JPH0225853U - - Google Patents
Info
- Publication number
- JPH0225853U JPH0225853U JP10363488U JP10363488U JPH0225853U JP H0225853 U JPH0225853 U JP H0225853U JP 10363488 U JP10363488 U JP 10363488U JP 10363488 U JP10363488 U JP 10363488U JP H0225853 U JPH0225853 U JP H0225853U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor device
- state
- section
- image processing
- lead bending
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000005259 measurement Methods 0.000 claims description 3
- 238000005452 bending Methods 0.000 claims 2
- 230000004308 accommodation Effects 0.000 description 2
Landscapes
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Description
第１図は本考案の一実施例を示す斜視図である
。
１…供給部、２…搬送部、３…画像処理部、４
…測定部、５…分類・収容部、６…排出・収容部
、７…制御部、８…半導体装置、８Ｌ…半導体装
置のリード、９…マガジン、１０…マニユアルロ
ーダ、１１…マガジンセツト部、１２…取手、１
３，１５…ストツパ、１４…搬送レール、１６…
画像処理ステージ、１７…カメラ、１８…画像処
理装置、１９…測定用ソケツト、２０…プツシヤ
、２１…分類用シヤトル、２２…モータ、２３…
排出ユニツト、２４…吸着パツド、２５…収容箱
。
FIG. 1 is a perspective view showing an embodiment of the present invention. 1... Supply section, 2... Conveyance section, 3... Image processing section, 4
...Measurement section, 5...Classification/accommodation section, 6...Ejection/accommodation section, 7...Control section, 8...Semiconductor device, 8L...Semiconductor device lead, 9...Magazine, 10...Manual loader, 11...Magazine set section, 12...Handle, 1
3, 15...Stopper, 14...Transportation rail, 16...
Image processing stage, 17... Camera, 18... Image processing device, 19... Measurement socket, 20... Pusher, 21... Classification shuttle, 22... Motor, 23...
Ejection unit, 24... Suction pad, 25... Storage box.
Claims (1)
より検出する手段と、検出した規格外のリード曲
がりの状態の半導体装置を排出・収容する手段と
を有することを特徴とする半導体装置の電気的測
定用ハンドリング装置。 A handling device for electrical measurement of a semiconductor device, comprising means for detecting the state of lead bending of a semiconductor device by image processing, and means for ejecting and storing the detected semiconductor device in a state of non-standard lead bending. Device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363488U JPH0225853U (en) | 1988-08-04 | 1988-08-04 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10363488U JPH0225853U (en) | 1988-08-04 | 1988-08-04 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0225853U true JPH0225853U (en) | 1990-02-20 |
Family
ID=31334645
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10363488U Pending JPH0225853U (en) | 1988-08-04 | 1988-08-04 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0225853U (en) |
-
1988
- 1988-08-04 JP JP10363488U patent/JPH0225853U/ja active Pending
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