JPH02254308A - Appearance inspection and apparatus therefor - Google Patents

Abstract

PURPOSE:To perform appearance inspections for many kinds of items efficiently and highly accurately by making lighting conditions variable, and setting the optimum lighting state for many kinds of the inspection items. CONSTITUTION:A lighting source is a so called ring lamp 7 whose lighting main body is constituted as a ring shape and has a lamp house 8. The lighting source such as halogen lamp is housed in the lamp house 8. Illuminating light which is generated in the lighting source is transmitted to the ring lamp 7 through an optical fiber cable 10 which is formed in a bundle shape. An outer ring lamp 7a and an inner ring lamp 7b are switched in lighting. Therefore, an illuminating angle theta of the light which is illuminating a semiconductor device 11 that is an object to be inspected can be changed. In the ring lamp 7, a large- diameter ring lamp 7a and a small-diameter ring lamp 7b can perform independent lightings in this structure.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a technique that can efficiently perform visual inspection of semiconductor devices or other electronic components, particularly visual inspection of multiple items.

[Conventional technology]

Examples of this type of technology described include JP-A-62-103548 and JP-A-62-1.
There are publications such as No. 56547.

In the manufacture of semiconductor devices and the like, the appearance of the package often greatly affects the quality. In other words, if a defective package, including leads, occurs in the product, it not only gives a bad visual impression (but also tends to cause property deterioration due to poor mounting or moisture intrusion, etc.). At the final stage, an appearance inspection process is carried out to check whether the appearance meets certain standards.

As described in each of the above-mentioned publications, such visual inspection is carried out by preparing an illumination system that has as uniform an illuminance as possible for the object to be inspected, such as an IC package, and from the surface of the package or lead as the object to be inspected. It is common to detect the reflected light of the product and recognize it visually by the inspector to determine the quality of the product.

By the way, the inspection items in the above appearance inspection include a wide variety of items related to leads, such as bent leads, missing leads, lead flatness, surface scratches, dents, and plating conditions.In addition, there are also items related to packages. There are a variety of inspection items, including mold dents, voids, package chips, cracks, and even the condition of marks printed on the package surface. For these multiple types of inspection items, the inspection means used is to uniformly irradiate the object to be inspected with illumination light.

[Problem to be solved by the invention]

However, as mentioned above, the optimal inspection conditions, especially the illumination conditions, are not constant among the various inspection items, and the present invention shows that the influence of the illumination conditions, such as the defect detection rate, varies greatly for each inspection item. discovered by someone. In other words, in the above-mentioned conventional technology, a wide variety of inspection items can be carried out by setting only certain illumination conditions even between parts to be inspected that have significantly different light reflectances, such as the package body surface and the lead surface. As a result, the defect detection rate inevitably decreased depending on the item, making it difficult to conduct highly accurate visual inspections.

Furthermore, as mentioned above, it is difficult to objectively determine pass/fail depending on the inspection criteria that depend on the visual inspection of the inspector, and this has also been a factor in reducing inspection accuracy.

Furthermore, although it is conceivable to prepare a plurality of inspection apparatuses with different conditions such as the amount of illumination light, this is not practical because there is a risk that the inspection efficiency will be significantly reduced.

The present invention has been made in view of the above-mentioned problems, and its purpose is to provide a technique that allows visual inspection of various items to be performed with high accuracy and efficiency.

The above and other objects and novel features of the present invention will become apparent from the description of this specification and the accompanying drawings.

[Means to solve the problem]

A brief overview of typical inventions disclosed in this application is as follows.

That is, the illumination conditions for the object to be inspected are varied, and the optimum illumination conditions are set for each of various inspection items.

In addition, when performing various inspection items by changing the parameters prepared in advance for setting the lighting conditions of the illumination light source for the object to be inspected, the inspection items can be divided into completely defective items and reproducible defective items. After inspecting completely defective items, reproducible defective items are inspected.

[Effect]

According to the above-mentioned means, by making it possible to set the optimal lighting conditions for various inspection items, it is possible to set the optimum illumination conditions for each of various inspection items, even between inspection parts with different light reflectances, such as the package body surface and the lead surface. Highly accurate detection can always be performed without changing the defect detection rate.

