JPH0223235B2 - - Google Patents
Info
- Publication number
- JPH0223235B2 JPH0223235B2 JP20310983A JP20310983A JPH0223235B2 JP H0223235 B2 JPH0223235 B2 JP H0223235B2 JP 20310983 A JP20310983 A JP 20310983A JP 20310983 A JP20310983 A JP 20310983A JP H0223235 B2 JPH0223235 B2 JP H0223235B2
- Authority
- JP
- Japan
- Prior art keywords
- edta
- wastewater
- cod
- recovered
- plating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- KCXVZYZYPLLWCC-UHFFFAOYSA-N EDTA Chemical compound OC(=O)CN(CC(O)=O)CCN(CC(O)=O)CC(O)=O KCXVZYZYPLLWCC-UHFFFAOYSA-N 0.000 claims description 47
- 239000002351 wastewater Substances 0.000 claims description 35
- 238000007747 plating Methods 0.000 claims description 17
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- 238000000034 method Methods 0.000 claims description 11
- 238000005406 washing Methods 0.000 claims description 10
- 239000007788 liquid Substances 0.000 claims description 9
- 239000002253 acid Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910052500 inorganic mineral Inorganic materials 0.000 claims description 4
- 239000011707 mineral Substances 0.000 claims description 4
- 238000000926 separation method Methods 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 23
- 238000011084 recovery Methods 0.000 description 13
- 239000000126 substance Substances 0.000 description 10
- 230000003647 oxidation Effects 0.000 description 9
- 238000007254 oxidation reaction Methods 0.000 description 9
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 6
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 6
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 239000006228 supernatant Substances 0.000 description 6
- 230000032683 aging Effects 0.000 description 5
- 230000035484 reaction time Effects 0.000 description 5
- 230000005611 electricity Effects 0.000 description 4
- 239000007800 oxidant agent Substances 0.000 description 4
- 239000000243 solution Substances 0.000 description 4
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- 238000004140 cleaning Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 235000010755 mineral Nutrition 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- 238000004062 sedimentation Methods 0.000 description 3
- 239000010802 sludge Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 239000008235 industrial water Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 1
- 230000002776 aggregation Effects 0.000 description 1
- 238000004220 aggregation Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229940079895 copper edta Drugs 0.000 description 1
- BDXBEDXBWNPQNP-UHFFFAOYSA-L copper;2-[2-[bis(carboxylatomethyl)amino]ethyl-(carboxylatomethyl)amino]acetate;hydron Chemical compound [Cu+2].OC(=O)CN(CC([O-])=O)CCN(CC(O)=O)CC([O-])=O BDXBEDXBWNPQNP-UHFFFAOYSA-L 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 238000010790 dilution Methods 0.000 description 1
- 239000012895 dilution Substances 0.000 description 1
- 239000010840 domestic wastewater Substances 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000011790 ferrous sulphate Substances 0.000 description 1
- 235000003891 ferrous sulphate Nutrition 0.000 description 1
- 238000001914 filtration Methods 0.000 description 1
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
- BAUYGSIQEAFULO-UHFFFAOYSA-L iron(2+) sulfate (anhydrous) Chemical compound [Fe+2].[O-]S([O-])(=O)=O BAUYGSIQEAFULO-UHFFFAOYSA-L 0.000 description 1
- 229910000359 iron(II) sulfate Inorganic materials 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 244000005700 microbiome Species 0.000 description 1
- 239000005416 organic matter Substances 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000003756 stirring Methods 0.000 description 1
- 238000004065 wastewater treatment Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C18/00—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating
- C23C18/16—Chemical coating by decomposition of either liquid compounds or solutions of the coating forming compounds, without leaving reaction products of surface material in the coating; Contact plating by reduction or substitution, e.g. electroless plating
- C23C18/1601—Process or apparatus
- C23C18/1617—Purification and regeneration of coating baths
Landscapes
- Chemical & Material Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Chemically Coating (AREA)
- Removal Of Specific Substances (AREA)
Description
【発明の詳細な説明】
(1) 発明の属する分野
この発明はめつき廃水の浄化処理方法に係り、
特にEDTA、銅などを含む老めつき液から有価
物である銅EDTAを回収した後の有価物回収残
廃水および有価物を洗浄した後の洗浄廃水からな
るめつき廃水（以下、単にめつき廃水という。）
の浄化処理方法に関する。[Detailed Description of the Invention] (1) Field of the Invention This invention relates to a method for purifying plating wastewater,
In particular, plating wastewater (hereinafter referred to simply as plating wastewater) consists of residual wastewater after recovering copper EDTA, which is a valuable material, from aging liquid containing EDTA and copper, and washing wastewater after washing valuable materials. )
This invention relates to a purification method.
