JPH02241692A - Cream solder and method for packaging electronic parts by using this solder - Google Patents
Cream solder and method for packaging electronic parts by using this solderInfo
- Publication number
- JPH02241692A JPH02241692A JP6245389A JP6245389A JPH02241692A JP H02241692 A JPH02241692 A JP H02241692A JP 6245389 A JP6245389 A JP 6245389A JP 6245389 A JP6245389 A JP 6245389A JP H02241692 A JPH02241692 A JP H02241692A
- Authority
- JP
- Japan
- Prior art keywords
- cream solder
- solder
- acrylate
- electronic parts
- meth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 58
- 239000006071 cream Substances 0.000 title claims abstract description 39
- 238000000034 method Methods 0.000 title claims description 12
- 238000004806 packaging method and process Methods 0.000 title abstract 2
- 239000000853 adhesive Substances 0.000 claims abstract description 15
- 230000001070 adhesive effect Effects 0.000 claims abstract description 13
- 230000004907 flux Effects 0.000 claims abstract description 12
- 239000002245 particle Substances 0.000 claims abstract description 12
- 239000002904 solvent Substances 0.000 claims abstract description 7
- 238000010438 heat treatment Methods 0.000 claims description 2
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 2
- 238000001704 evaporation Methods 0.000 abstract description 2
- 230000008020 evaporation Effects 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 25
- 239000000178 monomer Substances 0.000 description 17
- -1 flux Substances 0.000 description 12
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 8
- 239000002313 adhesive film Substances 0.000 description 7
- 125000005395 methacrylic acid group Chemical group 0.000 description 7
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 241000287828 Gallus gallus Species 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 2
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 2
- 239000012965 benzophenone Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 2
- 238000002156 mixing Methods 0.000 description 2
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 2
- AEENFMCEQQAULS-UHFFFAOYSA-N 1-ethoxyprop-1-yne Chemical compound CCOC#CC AEENFMCEQQAULS-UHFFFAOYSA-N 0.000 description 1
- 239000012956 1-hydroxycyclohexylphenyl-ketone Substances 0.000 description 1
- OAMHTTBNEJBIKA-UHFFFAOYSA-N 2,2,2-trichloro-1-phenylethanone Chemical compound ClC(Cl)(Cl)C(=O)C1=CC=CC=C1 OAMHTTBNEJBIKA-UHFFFAOYSA-N 0.000 description 1
- BTJPUDCSZVCXFQ-UHFFFAOYSA-N 2,4-diethylthioxanthen-9-one Chemical compound C1=CC=C2C(=O)C3=CC(CC)=CC(CC)=C3SC2=C1 BTJPUDCSZVCXFQ-UHFFFAOYSA-N 0.000 description 1
- HLIQLHSBZXDKLV-UHFFFAOYSA-N 2-(2-hydroxyethoxy)-1-phenoxyethanol Chemical compound OCCOCC(O)OC1=CC=CC=C1 HLIQLHSBZXDKLV-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- FPKCTSIVDAWGFA-UHFFFAOYSA-N 2-chloroanthracene-9,10-dione Chemical compound C1=CC=C2C(=O)C3=CC(Cl)=CC=C3C(=O)C2=C1 FPKCTSIVDAWGFA-UHFFFAOYSA-N 0.000 description 1
- XMLYCEVDHLAQEL-UHFFFAOYSA-N 2-hydroxy-2-methyl-1-phenylpropan-1-one Chemical compound CC(C)(O)C(=O)C1=CC=CC=C1 XMLYCEVDHLAQEL-UHFFFAOYSA-N 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DHKHKXVYLBGOIT-UHFFFAOYSA-N acetaldehyde Diethyl Acetal Natural products CCOC(C)OCC DHKHKXVYLBGOIT-UHFFFAOYSA-N 0.000 description 1
- 150000001241 acetals Chemical class 0.000 description 1
- 230000003712 anti-aging effect Effects 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- MQDJYUACMFCOFT-UHFFFAOYSA-N bis[2-(1-hydroxycyclohexyl)phenyl]methanone Chemical compound C=1C=CC=C(C(=O)C=2C(=CC=CC=2)C2(O)CCCCC2)C=1C1(O)CCCCC1 MQDJYUACMFCOFT-UHFFFAOYSA-N 0.000 description 1
- 238000009835 boiling Methods 0.000 description 1
- 125000006226 butoxyethyl group Chemical group 0.000 description 1
- 239000004359 castor oil Substances 0.000 description 1
- 235000019438 castor oil Nutrition 0.000 description 1
- 238000003776 cleavage reaction Methods 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000006356 dehydrogenation reaction Methods 0.000 description 1
- ISAOCJYIOMOJEB-UHFFFAOYSA-N desyl alcohol Natural products C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 125000005448 ethoxyethyl group Chemical group [H]C([H])([H])C([H])([H])OC([H])([H])C([H])([H])* 0.000 description 1
- ZEMPKEQAKRGZGQ-XOQCFJPHSA-N glycerol triricinoleate Natural products CCCCCC[C@@H](O)CC=CCCCCCCCC(=O)OC[C@@H](COC(=O)CCCCCCCC=CC[C@@H](O)CCCCCC)OC(=O)CCCCCCCC=CC[C@H](O)CCCCCC ZEMPKEQAKRGZGQ-XOQCFJPHSA-N 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 1
- 229910052753 mercury Inorganic materials 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 230000007017 scission Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3431—Leadless components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、印刷配線板に電子部品を半田付けにする際に
用いられるクリーム半田とそれを用いた電子部品の実装
方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a cream solder used for soldering electronic components to a printed wiring board and a method for mounting electronic components using the cream solder.
