JPH0185682U - - Google Patents
Info
- Publication number
- JPH0185682U JPH0185682U JP18126287U JP18126287U JPH0185682U JP H0185682 U JPH0185682 U JP H0185682U JP 18126287 U JP18126287 U JP 18126287U JP 18126287 U JP18126287 U JP 18126287U JP H0185682 U JPH0185682 U JP H0185682U
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- electronic
- electronic components
- robot equipped
- suction mechanism
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims description 2
- 230000003139 buffering effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
Landscapes
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- Tests Of Electronic Circuits (AREA)
Description
第１図は本考案の一実施例を示す上面図である
。
１〜３……ロボツト、４……加熱搬送装置、５
……供給装置、６……空トレーバツフアー装置、
７，８……収納装置、９……コンタクト装置、１
０……部品バツフアー装置、１２，１３……画像
処理用カメラ、２６……横送り装置、２７……測
定部。
FIG. 1 is a top view showing an embodiment of the present invention. 1-3...Robot, 4...Heating conveyance device, 5
...Feeding device, 6...Empty tray buffering device,
7, 8... Storage device, 9... Contact device, 1
0... Parts buffer device, 12, 13... Image processing camera, 26... Traverse feed device, 27... Measurement section.
Claims (1)
の吸着機構を備えた電子部品供給収納ロボツトと
、前記電子部品を順送りする機構を有する加熱装
置と、前記電子部品を吸着し前記電子部品の所在
を認識するカメラを具備し画像処理により前記電
子部品の位置補正をする電子部品搭載ロボツトと
、前記電子部品をソケツトに押込み加熱するコン
タクトユニツトとを含むことを特徴とするオート
ハンドラ。 An electronic component supply and storage robot equipped with an electronic component suction mechanism and an electronic component storage tray suction mechanism, a heating device having a mechanism for sequentially feeding the electronic components, and recognizing the location of the electronic components by suctioning the electronic components. An autohandler comprising: an electronic component mounting robot equipped with a camera and correcting the position of the electronic component through image processing; and a contact unit that pushes the electronic component into a socket and heats it.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126287U JPH0185682U (en) | 1987-11-27 | 1987-11-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18126287U JPH0185682U (en) | 1987-11-27 | 1987-11-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0185682U true JPH0185682U (en) | 1989-06-07 |
Family
ID=31472751
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18126287U Pending JPH0185682U (en) | 1987-11-27 | 1987-11-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0185682U (en) |
-
1987
- 1987-11-27 JP JP18126287U patent/JPH0185682U/ja active Pending
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