JP4054455B2 - Simultaneous molding material - Google Patents

Simultaneous molding material Download PDF

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Publication number
JP4054455B2
JP4054455B2 JP27237898A JP27237898A JP4054455B2 JP 4054455 B2 JP4054455 B2 JP 4054455B2 JP 27237898 A JP27237898 A JP 27237898A JP 27237898 A JP27237898 A JP 27237898A JP 4054455 B2 JP4054455 B2 JP 4054455B2
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Japan
Prior art keywords
transfer
layer
resin
molding
mold
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JP27237898A
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JP2000094891A (en
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正幸 経免
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Nissha Printing Co Ltd
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Nissha Printing Co Ltd
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    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14827Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles using a transfer foil detachable from the insert

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  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Decoration By Transfer Pictures (AREA)

Description

【0001】
【発明の属する技術分野】
この発明は、家電製品、化粧品容器、雑貨品などに用いる樹脂成形品の表面に成形同時転写法で装飾する際、連続成形中に転写材から生じる箔バリが金型に固着するのを防止することができる成形同時転写材に関する。
【0002】
【従来の技術】
樹脂成形品の表面を装飾する方法として、成形同時転写法がある。成形同時転写法とは、基体シート上に、剥離層、図柄層、接着層などからなる転写層を形成した転写材を成形金型内に挟み込み、金型内に樹脂を射出充満させ、冷却して樹脂成形品を得るのと同時に成形品表面に転写材を接着させた後、基体シートを剥離して、被転写物面に転写層を転移して装飾を行う方法である。
【0003】
成形同時転写法において、連続成形中に転写材から生じる箔バリが金型に固着するという問題がある。すなわち、被転写物の転写面積より大きく設けられた転写層の非転写部分、特に被転写物が穴を有するような形状の場合は穴をふさぐように設けられた転写層の非転写部分において、基体シートが剥離された後、成形品の周囲や穴に転写層が付着したままとなるいわゆる箔バリが生じる。箔バリは、金型が開くときの衝撃で成形品から脱落し、金型のコア型側に静電気の作用などによって付着する。その後、次の成形を行うために型締めしたときに、キャビティ型とコア型とにはさまれる部分に付着していた箔バリが、型締め圧によりキャビティ型またはコア型に固着してしまう。なお、型締め時に金型間にはさまれなかった箔バリは、金型の開閉時の衝撃で金型から脱落する。
【0004】
箔バリが金型に固着するのを防止するために、金型に対してテフロン加工を施したり、金型表面を鏡面に磨いたりして箔バリが当初から金型に付着しにくくする方法がある。また、箔バリが生じる箇所に粘着テープを貼り、キャビティ面とコア面との間に微小な隙間をつくり、型締め時に箔バリが付着している部分に圧力を加えないことにより、箔バリの金型への固着を防ぐ方法がある。また、成形時に金型温度を低くして箔バリの金型への固着を防止する方法がある。また、成形時の型締め圧力を低くして箔バリの金型への固着を防止する方法がある。
【0005】
【発明が解決しようとする課題】
しかし、金型に対してテフロン加工を施したり、金型表面を鏡面に磨いたりするのは、加工コストが高く、テフロン加工や鏡面処理の耐久性にも欠けるものである。また、箔バリが生じる箇所に粘着テープを貼るのは、作業が煩雑で生産効率が著しく低下する。また、成形時に金型温度を低くするのは、転写材の転写層と成形樹脂との密着力が低下したり、転写層を構成する各層間の密着力が低下して剥がれが生じるおそれがある。また、成形時の型締め圧力を低くすると、樹脂バリが生じるおそれがある。
【0006】
したがって、この発明は、上記のような問題点を解消し、連続成形中に転写材から生じる箔バリが金型に固着するのを防止することができる成形同時転写材を提供することを目的とする。