In addition, by dividing the inspection items into completely defective items and reproducible defective items, and inspecting the reproducible defective items after inspecting the completely defective items, the inspected object in which defects falling under the completely defective items have been detected can be Because it is eliminated at this stage,
The next reproducible defective item can be inspected efficiently, and the appearance inspection can be made more efficient.

〔Example〕

FIG. 1 is an explanatory diagram showing an optical system of a visual inspection apparatus that is an embodiment of the present invention, and FIG. 2 is a block diagram showing its processing system.
Fig. 3 is a perspective view showing the illumination light source, Fig. 4 is an explanatory diagram showing the state of change due to movement of the illumination light source, Fig. 5 is a sectional view showing the cross-sectional structure of the ring illumination, and Fig. 6 is a cross-sectional view of the object to be inspected. A block diagram for explaining the movement procedure, FIG. 7 is a perspective view showing the external appearance of the device configuration, and FIGS. 8(a) to (r) are explanations specifically showing defective items in the lead part to be inspected. 9(a) to 9(1) are explanatory diagrams specifically showing defective items in the mold part to be inspected, respectively.
Figures (a) to (C) are explanatory diagrams specifically showing defective items in the markings on the surface of the package to be inspected, and Figure 11 is a concrete illustration of the procedure for moving the inspected object within the visual inspection device. 12 is a cross-sectional view showing the mechanism of the lead flatness correction section; FIGS. 13(a) to (6) are explanatory drawings showing the positional relationship between the object to be inspected and the inspection head in the inspection section; FIG. FIG. 15 is an explanatory diagram showing the optical system inside the inspection head, FIG. 16 to 22 show the relationship between the defect detection accuracy (vertical axis) and the incident angle θ of illumination light (horizontal axis) for each inspection item obtained through experiments conducted by the inventor. FIG.

As shown in FIG. 7, the visual inspection apparatus 1 in this embodiment is composed of an apparatus main body 2 and a control section 3 consisting of a personal computer system or the like that controls the main body 2. In addition to the printer device 4 and the display 5 for displaying control information, a magnetic disk device 6 and the like are provided as external storage means, although not shown in the figure.

The illumination light source used in this embodiment is a so-called ring illumination 7 in which the illumination body is configured in a ring shape, and has a lamp house 8 as shown in FIG. lamp house 8
has a built-in illumination light source such as a halogen lamp (not shown), and the illumination light generated by this illumination light source is transmitted to the ring illumination 7 via an optical fiber cable 10 configured in a bundle. There is.

FIG. 1 shows the ring illumination 7 having a double structure, and by switching the illumination between the ring illumination 7a on the outer circumferential side and the ring illumination 7b on the inner circumference side, the object to be inspected can be inspected. The illumination angle θ of the illumination light irradiated onto the semiconductor device 11 can be changed. Like this, 2
As shown in FIG. 5, the multi-layered ring illumination 7 has a structure in which a large-diameter ring illumination 7a and a small-diameter ring illumination 7b can provide independent illumination, and each ring illumination 7 includes, for example, It has a structure in which optical fibers are embedded.

In addition, as a method of changing the illumination conditions, in addition to switching the illumination between the large-diameter ring illumination 7a and the small-diameter ring illumination 7b shown in FIG. 1, a single ring illumination 7 as shown in FIG. This ring illumination 7 is connected to the semiconductor device 11.
It is also possible to have a structure in which it is moved up and down with respect to.

The illumination light from the illumination light source is reflected on the surface of the semiconductor device 110 and then photoelectrically converted by the TV camera 13 located above the ring illumination 7. As schematically shown in FIG. 2, the image signal of the T■ camera 13 is first A/D converted in the A/D converter 14, and then binarized or multi-valued in the multi-value converter 19. After being stored in the memory 15, the detection unit 16 compares it with a reference signal sampled in advance to detect the presence or absence of an appearance defect.

FIG. 6 shows the procedure for moving the semiconductor device 11. As shown in the figure, the semiconductor device 11 that has been supplied from the loader/unloader 17 and has been positioned is first read by the lead flatness correction unit 18. After the flatness of the inspection section 20 is corrected, the inspection section 21 (in the figure, the first inspection section 21a to the third inspection section 21a to
A predetermined inspection is carried out in the inspection section 21c (excluding inspection section 21c shown in the figure), and then returned to the loader/unloader 17 by the conveyance section 22.

