JPH02232983A - Enameled board provided with insertion terminal and manufacture thereof - Google Patents
Enameled board provided with insertion terminal and manufacture thereofInfo
- Publication number
- JPH02232983A JPH02232983A JP1053515A JP5351589A JPH02232983A JP H02232983 A JPH02232983 A JP H02232983A JP 1053515 A JP1053515 A JP 1053515A JP 5351589 A JP5351589 A JP 5351589A JP H02232983 A JPH02232983 A JP H02232983A
- Authority
- JP
- Japan
- Prior art keywords
- tip
- board
- insertion terminal
- terminal
- metal core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000003780 insertion Methods 0.000 title claims abstract description 34
- 230000037431 insertion Effects 0.000 title claims abstract description 34
- 238000004519 manufacturing process Methods 0.000 title claims description 7
- 239000002184 metal Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 26
- 210000003298 dental enamel Anatomy 0.000 claims abstract description 23
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000004080 punching Methods 0.000 claims abstract description 9
- 239000000758 substrate Substances 0.000 claims description 13
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- 239000000463 material Substances 0.000 claims description 2
- 230000008961 swelling Effects 0.000 abstract description 4
- 239000011162 core material Substances 0.000 description 26
- 238000005554 pickling Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 238000004534 enameling Methods 0.000 description 3
- 238000005259 measurement Methods 0.000 description 3
- 241000894006 Bacteria Species 0.000 description 2
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 229910001369 Brass Inorganic materials 0.000 description 1
- 229910000906 Bronze Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 239000010953 base metal Substances 0.000 description 1
- 239000010951 brass Substances 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000000156 glass melt Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000005499 meniscus Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/05—Insulated conductive substrates, e.g. insulated metal substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Insulated Metal Substrates For Printed Circuits (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
（産業上の利用分野）
本発明は外部接続用コネクターへの接続特性（挿入性）
を改良した挿入端子部付きのホウロウ基板に関する。[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to connection characteristics (insertionability) to external connection connectors.
This invention relates to an enamel board with an improved insertion terminal part.
ホウロウ基板は、アルミナ基板がその上に厚膜ペースト
で回路を形成して、電子回路基板として用いられるのと
同様に、高耐熱回路基板として用いることができる。The enamel substrate can be used as a high heat resistant circuit board in the same way that an alumina substrate is used as an electronic circuit board by forming a circuit thereon with a thick film paste.
ホウロウ基板はその上、金属を芯材として用いているた
め機械的強度が大きいので、実開昭６０−１７５９４号
公報に示されているようにそれ自体に挿入端子部を設け
る（第７図５）ことにより、直接外部回路のコネクター
と接続することができる。第７図で４は回路基板、３は
厚膜導体回路、５が挿入端子部である。In addition, since the enameled board uses metal as its core material, it has high mechanical strength, so as shown in Japanese Utility Model Application No. 60-17594, it is provided with an insertion terminal part (see Fig. ), it can be directly connected to an external circuit connector. In FIG. 7, 4 is a circuit board, 3 is a thick film conductor circuit, and 5 is an insertion terminal portion.
一方、ホウＯウ基板の鋼製芯材に透孔を形成した時、そ
の後ホウ０ウがけしだ時に、孔の角部にホウロウが付き
難く、その周辺には又ホウロウが厚く盛り上る現像があ
り、これを回避するために特公昭５９−４８８０号公報
が開示されている。On the other hand, when a through hole is formed in the steel core material of the enamel substrate, when the enamel is poured out afterwards, it is difficult for the enamel to stick to the corners of the hole, and the enamel swells up thickly around the hole. To avoid this problem, Japanese Patent Publication No. 59-4880 is disclosed.
この技術は開孔の角部を、角部を丸めた押し型によって
上下から型押しして、透孔を角のない円滑な曲面にする
ものである。In this technique, the corners of the hole are pressed from above and below using a die with rounded corners, making the hole a smooth curved surface with no corners.