【0007】
【課題を解決するための手段】
この発明の成形同時転写材は、以上の目的を達成するために、つぎのように構成した。
【0008】
【課題を解決するための手段】
つまり、この発明の成形同時転写材は、剥離性を有する基体シート上に転写層が形成された転写材において、成形樹脂に接する転写部分の転写層の厚みよりも金型に挟まれる非転写部分の転写層の厚みが大きく、非転写部分の転写層が基体シートから剥離しないか、または、転写部分の転写層の剥離性よりも剥離性が小さいように構成した。
【0009】
また、上記の発明において、転写部分の転写層の厚みよりも非転写部分の転写層の厚みが0.1〜300μm大きいように構成してもよい。
【0010】
また、上記の発明において、非転写部分の転写層が剥離層、図柄層、アンカー層、接着層のいずれかによって形成されるように構成してもよい。
【0012】
【発明の実施の形態】
図面を参照しながらこの発明の実施の形態について詳しく説明する。
【0013】
図1は、この発明の成形同時転写材の一実施例を示す断面図である。図2は、この発明の成形同時転写材を用いて成形同時転写を行う様子を示す断面図である。図3は、この発明の成形同時転写材を用いて得た成形品を示す断面図である。図中、1は成形同時転写材、2は基体シート、3は剥離層、4は図柄層、5は接着層、6は転写層、7はキャビティ型、8はコア型、9は成形樹脂である。
【0014】
この発明の成形同時転写材1は、剥離性を有する基体シート2上に転写層6が形成された転写材において、成形樹脂9に接する転写部分の転写層6の厚みよりも金型に挟まれる非転写部分の転写層6の厚みが大きいものである(図1参照)。
【0015】
成形同時転写材1は、基体シート2上に、剥離層3、図柄層4、接着層5などからなる転写層6が形成されたものである。
【0016】
基体シート2の材質としては、ポリプロピレン系樹脂、ポリエチレン系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、アクリル系樹脂、ポリ塩化ビニル系樹脂などの樹脂シート、アルミニウム箔、銅箔などの金属箔、グラシン紙、コート紙、セロハンなどのセルロース系シート、あるいは以上の各シートの複合体など、通常の転写材の基体シート2として用いるものを使用することができる。また、基体シート2の表面が微細な凹凸を有する場合は、転写層6に凹凸が写し取られ、艶消しやヘアラインなどの表面形状を表現することができる。
【0017】
基体シート2からの転写層6の剥離性がよい場合には、基体シート2上に転写層6を直接設ければよい。基体シート2からの転写層6の剥離性を改善するために、基体シート2上に転写層6を設ける前に、離型層を全面的に形成してもよい。離型層は、成形同時転写後に基体シート2を剥離した際に、基体シート2とともに転写層6から離型する。離型層の材質としては、メラミン樹脂系離型剤、シリコーン樹脂系離型剤、フッ素樹脂系離型剤、セルロース誘導体系離型剤、尿素樹脂系離型剤、ポリオレフィン樹脂系離型剤、パラフィン系離型剤およびこれらの複合型離型剤などを用いることができる。離型層の形成方法としては、ロールコート法、スプレーコート法などのコート法、グラビア印刷法、スクリーン印刷法などの印刷法がある。
【0018】
剥離層3は、基体シート2または離型層上に全面的または部分的に形成する。非転写部分において箔バリが生じないようにするためには、剥離層3を転写部分にのみ設けるのが好ましいが、剥離層3を部分的に設けるには正確な見当合わせが必要であるから現実的には困難である。剥離層3は、成形同時転写後に基体シート2を剥離した際に、基体シート2または離型層から剥離して被転写物の最外面となる層である。剥離層3の材質としては、アクリル系樹脂、ポリエステル系樹脂、ポリ塩化ビニル系樹脂、セルロース系樹脂、ゴム系樹脂、ポリウレタン系樹脂、ポリ酢酸ビニル系樹脂などのほか、塩化ビニル−酢酸ビニル共重合体系樹脂、エチレン−酢酸ビニル共重合体系樹脂などのコポリマーを用いるとよい。剥離層3に硬度が必要な場合には、紫外線硬化性樹脂などの光硬化性樹脂、電子線硬化性樹脂などの放射線硬化性樹脂、熱硬化性樹脂などを選定して用いるとよい。剥離層3は、着色したものでも、未着色のものでもよい。剥離層3の形成方法としては、グラビアコート法、ロールコート法、コンマコート法などのコート法、グラビア印刷法、スクリーン印刷法などの印刷法がある。
【0019】
図柄層4は、剥離層3の上に、通常は印刷層として形成する。印刷層の材質としては、ポリビニル系樹脂、ポリアミド系樹脂、ポリエステル系樹脂、アクリル系樹脂、ポリウレタン系樹脂、ポリビニルアセタール系樹脂、ポリエステルウレタン系樹脂、セルロースエステル系樹脂、アルキド樹脂などの樹脂をバインダーとし、適切な色の顔料または染料を着色剤として含有する着色インキを用いるとよい。金属色を得たい場合は、金属粉などを顔料として用いるとよい。印刷層の形成方法としては、オフセット印刷法、グラビア印刷法、スクリーン印刷法などの通常の印刷法や、グラビアコート法、ロールコート法、コンマコート法などのコート法を採用することもできる。印刷層は、厚さ0.5〜50μmに形成するとよい。印刷層は、表現したい図柄に応じて、全面的に設ける場合や部分的に設ける場合もある。
【0020】