(2) 従来技術
化学銅めつき液、たとえばEDTA、ホルムア
ルデヒド、メタノール、銅などを含むめつき液を
使用するめつき処理においては、これらの化学成
分を含有する老めつき液が排出される。(2) Prior Art In a plating process using a chemical copper plating solution, such as a plating solution containing EDTA, formaldehyde, methanol, copper, etc., an aged plating solution containing these chemical components is discharged.
この老めつき液中の有価物である銅とEDTA
は互いに結びついて錯化合物を形成しており、老
めつき液にホルムアルデヒド、水酸化ナトリウム
を添加し加熱下で銅を金属単体として析出回収し
た後、硫酸などの鉱酸を添加してEDTAを溶解
度の小さい遊離酸の形態として回収している。 Copper and EDTA are valuable substances in this aging liquid.
are combined with each other to form a complex compound. After formaldehyde and sodium hydroxide are added to the aging solution and copper is precipitated and recovered as an elemental metal under heating, mineral acids such as sulfuric acid are added to increase the solubility of EDTA. It is recovered in the form of a small free acid.
これら回収工程後の残廃水および回収物を洗浄
した後の洗浄水が廃水として排出される。 The residual wastewater after these recovery steps and the washing water after washing the recovered material are discharged as wastewater.
従来、この廃水の浄化方法として生物処理、電
解酸化や薬品（過酸化水素、次亜塩素酸など）添
加による酸化およびこれらの組合せによつて行わ
れていた。 Conventionally, methods for purifying this wastewater include biological treatment, electrolytic oxidation, oxidation by adding chemicals (hydrogen peroxide, hypochlorous acid, etc.), and combinations thereof.
しかし、これらの方法では廃水のCODが高く
例えば生物処理ではCOD除去率が30〜60％が限
界であり、電解処理では大きな電気量が必要であ
つた。さらにCODを除去するためには過酸化水
素などの薬品を多量使用する必要があつた。 However, in these methods, the COD of the wastewater is high, and for example, in biological treatment, the COD removal rate is limited to 30-60%, and in electrolytic treatment, a large amount of electricity is required. Furthermore, in order to remove COD, it was necessary to use large amounts of chemicals such as hydrogen peroxide.
(3) 発明の目的
この発明の目的は前記従来技術の欠点を解消
し、高い除去率及び使用薬品の低減を得ることが
できる浄化処理方法を提供することにある。(3) Purpose of the Invention The purpose of the present invention is to provide a purification method capable of eliminating the drawbacks of the prior art and achieving a high removal rate and a reduction in the amount of chemicals used.
(4) 発明の要点
この発明は、廃水中に含まれる有機化学成物の
うち未回収のEDTAおよび有価物の洗浄水中の
EDTAが廃水のCODの30〜40％占めていること
に着目し、このEDTAを予じめ除去する手段と
してEDTA回収工程で回収したEDTAを一部添
加し、鉱酸を加えてPHを２以下に調節することに
よつて、すみやかにEDTAが固液分離できるこ
とを実験によつて確認し、前記EDTAを固液分
離した上澄水を生物処理および化学酸化（酸化剤
添加）などにより処理するようにしたものであ
る。(4) Summary of the Invention This invention aims to eliminate unrecovered EDTA and valuables from organic chemical components contained in wastewater in washing water.
Focusing on the fact that EDTA accounts for 30 to 40% of COD in wastewater, as a means to remove this EDTA in advance, we added some of the EDTA recovered in the EDTA recovery process and added mineral acid to reduce the pH to 2 or less. It was confirmed through experiments that EDTA can be quickly separated into solid-liquid by adjusting the temperature, and the supernatant water from which EDTA has been separated into solid-liquid is treated by biological treatment and chemical oxidation (addition of oxidizing agent). This is what I did.
(5) 発明の実施例
以下本発明の実施例を図面をもつて説明する。
第１図に本発明に係る廃水の浄化方法の実施例を
示す図である。(5) Embodiments of the invention Examples of the invention will be described below with reference to the drawings.
FIG. 1 is a diagram showing an embodiment of the wastewater purification method according to the present invention.