従来の嵌合川挿入端子はその断面が第５図の如く、端部
に近い部分にホウロウ層が厚く付着する。A conventional fitting insertion terminal has a cross section as shown in FIG. 5, and a thick enamel layer is attached to the portion near the end.
これは先端部分はホウロウガラスが溶融凝固するときに
、先端部分に流れが集まり、盛り上り（メニスカス）を
生じるためで、通常のホウロウ基板では盛り上りが１０
０μｍ近くある。この盛り上りが存在すると、コネクタ
ーに挿入する時の抵抗となる。第６図はホウロウ基板の
端子を挿入させるコネクターの一般的な金属端子の一例
の立面図を示す。これは黄銅やリン青銅で作られている
。This is because when the enamel glass melts and solidifies at the tip, the flow gathers at the tip and creates a bulge (meniscus).
It is close to 0 μm. If this bulge exists, it will create resistance when inserted into the connector. FIG. 6 shows an elevational view of an example of a general metal terminal of a connector into which a terminal of an enamel substrate is inserted. It is made of brass or phosphor bronze.
第５図は、従来の金属コアが通常の切断をしてある場合
の、端部からの種々の距離長さにおける厚みを測定した
結果（平均値）を示す。末端から０，６履岨れた位置で
、最も厚い０．８７０ｍを示している。FIG. 5 shows the results (average values) of thickness measurements at various distances from the end of a conventional metal core that has been cut in the usual way. The thickest point is 0.870m at a point 0.6 feet from the end.
本発明の目的は、嵌合川挿入端子部のホウＯウ層の盛り
上りをなくし、コネクターに円滑に挿入できるような挿
入端子部付き基板及びその製造方法を提供することであ
る。An object of the present invention is to provide a board with an insertion terminal portion that can be smoothly inserted into a connector by eliminating the swelling of the oxide layer on the fitting insertion terminal portion, and a method for manufacturing the same.
本発明は、外部接続用コネクターへの嵌合川挿入端子を
有するホウＯウ基板において、その端子の金属コアを該
コアの先端より１．０〜３．０＃ｌｌｌ１の範囲で、先
端部厚さが０．１０〜０．３０ａａ＋どなるよう厚さ方
向にテーパーを付けてなる挿入端子部付きホウロウ基板
である。The present invention provides a metal core of the terminal having a tip end thickness of 1.0 to 3.0 #lll1 from the tip of the core in a board having an insertion terminal that fits into an external connection connector. This is an enameled substrate with an insertion terminal portion tapered in the thickness direction so that the thickness is 0.10 to 0.30 aa+.
又、製造方法としては、外部接続用コネクターへの嵌合
川挿入端子を有するホウロウ基板の金屈コアの打抜にお
いて、先づ材料金属板からコアの挿入端子部の先端部の
形状を残して、その近傍部のみを打抜によって抜き落し
、次に挿入端子部の先端部のみを厚さ方向に押圧し、つ
ぶしてテーパーを付け、最後に、基板全体を、先端部の
該押圧によるバリと共に打抜いて金属コアとし、これに
ホウＯウコーティングを行うことを特徴とする挿入端子
部付きホウＯウ基板の製造方法である。In addition, as for the manufacturing method, in punching out the metal core of the enamel board having the insertion terminal that fits into the external connection connector, first, leave the shape of the tip of the insertion terminal part of the core from the material metal plate, Only the nearby part is punched out, then only the tip of the insertion terminal is pressed in the thickness direction, crushed and tapered, and finally the entire board is stamped together with the burr caused by the pressing of the tip. This is a method for manufacturing a HO-O board with an insertion terminal portion, which is characterized by punching out a metal core and applying a HO-O coating to the metal core.
第１図は本発明の挿入端子の断面立面図である。FIG. 1 is a cross-sectional elevational view of the insertion terminal of the present invention.
金属コア１にホウＯウ層２がコーティングされている。A metal core 1 is coated with a phosphor layer 2.