The above-mentioned movement of the semiconductor device 11 is performed by means of conveyance means such as a conveyor, and these are controlled by a drive mechanism control section 23 shown in FIG. The inspection sections 21 are each connected to an image processing section 24, and the image signals obtained from the inspection sections 21 are processed by the image processing section 24 and can be visually monitored by the operator using a monitor 25 such as a CRT. ing. The image processing section 24 is configured to be controlled by the control section 3.

FIG. 11 shows the above configuration as a layout on the device. The semiconductor device 11, which is the semiconductor device 11, is loaded into the loader/unloader 17 while being accommodated in the storage tray 26.
After the packages are taken out one by one from the storage tray 26 and positioned by the positioning section 9, they are sent to the lead flatness correction section 18. As shown in FIGS. 12(a) and 12(a), the lead flatness correction unit 18 includes a push-up mechanism 27 and a push-down mechanism 28.
Both mechanisms 27 and 28 include a suction stage 31 equipped with a vacuum suction port 3'0 that fixes the package surface of the semiconductor device 11.
have. Suction stage 31 in push-up mechanism 27
A lead presser 32 is provided above to support the root portion of the lead 20 protruding from the side surface of the semiconductor device 11 from above in the figure. A push-up mold 33 is arranged below the lead 20, and the lead 20
The tip is pushed up a certain distance from below.

On the other hand, the push-down mechanism 28 is arranged on the side of the suction stage 31 as shown in FIG. , has a push-down mold 34 disposed above the lead 20, and is structured to push down the tip end portion of the lead 20 from above to below by a certain distance.

The push-up die 33 and push-down die 34 of the push-up mechanism 27 and push-down mechanism 28 have a structure that allows for quantitative movement using a micrometer head, etc., and the leads 20 are formed in a gull-wing shape as shown in the figure. The flatness of the product is corrected through two steps: pushing down and pushing up the lead 20.

The semiconductor device 11 on which the flatness of the leads 20 has been corrected in the lead flatness correction section 18 is sent to the inspection IfB 21 where a predetermined visual inspection is performed.

Figures 13(a) to (6) show the first to fourth inspection sections (
21a to 21d) shows the positional relationship between the semiconductor device W111 and the inspection head 35. That is, in the first inspection section 21a (FIG. 13(a)), the semiconductor device 1
Inspection heads 35 and 35 are arranged in the side direction of the lead 20, and inspect the flatness of the lead 20, voids on the side surface of the package, solder adhesion at the base of the lead 20, and the like. In the second inspection section 21b (FIG. 13(C)), the inspection head 35 is placed above the semiconductor device 11, and mainly inspects voids on the package surface, foreign matter adhesion, package chipping/pumps, and puff cage cracks. Marking condition, lead 20
0 bends etc. are inspected. In the third inspection section 21c (FIG. 13(C)), an inspection head 35 is placed below the semiconductor device 11.
are arranged, and the same inspection items as those explained with reference to FIG. 13 above are performed from the bottom side of the semiconductor device 11. Although not shown in FIG. 6, the inspection head 35 is disposed as a fourth inspection section 21d (FIG. 13) in the side direction of the semiconductor device II to check the flatness and bending of the leads 20. etc. may be inspected more precisely, or a portion (the back side of the lead) which cannot be inspected by the first inspection section 21a to the third inspection section 2IC may be inspected.

FIG. 14 shows the configuration of the gamma door 35 for the above-mentioned inspection.

It is assumed that the arrangement of the inspection head 35 in FIG. 14 corresponds to the arrangement of the inspection head 35 in FIG. 13(b). In this arrangement state, a galvano mirror 37 is disposed inside the inspection radar 35 located above the ring illumination 7 via a lens 36, and the light reflected by this galvano mirror 37 is transmitted to, for example, 2048 pixels. CCD
The light enters a light receiving element 38 constituted by a linear sensor, and the reflected light from the semiconductor device 11 is converted into an image signal. In addition, the above galvano mirror 37 is
It has a structure in which the reflection angle can be moved by a galvano mirror control unit 40, and the surface of the package of the semiconductor device 11 can be scanned within a predetermined range.

Next, the main inspection items in this example are shown in Figs.
This will be explained in detail using FIG. 10.

FIGS. 8(a) to (r) show the semiconductor device 11i! Each of the defective items in the 11 lead portions is shown.

