JPH02239575A - Terminal connection structure for microwave unit - Google Patents
Terminal connection structure for microwave unitInfo
- Publication number
- JPH02239575A JPH02239575A JP5911589A JP5911589A JPH02239575A JP H02239575 A JPH02239575 A JP H02239575A JP 5911589 A JP5911589 A JP 5911589A JP 5911589 A JP5911589 A JP 5911589A JP H02239575 A JPH02239575 A JP H02239575A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- printed board
- microwave
- integrated circuit
- coil
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052751 metal Inorganic materials 0.000 claims description 15
- 239000002184 metal Substances 0.000 claims description 15
- 238000005192 partition Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 abstract description 14
- 239000004020 conductor Substances 0.000 abstract description 12
- 230000007613 environmental effect Effects 0.000 abstract description 7
- 238000006073 displacement reaction Methods 0.000 abstract description 5
- 238000005476 soldering Methods 0.000 abstract description 4
- 238000005336 cracking Methods 0.000 abstract description 3
- 239000006096 absorbing agent Substances 0.000 description 6
- 230000008602 contraction Effects 0.000 description 5
- 239000000758 substrate Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 210000004907 gland Anatomy 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 229920003002 synthetic resin Polymers 0.000 description 2
- 239000000057 synthetic resin Substances 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910000990 Ni alloy Inorganic materials 0.000 description 1
- KGWWEXORQXHJJQ-UHFFFAOYSA-N [Fe].[Co].[Ni] Chemical compound [Fe].[Co].[Ni] KGWWEXORQXHJJQ-UHFFFAOYSA-N 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
- Connections Arranged To Contact A Plurality Of Conductors (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
Description
【発明の詳細な説明】
〔概要〕
マイクロ波ユニットの端子接続構造の改造に関し、
環境温度の変化に対して、マイクロ波集積回路とプリン
ト板との接続の信軌度が高い、マイクロ波ユニットの端
子接続構造を提供することを目的とし、
金属ケース内の中間板により、マイクロ波集積回路を実
装するマイクロ波回路部と、プリント板を実装する中間
周波数回路部とに仕切り、該マイクロ波集積回路の端子
を介して、該マイクロ波集積回路と該プリント板とを接
続するよう構成したマイクロ波ユニットにおいて、該端
子に外嵌するコイル部と、該コイル部の一方の端末が軸
心に直交する方向に延伸されてなる直線部とで、構成し
たばね形導線を用い、該プリント板の孔に該端子の先端
部を遊挿貫通させ、該プリント板の下面より突出した該
端子の先端部に該コイル部が外嵌し、コイル端末部が端
子先端に、該直線部が該プリント板のパターンに、それ
ぞれ半田付けされてなる構成とする．
〔産業上の利用分野〕
本発明は、マイクロ波ユニットの端子接続構造の改造に
関する．
通信装置には、受信したマイクロ波信号を一度中間周波
数信号に変換し、中間周波数増幅器で増幅した後、再び
マイクロ波信号に変換して送信するという増幅機能を備
えたマイクロ波ユニット，或いは周波数変換機能を備え
たマイクロ波ユニット等が使用されている．
〔従来の技術〕・
第３図は上述のようなマイクロ波ユニットの断面図であ
って、１は、例えばアルミニウム等よりなる平形の金属
ケースである。金属ケース１の空間をケース側壁と一体
形成した中間板２により、マイクロ波集積回路５等を実
装するマイクロ波回路部Ｈと、基板上にマイクロ波集積
回路の増幅回路，ｔ源回路等を設けたプリント板１５を
実装する中間周波数回路部Ｌとに仕切ってある。[Detailed Description of the Invention] [Summary] Regarding modification of the terminal connection structure of a microwave unit, the present invention relates to a modification of the terminal connection structure of a microwave unit, which has a high reliability of connection between a microwave integrated circuit and a printed circuit board against changes in environmental temperature. For the purpose of providing a terminal connection structure, an intermediate plate in a metal case is used to divide the microwave circuit part into which the microwave integrated circuit is mounted and the intermediate frequency circuit part into which the printed circuit board is mounted, and to connect the microwave integrated circuit. In a microwave unit configured to connect the microwave integrated circuit and the printed board through a terminal, a coil portion that fits over the terminal and one end of the coil portion are perpendicular to the axis. Using a spring-shaped conducting wire configured with a straight line portion extending in the direction, the tip of the terminal is loosely inserted through the hole of the printed board, and the tip of the terminal protrudes from the bottom surface of the printed board. The coil part is fitted onto the outside, the coil end part is soldered to the tip of the terminal, and the straight part is soldered to the pattern of the printed board. [Industrial Application Field] The present invention relates to modification of the terminal connection structure of a microwave unit. The communication device includes a microwave unit with an amplification function that converts the received microwave signal into an intermediate frequency signal, amplifies it with an intermediate frequency amplifier, and then converts it back into a microwave signal and transmits it, or a frequency converter. Microwave units with various functions are used. [Prior Art] - Fig. 3 is a sectional view of the above-mentioned microwave unit, and numeral 1 denotes a flat metal case made of, for example, aluminum. A space in the metal case 1 is formed by an intermediate plate 2 integrally formed with the side wall of the case, and a microwave circuit section H is provided on which the microwave integrated circuit 5 and the like are mounted, and an amplifier circuit, a t-source circuit, etc. of the microwave integrated circuit are provided on the substrate. It is partitioned into an intermediate frequency circuit section L on which a printed board 15 is mounted.