この金属コアが該コアの先喘より１．０〜３．０ｍの範
囲で、好ましくは１．０〜１．５Ｉｍの範囲で（第１図
ｂ）、先端部厚さ（第１図ａ）が０．１０〜０．３０ｍ
となるよう、厚さ方向にテーパーが付けられている。The metal core has a thickness of 1.0 to 3.0 m, preferably 1.0 to 1.5 Im from the tip of the core (Fig. 1 b), and a tip thickness (Fig. 1 a). is 0.10~0.30m
It is tapered in the thickness direction so that
Ｃは金属コアの厚さであって、通常０．５〜０．７履程
度である。C is the thickness of the metal core, which is usually about 0.5 to 0.7 inches.
先端部の厚さａは、０． １ｍより薄いとホウロウ施釉
の前処理の酸洗時に更に薄くなる関係上、強度的に問題
が出て来て先端が欠け易くなり好ましくない。又０．
３ａｍ＋より厚くなると、板厚の薄いものでは元のコア
厚との差が少なく、ホウロウの盛り上りを防ぐ効果は少
なくなり、挿入力を大きくしないと挿入し難くなる。The thickness a of the tip is 0. If it is thinner than 1 m, it becomes even thinner during pickling as a pretreatment for enameling glazing, which causes problems in terms of strength and makes the tip easily chipped, which is not preferable. Also 0.
If the thickness becomes thicker than 3am+, the difference from the original core thickness will be small if the plate thickness is thin, and the effect of preventing the enamel from swelling will be reduced, making it difficult to insert unless the insertion force is increased.
テーパーの始まる位誼の先端からの距離ｂについては、
第５図において、従来の金属コアを用いた時、最もホウ
ロウ層が厚くなる０．６ｓ程度がテーバ一部分に入るよ
うにする必要があり、この意味で１．０ｍ＋より１．５
Ｎの範囲が適当であり、一方、ｂが３．０ｍより大きく
なると、板厚の薄いものではテーパー角度が小さ《なり
、盛り上がりをなくすことが困雌となるため、コネクタ
ーへの挿入力が増大するなどの問題を生じ易くなるので
好ましくない。Regarding the distance b from the tip of the position where the taper begins,
In Fig. 5, when using a conventional metal core, it is necessary to make sure that about 0.6 seconds, where the enamel layer is the thickest, is included in the Taber part, and in this sense, it is 1.5 m+ from 1.0 m+.
The range of N is appropriate. On the other hand, if b is larger than 3.0 m, the taper angle will be small for thin plates and it will be difficult to eliminate the bulge, so the insertion force into the connector will increase. This is not preferable because it tends to cause problems such as
ｂはこれ等の観点から１．５＃Ｉｍ以下がより好ましい
。From these points of view, b is more preferably 1.5 #Im or less.
金属コアの先端部にこのようなテーパーをつける事によ
って、第１図に示したように、従来の金属コアでは、ホ
ウロウ層が最も厚くなった先端から０．６５１１の■の
厚さが平板部の厚ざ■にくらべ、平均５５μｍ程度薄く
することができ、端子の挿入に全く支障がなくなった。By creating such a taper at the tip of the metal core, as shown in Figure 1, in the conventional metal core, the thickness of 0.6511 mm from the tip where the enamel layer is the thickest is the flat plate part. Compared to the thickness of (2), the thickness can be reduced by about 55 μm on average, and there is no problem in inserting the terminal.
第１図の■〜■の厚さは、多数の測定における平均値で
ある。The thicknesses marked with ■ to ■ in FIG. 1 are average values obtained from a large number of measurements.
次に製造方沫であるが、金属板より基板を打抜き加工す
る際に、打抜金型の同一ステージ上で端子先端部を厚さ
方向につぶしてテーパーを付けることが、工程的に最も
好適である。この工程を第２図〜第４図に示す。Next, regarding the manufacturing method, when punching a board from a metal plate, the most suitable process is to flatten the tip of the terminal in the thickness direction on the same stage of the punching die to create a taper. It is. This process is shown in FIGS. 2 to 4.