従来の技術
クリーム半田は、大きくは、半田粒子とフラックスと溶
剤とからなるものであり、チップ形電子部品を印刷配線
板に半田付けする際に用いられる。BACKGROUND OF THE INVENTION Conventional cream solder mainly consists of solder particles, flux, and solvent, and is used when soldering chip-shaped electronic components to printed wiring boards.
第２図（ａ）、 （ｂ）、 （Ｃ）に従来のクリーム半
田を使用した電子部品の実装工程を示す。FIGS. 2(a), 2(b), and 2(C) show the mounting process of electronic components using conventional cream solder.
まず、デイスペンサーあるいは印刷機により印刷配線板
１の電極部位２にクリーム半田３を塗布しく第２図（ａ
））、次にチップ形電子部品４を装着したのち（第２図
（ｂ））、リフロー半田付は工程においてクリーム半田
３を加熱溶融させ、ついで冷却固化させることによって
電子部品４を実装する。このようにクリーム半田はチッ
プ形電子部品４を印刷配線板１に半田付けするのに使用
される。First, apply cream solder 3 to the electrode parts 2 of the printed wiring board 1 using a dispenser or a printing machine.
)) Next, after mounting the chip-shaped electronic component 4 (FIG. 2(b)), the electronic component 4 is mounted by heating and melting the cream solder 3 in the reflow soldering process and then cooling and solidifying it. In this way, the cream solder is used to solder the chip-shaped electronic component 4 to the printed wiring board 1.
また、クリーム半田は、チップ形電子部品を仮固着する
力が弱いため、その組成分中に、接着荊を混入して、そ
の仮固着力を増す方法（特開昭６２−１３４１９号公報
）がある。この方法におけるクリーム半田は、塗布後一
定期間で硬化するか、または、ある温度以下になると硬
化するものである。In addition, cream solder has a weak ability to temporarily fix chip-shaped electronic components, so there is a method (Japanese Unexamined Patent Application Publication No. 13419/1983) of increasing the temporary fixing force by mixing an adhesive into its composition. be. The cream solder used in this method hardens within a certain period of time after being applied, or hardens when the temperature drops below a certain temperature.
発明が解決しようとする課題
しかしながら、この方法では、その仮固着力は硬化時間
および硬化温度の違いによって、ばらつきを生じやすく
不安定であり、完全に電子部品のずれを防止することが
できない。また、粉末状半田を含んだまま硬化するため
に、粉末状半田が溶融して凝集した際に、内部に接着剤
が残存して、電気的導通の不良を招く恐れがある。また
、電子部品の装着前に保温が必要であり、工程が複雑と
なる。Problems to be Solved by the Invention However, with this method, the temporary fixing force tends to vary and is unstable due to differences in curing time and curing temperature, and it is not possible to completely prevent the electronic component from slipping. Further, since the adhesive is cured while containing the powdered solder, when the powdered solder melts and aggregates, the adhesive may remain inside, resulting in poor electrical continuity. Furthermore, it is necessary to keep the electronic parts warm before mounting them, which complicates the process.