そして、金属筐体１のマイクロ波回路部Ｈの開口側は、
上カバー３で覆ってシールドし、中間周波数回路部Ｌの
開口側は、下カバー４で覆ってシールドしている。The opening side of the microwave circuit section H of the metal casing 1 is
The intermediate frequency circuit section L is covered with an upper cover 3 for shielding, and the opening side of the intermediate frequency circuit section L is covered with a lower cover 4 for shielding.
５は、鉄・コバルト・ニッケル合金，銅等の金属でバッ
ケージングしたマイクロ波集積回路であって、パッケー
ジの底面に対して垂直になるように、パッケージ側面か
ら長い端子１０を引き出し、プリント板１５との間で、
中間周波数信号．電源等を授受するようにしてある．
中間板２の所望の個所に、端子１０に対応して孔を穿設
し、軸心に端子１０が貫通する軸心孔を設けたフエライ
ト系の電波吸収体板１１を、その孔に嵌着してある．
そして、端子１０を電波吸収体板ｌ１の軸心孔を貫通さ
せ、パッケージ底面を中間板の上面に当接した状態で、
図示省略したねじを用いて金属ケースｌにマイクロ波集
積回路５を固着することで、マイクロ波回路部Ｈにマイ
クロ波集積回路５を実装している．
上述のように電波吸収体板ｌ１を用いることで、不必要
なマイクロ波信号が、マイクロ波回路部Ｈから中間周波
数回路部Ｌへ侵入することを阻止している．
一方、マイクロ波の信号端子６は、パッケージ側面から
水平に突出させてある。5 is a microwave integrated circuit packaged with metal such as iron-cobalt-nickel alloy, copper, etc. A long terminal 10 is pulled out from the side of the package so as to be perpendicular to the bottom of the package, and a printed board 15 is packaged. Between
Intermediate frequency signal. It is designed to send and receive power, etc. A hole is bored in a desired location of the intermediate plate 2 in correspondence with the terminal 10, and a ferrite-based radio wave absorber plate 11 having an axial hole through which the terminal 10 passes through the axial center is fitted into the hole. It has been done. Then, the terminal 10 is passed through the axial hole of the radio wave absorber plate l1, and with the bottom of the package in contact with the top of the intermediate plate,
The microwave integrated circuit 5 is mounted in the microwave circuit section H by fixing the microwave integrated circuit 5 to the metal case L using screws (not shown). By using the radio wave absorber plate l1 as described above, unnecessary microwave signals are prevented from entering the intermediate frequency circuit section L from the microwave circuit section H. On the other hand, the microwave signal terminal 6 is horizontally projected from the side surface of the package.
そして、中間板２の上面の所望の位置に、ストリップ線
路７を設けた誘電体基板８を装着し、信号端子６をこの
ストリップ線路７に接続することで、ストリップ線路７
を介して、マイクロ波集積回路相互間を接続したり、或
いは金属ケースｌの側壁に装着した同軸コネクタ９に接
続している．１５は、増幅回路，電源回路等を設けたプ
リント板である．
中間板２の下方の中間周波数回路部Ｌに、段付凹部を設
け、プリント板１５の周縁をこの段付凹部の段端面に当
接した状態でねし止めし、プリント板１５を中間周波数
回路部Ｌに実装している。Then, a dielectric substrate 8 provided with a strip line 7 is attached to a desired position on the upper surface of the intermediate plate 2, and the signal terminal 6 is connected to this strip line 7.