老めつき液１は銅回収工程２で水酸化ナトリウ
ム、ホルムアルデヒドを添加し、加熱下で金属銅
を回収した後、上澄液はEDTA回収工程５に移
され硫酸を添加しEDTAが回収される。この回
収工程では、回収物を工業用水またはイオン交換
水などで洗浄し回収工程外に回収銅３、回収
EDTA６として引抜かれ、おのおのの洗浄廃水
４および７はEDTA回収工程５でEDTAを回収
し後の有価物回収残廃水８とともにEDTA除去
反槽９に移される。 Aging liquid 1 is added with sodium hydroxide and formaldehyde in copper recovery step 2, and metal copper is recovered under heating.The supernatant liquid is transferred to EDTA recovery step 5, where sulfuric acid is added and EDTA is recovered. . In this recovery process, the recovered material is washed with industrial water or ion-exchanged water, etc.
The respective cleaning wastewaters 4 and 7 are extracted as EDTA 6 and are transferred to an EDTA removal tank 9 together with the residual wastewater 8 after recovering EDTA in an EDTA recovery step 5.
EDTA除去反応槽９では鉱酸（好ましくは硫
酸）でPHを２以下に調整し撹拌器１０で撹拌した
後、EDTA沈でん槽１１に移してEDTAを除去
できるが、EDTAをその溶解度近くまで除去す
るには第２図に示すようにEDTA除去反応槽９
の反応時間が５時間と長時間要する。 In the EDTA removal reaction tank 9, the pH is adjusted to 2 or less with a mineral acid (preferably sulfuric acid), and after stirring with the stirrer 10, it is transferred to the EDTA precipitation tank 11 to remove EDTA, but EDTA is removed to a level close to its solubility. The EDTA removal reaction tank 9 is installed as shown in Figure 2.
The reaction time is as long as 5 hours.
そこで本実施例ではEDTA回収工程５から回
収されたEDTA（洗浄前でよい）６を乾物基準で
３ｇ／添加することによつて第２図に示すよう
に反応時間を0.5〜１時間に短縮できる。この効
果は一種の晶析作用によるものと推定される。
EDTA沈でん槽１１は、固液分離ができる遠心
分離機などの分離機および脱水機でも構わないま
たろ過などの分離方法を組み合わせるとさらによ
い。 Therefore, in this example, by adding 3 g/dry weight of EDTA (before washing) 6 recovered from the EDTA recovery step 5, the reaction time can be shortened to 0.5 to 1 hour as shown in Figure 2. . This effect is presumed to be due to a type of crystallization effect.
The EDTA sedimentation tank 11 may be a separator such as a centrifugal separator capable of solid-liquid separation, and a dehydrator. It is even better to use a separation method such as filtration in combination.
この回収EDTA６を一部添加して行うEDTA
除去によつてめつき廃水のCODは第３図に示す
ように大巾に低減され、後の廃水処理が容易とな
り処理薬品量が低減できる。 EDTA made by adding a part of this recovered EDTA6
By removing it, the COD of the plating wastewater is greatly reduced as shown in Figure 3, and subsequent wastewater treatment becomes easier and the amount of chemicals to be treated can be reduced.
EDTA沈でん槽１１からの上澄水は本実施例
では工業用水または生活系廃水（トイレ、シヤ
ワ、食堂廃水など）で希釈した後、微生物によつ
て好気性条件下で有機物を分解する生物処理装置
１２で処理し、さらに排出基準によつて過酸化水
素と硫酸第１鉄を同時に添加し、強酸化剤であ
る・OHラジカルを発生させて酸化処理するフエ
ントン酸化装置１３で処理し、処理水１４とする
EDTA沈でん槽１１からの上澄水は他のCOD除
去方法によつて処理してもよい。 In this embodiment, the supernatant water from the EDTA sedimentation tank 11 is diluted with industrial water or domestic wastewater (toilet, shower, cafeteria wastewater, etc.), and then processed into a biological treatment device 12 in which microorganisms decompose organic matter under aerobic conditions. Hydrogen peroxide and ferrous sulfate are added at the same time according to the emission standards, and the treated water is treated with the Fuenton oxidizer 13, which generates ・OH radicals, which are strong oxidizing agents, for oxidation treatment. do
The supernatant water from the EDTA settling tank 11 may be treated by other COD removal methods.