また、通常のクリーム半田においては、印刷配線板上に
塗布されたのち、半田付けされるまでの間に、長時間放
置されると、その組成分中の溶剤が蒸発したり、フラッ
クスが酸化したりして、フラックスの活性度が低下する
ため、半田付は不良を生じる。In addition, if normal cream solder is left for a long time after it is applied to a printed wiring board and before it is soldered, the solvent in its composition may evaporate or the flux may oxidize. As a result, the activity of the flux decreases, resulting in poor soldering.
課題を解決するための手段
本発明によるクリーム半田は、紫外線を照射することに
より粘着性を発現する粘着剤成分と半田粒子と溶剤とフ
ラックスとを含有していることを特徴とする。Means for Solving the Problems The cream solder according to the present invention is characterized in that it contains an adhesive component that develops tackiness when irradiated with ultraviolet rays, solder particles, a solvent, and a flux.
この粘着剤成分としては、単官能アクリル系モノマーお
よびプレポリマー、または単官能メタクリル系モノマー
およびプレポリマー、または多官能アクリル系モノマー
およびプレポリマーまたは多官能メンクリル系モノマー
およびプレポリマーの少なくしも１つのモノマーにより
構成するのが好ましい。This adhesive component includes at least one of a monofunctional acrylic monomer and prepolymer, a monofunctional methacrylic monomer and prepolymer, a polyfunctional acrylic monomer and prepolymer, or a polyfunctional mencryl monomer and prepolymer. Preferably, it is composed of monomers.
単官能アクリル系モノマーおよびプレポリマー、及び単
官能メタクリル系モノマーおよびプレポリマーとしては
、メトキシエチル（メタ）アクリレート、メトキシプロ
ピル（メタ）アクリレート、エトキシエチル（メタ）ア
クリレート、エトキシプロピン（メタ）アクリレート、
ブトキシエチル（メタ）アクリレート、ブトキシプロピ
ル（メタ）アクリレート、フェノキシエチル（メタ）ア
クリレート、フェノキシプロピル（メタ）アクリレート
、フェノキシエチル（メタ）アクリレート、ノニルフェ
ノキシプロビル（メタ）アクリレート、ベンゾイルオキ
シエチル（メタ）アクリレート、フェノキシジエチレン
グリコール（メタ）アクリレート、２−ヒドロ−３−フ
ェノキシプロピル（メタ）アクリレート等が利用可能で
ある。Monofunctional acrylic monomers and prepolymers, and monofunctional methacrylic monomers and prepolymers include methoxyethyl (meth)acrylate, methoxypropyl (meth)acrylate, ethoxyethyl (meth)acrylate, ethoxypropyne (meth)acrylate,
Butoxyethyl (meth)acrylate, butoxypropyl (meth)acrylate, phenoxyethyl (meth)acrylate, phenoxypropyl (meth)acrylate, phenoxyethyl (meth)acrylate, nonylphenoxypropyl (meth)acrylate, benzoyloxyethyl (meth)acrylate Acrylate, phenoxydiethylene glycol (meth)acrylate, 2-hydro-3-phenoxypropyl (meth)acrylate, etc. can be used.
多官能アクリル系モノマー及びプレポリマー及び多官能
性メタクリル系モノマーおよびプレポリマーとしては、
ポリエチレングリコールジ（メタ）アクリレート、ポリ
ブロビレングリコールジ（メタ）アクリレート、ネオペ
ンチルグリコール（メタ）アクリレート、１，６−へキ
サジオールジ（メタ）アクリレート、ペンタエリスリト
ールトリ（メタ）アクリレート、トリメチロールプロパ
ントリ（メタ）アクリレート、ジペンタエリスリトール
ヘキサ（メタ）アクリレート、１．４−ブタンジオール
ジ（メタ）アクリレート、アセタールグリコールジ（メ
タ）アクリレート、アリール（メタ）アクリレート等が
利用可能である。As polyfunctional acrylic monomers and prepolymers and polyfunctional methacrylic monomers and prepolymers,
Polyethylene glycol di(meth)acrylate, polybrobylene glycol di(meth)acrylate, neopentyl glycol (meth)acrylate, 1,6-hexadiol di(meth)acrylate, pentaerythritol tri(meth)acrylate, trimethylolpropane tri( Usable are meth)acrylate, dipentaerythritol hexa(meth)acrylate, 1,4-butanediol di(meth)acrylate, acetal glycol di(meth)acrylate, aryl(meth)acrylate, and the like.