また、図柄層4は、金属薄膜層からなるもの、あるいは印刷層と金属薄膜層との組み合わせからなるものでもよい。金属薄膜層は、図柄層4として金属光沢を表現するためのものであり、真空蒸着法、スパッターリング法、イオンプレーティング法、鍍金法などで形成する。表現したい金属光沢色に応じて、アルミニウム、ニッケル、金、白金、クロム、鉄、銅、スズ、インジウム、銀、チタニウム、鉛、亜鉛などの金属、これらの合金または化合物を使用する。また、金属薄膜層を設ける際に、他の転写層6と金属薄膜層との密着性を向上させるために、前アンカー層や後アンカー層を設けてもよい。前アンカー層および後アンカー層の材質としては、2液性硬化ウレタン樹脂、熱硬化ウレタン樹脂、メラミン系樹脂、セルロースエステル系樹脂、塩素含有ゴム系樹脂、塩素含有ビニル系樹脂、アクリル系樹脂、エポキシ系樹脂、ビニル系共重合体樹脂などを使用するとよい。前アンカー層および後アンカー層の形成方法としては、グラビアコート法、ロールコート法、コンマコート法などのコート法、グラビア印刷法、スクリーン印刷法などの印刷法がある。
【0021】
接着層5は、被転写物面に上記の各層を接着するものである。接着層5は、全面的または部分的に形成する。接着層5としては、被転写物の素材に適した感熱性あるいは感圧性の樹脂を適宜使用する。たとえば、被転写物の材質がアクリル系樹脂の場合はアクリル系樹脂を用いるとよい。また、被転写物の材質がポリフェニレンオキシド・ポリスチレン系樹脂、ポリカーボネート系樹脂、スチレン共重合体系樹脂、ポリスチレン系ブレンド樹脂の場合は、これらの樹脂と親和性のあるアクリル系樹脂、ポリスチレン系樹脂、ポリアミド系樹脂などを使用すればよい。さらに、被転写物の材質がポリプロピレン樹脂の場合は、塩素化ポリオレフィン樹脂、塩素化エチレン−酢酸ビニル共重合体樹脂、環化ゴム、クマロンインデン樹脂が使用可能である。接着層5の形成方法としては、グラビアコート法、ロールコート法、コンマコート法などのコート法、グラビア印刷法、スクリーン印刷法などの印刷法がある。
【0022】
転写層6の構成は、上記した態様に限定されるものではなく、たとえば、図柄層4の材質として被転写物との接着性に優れたものを使用する場合には、接着層5を省略することができる。
【0023】
このような層構成の転写材において、成形樹脂9に接する転写部分の転写層6の厚みよりも金型に挟まれる非転写部分の転写層6の厚みが大きいようにする。すなわち、金型を閉じたとき、非転写部分の転写層6の厚みと転写部分の転写層6の厚みの差だけコア型8とキャビティ型7とに間隔が生じるようにすることで、箔バリが型締め圧により金型に押しつけられることがなくなるため、金型に箔バリが固着するのを防止することができる。
【0024】
非転写部分の転写層6の厚みは、転写部分の転写層6の厚みよりも0.1〜300μm大きいようにするとよい。非転写部分の転写層6の厚みが転写部分よりも0.1μmに満たない場合は、金型を閉じたとき型締め圧の影響を受け、発生した箔バリが金型に押さえつけられて固着する。また、300μmを越える場合は、樹脂バリの原因となったりする。
【0025】
非転写部分の転写層6の厚みを大きくするには、転写層6の厚みを大きくすることを目的とし、他の作用効果を発揮することを目的としないダミーの図柄層4やアンカー層などの転写層6を非転写部分に積層して形成するとよい。また、基体シート2から剥離しないかまたは転写部分の剥離性よりも剥離性が小さい転写層6を非転写部分に形成すると、さらに箔バリの発生を抑えることができる。
【0026】
前記した層構成の転写材を用い、射出成形による成形同時転写法を利用して被転写物である樹脂成形品の表面に装飾を行う方法について説明する。
【0027】
まず、キャビティ型7とコア型8とからなる成形用金型内に成形同時転写材1を送り込み、位置決めして固定する。その際、枚葉の成形同時転写材1を1枚づつ送り込んでもよいし、長尺の成形同時転写材1の必要部分を間欠的に送り込んでもよい。
【0028】
次いで、成形用金型を閉じ、成形同時転写材1を金型で挟み込む(図2参照)。成形同時転写材1は、成形樹脂9に接する転写部分の転写層6の厚みよりも金型に挟まれる非転写部分の転写層6の厚みを大きくすることにより、キャビティ型7とコア型8との間に樹脂バリが生じない程度の隙間を設け、金型への箔バリの固着を恒久的に防止することができる。すなわち、箔バリが発生しても、樹脂バリが生じない程度の隙間を設けることで、金型が閉じられてもキャビティ型7とコア型8とにはさまれた箔バリに型締め圧が加わらないか、圧が加わっても非常に低いものであるため、箔バリが金型で押さえつけられることがなく、箔バリが金型に固着しない。
【0029】
なお、非転写部分の転写層6は、転写部分の転写層6よりも厚みが大きいため、非転写部分に型締め圧がかかり、非転写部分の転写層6は金型に強く押しつけられるが、非転写部分の転写層6を、基体シート2から剥離しないようにするか、基体シート2からの剥離が困難であるように構成することによって、非転写部分の転写層6が基体シート2に密着し、箔バリが金型に固着しないようにすることができる。
【0030】
次いで、コア型8に設けたゲートより成形樹脂9を金型内に射出充満させ、被転写物を形成するのと同時にその面に成形同時転写材1を接着させる(図2参照)。
【0031】
成形樹脂9としては、ポリスチレン系樹脂、ポリオレフィン系樹脂、ABS樹脂、AS樹脂などの汎用樹脂を挙げることができる。また、ポリフェニレンオキシド・ポリスチレン系樹脂、ポリカーボネート系樹脂、ポリアセタール系樹脂、アクリル系樹脂、ポリカーボネート変性ポリフェニレンエーテル樹脂、ポリブチレンテレフタレート樹脂、ポリブチレンテレフタレート樹脂、超高分子量ポリエチレン樹脂などの汎用エンジニアリング樹脂やポリスルホン樹脂、ポリフェニレンサルファイド系樹脂、ポリフェニレンオキシド系樹脂、ポリアリレート樹脂、ポリエーテルイミド樹脂、ポリイミド樹脂、液晶ポリエステル樹脂、ポリアリル系耐熱樹脂などのスーパーエンジニアリング樹脂を使用することもできる。さらに、ガラス繊維や無機フィラーなどの補強材を添加した複合樹脂も使用できる。