先づ第２図において、挿入端子部５の先端部の形状を残
し、その近傍部６の斜線部分のみを打抜きによって抜き
落す。First, in FIG. 2, the shape of the tip end of the insertion terminal portion 5 is left intact, and only the diagonally shaded portion 6 in the vicinity thereof is punched out.
次に、第３図において、突起している端子部５の先端部
７の斜線部のみを厚さ方向に押圧して、つぶし、テーパ
ーを付ける。この時先端部の周囲にバリが出る。最後に
、第４図において、基仮金体４と、第２工程でできたバ
リとを一挙に打抜いて（８の斜線部分を打抜ク）本発明
のホウロウ基板の金属コアを得る。Next, in FIG. 3, only the diagonally shaded portion of the tip 7 of the protruding terminal portion 5 is pressed in the thickness direction to crush and taper. At this time, burrs appear around the tip. Finally, in FIG. 4, the base metal body 4 and the burr formed in the second step are punched out at once (the diagonally shaded portion 8 is punched out) to obtain the metal core of the enamel substrate of the present invention.
このように、打抜き、つぶし加工したコアはホウロウ施
釉の前処理として酸洗工程を経る為、コア厚は０．０３
〜０．０５州は薄くなる。このような見地から前記のよ
うに、先端部のコア厚ａは０．１〜０．３Ｉ１１ｌが適
当であり、０．１履以下になると、酸洗後の先端コア厚
が０．０５ｍ以下になり、強度的に問題がでてくる。In this way, the punched and crushed core undergoes a pickling process as a pretreatment for enameling, so the core thickness is 0.03.
~0.05 states become thinner. From this point of view, as mentioned above, the appropriate core thickness a at the tip is 0.1 to 0.3I11l, and if it is less than 0.1, the tip core thickness after pickling will be less than 0.05m. Therefore, a serious problem arises.
このような酸洗工程を経て、ホウロウ施釉を行い、焼成
することによって本発明の挿入端子部付きホウロウ基板
が得られる。After such a pickling process, enameling is applied and fired to obtain the enameled substrate with the insertion terminal portion of the present invention.
以下に実施例によって、本発明を更に詳細に説明するが
、本発明はこの実施例によって何等限定されるものでは
ない。EXAMPLES The present invention will be explained in more detail with reference to Examples below, but the present invention is not limited to these Examples in any way.
金屈コアとして、第１図に示す厚さ０．６ｍ鋼板を使用
した。テーパー加工としてａ＝０．２５馴、ｂ＝１．０
＃＋のコアにホウロウを０．１２ｍ厚（片側）施釉した
。焼成侵の、先端部から夫々０．３＃ｌＩＩ＋，０．６
Ｍ，１．２ｍｍ、２．０Ｍの位置でホウロウ基板の厚さ
を測定した。第１図の本発明の基板と、第５図の従来の
基板とについて多数の測定値の平均値を示す。A 0.6 m thick steel plate shown in FIG. 1 was used as the Kinku core. As taper processing, a=0.25, b=1.0
A #+ core was glazed with enamel to a thickness of 0.12 m (on one side). 0.3#lII+, 0.6 from the tip of firing corrosion, respectively
The thickness of the enamel substrate was measured at positions of M, 1.2 mm, and 2.0 M. The average value of a large number of measurements is shown for the substrate of the present invention in FIG. 1 and the conventional substrate in FIG.
（本発明） （従来例）
■：０．６００順 ■：０．８４Ｍ
■：０．７６５履 ■：０．８７ａ膚■：０．８３５
厳 ■：０．８３櫨
■：０．８２０菌 ■：０．８２贋
本発明の回路用基板と従来品の金ＪｉｊＫ Ｅ子への挿
入力を比較した。挿入力は金属端子４個対回路基板端子
４本について、ＴＣＭ−２００型試験機を用いて測定し
た。ｎ＝５でテストした時の挿入力で示す。(Present invention) (Conventional example) ■: 0.600 order ■: 0.84M ■: 0.765 shoe ■: 0.87a skin ■: 0.835
Strict ■: 0.83 Bacteria ■: 0.820 Bacteria ■: 0.82 False The insertion force into the circuit board of the present invention and the conventional product was compared. The insertion force was measured using a TCM-200 tester for four metal terminals versus four circuit board terminals. It is shown by the insertion force when tested with n=5.