また、上記粘着剤成分には光開始剤を添加する必要があ
り、その光開始剤としては、分子開裂型のものや水素引
抜き型のものが有効である。分子開裂型のものとしては
、ベンゾインアルキルエーテル、ベンジルジメチルケタ
ール、１−ハイドロオキシシクロへキシルフェニルケト
ン、２−ハイドロオキシ−２−メチル−１−フェニルプ
ロパン−１−オン２ジエトキシアセトフエノン、トリク
ロロアセトフェノン等が利用可能である。水素引抜き型
のものとしては、ベンゾフェノン、２，４−ジエチルチ
オキサントン、ベンジル、２−アルキルアントラキノン
、２−クロロアントラキノン等が利用可能である。Furthermore, it is necessary to add a photoinitiator to the adhesive component, and effective photoinitiators include molecular cleavage type and hydrogen abstraction type. Examples of molecularly cleaved types include benzoin alkyl ether, benzyl dimethyl ketal, 1-hydroxycyclohexylphenyl ketone, 2-hydroxy-2-methyl-1-phenylpropan-1-one 2-diethoxyacetophenone, Trichloroacetophenone and the like can be used. As the hydrogen abstracting type, benzophenone, 2,4-diethylthioxanthone, benzyl, 2-alkylanthraquinone, 2-chloroanthraquinone, etc. can be used.
フラックスとしては、いずれのタイプのものでもよいが
、好ましくは、有機系の非ロジンまたは、ロジンである
。The flux may be of any type, but is preferably an organic non-rosin or rosin flux.
半田粒子としては、いかなる粒度を有するものでもよ（
、その組成も限定されるものではないが、好ましくは、
平均粒径が１００μｍ以下であり、組成は、Ｓｎ ：
Ｐｂ＝６３ ： ３７である。Solder particles may have any particle size (
, although its composition is not limited, preferably,
The average particle size is 100 μm or less, and the composition is Sn:
Pb=63:37.
溶剤としては、いかなるものでもよいが、好ましくは、
１００℃以上の沸点を有するものが望ましい。Any solvent may be used, but preferably,
It is desirable to have a boiling point of 100°C or higher.
また、低粘度で、ダレ防止をするため、チキン性付与剤
を加えるのが好ましい。チキン性付与剤としては、いか
なるものでもよいが、好ましくは、水添ヒマシ油系であ
る。Further, in order to have a low viscosity and prevent sag, it is preferable to add a chicken character imparting agent. Any type of chicken-like agent may be used, but hydrogenated castor oil is preferred.
さらに、クリーム半田の配合量は、単官能アクリル系モ
ノマーまたは単官能メタクリルモノマーまたは多官能ア
クリル系モノマーまたは多官能メタクリル系モノマーの
少なくとも１つを１〜３０重量部、光開始剤を０．００
１〜１０重量部フラックスを０．１〜２０Ｍ量部、半田
粒子を５０〜９８重量部、チキン性付与剤を０．１〜３
０重量部とするのが好適である。さらに、最適の範囲は
、単官能アクリル系モノマーまたは単官能メタクリル系
モノマーまたは多官能アクリル系モノマーまたは多官能
メタクリル系モノマーを５・〜２０重量部、光開始剤を
０．０１〜５Ｍ量部、フラックスを１〜１０重量部半田
粒子を７０〜９５重量部、チキソ性付与剤を１〜２５重
量部である。Furthermore, the amount of the cream solder is 1 to 30 parts by weight of at least one of a monofunctional acrylic monomer, a monofunctional methacrylic monomer, a polyfunctional acrylic monomer, or a polyfunctional methacrylic monomer, and 0.00 parts by weight of a photoinitiator.
1 to 10 parts by weight, 0.1 to 20 M parts of flux, 50 to 98 parts by weight of solder particles, and 0.1 to 3 parts of chicken property imparting agent.
Preferably, the amount is 0 parts by weight. Furthermore, the optimal range is 5. to 20 parts by weight of a monofunctional acrylic monomer, monofunctional methacrylic monomer, or polyfunctional acrylic monomer or polyfunctional methacrylic monomer, 0.01 to 5 M parts of a photoinitiator, The flux is 1 to 10 parts by weight, the solder particles are 70 to 95 parts by weight, and the thixotropic agent is 1 to 25 parts by weight.