【0032】
被転写物である樹脂成形品を冷却した後、成形用金型を開いて樹脂成形品を取り出す。最後に、基体シート2を剥がすことにより、転写が完了する(図3参照)。
【0033】
なお、成形同時転写法は、射出成形法だけでなく、圧縮成形法、トランスファー成形法、積層成形法、注型成形法、スラッシュモールド法、ディップモールド法、押し出し成形法、インフレーションモールド法、ブローモールド法、真空成形法などにも適用できるものである。
【0034】
【実施例】
基体シートとして厚さ50μmのポリエチレンテレフタレートフィルムを用い、その上に活性エネルギー線硬化性樹脂インキを用いて剥離層を形成し、アクリル樹脂系インキを用いて図柄層を形成し、塩化ビニル酢酸ビニル共重合体樹脂系インキを用いて接着層を形成した。成形樹脂に接する転写部分の転写層の厚みよりも金型に挟まれる非転写部分の転写層の厚みが5μm大きくなるように図柄層を設けた。このようにして、携帯電話の前面パネル用の成形同時転写材を得た。
【0035】
このようにして得た成形同時転写材を射出成形用金型内に配置して型締めし、成形樹脂としてアクリルニトリルブタジエンスチレン樹脂を射出した後、型開きして成形品を得るのと同時に転写を行った。成形条件は、射出成形機として株式会社日本製鋼所製J220SAIIを用い、可動型温度60℃、固定型温度60℃、型締力130t、ヒーター温度H1=210℃、H2=215℃、H3=220℃、H4=220℃、NH=220℃、射出時間0.85秒、冷却時間20秒、射出保圧時間2秒とした。200回連続して成形同時転写を行ったところ、金型への箔バリの固着は認められなかった。
【0036】
比較例として、転写層の厚みが均一なほかは上記実施例と同様の構成の成形同時転写材を用いて同様の条件で成形同時転写を行ったところ、5回目の成形後に金型に箔バリが固着した。
【0037】
【発明の効果】
この発明は、前記した構成からなるので、次のような効果を有する。
【0038】
この発明の成形同時転写材は、剥離性を有する基体シート上に転写層が形成された転写材において、成形樹脂に接する転写部分の転写層の厚みよりも金型に挟まれる非転写部分の転写層の厚みが大きいので、キャビティ型とコア型との間に一定の間隔が生じ、発生した箔バリが型締め時の圧力で金型に押さえつけられることなく成形されるため、箔バリが金型へ固着するのを防止でき、金型に対しては何ら加工を施すことなく最適な成形条件において、連続成形中に転写材から生じる箔バリが金型に固着するのを防止することができる。
【図面の簡単な説明】
【図1】この発明の成形同時転写材の一実施例を示す断面図である。
【図2】この発明の成形同時転写材を用いて成形同時転写を行う様子を示す断面図である。
【図3】この発明の成形同時転写材を用いて得た成形品を示す断面図である。
【符号の説明】
1 成形同時転写材
2 基体シート
3 剥離層
4 図柄層
5 接着層
6 転写層
7 キャビティ型
8 コア型
9 成形樹脂
[0001]
BACKGROUND OF THE INVENTION
This invention prevents a foil burr generated from a transfer material from sticking to a mold during continuous molding when decorating the surface of a resin molded product used for home appliances, cosmetic containers, miscellaneous goods, etc., by a simultaneous molding method. The present invention relates to a molding simultaneous transfer material that can be used.
[0002]
[Prior art]
As a method for decorating the surface of a resin molded product, there is a simultaneous molding transfer method. The simultaneous molding transfer method is a method in which a transfer material in which a transfer layer composed of a release layer, a design layer, an adhesive layer, etc. is formed on a base sheet is sandwiched in a molding die, resin is injected into the die, and cooled. In this method, a transfer material is adhered to the surface of the molded product at the same time as the resin molded product is obtained, and then the base sheet is peeled off, and the transfer layer is transferred to the surface of the transfer object to decorate.