実施例 １
有価物回収残廃水８、回収銅洗浄廃水４、回収
EDTA洗浄廃水７からなるCOD5500mg／のめ
つき廃水を、第１図に従い処理した。EDTA除
去反応槽９では、回収EDTA６を乾物基準で３
ｇ／添加し、硫酸を加えてPHを1.8に調節し、
反応時間は30分とした。EDTA沈でん槽１１か
らの上澄水のCODは3500mg／であり、原水に
対するCOD除去率は36％であつた。この上澄水
を10倍に希釈し生物処理装置１２で活性汚泥処理
（滞留時間7hr MLSS4000mg／）した結果、処
理水のCODは93mg／であり、原水に対する
COD総量除去率は83％であつた。この活性汚泥
処理水を、さらにフエントン酸化装置で処理
（H2O2添加量210mg／、FeSO4添加量1340mg／
、反応時間15分、反応時のPH3.5、凝集時のPH
5.0）した結果、処理水のCODは20mg／であり、
原水に対するCOD総量除去率は96％となつた。Example 1 Valuables recovery residual wastewater 8, recovered copper washing wastewater 4, recovery
Plating wastewater consisting of EDTA washing wastewater 7 with a COD of 5500mg/was treated according to FIG. In the EDTA removal reaction tank 9, the recovered EDTA6 is reduced to 3% on a dry matter basis.
g/ and adjust the pH to 1.8 by adding sulfuric acid,
The reaction time was 30 minutes. The COD of the supernatant water from the EDTA sedimentation tank 11 was 3500 mg/, and the COD removal rate relative to the raw water was 36%. This supernatant water was diluted 10 times and treated with activated sludge in biological treatment equipment 12 (retention time 7hr MLSS 4000mg/). As a result, the COD of the treated water was 93mg/, which was lower than the raw water.
The total COD removal rate was 83%. This activated sludge treated water was further treated with a Fenton oxidizer (H 2 O 2 addition amount 210 mg/, FeSO 4 addition amount 1340 mg/
, reaction time 15 minutes, PH3.5 during reaction, PH during aggregation
5.0) As a result, the COD of the treated water is 20 mg/
The total removal rate of COD from raw water was 96%.
比較例 １
実施例１と同様のめつき廃水に対して、
EDTAを除去せずに、直接10倍に希釈し、以下、
実施例１と同様の条件で処理した。その結果、活
性汚泥処理水のCODは250mg／であり、原水に
対するCOD総量除去率は54％、フエントン酸化
処理水のCODは120mg／であり、原水に対する
COD総量除去率は78％であつた。また、実施例
１と同様のCOD総量除去率を得るためには、フ
エントン酸化処理におけるH2O2，FeSO4の添加
量を実施例１の場合の３倍を必要とした。Comparative Example 1 For plating wastewater similar to Example 1,
Directly dilute 10x without removing EDTA, below:
The treatment was carried out under the same conditions as in Example 1. As a result, the COD of activated sludge treated water was 250mg/, the total COD removal rate relative to raw water was 54%, and the COD of Fuenton oxidation treated water was 120mg/, relative to raw water.
The total COD removal rate was 78%. Furthermore, in order to obtain the same total COD removal rate as in Example 1, the amount of H 2 O 2 and FeSO 4 added in the Fenton oxidation treatment was required to be three times that in Example 1.
実施例 ２
実施例１と同様のめつき廃水から、実施例１と
同様にEDTAを除去したのち、希釈せずにその
まま電解酸化処理（電流密度5A／ｄm2、極間距
離10mm、電気量90.7×103クーロン／）した結
果、処理水のCODは2100mg／であり、原水に
対するCOD除去率は62％であつた。Example 2 EDTA was removed in the same manner as in Example 1 from the same plating wastewater as in Example 1, and then subjected to electrolytic oxidation treatment without dilution (current density: 5 A/dm 2 , interelectrode distance: 10 mm, electricity consumption: 90.7 ×10 3 coulombs/), the COD of the treated water was 2100 mg/, and the COD removal rate relative to the raw water was 62%.
比較例 ２
実施例１と同様のめつき廃水を用い、EDTA
を除去せずに、そのまま実施例２と同様の条件で
電解酸化処理した。その結果、処理水のCODは
2900mg／であり、原水に対するCOD除去率は
47％であつた。また、実施例２と同等のCOD除
去率を得るためには、163×103クーロン／の電
気量が必要であることが判明した。Comparative Example 2 Using the same plating wastewater as in Example 1, EDTA
was subjected to electrolytic oxidation treatment under the same conditions as in Example 2 without removing it. As a result, the COD of the treated water is
2900mg/, and the COD removal rate for raw water is
It was 47%. Furthermore, it was found that in order to obtain a COD removal rate equivalent to that of Example 2, an amount of electricity of 163×10 3 coulombs/was required.