さらに、本発明のクリーム半田には、その性能を変えな
い範囲において、添加剤を加えることができる。この添
加剤は、重合禁止剤２分散剤、老化防止剤、顔料等であ
る。Furthermore, additives can be added to the cream solder of the present invention within a range that does not change its performance. The additives include a polymerization inhibitor, a dispersant, an anti-aging agent, and a pigment.
作 用
クリーム半田中に含有されている粘着剤成分が、紫外線
を照射されることにより、厚さ１〜３００μｍ程度の粘
着膜をクリーム半田表面上に生じ、その膜により、外気
とクリーム半田内部の分離を行い、クリーム半田中の成
分の蒸発を防止する。Function When the adhesive component contained in the cream solder is irradiated with ultraviolet rays, an adhesive film with a thickness of about 1 to 300 μm is formed on the surface of the cream solder, and this film makes it possible to connect the outside air with the inside of the cream solder. Separation is performed to prevent the components in the cream solder from evaporating.
また、その粘着膜上にチップ形電子部品を装着すること
により、その粘着力により、印刷配線基板への電子部品
の実装中および搬送中の振動によるチップ形電子部品の
ずれを防止する。Furthermore, by mounting the chip-shaped electronic component on the adhesive film, the adhesive force prevents the chip-shaped electronic component from shifting due to vibrations during mounting and transportation of the electronic component on the printed wiring board.
実施例
第１図（ａ）、 （ｂ）、 （Ｃ）、 （ｄ）に、本発
明のクリーム半田による電子部品の実装を示す。Embodiment FIGS. 1(a), (b), (C), and (d) show mounting of electronic components using cream solder of the present invention.
フェノキシエタルアクリレートを１０重量部、ベンゾフ
ェノンを１重量部、フラックスを５重量部、半田粒子を
８０重量部、チキン性付与剤を４重量部を混合して、ク
リーム半田を作製し、印刷配線板１上の電極２に、厚さ
１０〜１，０００μｍ程度に塗布したのち（第１図（ａ
））、紫外線硬化用高圧水銀ランプ（８０Ｗ ／ ｃｍ
）のランプ下１０備の位置で、１〜５秒間紫外線を照
射する。この結果、クリーム半田３は、約１〜３００μ
工程度の厚さを有する粘着膜５を生じる（第１図（ｂ）
）。Cream solder was prepared by mixing 10 parts by weight of phenoxyethal acrylate, 1 part by weight of benzophenone, 5 parts by weight of flux, 80 parts by weight of solder particles, and 4 parts by weight of chicken property imparting agent, and printed wiring board 1 After coating the upper electrode 2 to a thickness of about 10 to 1,000 μm (see Figure 1 (a)
)), high pressure mercury lamp for ultraviolet curing (80W/cm
), irradiate with ultraviolet rays for 1 to 5 seconds at the position 10 below the lamp. As a result, the cream solder 3 has a thickness of approximately 1 to 300 μm.
An adhesive film 5 having a thickness corresponding to that of the process is formed (Fig. 1(b)).
).
２の粘着膜５は、大気とクリーム半田３の内部を完全に
遮断し、クリーム半田中の成分の揮発を防止する。また
、この粘着膜５は、約１００〜５００ｇ ／ ｃｏｔの
粘着力を有するため、この上に、端子を重ねるようにチ
ップ形電子部品４を装着するとく第１図（Ｃ））、その
粘着力により印刷配線板１の搬送中およびチップ形電子
部品４の装着時の振動によるチップ形電子部品４のずれ
が防止できる。The adhesive film 5 of No. 2 completely blocks the inside of the cream solder 3 from the atmosphere and prevents the components in the cream solder from volatilizing. In addition, since this adhesive film 5 has an adhesive force of about 100 to 500 g/cot, when the chip-shaped electronic component 4 is mounted on it so that the terminals are overlapped (Fig. 1(C)), its adhesive strength is This makes it possible to prevent the chip-shaped electronic component 4 from shifting due to vibrations during transportation of the printed wiring board 1 and during mounting of the chip-shaped electronic component 4.