It is used to connect microwave integrated circuits to each other or to a coaxial connector 9 attached to the side wall of the metal case l. 15 is a printed board provided with an amplifier circuit, a power supply circuit, etc. A stepped recess is provided in the lower intermediate frequency circuit portion L of the intermediate plate 2, and the peripheral edge of the printed board 15 is screwed in contact with the step end face of the stepped recess, and the printed board 15 is connected to the intermediate frequency circuit. It is implemented in part L.
マイクロ波集積回路５とプリント板ｌ５の従来の接続は
、プリント板１５のスルーホールにそれぞれの端子１０
の先端部を嵌入し、プリント板１５の裏面で半田１６を
用いて半田付け固着することで、プリント板１５のパタ
ーンと端子１０とを接続している．〔発明が解決しよう
とする課題〕
従来は上述のように、マイクロ波集積回路の端子の先端
部をプリント板のスルーホールに嵌人させ半田で固着し
ている。またプリント板は、中間板にねじを用いて固着
している。The conventional connection between the microwave integrated circuit 5 and the printed circuit board 15 is to connect each terminal 10 to a through hole of the printed board 15.
The pattern on the printed board 15 and the terminal 10 are connected by fitting the tip of the terminal and fixing the pattern on the printed board 15 using solder 16 on the back side of the printed board 15. [Problems to be Solved by the Invention] Conventionally, as described above, the tips of the terminals of a microwave integrated circuit are fitted into through holes of a printed circuit board and fixed with solder. Further, the printed board is fixed to the intermediate board using screws.
一方、プリント板の熱膨張係数が、マイクロ波集積回路
のメタルパッケージ，及び金属ケースの熱膨張係数より
も大きい．
したがって、環境温度が変化するとプリント板がより大
きく膨張或いは収縮することに起因して、端子とスルー
ホールとの半田付け接続部に応力が集中し、半田に亀裂
が発生したり，或いは破断して、接続不良になるという
問題点があった．本発明はこのような点に鑑みて創作さ
れたもので、環境温度の変化に対して、マイクロ波集積
回路とプリント板との接続の信頬度が高い、マイクロ波
ユニットの端子接続構造を提供することを目的としてい
る。On the other hand, the thermal expansion coefficient of the printed circuit board is larger than that of the metal package and metal case of the microwave integrated circuit. Therefore, when the environmental temperature changes, the printed board expands or contracts more, and stress concentrates on the soldered connection between the terminal and the through hole, causing the solder to crack or break. However, there was a problem with poor connections. The present invention has been created in view of the above points, and provides a terminal connection structure for a microwave unit in which the connection between a microwave integrated circuit and a printed board is highly reliable against changes in environmental temperature. It is intended to.
上記の目的を達成するために本発明は、第１図に例示し
たように、金属ケース１内の中間板２により、マイクロ
波集積回路５を実装するマイクロ波回路部■｛と、プリ
ント板１５を実装する中間周波数回路部Ｌとに仕切り、
マイクロ波集積回路５の端子１０を介して、マイクロ波
集積回路５とプリント板１５とを接続するよう構成した
マイクロ波ユニットにおいて、端子ｌＯの先端部に外嵌
可能とするコイル部２１と、コイル部２１の一方の端末
が軸心に直交する方向に延伸されてなる直線部２２とで
、構成したばね形導線２０を設ける。In order to achieve the above object, the present invention, as illustrated in FIG. partitioned into an intermediate frequency circuit section L that implements the
In a microwave unit configured to connect a microwave integrated circuit 5 and a printed circuit board 15 via a terminal 10 of the microwave integrated circuit 5, a coil portion 21 that can be externally fitted onto the tip of the terminal IO, and a coil A spring-shaped conducting wire 20 is provided, which is constituted by a straight portion 22 formed by extending one end of a portion 21 in a direction perpendicular to the axis.
