JPH02226789A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH02226789A JPH02226789A JP4702089A JP4702089A JPH02226789A JP H02226789 A JPH02226789 A JP H02226789A JP 4702089 A JP4702089 A JP 4702089A JP 4702089 A JP4702089 A JP 4702089A JP H02226789 A JPH02226789 A JP H02226789A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- circuit board
- printed circuit
- bimetal
- thermal expansion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000007769 metal material Substances 0.000 claims description 6
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 238000005476 soldering Methods 0.000 abstract description 5
- 238000010438 heat treatment Methods 0.000 abstract description 2
- 150000002739 metals Chemical class 0.000 abstract 1
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 15
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 229910052759 nickel Inorganic materials 0.000 description 6
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は、表面実装用電子部品を装着するプリント基
板装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a printed circuit board device on which surface-mounted electronic components are mounted.
第２図〜第４図は、従来のプリント基板に表面実装用電
子部品を装置する工程を示した図で図において、（１）
は表面実装用電子部品の本体、（２）はこの本体（１）
に取付けられた外部信号等の取出し用リード端子部であ
って、一般的１こは銅系または鉄やニッケル系の金属が
単独で用いられることが多かった。 （２ａ）（２ｂ）
（２Ｃ）（２ｄ） はそれぞれ電気信号や電源等の外
部取出し用リード端子である。（３）は端子部（２）を
接点用ランド（４）に取付けるためのクリーム状の半田
、（６）は上記リード端子（２）を上記半田（３）を用
いて、接点用ランド（４）が装着されるプリント基板で
ある。Figures 2 to 4 are diagrams showing the process of mounting electronic components for surface mounting on a conventional printed circuit board.
is the main body of the electronic component for surface mounting, (2) is this main body (1)
A lead terminal section for taking out external signals, etc., attached to the terminal, is generally made of a metal such as copper, iron, or nickel. (2a) (2b)
(2C) and (2d) are lead terminals for taking out electrical signals, power supply, etc., respectively. (3) is cream-like solder for attaching the terminal part (2) to the contact land (4), and (6) is the solder (3) used to attach the lead terminal (2) to the contact land (4). ) is the printed circuit board to which it is mounted.
次に動作について説明する。電子部品のＩＪ−ド端子（
２）を接点用ランド（４）に半田（３）を用いて装着す
る場合は一般的に赤外線リフロー法区よりプリント基板
（５）上の銅配線パターンで作られてている接点用ラン
ド（４）上にスクリーン印刷法により、半田（３）を塗
布し、この状態で赤外線ヒータ（図示せず）番こより加
熱してクリーム状の半田（３）を溶融し、リード端子（
２）と接点用ランド（４）が半田付される。Next, the operation will be explained. IJ-do terminal of electronic parts (
When attaching 2) to the contact land (4) using solder (3), the contact land (4) is generally made of a copper wiring pattern on the printed circuit board (5) using the infrared reflow method. ) on the lead terminal (
2) and the contact land (4) are soldered.
従来のプリント基板装置は以上のように構成されている
ので、第３図（２ａ）に示すようにす−ド端子が上方等
に曲った場合、その−本は半田付けされず浮いた状態と
なり普通不良となる、などの課題があった。Conventional printed circuit board devices are constructed as described above, so if the lead terminal bends upward, etc., as shown in Figure 3 (2a), the lead terminal will not be soldered and will be in a floating state. There were issues such as the product being usually defective.
この発明は上記のような課題を解消するためになされた
もので、たとえリード端子が変形を起しても、半田付は
時の加熱により、正しい形状に自刃で復元できるととも
に確実に半田付ができるプリント基板装置を得ることを
目的とする。This invention was made in order to solve the above-mentioned problems. Even if the lead terminal is deformed, it can be restored to the correct shape with a self-blade by heating during soldering, and the soldering can be performed reliably. The purpose is to obtain a printed circuit board device that can be used.
この発明に係るプリント基板装置は、電子部品の端子部
を熱膨張率の異なる少なくとも２種の導電性金属材で構
成したものである。In the printed circuit board device according to the present invention, the terminal portion of the electronic component is made of at least two kinds of conductive metal materials having different coefficients of thermal expansion.
この発明１こおけるプリント基板装置は、半田の融点近
傍の濁度により熱膨張率の異なる導電性金属性金属材の
上側がのび、下側が縮んでプリント基板上にリード端子
が接触する。In the printed circuit board device according to the first aspect of the present invention, the upper side of the conductive metallic material having different coefficients of thermal expansion expands due to the turbidity near the melting point of the solder, and the lower side contracts, so that the lead terminal comes into contact with the printed circuit board.
