JPH02253576A - Manufacture of square-shaped chip jumper wire - Google Patents

Abstract

PURPOSE:To make the manufacture easier by carrying out the printing of the terminal electrodes at the upper surface and the lower surface of a thin alumina base plate and the printing of the wiring simultaneously. CONSTITUTION:After a through hole is formed at a thin alumina base plate 1 with the thickness 0.05mm-0.2mm, a conductor paste is printed by a screen painting. By screen-painting the upper surface while vacuum-absorbing from the lower surface of the plate 1 in the printing process, the upper surfaces 2 and 4, or the lower surface 3 and the wall surface 5 are printed simultaneously. Then, after the plate 1 is baked up, the longitudinal direction is cut along the center line of the through hole, to obtain a square-shaped chip jumper wire. In such a way, a thin type and light weight square-shaped chip jumper wire can be manufactured simply.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to a method for manufacturing a rectangular chip jumper wire used as a cross-over part in multilayer wiring, and more specifically, a method for manufacturing a rectangular chip jumper wire using a thin alumina substrate. The present invention relates to a method of manufacturing a rectangular chip jumper wire that is thin, lightweight, and easy to manufacture.

[Conventional technology] As semiconductor devices become faster and more dense, the substrates on which these electronic components are mounted are also becoming more dense, smaller, and thinner.
For this reason, substrates have become multilayered.

With this multilayering, it is necessary to cross over wiring in a hybrid IC, and the following methods (1) to (5) and the like are conventionally known as methods for this purpose.

(1) Form wiring in a detour to avoid crossover.

(2) Utilizing the space above the wiring, the wiring is suspended in space and crossed.

(3) Print glass on top of the wiring, and print intersecting wiring on its surface.

(4) Direct contact with the wiring is avoided by printing the wiring so as to intersect with the through holes formed on both sides of the wiring and the back surface of the substrate.

(5) Equipped with a square zero ohm resistance chip.

[Problems to be Solved by the Invention] However, such conventional techniques have the following problems.

In method (1), as the density of the substrate increases, the wiring distance becomes longer because the wiring is detoured, which impairs the densification.

Method (2) not only becomes a hindrance to mounting components on the top surface, but also tends to cause wires in crossed wiring to deform and short-circuit with lower wiring, or to cause disconnection due to disconnection of contacts, etc.

In the method (3), the number of printing steps for glass, wiring, etc. is increased, which increases the cost, and furthermore, it becomes complicated to manage the thickness of the glass layer to manage the capacity of the wiring.

Method (4) increases costs because it requires additional steps such as drilling through holes on the board, printing the walls of the through holes to make them conductive, and printing wiring on the back side.

In method (5), since the thickness of the square chip component (zero ohm resistance chip) is thick, the manufacturing process of the component is complicated;
Furthermore, since the rectangular chip component is thick, there are restrictions on mounting components on the top.

Therefore, as a result of various studies regarding the above-mentioned problem, the inventor of the present invention found that by improving the method (5) above, it is possible to easily manufacture, and also achieve thinner and lighter weight. The invention was made based on this knowledge.

Therefore, an object of the present invention is to provide a rectangular chip jumper that is thinner and lighter, which eliminates the complexity of the manufacturing method, is simple to manufacture, and has no restrictions on mounting components on the top. The object of the present invention is to provide a method for manufacturing wires.

[Means for Solving the Problems] The object of the present invention is to provide a method for manufacturing a rectangular chip jumper wire in which conductive paste is printed on the upper surface, lower surface and through-hole wall surface of a thin alumina substrate of 0.05 ma+ to 0.2 mm. A method for manufacturing a rectangular chip jumper wire, characterized by comprising the following steps (a) to (d).

(B) A process of using a thin alumina substrate of 0.05 mm to 0.2 mm as a substrate, (B) A process of forming through holes for electrode connection on the alumina substrate, (C) Alumina substrate having the obtained through holes. A step of forming terminal electrodes and wiring conductors on the upper surface, lower surface, and wall surface of the through hole at the same time. (d) Then, cutting the alumina substrate obtained in step (c) along the center line of the through hole. This was achieved by the step of forming a terminal electrode section.

Next, the present invention will be explained in more detail.

The rectangular chip jumper wire used in the present invention is a thin film,
Although any thick film can be formed, it is preferably formed using thick film techniques.