一方、プリント板１５にはそれぞれの端子１０に対応し
て、端子１０の外径よりも充分に大きい孔１８を設け、
孔１８近傍にマイクロ波集積回路５に接続すべきパター
ンｌ９を設ける．
プリント板１５の孔１８に端子１０の先端部を遊挿貫通
させ、プリント板１５の下面より突出した端子１０の先
端部に、ばね形導線２０のコイル部２１を外嵌して、ば
ね形導腺２０を装着する，
そして、直線部２２とは反対側のコイル端末部を端子先
端に半田付し、直線部２２をプリント板１５のパターン
１９に半田付け接続する．
Ｃ作用〕
上述のように端子１０はプリント板１５の孔１８を、充
分に大きい間隙を保って貫通し、且つ直線部２２とは反
対側のコイル端末部を、端子先端に半田付している．
よって、プリント板１５が端子１０等よりもより大きく
膨張，或いは収縮することに起因して、端子１０の軸心
方向との相対関係位置が変化しても、その変位は、ばね
形導線２０のコイル部２１の軸心方向の伸縮により補償
される．
また、プリント板ｌ５の平面に平行する面での変位は、
ばね形導線２０のコイル部２１の半径方向の伸縮により
補償される。On the other hand, holes 18 that are sufficiently larger than the outer diameter of the terminals 10 are provided in the printed board 15 in correspondence with the respective terminals 10.
A pattern l9 to be connected to the microwave integrated circuit 5 is provided near the hole 18. The tip of the terminal 10 is loosely inserted into the hole 18 of the printed board 15, and the coil portion 21 of the spring-shaped conductor 20 is fitted onto the tip of the terminal 10 protruding from the bottom surface of the printed board 15, thereby forming a spring-shaped conductor. Attach the gland 20. Then, solder the end of the coil on the opposite side to the straight part 22 to the tip of the terminal, and connect the straight part 22 to the pattern 19 of the printed board 15 by soldering. C action] As described above, the terminal 10 passes through the hole 18 of the printed board 15 with a sufficiently large gap, and the coil end portion on the opposite side from the straight portion 22 is soldered to the tip of the terminal. ．． Therefore, even if the relative position of the terminal 10 with respect to the axial direction changes due to the printed board 15 expanding or contracting more than the terminal 10 etc., the displacement will be caused by the change of the spring-shaped conducting wire 20. This is compensated for by the expansion and contraction of the coil portion 21 in the axial direction. Moreover, the displacement in a plane parallel to the plane of printed board l5 is:
This is compensated for by the radial expansion and contraction of the coil portion 21 of the spring-shaped conductor 20.
即ち、ばね形導線２０のコイル端末部と端子１０の端子
先端との半田付け接続部、及びばね形導線２０の直線部
２２とプリント板１５のパターンｌ９との半田付け接続
部には、強い応力が作用しない．したがって、半田に亀
裂が発生したり、破断する恐れがない。That is, strong stress is applied to the soldered connection between the coil end of the spring-shaped conductor 20 and the terminal tip of the terminal 10, and the soldered connection between the straight portion 22 of the spring-shaped conductor 20 and the pattern 19 of the printed board 15. does not work. Therefore, there is no fear that the solder will crack or break.
（実施例〕
以下図を参照し・ながら、本発明を具体的に説明する．
なお、全図を通じて同一符号は同一対象物を示す．
第１図は本発明の一実施例の断面図、第２図は本発明の
実施例の要部断面図である。(Example) The present invention will be specifically explained below with reference to the figures.
The same reference numerals indicate the same objects throughout the figures. FIG. 1 is a cross-sectional view of an embodiment of the present invention, and FIG. 2 is a cross-sectional view of essential parts of the embodiment of the present invention.