以下、この発明の一実施例を図について説明する。第１
図１とおいて、（６）は熱膨張率の高い金属材であって
、たとえば第１の金属部材である銅、（７）は熱膨張率
が上記鋼（６）より低い金属材であって、たとえば、第
２の金属部材でみろニッケルであり、上記鋼（６）と上
記ニッケル（７）を貼り合わせて、バイメタル端子（８
）を構成している。An embodiment of the present invention will be described below with reference to the drawings. 1st
In FIG. 1, (6) is a metal material with a high coefficient of thermal expansion, such as copper, which is the first metal member, and (7) is a metal material with a coefficient of thermal expansion lower than that of steel (6). For example, the second metal member is made of nickel, and the steel (6) and the nickel (7) are bonded together to form a bimetal terminal (8).
).
なお、その他の構成については従来と同様につき説明を
省略する。Note that the other configurations are the same as those of the prior art, so explanations will be omitted.
次に動作について説明する。銅（６）とニッケル（７）
で構成されたバイメタル端子（８）に熱が印加されると
、銅（６）とニッケル（７）は各々の膨張率で膨張を起
こし、結果としてバイメタル端子（８）はニッケル（７
）側（この場合、矢印側）へ形状変化をおこす。Next, the operation will be explained. Copper (6) and Nickel (7)
When heat is applied to the bimetallic terminal (8), copper (6) and nickel (7) expand at their respective expansion coefficients, and as a result, the bimetallic terminal (8) becomes nickel (7).
) side (in this case, the arrow side).
以上のように、この発明によれば電子部品の端子部を熱
膨張率の異なる少なくとも２種の導電性金属材であるバ
イメタル端子で構成したので、端子をプリント基板に半
田付する場合、端子の浮ｈ１こよる接触不良や、他の端
子との短絡などを防止できる効果がある。As described above, according to the present invention, the terminal portion of an electronic component is configured with a bimetal terminal made of at least two kinds of conductive metal materials having different coefficients of thermal expansion. This has the effect of preventing poor contact due to floating h1 and short circuits with other terminals.
第１図はこの発明の一実施例によるプリント基板装置の
端子部詳細図、第２図〜第４図は従来のプリント基板装
置を示す図で、第２図は半田付の状態図、第３図は端子
が上方へ折れ曲っだ図、第４図は本体にリード端子が取
付けられた図である。
図にどいて、（１）は本体、（２）はリード端子、（３
）は半田、（４）は接点用ランド、（５）はプリント基
板、（６）は第１の金属部材、（７）は第２の金属部材
、（８）はバイメタル端子。
なお、図中、同一符号は同一または相当部分を示す。FIG. 1 is a detailed view of the terminal portion of a printed circuit board device according to an embodiment of the present invention, FIGS. 2 to 4 are diagrams showing conventional printed circuit board devices, FIG. 2 is a soldering state diagram, and FIG. The figure shows the terminal bent upward, and FIG. 4 shows the lead terminal attached to the main body. In the figure, (1) is the main body, (2) is the lead terminal, and (3) is the main body.
) is solder, (4) is a contact land, (5) is a printed circuit board, (6) is a first metal member, (7) is a second metal member, and (8) is a bimetal terminal. In addition, in the figures, the same reference numerals indicate the same or corresponding parts.
Claims (1)
が、表面実装用電子部品の本体に取付けられ、熱の印加
によって装着されるプリント基板において、上記電子部
品の端子部に熱膨張率の異なる少なくとも２種の導電性
金属材で構成されたバイメタル端子を配設したことを特
徴とするプリント基板装置。In a printed circuit board in which a lead terminal section for taking out external signals such as electric signals and power supply is attached to the main body of a surface-mounted electronic component and is attached by applying heat, the terminal section of the electronic component has a different coefficient of thermal expansion. A printed circuit board device comprising a bimetal terminal made of at least two types of conductive metal materials.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4702089A JPH02226789A (en) | 1989-02-28 | 1989-02-28 | Printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4702089A JPH02226789A (en) | 1989-02-28 | 1989-02-28 | Printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02226789A true JPH02226789A (en) | 1990-09-10 |
Family
ID=12763500
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4702089A Pending JPH02226789A (en) | 1989-02-28 | 1989-02-28 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02226789A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011193008A (en) * | 2001-04-10 | 2011-09-29 | Nec Corp | Surface mounting component mounted on circuit board, method of mounting the circuit board, and electronic apparatus using the circuit board |
-
1989
- 1989-02-28 JP JP4702089A patent/JPH02226789A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2011193008A (en) * | 2001-04-10 | 2011-09-29 | Nec Corp | Surface mounting component mounted on circuit board, method of mounting the circuit board, and electronic apparatus using the circuit board |
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