[0003]
In the simultaneous molding and transfer method, there is a problem that foil burrs generated from the transfer material adhere to the mold during continuous molding. That is, in the non-transfer part of the transfer layer provided larger than the transfer area of the transfer object, particularly in the non-transfer part of the transfer layer provided so as to close the hole when the transfer object has a shape with a hole, After the base sheet is peeled off, so-called foil burrs are generated in which the transfer layer remains attached around the molded product and in the holes. The foil burr is dropped from the molded product by an impact when the mold is opened, and adheres to the core mold side of the mold by the action of static electricity. Thereafter, when the mold is clamped to perform the next molding, the foil burrs adhering to the portion sandwiched between the cavity mold and the core mold are fixed to the cavity mold or the core mold by the mold clamping pressure. It should be noted that the foil burrs that were not sandwiched between the molds when the molds were clamped fall off from the molds due to the impact when the molds are opened and closed.
[0004]
In order to prevent foil burrs from sticking to the mold, there are methods to make the foil burrs difficult to adhere to the mold from the beginning by applying Teflon processing to the mold or polishing the mold surface to a mirror surface. is there. Adhesive tape is applied to the location where foil burrs occur, creating a minute gap between the cavity surface and the core surface, and by applying no pressure to the area where the foil burrs are attached during mold clamping, There is a method to prevent sticking to the mold. Further, there is a method for preventing the sticking of the foil burr to the mold by lowering the mold temperature at the time of molding. In addition, there is a method for preventing sticking of the foil burr to the mold by lowering the clamping pressure at the time of molding.
[0005]
[Problems to be solved by the invention]
However, performing Teflon processing on the mold or polishing the mold surface to a mirror surface is expensive in processing cost and lacks durability of Teflon processing and mirror surface treatment. Moreover, sticking an adhesive tape to a place where foil burrs are generated is complicated and the production efficiency is remarkably reduced. In addition, when the mold temperature is lowered at the time of molding, the adhesion between the transfer layer of the transfer material and the molding resin may decrease, or the adhesion between the layers constituting the transfer layer may decrease, causing peeling. . Moreover, if the clamping pressure at the time of molding is lowered, resin burrs may be generated.
[0006]
Accordingly, an object of the present invention is to provide a molding simultaneous transfer material that can eliminate the above-described problems and prevent the foil burrs generated from the transfer material from sticking to the mold during continuous molding. To do.
[0007]
[Means for Solving the Problems]
In order to achieve the above object, the molding simultaneous transfer material of the present invention is configured as follows.
[0008]
[Means for Solving the Problems]
That is, the molding simultaneous transfer material of the present invention is a non-transfer portion sandwiched between molds in a transfer material in which a transfer layer is formed on a peelable substrate sheet, rather than the thickness of the transfer layer of the transfer portion in contact with the molding resin. the thickness of the transfer layer is rather large, the transfer layer non-transfer portion or not peeled from the base sheet, or is constructed as a small release properties than the peeling of the transfer layer of the transfer portion.
[0009]
In the above invention, the thickness of the transfer layer in the non-transfer portion may be 0.1 to 300 μm larger than the thickness of the transfer layer in the transfer portion.
[0010]
In the above invention, the transfer layer of the non-transfer portion may be formed of any one of a release layer, a design layer, an anchor layer, and an adhesive layer.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Embodiments of the present invention will be described in detail with reference to the drawings.
[0013]
FIG. 1 is a cross-sectional view showing one embodiment of the simultaneous molding and transfer material of the present invention. FIG. 2 is a cross-sectional view showing a state where simultaneous molding transfer is performed using the simultaneous molding transfer material of the present invention. FIG. 3 is a cross-sectional view showing a molded product obtained using the molding simultaneous transfer material of the present invention. In the figure, 1 is a molding simultaneous transfer material, 2 is a base sheet, 3 is a release layer, 4 is a design layer, 5 is an adhesive layer, 6 is a transfer layer, 7 is a cavity mold, 8 is a core mold, and 9 is a molding resin. is there.
[0014]
The molding simultaneous transfer material 1 according to the present invention is sandwiched between molds in a transfer material in which a transfer layer 6 is formed on a base sheet 2 having releasability, rather than the thickness of the transfer layer 6 at the transfer portion in contact with the molding resin 9. The thickness of the transfer layer 6 in the non-transfer portion is large (see FIG. 1).
[0015]
The molding simultaneous transfer material 1 is obtained by forming a transfer layer 6 including a release layer 3, a design layer 4, and an adhesive layer 5 on a base sheet 2.