第１図において、アルミニウム等よりなる平形の金属筐
体１内の空間を筐体と一体形成した中間板２により、マ
イクロ波集積回路５等を実装するマイクロ波回路部Ｈと
、回路基板１０等を実装する中間周波数回路部Ｌとに仕
切ってある。 そして、マイクロ波回路部Ｈの開口側は
、上カバー３で覆ってシールドし、中間周波数回路部Ｌ
の開口側は、下カバー４で覆ってシールドするようにな
っている．
金属でバッケージングしたマイクロ波集積回路５は、パ
ッケージの底面に対して垂直になるように、バッケージ
側面から長い端子ＩＯを引き出してある。そして、中間
板２に穿設した孔に、軸心に端子１０が貫通する軸心孔
を設けたフエライト系の電波吸収体板１１を嵌着し、端
子１０を電波吸収体板１１の軸心孔を貫通させ、パッケ
ージ底面を中間板の上面に当接した状態で、図示省略し
たねじを用いてパッケージを金属ケース１に固着するこ
とで、マイクロ波集積回路５をマイクロ波回路部Ｈに実
装している．
一方、中間板２の上面の所望の位置にストリッブ腺路７
を設けた誘電体基板８を装着し、パッケージ側面から水
平に突出させたマイクロ波の信号端子６を、このストリ
ップ線路７に接続することで、ストリップ線路７を介し
て、マイクロ波集積回路相互間を接続したり、或いは金
属ケースｌの側壁に装着した同軸コネクタ９に接続して
いる。In FIG. 1, a space inside a flat metal casing 1 made of aluminum or the like is formed by an intermediate plate 2 integrally formed with the casing, and a microwave circuit section H on which a microwave integrated circuit 5, etc. is mounted, and a circuit board 10, etc. It is partitioned into an intermediate frequency circuit section L that implements the. The opening side of the microwave circuit section H is covered and shielded with the upper cover 3, and the intermediate frequency circuit section L
The opening side is covered with a lower cover 4 for shielding. The microwave integrated circuit 5 packaged with metal has a long terminal IO drawn out from the side surface of the package so as to be perpendicular to the bottom surface of the package. Then, a ferrite-based radio wave absorber plate 11 having an axial hole through which the terminal 10 passes through is fitted into the hole drilled in the intermediate plate 2, and the terminal 10 is inserted into the axial center of the radio wave absorber plate 11. The microwave integrated circuit 5 is mounted in the microwave circuit section H by fixing the package to the metal case 1 using screws (not shown) with the hole penetrated and the bottom of the package in contact with the top surface of the intermediate plate. are doing. On the other hand, a strip gland 7 is placed at a desired position on the upper surface of the intermediate plate 2.
By attaching a dielectric substrate 8 provided with a dielectric substrate 8 and connecting a microwave signal terminal 6 horizontally protruding from the side of the package to this strip line 7, the microwave integrated circuits can be connected to each other via the strip line 7. or to a coaxial connector 9 attached to the side wall of the metal case l.
中間板２の下方の中間周波数回路部Ｌに、段付凹部を設
け、プリント板１５の周縁をこの段付凹部の段端面に当
接した状態でねじ止めし、プリント板１５を中間周波数
回路部Ｌに実装している。A stepped recess is provided in the lower intermediate frequency circuit portion L of the intermediate plate 2, and the peripheral edge of the printed board 15 is screwed in contact with the step end face of the stepped recess, and the printed board 15 is attached to the intermediate frequency circuit portion. It is implemented in L.
詳細を第２図に示すように、２０は、例えば細い黄ｗ４
線を所望に巻回して構成したばね形導線であって、内径
が端子１０の外径よりも所望に大きい寸法となる如くに
所望のターン数（７〜８クーン）巻回したコイル部２１
と、コイル部２１の一方の端末が軸心に直交する方向に
延伸した直線部２２とで構成してある。As the details are shown in Fig. 2, 20 is, for example, a thin yellow w4
A coil portion 21 which is a spring-shaped conductive wire formed by winding a wire in a desired number of turns (7 to 8 coils) so that the inner diameter is larger than the outer diameter of the terminal 10 as desired.
and a straight portion 22 in which one end of the coil portion 21 extends in a direction perpendicular to the axis.
このコイル部２１は、直線部２２とは反対側のコイル端
末部２１ａを残して、他の部分に合成樹脂等のコーテン
グを施し、コイル端末部２１ａ以外の処に半田が付着し
ないように処理してある。This coil part 21 is coated with synthetic resin or the like on the other parts, leaving the coil terminal part 21a on the opposite side to the straight part 22, to prevent solder from adhering to parts other than the coil terminal part 21a. There is.
一方、プリント板１５には、マイクロ波集積回路５のそ
れぞれの端子１０に対応して、端子１０の外径よりも充
分に大きい孔１日を設け、孔ｌ８近傍にマイクロ波集積
回路５に接続すべきパターンｌ９を設けてある。On the other hand, holes sufficiently larger than the outer diameter of the terminals 10 are provided in the printed board 15 in correspondence with the respective terminals 10 of the microwave integrated circuit 5, and the holes are connected to the microwave integrated circuit 5 near the hole l8. A pattern 19 to be performed is provided.