（本発明）（Ｎｙ・ｆ）
１． ８．８
２． ９．２
３． ７．３
４． ６．８
５． ８．５
平均値 ８．１
〔発明の効果〕
本発明のように、コア先端にテーパー加工を施した金属
］アとすることによって、ホウロウ施釉（従来品）（Ｋ
ｇ・ｆ）
１． １１．２
２． １３．０
３． １４．５
４． １０．９
５． １３．８
平均値 １２．７
後のホウロウの盛り上りを防ぐことが可能となり、実際
の金Ｒ端子への挿入力も約３６％低下し、更に挿入時に
、導体回路や基板を傷つけることなく円滑な挿入が可能
となった。製造方法においては、基板の打抜工程に端子
部先端部のテーパー加工を組み込み、基板とバリ取りを
一挙に行なう事ができ、テーパー加工工程を簡易化でき
た効果は大きい。(Present invention) (Ny・f) 1. 8.8 2. 9.2 3. 7.3 4. 6.8 5. 8.5 Average value 8.1 [Effect of the invention] As in the present invention, by using a metal with a tapered core tip]A, enameled glaze (conventional product) (K
g・f) 1. 11.2 2. 13.0 3. 14.5 4. 10.9 5. 13.8 Average value 12.7 It is possible to prevent the enamel from swelling later, and the actual insertion force into the gold R terminal is reduced by about 36%, and it is also possible to insert it smoothly without damaging the conductor circuit or board. Insertion is now possible. In the manufacturing method, taper processing of the tip of the terminal part is incorporated into the board punching process, and the board and burrs can be removed all at once, which has a great effect in simplifying the taper processing process.
第１図は本発明の挿入端子部付きホウロウ基板の挿入端
子部の断面立面図を示す。
第２図は金属コアの打抜において、端子部先端部の形状
を残して、その近傍部のみを打抜いた平面図である。
第３図は端子先端部のみを厚み方向に押圧して、テーパ
ーをつけた平面図である。
第４図は基板全体と先端部のテーパー加工によるバリを
打抜いた平面図である。
第５図は従来の端子部付きホウロウ基板の端子部の断面
立面図を示す。
第６図は端子部付きホウロウ基板を挿入するコネクター
の一例の立面図である。
第７図は回路基板と挿入端子部との関係を示す平面図で
ある。FIG. 1 shows a cross-sectional elevational view of the insertion terminal portion of the enameled enamel substrate with insertion terminal portion of the present invention. FIG. 2 is a plan view in which the metal core is punched out, leaving only the shape of the tip end of the terminal portion and punching out only the vicinity thereof. FIG. 3 is a plan view in which only the tip end of the terminal is pressed in the thickness direction to form a taper. FIG. 4 is a plan view of the entire board and the tip of the board, with burrs removed by taper processing. FIG. 5 shows a cross-sectional elevational view of a terminal portion of a conventional enameled enamel substrate with a terminal portion. FIG. 6 is an elevational view of an example of a connector into which an enameled board with a terminal portion is inserted. FIG. 7 is a plan view showing the relationship between the circuit board and the insertion terminal portion.
Claims (2)
ホウロウ基板において、その端子の金属コアを該コアの
先端より１．０〜３．０ｍｍの範囲で、先端部厚さが０
．１０〜０．３０ｍｍとなるよう厚さ方向にテーパーを
付けてなる挿入端子部付きホウロウ基板。1. In an enameled board having an insertion terminal for fitting into an external connection connector, the metal core of the terminal is placed within a range of 1.0 to 3.0 mm from the tip of the core, and the thickness of the tip is 0 mm.
．． An enameled board with an insertion terminal tapered in the thickness direction to a thickness of 10 to 0.30 mm.