[0016]
The material of the base sheet 2 includes polypropylene resin, polyethylene resin, polyamide resin, polyester resin, acrylic resin, polyvinyl chloride resin resin sheet, aluminum foil, copper foil and other metal foil, glassine paper In addition, a cellulose-based sheet such as coated paper or cellophane, or a composite of each of the above-described sheets can be used as a base sheet 2 for a normal transfer material. Moreover, when the surface of the base sheet 2 has fine irregularities, the irregularities are copied onto the transfer layer 6, and a surface shape such as matte or hairline can be expressed.
[0017]
When the peelability of the transfer layer 6 from the base sheet 2 is good, the transfer layer 6 may be provided directly on the base sheet 2. In order to improve the peelability of the transfer layer 6 from the base sheet 2, the release layer may be formed on the entire surface before the transfer layer 6 is provided on the base sheet 2. The release layer is released from the transfer layer 6 together with the base sheet 2 when the base sheet 2 is peeled off after simultaneous molding and transfer. As the material of the release layer, melamine resin release agent, silicone resin release agent, fluororesin release agent, cellulose derivative release agent, urea resin release agent, polyolefin resin release agent, Paraffin-type release agents and composite release agents thereof can be used. As a method for forming the release layer, there are a coating method such as a roll coating method and a spray coating method, a printing method such as a gravure printing method and a screen printing method.
[0018]
The release layer 3 is formed entirely or partially on the base sheet 2 or the release layer. In order to prevent foil burrs from occurring in the non-transfer portion, it is preferable to provide the release layer 3 only in the transfer portion. However, in order to provide the release layer 3 partially, it is necessary to accurately register. Is difficult. The release layer 3 is a layer that peels from the base sheet 2 or the release layer and becomes the outermost surface of the transfer object when the base sheet 2 is peeled off after simultaneous molding and transfer. The release layer 3 can be made of acrylic resin, polyester resin, polyvinyl chloride resin, cellulose resin, rubber resin, polyurethane resin, polyvinyl acetate resin, or vinyl chloride-vinyl acetate copolymer. Copolymers such as system resins and ethylene-vinyl acetate copolymer resins may be used. When the release layer 3 requires hardness, a photo-curing resin such as an ultraviolet curable resin, a radiation curable resin such as an electron beam curable resin, or a thermosetting resin may be selected and used. The release layer 3 may be colored or uncolored. Examples of the method for forming the release layer 3 include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, and a printing method such as a gravure printing method and a screen printing method.
[0019]
The design layer 4 is usually formed on the release layer 3 as a printing layer. As a material for the printing layer, a resin such as polyvinyl resin, polyamide resin, polyester resin, acrylic resin, polyurethane resin, polyvinyl acetal resin, polyester urethane resin, cellulose ester resin, alkyd resin is used as a binder. A colored ink containing a pigment or dye of an appropriate color as a colorant may be used. When it is desired to obtain a metal color, metal powder or the like may be used as a pigment. As a method for forming the printing layer, a normal printing method such as an offset printing method, a gravure printing method, a screen printing method, or a coating method such as a gravure coating method, a roll coating method, or a comma coating method may be employed. The printed layer is preferably formed to a thickness of 0.5 to 50 μm. The print layer may be provided entirely or partially depending on the pattern to be expressed.
[0020]
The design layer 4 may be composed of a metal thin film layer or a combination of a printed layer and a metal thin film layer. The metal thin film layer is for expressing metallic luster as the pattern layer 4 and is formed by a vacuum deposition method, a sputtering method, an ion plating method, a plating method, or the like. Metals such as aluminum, nickel, gold, platinum, chromium, iron, copper, tin, indium, silver, titanium, lead, and zinc, and alloys or compounds thereof are used depending on the metallic luster color to be expressed. Moreover, when providing a metal thin film layer, in order to improve the adhesiveness of the other transfer layer 6 and a metal thin film layer, you may provide a front anchor layer and a back anchor layer. As materials for the front anchor layer and the rear anchor layer, two-component cured urethane resin, thermosetting urethane resin, melamine resin, cellulose ester resin, chlorine-containing rubber resin, chlorine-containing vinyl resin, acrylic resin, epoxy It is preferable to use a vinyl resin, a vinyl copolymer resin, or the like. Examples of methods for forming the front anchor layer and the rear anchor layer include coating methods such as gravure coating, roll coating, and comma coating, printing methods such as gravure printing, and screen printing.
[0021]
The adhesive layer 5 adheres each of the above layers to the surface of the transfer object. The adhesive layer 5 is formed entirely or partially. As the adhesive layer 5, a heat-sensitive or pressure-sensitive resin suitable for the material of the transfer object is appropriately used. For example, when the material of the transfer object is an acrylic resin, an acrylic resin may be used. In addition, when the material of the material to be transferred is polyphenylene oxide / polystyrene resin, polycarbonate resin, styrene copolymer resin, or polystyrene blend resin, acrylic resin, polystyrene resin, polyamide having affinity with these resins A series resin or the like may be used. Further, when the material of the transfer object is a polypropylene resin, chlorinated polyolefin resin, chlorinated ethylene-vinyl acetate copolymer resin, cyclized rubber, and coumarone indene resin can be used. Examples of the method for forming the adhesive layer 5 include a coating method such as a gravure coating method, a roll coating method, and a comma coating method, a printing method such as a gravure printing method, and a screen printing method.