プリント板１５の孔１８に端子１０の端子先端１０Ａが
貫通するように、プリント板１５を中間板２に固着し、
プリント板Ｉ５の下面より突出した端子先端１０＾部分
に、直線部２２がプリント板１５の下面側になるように
コイル部２１を外嵌させて、ばね形導線２０を装着する
．
そして、直線部２２をプリント板１５のパターン１９に
位置合わせして半田２３で半田付け接続し、さらにコイ
ル部２１のコイル端末部２１ａを、端子先端１０Ａに半
田２４で半田付けし固着してある。The printed board 15 is fixed to the intermediate board 2 so that the terminal tip 10A of the terminal 10 passes through the hole 18 of the printed board 15,
The spring-shaped conducting wire 20 is attached to the terminal tip 10^ portion protruding from the lower surface of the printed board I5 by fitting the coil portion 21 onto the terminal end 10^ portion protruding from the lower surface of the printed board I5 so that the straight portion 22 is on the lower surface side of the printed board 15. Then, the straight part 22 is aligned with the pattern 19 of the printed board 15 and connected by soldering with the solder 23, and the coil terminal part 21a of the coil part 21 is further soldered and fixed to the terminal tip 10A with the solder 24. .
上述のようにばね形導腺２０を介して端子１０とプリン
ト板１５とを接続しているので、環境温度が変化して、
プリント板ｌ５が端子１０等よりもより大きく膨張．或
いは収縮して、端子１０の軸心方向とブリント板１５と
の相対関係位置が変化しても、その変位は、ばね形導線
２０のコイル部２１の軸心方向の伸縮により補償される
．
また、プリント板１５の平面に平行する面での変位は、
ばね形導線２０のコイル部２１の半径方向の伸縮により
補償される。As mentioned above, since the terminal 10 and the printed board 15 are connected via the spring-shaped conductive gland 20, the environmental temperature changes,
The printed board l5 expands more than the terminals 10, etc. Alternatively, even if the relative position between the terminal 10 in the axial direction and the blind plate 15 changes due to contraction, the displacement is compensated by the axial expansion and contraction of the coil portion 21 of the spring-shaped conducting wire 20. Moreover, the displacement in a plane parallel to the plane of the printed board 15 is
This is compensated for by the radial expansion and contraction of the coil portion 21 of the spring-shaped conductor 20.
即ち、ばね形導線２０のコイル端末部と端子１０の端子
先端との半田２４部分、及びばね形導！２０の直線部２
２とプリント板１５のパターン１９との半田２３部分に
、亀裂が発生したり，破断したりする恐れがない。That is, the solder 24 portion between the coil terminal portion of the spring-shaped conductor 20 and the terminal tip of the terminal 10, and the spring-shaped conductor! 20 straight line part 2
There is no risk of cracking or breakage in the solder 23 portion between 2 and the pattern 19 of the printed board 15.
なお、コイル端末部２１ａを残して、他のコイル部２１
部分に合成樹脂等のコーテングを施すことは、必ずしも
必要のことではないが、コイル部２１の全面に半田が付
着するとコイル部２１のばね性がなくなるので、このこ
とを防止する上から、半田付着防止の表面処理を施すこ
とが望ましい．〔発明の効果〕
以上説明したように本発明は、マイクロ波集積回路の端
子とプリント板のパターンとを、ばね形導線を介して半
田付け接続するようにしたことにより、環境温度の変化
に起因する接続の半田部分の亀裂，或いは破断を防止す
ることができ、マイクロ波集積回路とプリント板との接
続の信較度が向上するという、実用上で優れた効果があ
る。Note that, except for the coil terminal portion 21a, the other coil portions 21
Although it is not necessarily necessary to coat the parts with synthetic resin or the like, if solder adheres to the entire surface of the coil part 21, the springiness of the coil part 21 will be lost. It is desirable to apply a surface treatment to prevent this. [Effects of the Invention] As explained above, the present invention connects the terminals of a microwave integrated circuit and the pattern of a printed circuit board by soldering through a spring-shaped conductor wire, thereby reducing the effects caused by changes in environmental temperature. This has excellent practical effects in that it can prevent cracking or breakage of the solder portion of the connection, and improve the reliability of the connection between the microwave integrated circuit and the printed board.