The figure (a) shows a flat package, and the figure (b) shows a defective state regarding lead flatness of a J-lead package.
If it is more than m, the lead flatness is considered to be poor.

Figures (C) and (6) show defective lead bending, that is, displacement of the lead 20 in the horizontal direction, and when the amount of displacement Δa exceeds a certain value, it is determined to be defective.

The same figure (e) shows a lead misalignment defect, the same figure (g) shows a dam cutting defect, the same figure ((to)) shows a lead dent defect, the same figure shows a resin flash defect, the same figure (i) shows a lead scratch defect, The same figure (J) shows a plating defect, the same figure (capital) shows a solder wetting defect, the same figure (1) shows a solder bridge defect, the same figure ■ shows a solder whisker and solder icicle defect, and the same figure (n) to (B) shows a solder bridging defect. Solder protrusions/excessive/defective grains, figure (6) shows defective foreign matter adhesion, figure (r
) indicate stain defects. Many of these inspection items can be inspected simultaneously by the same inspection section 21.

For example, items such as (e) to (0) in the same figure can be inspected at the same time.

FIG. 9 (a) to (i) each show defective items in the mold section.

That is, in FIGS. 11A and 11B, the semiconductor device 11
This figure shows void defects on the package surface, and (C) shows defects mainly due to foreign matter adhesion due to resin debris, etc.
Figures (6) and (e) are defective chips/depressions, and (f)
) is a package crack defect, the same figure (8) is a scratch defect,
The same figure shows a dirt/stain defect, and the same figure shows a solder adhesion defect. In the same figure, only (1) shows the DI.
Although a P-type package structure is shown, the inspection items are almost the same for other package structures.

Figures 10 (a) to (C) each show forms of defective marking. Figure 10 (a) shows a defective mark where part of the character is missing, and Figure 10 (a) shows a defect where the mark is missing, and Figure 10 (a) shows the character disappearing. (C) shows a mark erasure defect, and (C) shows a shading defect in which the shading of the marking is abnormal. Although not shown, there are other marking defects such as ink adhesion, misalignment, and double marking.

Note that the inspection for marking defects shown in FIG. 10 can be carried out at the same time as the inspection of the lead part or the inspection of the mold part shown in FIG. 8.

Furthermore, the inspection items explained in FIGS. 8 to 10 above can be classified into completely defective items and reproducible defective items. In other words, the former refers to products whose defects cannot be compensated for by reprocessing, and when such defects are discovered, the only option is to discard the product from the production line. These include lead misalignment defects (Figure 8 (e)), lead dent defects (Figure 8 ()),
Plating defects (Fig. 8 (company)), void defects (Fig. 9 (a)
)), package crack defects (FIG. 9(f)), etc. The latter reproducible defects are items that can be recovered by correcting the defective part, such as lead flatness defects (Figure 8 (a) and (b)) and lead bending defects (Figure 8 (C)).
) and (6)), poor solder wetting (Fig. 8 Ck)),
There are solder bridge defects (Fig. 8 (1)), etc.

When inspecting defective items in the inspection section 21 of this embodiment, first, the former completely defective items are inspected;
Next, by inspecting recyclable defective items, completely defective products are forcibly removed from the line, and then
It is possible to efficiently inspect reproducible defective items and reduce the waste of duplicate inspections.

Next, changes in the defect detection rate obtained in this example will be explained based on the inventor's experimental results.

In this experiment, as shown in FIG. 15, the inventor placed a ring illumination 7 with a diameter r that can be moved up and down at a height above the semiconductor device 11, which is the object to be inspected, and placed an optical system above it. 41 was placed. At this time, the angle formed by the incident light from the ring illumination 7 and the reference optical axis l is set as θ, and the height h of the ring illumination 7 is changed to change this angle θ and the change in the defect detection rate is measured. did.

In addition, in Figures 16 to 22, ◎, O1△, and X indicate the degree of defect detection rate. When the state is appropriate, △ indicates that detection is somewhat difficult, and × indicates that detection is difficult.

Figure 16 shows the experimental results of detecting voids on the package surface as shown in Figure 9 (a) or (b). A sample was prepared, and the defect detection rate was inspected using a recognized image on the monitor 25 in the range of θ=12.3° to 40.9°. As a result, as shown in the same figure, the voids were clearly detectable when θ was between 12° and 3°, but between 27.5 and 3°.
Detection was difficult between 3.0° and impossible to detect above 39.1°. As a result, it has been found that in detecting voids on the package surface, the detection rate is higher when θ is small, that is, when h is placed at a relatively high position.