[0022]
The configuration of the transfer layer 6 is not limited to the above-described embodiment. For example, when the material of the design layer 4 that has excellent adhesion to the transfer object is used, the adhesive layer 5 is omitted. be able to.
[0023]
In the transfer material having such a layer structure, the thickness of the transfer layer 6 in the non-transfer portion sandwiched between the molds is larger than the thickness of the transfer layer 6 in the transfer portion in contact with the molding resin 9. That is, when the mold is closed, the gap between the core mold 8 and the cavity mold 7 is generated by the difference between the thickness of the transfer layer 6 in the non-transfer portion and the thickness of the transfer layer 6 in the transfer portion. Can be prevented from being pressed against the mold by the clamping pressure, so that it is possible to prevent the foil burr from sticking to the mold.
[0024]
The thickness of the transfer layer 6 in the non-transfer portion is preferably 0.1 to 300 μm larger than the thickness of the transfer layer 6 in the transfer portion. When the thickness of the transfer layer 6 in the non-transfer portion is less than 0.1 μm than the transfer portion, the foil burrs that are generated are pressed against and fixed by the mold when the mold is closed. . Moreover, when exceeding 300 micrometers, it may cause a resin burr | flash.
[0025]
In order to increase the thickness of the transfer layer 6 in the non-transfer portion, it is intended to increase the thickness of the transfer layer 6, such as a dummy pattern layer 4 or an anchor layer that is not intended to exhibit other effects. The transfer layer 6 is preferably laminated on the non-transfer portion. Further, when the transfer layer 6 that does not peel from the base sheet 2 or has a peelability smaller than the peelability of the transfer portion is formed in the non-transfer portion, the generation of foil burrs can be further suppressed.
[0026]
A method for decorating the surface of a resin molded product, which is a transfer object, using the transfer material having the above-described layer structure and utilizing a simultaneous molding transfer method by injection molding will be described.
[0027]
First, the molding simultaneous transfer material 1 is fed into a molding die composed of the cavity mold 7 and the core mold 8 and positioned and fixed. At that time, the single sheet simultaneous molding transfer material 1 may be fed one by one, or a necessary part of the long molding simultaneous transfer material 1 may be intermittently fed.
[0028]
Next, the molding die is closed, and the molding simultaneous transfer material 1 is sandwiched between the molds (see FIG. 2). The molding simultaneous transfer material 1 has a cavity mold 7 and a core mold 8 formed by increasing the thickness of the transfer layer 6 in the non-transfer portion sandwiched between the molds more than the thickness of the transfer layer 6 in the transfer portion in contact with the molding resin 9. A gap to the extent that no resin burrs are generated between them can be provided to permanently prevent sticking of the foil burrs to the mold. That is, even if a foil burr occurs, a gap is provided so that a resin burr is not generated, so that a mold clamping pressure is applied to the foil burr sandwiched between the cavity mold 7 and the core mold 8 even when the mold is closed. The foil burr is not pressed down by the mold because it is not applied or is very low even when pressure is applied, and the foil burr does not adhere to the mold.
[0029]
Since the transfer layer 6 of the non-transfer portion is thicker than the transfer layer 6 of the transfer portion, a clamping pressure is applied to the non-transfer portion, and the transfer layer 6 of the non-transfer portion is strongly pressed against the mold. The transfer layer 6 in the non-transfer portion is not peeled off from the base sheet 2 or is configured to be difficult to peel off from the base sheet 2 so that the transfer layer 6 in the non-transfer portion is in close contact with the base sheet 2. In addition, the foil burr can be prevented from being fixed to the mold.
[0030]
Next, the molding resin 9 is injected and filled into the mold from the gate provided in the core mold 8, and simultaneously with the formation of the transfer object, the molding simultaneous transfer material 1 is adhered to the surface (see FIG. 2).
[0031]
Examples of the molding resin 9 include general-purpose resins such as polystyrene resin, polyolefin resin, ABS resin, and AS resin. Also, general-purpose engineering resins and polysulfone resins such as polyphenylene oxide / polystyrene resins, polycarbonate resins, polyacetal resins, acrylic resins, polycarbonate-modified polyphenylene ether resins, polybutylene terephthalate resins, polybutylene terephthalate resins, and ultrahigh molecular weight polyethylene resins. Super engineering resins such as polyphenylene sulfide resins, polyphenylene oxide resins, polyarylate resins, polyetherimide resins, polyimide resins, liquid crystal polyester resins, and polyallyl heat-resistant resins can also be used. Furthermore, composite resins to which reinforcing materials such as glass fibers and inorganic fillers are added can also be used.
[0032]
After the resin molded product, which is the transfer target, is cooled, the molding die is opened and the resin molded product is taken out. Finally, the transfer is completed by peeling off the base sheet 2 (see FIG. 3).
