JPS60114979U - handling equipment - Google Patents
handling equipmentInfo
- Publication number
- JPS60114979U JPS60114979U JP315384U JP315384U JPS60114979U JP S60114979 U JPS60114979 U JP S60114979U JP 315384 U JP315384 U JP 315384U JP 315384 U JP315384 U JP 315384U JP S60114979 U JPS60114979 U JP S60114979U
- Authority
- JP
- Japan
- Prior art keywords
- handling equipment
- lead frame
- semiconductor device
- label
- handling device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Testing Of Individual Semiconductor Devices (AREA)
- Testing Relating To Insulation (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は本考案の実施例のハンドリング装置の、 概略
図であり、第２図は測定（選別）の終えたリードフレー
ム状態の半導体装置（被測定物）にラベルの貼れている
一例である。
なお図において、１・・・・・・供給部、２・・・・・
・搬送部、３・・・・・・測定部、４・・・・・・ラベ
ル部、５・・・・・・収容部、６・・・・・・リードフ
レーム状態の半導体装置、７・・・・・・供給用のリー
ドフレームマガジン、８・・・・・・収容用のリードフ
レームマガジン、９．１０・・・・・・搬送用送り爪、
１１．１２・・・・・・半導体装置、１３・・・・・・
ソケット、１４・・・・・・リード押え板、１５・・・
・・・半導体装置のリード、１６・・・・・・ソケット
のコンタクトリード、１７・・・・・・ラベル貼り機、
１８，１９゜２０、 ２１．２２・・・・・・半導体装
置、２３，２４・・・・・・ラベル、２５・・・・・・
リードフレーム、である。Fig. 1 is a schematic diagram of a handling device according to an embodiment of the present invention, and Fig. 2 is an example of a semiconductor device (object to be measured) in a lead frame state after measurement (sorting) with a label attached. . In the figure, 1... supply section, 2...
・Transporting section, 3... Measuring section, 4... Label section, 5... Accommodating section, 6... Semiconductor device in lead frame state, 7. ... Lead frame magazine for supply, 8 ... Lead frame magazine for storage, 9.10 ... Feed claw for transportation,
11.12... Semiconductor device, 13...
Socket, 14...Lead holding plate, 15...
...Semiconductor device leads, 16...Socket contact leads, 17...Label pasting machine,
18, 19° 20, 21. 22... Semiconductor device, 23, 24... Label, 25...
It is a lead frame.
Claims (1)
ハンドリング装置において、被測定物の一表面に測定結
果によりラベルを貼る手段を有することを特徴とするハ
ンドリング装置。A handling device used for electrical measurement of a semiconductor device in a lead frame state, characterized in that the handling device has means for pasting a label on one surface of an object to be measured according to a measurement result.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP315384U JPS60114979U (en) | 1984-01-13 | 1984-01-13 | handling equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP315384U JPS60114979U (en) | 1984-01-13 | 1984-01-13 | handling equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60114979U true JPS60114979U (en) | 1985-08-03 |
Family
ID=30477510
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP315384U Pending JPS60114979U (en) | 1984-01-13 | 1984-01-13 | handling equipment |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60114979U (en) |
-
1984
- 1984-01-13 JP JP315384U patent/JPS60114979U/en active Pending
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