FIG. 17 shows the case of detecting a scratch defect as shown in FIG. 8 (1). In this case, as shown in the same figure, a narrow It became clear that the detection rate was high within this range.

Fig. 18 shows the detection of a dent defect as shown in Fig. 8 (g). The range of
In other words, it has been found that the failure detection rate can be increased by arranging the ring illumination 7 at a position lowered and closer to the semiconductor device 11 so that the value of h is small.

Figure 19 shows the detection of the resin flash failure shown in Figure 8 (Company), and this type of inspection item is 12.3.
A high detection rate was obtained over a relatively wide range of 33,0° to 33,0°.

FIG. 20 shows changes in the detection rate of mold scratch defects (FIG. 9 (g)) on the package of the semiconductor device 11, and for the inspection item,
The detection rate in the @ range is high.

FIG. 21 shows changes in the detection rate of mold foreign matter adhesion (FIG. 9(C)) on the package of the semiconductor device 11, and according to the figure, θ=12.3° to 40.9°. Appropriate detection rates were generally maintained within this range.

FIG. 22 shows marking defects on the surface of the package in the semiconductor device 11, and shows marking defects of 22.1° to 40.9°.
A high detection rate was obtained within the range of .

As shown in Figures 16 to 22 above, the range of angle θ that provides a high detection rate differs depending on each test item, and the angle θ is set so that the highest detection rate can be obtained for each test item. I can understand what is needed.

As explained above, the setting of the angle θ is the 151st!
This is possible by changing the height h shown in l. On the right, in FIG. 15, the ring illumination 7 is moved up and down to change the height h, and the angle θ is changed accordingly, but the present invention is not limited to this, as described in FIG. It is also possible to prepare large-diameter and small-diameter ring lights 7a and 7b and change the angle θ in two or several stages by switching between these lights.

Furthermore, in addition to the above, a structure may be adopted in which a plurality of ring lights 7 are provided at positions with different heights h, and the angle θ is changed in stages by switching and controlling these lights.

Although the invention made by the present inventor has been specifically explained above based on Examples, it goes without saying that the present invention is not limited to the above Examples and can be modified in various ways without departing from the gist thereof. Nor. For example, as a change in illumination conditions, we have explained the case where the irradiation angle of the illumination light source with respect to the object to be inspected is changed, but this is not limited to this, and it is also possible to change other illumination conditions, such as changing the amount of illumination light. good.

In the above explanation, the invention made by the present inventor was mainly applied to the field of application, which is the visual inspection technology after package assembly in semiconductor device manufacturing, but the present invention is not limited to this, and for example, It can be widely applied to visual inspection of semiconductor wafers and other electronic components.

〔Effect of the invention〕

A brief explanation of the effects obtained by typical inventions disclosed in this application is as follows.

In other words, by making it possible to set the optimal lighting conditions for various inspection items, the defect detection rate does not change even when inspecting parts with different light reflectances, and it is possible to always maintain high accuracy. Detection can be performed.

[Brief explanation of drawings]