[0033]
The molding simultaneous transfer method is not limited to the injection molding method, but also the compression molding method, transfer molding method, laminate molding method, cast molding method, slash molding method, dip molding method, extrusion molding method, inflation molding method, blow molding method. It can also be applied to the method and vacuum forming method.
[0034]
【Example】
A polyethylene terephthalate film having a thickness of 50 μm is used as a base sheet, a release layer is formed thereon using an active energy ray-curable resin ink, a pattern layer is formed using an acrylic resin-based ink, and vinyl chloride / vinyl acetate is used. An adhesive layer was formed using a polymer resin ink. The pattern layer was provided so that the thickness of the transfer layer in the non-transfer portion sandwiched between the molds was 5 μm larger than the thickness of the transfer layer in the transfer portion in contact with the molding resin. Thus, a molding simultaneous transfer material for a front panel of a mobile phone was obtained.
[0035]
The molding simultaneous transfer material obtained in this way is placed in an injection mold and clamped. After injection of acrylonitrile butadiene styrene resin as the molding resin, the mold is opened to obtain a molded product and transferred simultaneously. Went. The molding conditions used were J220SAII manufactured by Nippon Steel Works as an injection molding machine, movable mold temperature 60 ° C, fixed mold temperature 60 ° C, clamping force 130t, heater temperature H1 = 210 ° C, H2 = 215 ° C, H3 = 220. C., H4 = 220.degree. C., NH = 220.degree. C., injection time 0.85 seconds, cooling time 20 seconds, injection pressure holding time 2 seconds. When simultaneous molding and transfer were performed 200 times continuously, no sticking of foil burrs to the mold was observed.
[0036]
As a comparative example, molding simultaneous transfer was performed under the same conditions using a molding simultaneous transfer material having the same configuration as in the above example except that the thickness of the transfer layer was uniform. After the fifth molding, the foil burrs were applied to the mold. Stuck.
[0037]
【The invention's effect】
Since this invention consists of an above-described structure, it has the following effects.
[0038]
The molding simultaneous transfer material of the present invention is a transfer material in which a transfer layer is formed on a peelable substrate sheet. Transfer of a non-transfer portion sandwiched between molds rather than the thickness of the transfer layer of the transfer portion in contact with the molding resin Since the thickness of the layer is large, a certain distance is generated between the cavity mold and the core mold, and the generated foil burr is molded without being pressed against the mold by the pressure at the time of clamping. The foil burrs generated from the transfer material during continuous molding can be prevented from adhering to the mold under optimum molding conditions without any processing on the mold.
[Brief description of the drawings]
FIG. 1 is a cross-sectional view showing an embodiment of a simultaneous molding and transfer material of the present invention.
FIG. 2 is a cross-sectional view showing a state in which simultaneous molding transfer is performed using the simultaneous molding transfer material of the present invention.
FIG. 3 is a cross-sectional view showing a molded product obtained using the molding simultaneous transfer material of the present invention.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Molding simultaneous transfer material 2 Base sheet 3 Release layer 4 Design layer 5 Adhesive layer 6 Transfer layer 7 Cavity mold 8 Core mold 9 Molding resin

Claims (3)

剥離性を有する基体シート上に転写層が形成された転写材において、成形樹脂に接する転写部分の転写層の厚みよりも金型に挟まれる非転写部分の転写層の厚みが大きく、非転写部分の転写層が基体シートから剥離しないか、または、転写部分の転写層の剥離性よりも剥離性が小さいことを特徴とする成形同時転写材。In the transfer material transfer layer is formed on a substrate sheet having release properties, the thickness of the transfer layer non-transfer portion sandwiched in the mold than the thickness of the transfer layer of the transfer portion in contact with the molding resin is rather large, non-transferable A molding simultaneous transfer material, wherein the transfer layer of the part does not peel from the substrate sheet, or the peelability is lower than the peelability of the transfer layer of the transfer part . 転写部分の転写層の厚みよりも非転写部分の転写層の厚みが0.1〜300μm大きい請求項1に記載の成形同時転写材。  The molding simultaneous transfer material according to claim 1, wherein the thickness of the transfer layer in the non-transfer portion is 0.1 to 300 µm larger than the thickness of the transfer layer in the transfer portion. 非転写部分の転写層が剥離層、図柄層、アンカー層、接着層のいずれかによって形成されたものである請求項1〜2のいずれかに記載の成形同時転写材。  The molding simultaneous transfer material according to claim 1, wherein the transfer layer of the non-transfer portion is formed by any one of a release layer, a design layer, an anchor layer, and an adhesive layer.
JP27237898A 1998-09-28 1998-09-28 Simultaneous molding material Expired - Lifetime JP4054455B2 (en)

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JPH01241415A (en) * 1988-03-24 1989-09-26 Nissha Printing Co Ltd Transfer material for in-mold molding
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JPH0737919Y2 (en) * 1989-05-31 1995-08-30 日本写真印刷株式会社 Transfer foil
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