-11-12 | パナソニックIpマネジメント株式会社 | In-mold molding, film for in-mold molding and method of producing in-mold molding |
US9375867B2 (en) | 2011-06-20 | 2016-06-28 | Jnc Corporation | Transfer film for in-mold molding and method for producing same |
US10449705B2 (en) | 2012-12-19 | 2019-10-22 | Jnc Corporation | Transfer film for in-mold molding, method for producing in-mold molded product, and molded product |
-
1989
- 1989-04-03 JP JP8458189A patent/JPH02261614A/en active Pending
Cited By (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04101587U (en) * | 1991-02-13 | 1992-09-02 | アルプス電気株式会社 | In-mold lighting plate |
US6245182B1 (en) * | 1997-08-12 | 2001-06-12 | Nissha Printing Co., Ltd. | Transfer material, surface-protective sheet, and process for producing molded article |
JP2009255467A (en) * | 2008-04-21 | 2009-11-05 | Fujicopian Co Ltd | In-mold transfer film |
JP2010247493A (en) * | 2009-04-20 | 2010-11-04 | Nissha Printing Co Ltd | Method of manufacturing in-mold decorative molded product, molded product manufactured thereby and decorative sheet |
WO2012176593A1 (en) * | 2011-06-20 | 2012-12-27 | ソニー株式会社 | Molded article and in-mold transfer foil |
JP2013028153A (en) * | 2011-06-20 | 2013-02-07 | Sony Corp | Molded article and in-mold transfer foil |
KR101403170B1 (en) * | 2011-06-20 | 2014-06-03 | 소니 주식회사 | Molded article and in-mold transfer foil |
US8981231B2 (en) | 2011-06-20 | 2015-03-17 | Sony Corporation | Molded product and in-mold transfer foil |
US9375867B2 (en) | 2011-06-20 | 2016-06-28 | Jnc Corporation | Transfer film for in-mold molding and method for producing same |
US10449705B2 (en) | 2012-12-19 | 2019-10-22 | Jnc Corporation | Transfer film for in-mold molding, method for producing in-mold molded product, and molded product |
JP2015199199A (en) * | 2014-04-04 | 2015-11-12 | パナソニックIpマネジメント株式会社 | In-mold molding, film for in-mold molding and method of producing in-mold molding |
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