FIG. 1 is an explanatory diagram showing an optical system of a visual inspection apparatus that is an embodiment of the present invention, FIG. 2 is a block diagram showing its processing system, and FIG. 3 is a perspective view showing an illumination light source in the above embodiment. FIG. 4 is an explanatory diagram showing the state of change due to movement of the illumination light source, FIG. 5 is a sectional view showing the cross-sectional structure of the ring illumination, and FIG. 6 is for explaining the procedure for moving the object to be inspected in this example. 7 is a perspective view showing the external appearance of the device configuration, and FIG. 8(a) to
(r) is an explanatory diagram specifically showing defective items in the lead part to be inspected, and FIGS. 9(a) to (1) are explanatory diagrams specifically showing defective items in the mold part to be inspected, respectively. , FIGS. 10(a) to (C) are explanatory diagrams specifically showing defective items in the markings on the surface of the package to be inspected, and FIG. 11 is the movement of the object to be inspected within the visual inspection apparatus of the example. Explanatory diagrams specifically showing the procedure, FIGS. 12(a) and (5) are cross-sectional views showing the mechanism of the lead flatness correction section of the example, and FIGS. 13(a) to (d) are diagrams of each inspection section. An explanatory diagram showing the positional relationship between the object to be inspected and the inspection head, FIG. 14 is an explanatory diagram showing the optical system inside the inspection head in the example, and FIG. 15 is an optical diagram for explaining the experimental results of this example. An explanatory diagram showing the arrangement of the system, ring illumination, and a semiconductor device as an object to be inspected, and Figures 16 to 22 are diagrams showing defects in each inspection item obtained through experiments by the inventor for the purpose of explaining examples. FIG. 3 is an explanatory diagram showing the relationship between detection accuracy (vertical axis) and incident angle θ of illumination light (horizontal axis). DESCRIPTION OF SYMBOLS 1... Appearance inspection device, 2... Device body, 3... Control unit, 4... Printer device, 5... Display,
7...Ring lighting, 7a...Ring lighting, 7b...
- Ring lighting, 8... Lamp house, 9... Positioning unit, 10... Optical fiber cable, 11... Semiconductor device, 13... TV camera, 14... A/D conversion unit, 15...Memory, 16...Detection unit, 17...
Loader/unloader, 18... Lead flatness correction section,
DESCRIPTION OF SYMBOLS 19... Multi-value conversion part, 20... Lead, 21... Inspection part, 21a... First inspection part, 21b... Second inspection part, 21c... Third inspection part, 21d ... Fourth inspection section, 22... Conveyance section, 23... Drive mechanism control section, 24
... Image processing section, 25 ... Monitor, 26 ... Storage tray, 27 ... Push-up mechanism, 28 ... Push-down mechanism, 3
0... Vacuum suction port, 31... Adsorption stage, 32...
...Lead presser, 33...Pushing die, 34...Pushing die, 35...Inspection head, 36...Lens, 37...
- Galvano mirror 38... Light reception, l, 40... Galvano mirror control unit, 41... Optical system, θ... Incident angle. Agent: Daiwa Tsutsui, Patent Attorney Figure 2, 11 pages of engraving, Figure 7; engraving of Figure 7; Engraving of drawings (C) (d) Fig. 14 Fig. Fig. 17 Fig. 18 Fig. 19 Fig. 20 Fig. 22 Drawing procedure amendment (method) % formula % Name of invention Visual inspection method and device 3゜Relationship name with the person making the amendment (510)

Claims (1)

[Claims] 1. A visual inspection in which an object to be inspected is irradiated with illumination light and the external appearance is inspected using the reflected light, and the illumination conditions are varied to be optimized for various inspection items. An appearance inspection method characterized by making it possible to set a lighting condition. 2. The external appearance inspection method according to claim 1, wherein the illumination conditions are changed by continuously changing the irradiation angle of the illumination light source with respect to the object to be inspected. 3. The external appearance inspection method according to claim 1, wherein the change in the illumination conditions is carried out by changing stepwise the irradiation angle of the illumination light source with respect to the object to be inspected. 4. When performing a variety of inspection items by changing various parameters prepared in advance for setting the illumination conditions of the illumination light source for a given object to be inspected, it is possible to differentiate the inspection items from completely defective items and reproducible defects. An appearance inspection method characterized by dividing the items into two, and inspecting completely defective items and then inspecting recyclable defective items. 5. An illumination light source that is movable relative to the object to be inspected, and a control means that sets the position of the object to be inspected and the illumination light source to a predetermined optimum value in accordance with changes in two or more inspection items. Equipped with visual inspection equipment. 6. Two or more illumination light sources that can be switched to illuminate the object to be inspected, and control to select and illuminate the optimal illumination light source from among the two or more illumination light sources according to changes in two or more inspection items. Appearance inspection device comprising means. 7. The appearance inspection apparatus according to claim 6, wherein the two or more illumination light sources are two or more ring lights arranged with respect to the object to be inspected and having different ring diameters. 8. The appearance inspection apparatus according to claim 6, wherein the two or more illumination light sources are two or more ring lights at different height positions with respect to the object to be inspected. 9. It has two or more image input units each equipped with an illumination light source, an optical system, and a surface image recognition means, and each image input unit receives a recognized image from the object to be inspected recognized by a different illumination arrangement. Appearance inspection device characterized by obtaining.