As the insulating substrate used for the square chip jumper wire, a thin alumina substrate is preferable, and its thickness is 0.05 m.
The range of mN0.2■■ is good; if it is less than O.05u+m, the mechanical strength will not be sufficient, and if it exceeds 0.2 mm, it will not be possible to achieve a reduction in thickness and weight.

In the present invention, terminal electrodes are provided on both sides of the substrate, and these are connected in advance through through holes. This connection is printed by screen printing, and the terminal electrodes and wiring are printed on the top and bottom surfaces of the alumina substrate at the same time.
Since the alumina substrate is thus thin, the terminal electrodes, wiring, and walls of the through holes are printed at the same time, which greatly simplifies the manufacturing process.

For the general means and baking of the conductive paste used in the present invention, ordinary thick film manufacturing techniques are used, and it is particularly preferable to use a screen printing method as the printing method.

The conductor portion or wiring portion on the upper surface of the rectangular chip jumper wire used in the present invention may further have a protective film, and as the protective film, for example, a glass coat or the like is used, but these materials are usually It is used in this technical field.

[Action of the present invention] Since the alumina substrate has high strength, its thickness can be reduced. Taking advantage of this advantage, printing terminal electrodes and wiring on the upper and lower surfaces of the substrate can be performed at the same time to create a rectangular shape. Chip jumper wires can be easily manufactured.

[Example] Next, the present invention will be described in more detail with reference to the drawings, but this is one embodiment of the present invention, and the present invention is not limited thereto.

Embodiment FIG. 1 is a front view showing a rectangular chip jumper wire manufactured by the manufacturing method of the present invention, in which 1 is an alumina substrate, 2 and 3 are terminal electrodes, 4 is a wiring conductor, and 5 is a through hole. 6 is a connection portion between the electrode on the upper surface and the electrode on the lower surface, and is printed with a conductive paste. 2 is a sectional view of the rectangular chip jumper wire of FIG. 1.

Hereinafter, the method for manufacturing a rectangular chip jumper wire according to the present invention will be explained in detail with reference to FIG.

First, as shown in FIG. 2, a dense alumina substrate 1 with a thickness of 0.2 mm is used as a substrate, and after forming through holes in this alumina substrate 1,
Copper conductor paste (60%
01, manufactured by DuPont) was printed. During printing, by screen printing the upper surface of the substrate while vacuum suctioning from below, the conductor paste was sucked and the wall surface 5 of the through hole was also printed. As a result, the top surfaces 2 and 4 or the bottom surface 3 and wall surface 5 are printed at the same time. The substrate was fired in a nitrogen atmosphere at a firing peak temperature of 600° C. for 5 minutes and a total time of 30 minutes. The thus obtained substrate was cut in the vertical direction along the center line of the through hole to obtain a square chip jumper wire.

[Effects of the Invention] According to the present invention, a rectangular chip jumper wire that is thinner and lighter can be easily manufactured by the manufacturing method described in the claims, and a board using the wire can be used for this rectangular chip jumper wire. It was possible to mount electronic components even on the wires, making it possible to achieve high density layers.

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a front view showing a rectangular chip jumper wire manufactured by the manufacturing method of the present invention, and FIG.
FIG. 2 is a cross-sectional view of the square chip jumper wire of FIG. 1; Explanation of symbols 1... Alumina substrate 2.3... Terminal electrode 4...
Wiring or wiring conductor 5... Opening or wall surface formed from a through hole 6... Connecting part or conductor Fig. 1 Fig. 2

Claims (1)

[Claims] The upper surface of a thin alumina substrate of 0.05 mm to 0.2 mm,
In the manufacturing method of square chip jumper wire in which conductive paste is printed on the bottom surface and the wall surface of the through hole, the following (a)
A method for manufacturing a rectangular chip jumper wire, characterized by comprising the steps of (d). (B) A process of using a thin alumina substrate of 0.05 mm to 0.2 mm as a substrate, (B) A process of forming through holes for electrode connection on the alumina substrate, (C) Alumina substrate having the obtained through holes. Step of forming terminal electrodes and wiring conductors on the upper surface, lower surface, and wall surface of the through hole at the same time; (d) Then, cutting the alumina substrate obtained in step (c) along the center line of the through hole. a step of forming a terminal electrode part;