第１図は本発明の実施例の断面図、
第２図は本発明の実施例の要部断面図、第３図は従来例
の断面図である。
図において、
１は金属ケース、
５はマイクロ波集積回路、
７はストリップ線路、
９は同軸コネクタ、
１０Ａは端子先端、
ｌ５はプリント板、
１８は孔、
２０はばね形導線、
２は中間板、
６は信号端子、
８は誘電体基板、
１０は端子、
１１は電波吸収体板、
１６．２３．２４は半田、
１９はパターン、
２１はコイル部、
２１ａはコイル端末部、
２２は直線部、
Ｈはマイクロ波回路部、
Ｌは中間周波数回路部をそれぞれ示す。FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a cross-sectional view of a main part of the embodiment of the present invention, and FIG. 3 is a cross-sectional view of a conventional example. In the figure, 1 is a metal case, 5 is a microwave integrated circuit, 7 is a strip line, 9 is a coaxial connector, 10A is a terminal tip, 15 is a printed board, 18 is a hole, 20 is a spring-shaped conducting wire, 2 is an intermediate plate, 6 is a signal terminal, 8 is a dielectric substrate, 10 is a terminal, 11 is a radio wave absorber plate, 16, 23, 24 is solder, 19 is a pattern, 21 is a coil part, 21a is a coil terminal part, 22 is a straight part, H indicates a microwave circuit section, and L indicates an intermediate frequency circuit section.
Claims (1)
集積回路（５）を実装するマイクロ波回路部と、プリン
ト板（１５）を実装する中間周波数回路部とに仕切り、
該マイクロ波集積回路（５）の端子（１０）を介して、
該マイクロ波集積回路（５）と該プリント板（１５）と
を接続するよう構成したマイクロ波ユニットにおいて、 該端子（１０）に外嵌するコイル部（２１）と、該コイ
ル部（２１）の一方の端末が軸心に直交する方向に延伸
されてなる直線部（２２）とで、構成したばね形導線（
２０）を用い、 該プリント板（１５）の孔（１８）に該端子（１０）の
先端部を遊挿貫通させ、該プリント板（１５）の下面よ
り突出した該端子（１０）の先端部に該コイル部（２１
）が外嵌し、コイル端末部が端子先端に、該直線部（２
２）が該プリント板（１５）のパターン（１９）に、そ
れぞれ半田付けされてなることを特徴とするマイクロ波
ユニットの端子接続構造。[Claims] An intermediate plate (2) in a metal case (1) separates a microwave circuit section on which a microwave integrated circuit (5) is mounted and an intermediate frequency circuit section on which a printed board (15) is mounted. partition,
Via the terminal (10) of the microwave integrated circuit (5),
In a microwave unit configured to connect the microwave integrated circuit (5) and the printed board (15), a coil portion (21) that fits over the terminal (10), and a coil portion (21) of the coil portion (21). A spring-shaped conducting wire (
20), the tip of the terminal (10) is loosely inserted through the hole (18) of the printed board (15), and the tip of the terminal (10) protrudes from the bottom surface of the printed board (15). The coil part (21
) is fitted externally, the coil terminal part is attached to the terminal tip, and the straight part (2
2) are respectively soldered to the patterns (19) of the printed board (15).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5911589A JPH02239575A (en) | 1989-03-10 | 1989-03-10 | Terminal connection structure for microwave unit |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5911589A JPH02239575A (en) | 1989-03-10 | 1989-03-10 | Terminal connection structure for microwave unit |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02239575A true JPH02239575A (en) | 1990-09-21 |
Family
ID=13103993
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5911589A Pending JPH02239575A (en) | 1989-03-10 | 1989-03-10 | Terminal connection structure for microwave unit |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02239575A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148421A (en) * | 2018-08-31 | 2019-01-04 | 成都天箭科技股份有限公司 | A kind of microwave monolithic integrated circuit ground structure and its mounting process |
-
1989
- 1989-03-10 JP JP5911589A patent/JPH02239575A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109148421A (en) * | 2018-08-31 | 2019-01-04 | 成都天箭科技股份有限公司 | A kind of microwave monolithic integrated circuit ground structure and its mounting process |
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