その後、適当なりフロー装置により半田が加熱溶融させ
れば通常の半田イ１けができる（第１図（ｄ））。その
際、クリーム半田表面の粘着膜５は、加熱されることに
より軟化流動し、電極部分２から流れだすと同時に、半
田粒の凝縮力により、半田内部から排除され、半田内部
には残存せず、電気的導通を疎外しない。Thereafter, if the solder is heated and melted using an appropriate flow device, a normal solder hole can be formed (FIG. 1(d)). At this time, the adhesive film 5 on the surface of the cream solder softens and flows as it is heated, flows out from the electrode part 2, and at the same time is removed from the inside of the solder by the condensation force of the solder particles, and does not remain inside the solder. , do not alienate electrical continuity.
発明の効果
以上のように本発明によるクリーム半田を使用すれば、
クリーム半田の組成が変化するのが防止でき、かつ、搬
送中のチップ形電子部品のずれが防止できるという効果
がある。If the cream solder according to the present invention is used, the effects of the invention are as follows.
This has the effect of preventing the composition of the cream solder from changing and also preventing the chip-shaped electronic component from shifting during transportation.
第１図（ａ）、 （ｂ）、 （ｃ）、 （ｄ）は、本発
明の実施例におけるクリーム半田を用いた印刷配線板へ
のチップ形電子部品の実装工程を示す断面図、第２図（
ａ）。
（ｂ）、 （ｅ）は、従来の印刷配線板へのチップ形電
子部品の実装工程を示す断面図である。
１・・・・・・印刷配線基板、２・・・・・・電極、３
・・・・・・クリーム半田、４・・・・・・チップ形電
子部品、５・・・・・・粘着膜。
ｆ−一一印セｊか一基板
第
図1(a), (b), (c), and (d) are cross-sectional views showing the mounting process of a chip-shaped electronic component on a printed wiring board using cream solder in an embodiment of the present invention; figure(
a). (b) and (e) are cross-sectional views showing a conventional mounting process of a chip-shaped electronic component on a printed wiring board. 1...Printed wiring board, 2...Electrode, 3
...Cream solder, 4...Chip type electronic component, 5...Adhesive film. f-11 mark sejka1 board diagram
Claims (2)
着剤成分と半田粒子と溶剤とフラックスとを含有してい
ることを特徴とするクリーム半田。(1) A cream solder characterized by containing an adhesive component, solder particles, a solvent, and a flux that develops adhesiveness when irradiated with ultraviolet rays.
着剤成分と半田粒子と溶剤とフラックスとを含有したク
リーム半田を印刷配線板の電極に塗布する工程と、該ク
リーム半田の表面に紫外線を照射する工程と、該クリー
ム半田の上に電子部品の端子を重ねるようにして載置す
る工程と、加熱により該クリーム半田を溶融して前記印
刷配線板の電極と前記電子部品の端子とを半田付けする
ことを特徴とする電子部品の実装方法。(2) A step of applying cream solder containing an adhesive component, solder particles, a solvent, and a flux that develops adhesiveness when irradiated with ultraviolet rays to the electrodes of a printed wiring board, and irradiating the surface of the cream solder with ultraviolet rays. a step of irradiating, a step of placing the terminals of the electronic component in an overlapping manner on the cream solder, and a step of melting the cream solder by heating to solder the electrodes of the printed wiring board and the terminals of the electronic component. A method for mounting electronic components, characterized by attaching the components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6245389A JPH02241692A (en) | 1989-03-15 | 1989-03-15 | Cream solder and method for packaging electronic parts by using this solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6245389A JPH02241692A (en) | 1989-03-15 | 1989-03-15 | Cream solder and method for packaging electronic parts by using this solder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02241692A true JPH02241692A (en) | 1990-09-26 |
Family
ID=13200642
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6245389A Pending JPH02241692A (en) | 1989-03-15 | 1989-03-15 | Cream solder and method for packaging electronic parts by using this solder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02241692A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009540598A (en) * | 2006-06-15 | 2009-11-19 | ジュン ベ，サン | Method of forming solder bump using solder paste and solder paste |
| JP2015139821A (en) * | 2014-01-30 | 2015-08-03 | 株式会社タムラ製作所 | Acrylic resin-containing flux for soldering, and solder paste composition |
-
1989
- 1989-03-15 JP JP6245389A patent/JPH02241692A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2009540598A (en) * | 2006-06-15 | 2009-11-19 | ジュン ベ，サン | Method of forming solder bump using solder paste and solder paste |
| JP2015139821A (en) * | 2014-01-30 | 2015-08-03 | 株式会社タムラ製作所 | Acrylic resin-containing flux for soldering, and solder paste composition |
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