ホウロウ基板の金属コアの打抜において、先づ材料金属
板からコアの挿入端子部の先端部の形状を残して、その
近傍部のみを打抜によって抜き落し、次に挿入端子部の
先端部のみを厚さ方向に押圧し、つぶしてテーパーを付
け、最後に基板全体を、先端部の該押圧によるバリと共
に打抜いて金属コアとし、これにホウロウコーティング
を行うことを特徴とする挿入端子部付きホウロウ基板の
製造方法。2. When punching out the metal core of the enamel board that has the insertion terminal for fitting into the external connection connector, first, leave the shape of the tip of the insertion terminal part of the core from the material metal plate, and punch out only the nearby part. Then, press only the tip of the insertion terminal part in the thickness direction, crush it to create a taper, and finally punch out the entire board with the burr caused by the pressure on the tip to form a metal core, and then enamel it. A method for manufacturing an enameled substrate with an insertion terminal portion, which comprises coating.
Priority Applications (9)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053515A JPH0719961B2 (en) | 1989-03-06 | 1989-03-06 | Method for manufacturing enamel board with insert terminal |
| DE68928918T DE68928918T2 (en) | 1988-10-07 | 1989-10-05 | Flat resistor for blower control unit of an automotive air conditioner and blower control unit |
| ES89310180T ES2130112T3 (en) | 1988-10-07 | 1989-10-05 | FLAT RESISTOR FOR A VEHICLE AIR CONDITIONER BLOWER CONTROL UNIT AND A CONTROL UNIT USED. |
| US07/417,571 US5000662A (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner |
| EP89310180A EP0363191B1 (en) | 1988-10-07 | 1989-10-05 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| CA 2000290 CA2000290C (en) | 1988-10-07 | 1989-10-06 | Flat resistance for blower control unit of automobile air conditioner and blower control unit using the same |
| KR1019890014406A KR950006465B1 (en) | 1988-10-07 | 1989-10-06 | Flat resistance fo rblower control unit of automobile air conditioner |
| US07/636,901 US5192940A (en) | 1988-10-07 | 1990-12-31 | Flat resistance for blower control unit for automobile air conditioner and blower control unit using the same |
| KR1019940026026A KR950006464B1 (en) | 1988-10-07 | 1994-10-20 | Blower control unit for automobile air conditioner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1053515A JPH0719961B2 (en) | 1989-03-06 | 1989-03-06 | Method for manufacturing enamel board with insert terminal |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02232983A true JPH02232983A (en) | 1990-09-14 |
| JPH0719961B2 JPH0719961B2 (en) | 1995-03-06 |
Family
ID=12944958
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1053515A Expired - Lifetime JPH0719961B2 (en) | 1988-10-07 | 1989-03-06 | Method for manufacturing enamel board with insert terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0719961B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5764425A (en) * | 1995-08-17 | 1998-06-09 | Nikon Corporation | Telephoto lens |
| DE10251615A1 (en) * | 2002-11-06 | 2004-05-19 | Valeo Schalter Und Sensoren Gmbh | Plug element and circuit board structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6011463U (en) * | 1983-07-01 | 1985-01-25 | 株式会社フジクラ | enamel board |
| JPS6079768U (en) * | 1983-11-04 | 1985-06-03 | 株式会社フジクラ | Lead wire mounting structure on enamel board with electric circuit |
| JPS63131161U (en) * | 1987-02-17 | 1988-08-26 |
-
1989
- 1989-03-06 JP JP1053515A patent/JPH0719961B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6011463U (en) * | 1983-07-01 | 1985-01-25 | 株式会社フジクラ | enamel board |
| JPS6079768U (en) * | 1983-11-04 | 1985-06-03 | 株式会社フジクラ | Lead wire mounting structure on enamel board with electric circuit |
| JPS63131161U (en) * | 1987-02-17 | 1988-08-26 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5764425A (en) * | 1995-08-17 | 1998-06-09 | Nikon Corporation | Telephoto lens |
| DE10251615A1 (en) * | 2002-11-06 | 2004-05-19 | Valeo Schalter Und Sensoren Gmbh | Plug element and circuit board structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0719961B2 (en) | 1995-03-06 |
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