(6) 発明の効果
本発明によれば、めつき廃水のCODのうち30
〜40％を占めるEDTAをすみやかに除去し、そ
の後廃水処理を行うようにしたので、めつき廃水
のCOD除去率を高くすることができ、また使用
薬品、電気量を低減できる。(6) Effects of the invention According to the present invention, 30% of the COD of plating wastewater is
By quickly removing EDTA, which accounts for ~40%, and then treating the wastewater, it is possible to increase the COD removal rate of plating wastewater and reduce the amount of chemicals and electricity used.
第１図は本発明の実施例を示す装置系統図、第
２図，第３図はそれぞれ、EDTA除去反応工程
において、回収EDTAを添加した場合、添加し
ない場合の反応時間と残留EDTA、残留CODの
関係を示すグラフである。
１…老めつき液、２…銅回収工程、４…回収銅
洗浄廃水、５…EDTA回収工程、７…回収
EDTA洗浄廃水、８…有価物回収残廃水、９…
EDTA除去反応槽、１１…EDTA沈でん槽、１
２…生物処理装置、１３…フエントン酸化装置。
Figure 1 is a system diagram of an apparatus showing an example of the present invention, and Figures 2 and 3 show the reaction time, residual EDTA, and residual COD in the EDTA removal reaction step with and without the addition of recovered EDTA. It is a graph showing the relationship between. 1...Aging liquid, 2...Copper recovery process, 4...Recovered copper cleaning wastewater, 5...EDTA recovery process, 7...Recovery
EDTA cleaning wastewater, 8... Valuables recovery residual wastewater, 9...
EDTA removal reaction tank, 11...EDTA settling tank, 1
2...Biological treatment equipment, 13...Fuenton oxidation equipment.
Claims (1)
物として銅、EDTAを回収した後の有価物回収
残廃水および回収物を洗浄した後の洗浄廃水から
なるめつき廃水の浄化処理方法において、上記め
つき廃水に前記回収したEDTAを一部添加し、
鉱酸を加えてPHを２以下に調節して、EDTAを
固形物として固液分離して除去する工程を設け、
EDTAを除去した後、廃水処理を行うように構
成したことを特徴とするめつき廃水の浄化処理方
法。1. In a method for purifying plating wastewater consisting of wastewater after recovering valuables after recovering copper and EDTA as valuables from an aged plating solution containing EDTA and copper, and washing wastewater after washing the recovered materials, the method described above Adding a portion of the recovered EDTA to the plating wastewater,
A step is provided to adjust the pH to 2 or less by adding mineral acid, and remove EDTA as a solid through solid-liquid separation.
A method for purifying wastewater, characterized in that the wastewater is treated after EDTA is removed.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20310983A JPS6096765A (en) | 1983-10-28 | 1983-10-28 | Purifying treatment of plating waste water |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20310983A JPS6096765A (en) | 1983-10-28 | 1983-10-28 | Purifying treatment of plating waste water |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6096765A JPS6096765A (en) | 1985-05-30 |
| JPH0223235B2 true JPH0223235B2 (en) | 1990-05-23 |
Family
ID=16468540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20310983A Granted JPS6096765A (en) | 1983-10-28 | 1983-10-28 | Purifying treatment of plating waste water |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6096765A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105036418A (en) * | 2015-08-27 | 2015-11-11 | 中山市宝绿环境技术发展有限公司 | Treatment technique of printing ink wastewater |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE3582964D1 (en) * | 1984-07-13 | 1991-07-04 | Hitachi Ltd | METHOD FOR THE TREATMENT OF WASTE CONTAINING LIQUID, CHELATE OF HEAVY METALS. |
| CN115231679B (en) * | 2022-06-23 | 2024-01-30 | 无锡中天固废处置有限公司 | Method for separating copper and EDTA in electroplating waste liquid |
-
1983
- 1983-10-28 JP JP20310983A patent/JPS6096765A/en active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105036418A (en) * | 2015-08-27 | 2015-11-11 | 中山市宝绿环境技术发展有限公司 | Treatment technique of printing ink wastewater |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6096765A (en) | 1985-05-30 |
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