JPH03138874A - Connecting terminal - Google Patents
Connecting terminalInfo
- Publication number
- JPH03138874A JPH03138874A JP1278031A JP27803189A JPH03138874A JP H03138874 A JPH03138874 A JP H03138874A JP 1278031 A JP1278031 A JP 1278031A JP 27803189 A JP27803189 A JP 27803189A JP H03138874 A JPH03138874 A JP H03138874A
- Authority
- JP
- Japan
- Prior art keywords
- connection
- connecting terminal
- conductor pattern
- thick
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 claims abstract description 10
- 239000004020 conductor Substances 0.000 abstract description 19
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000011241 protective layer Substances 0.000 abstract 1
- 238000000034 method Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 4
- 238000005452 bending Methods 0.000 description 3
- 230000000873 masking effect Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000005242 forging Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野）
この発明は、プリント配線板に接合される接続端子に関
する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a connection terminal that is bonded to a printed wiring board.
〔従来の技術）
プリント配線板から外部へ接続端子をひきだす場合、従
来から第３図のような形状の接続端子が広く用いられて
いる。[Prior Art] When connecting terminals are drawn out from a printed wiring board, connecting terminals having a shape as shown in FIG. 3 have been widely used.
プリント配線板１の表面に形成された導体バタン２の上
には、通常、その導体パターン２を保護する目的でソル
ダーレジストなどの回路保護層３が設けられている。し
かし、プリント配線板ｌの導体パターン２から外部へ接
続端子４をひきだす場合、接続端子４が接合する箇所６
のプリント配線板１の導体パターン２には前記の回路保
護層３を形成しないで、導体パターン２を外部に露出さ
せておく必要がある。このため、外部に露出した前記導
体パターン２の部分は回路保護層３が設けられた部分よ
り窪んで凹部７を形成することになる。A circuit protection layer 3 such as a solder resist is usually provided on the conductor pattern 2 formed on the surface of the printed wiring board 1 in order to protect the conductor pattern 2. However, when connecting the connecting terminal 4 to the outside from the conductor pattern 2 of the printed wiring board l, the connecting terminal 4 is connected to the part 6.
It is necessary that the circuit protection layer 3 is not formed on the conductor pattern 2 of the printed wiring board 1, and the conductor pattern 2 is exposed to the outside. Therefore, the portion of the conductor pattern 2 exposed to the outside is recessed from the portion where the circuit protection layer 3 is provided to form a recess 7.
この凹部７に露出した導体パターン２とできるだけ広い
面積で接合するように接続端子４は金属板を折り曲げて
形成される。したがって、折り曲げ加工時の応力が残留
する。The connection terminal 4 is formed by bending a metal plate so as to be connected to the conductor pattern 2 exposed in the recess 7 over as wide an area as possible. Therefore, stress during the bending process remains.
このために前記折り曲げ加工で形成された接続端子は、
時間経過とともに歪みを生したり、接合する場合の熱で
歪みを生じる問題を有していた。For this purpose, the connection terminal formed by the bending process is
This has caused problems such as distortion over time and distortion caused by heat during bonding.
時間経過とともに歪みを生じたり、接合する場合の熱で
歪みを生じることのない接続端子を提供することにある
。It is an object of the present invention to provide a connection terminal that does not become distorted over time or due to heat during bonding.
本発明は、前記の課題を解決するためになされた接続端
子である。その特徴は、接続端子において同質材料で形
成された肉厚の凸部状の接合部を有することにある。The present invention is a connection terminal made to solve the above problems. Its feature is that the connection terminal has a thick convex joint made of the same material.
（実施例）
以下同面に基づいて詳しく説明する。第１図は本発明の
一実施例で、接続端子がプリント配線１戻に設けられた
電子部品の平面図、第２図はこのχＹ断面を示したもの
である。(Example) A detailed description will be given below based on the same figure. FIG. 1 shows an embodiment of the present invention, which is a plan view of an electronic component in which connection terminals are provided on a printed wiring 1 return, and FIG. 2 shows a χY cross section of the electronic component.
第２図の接続端子は同質材料で形成された肉厚の凸部状
の接合部を有する接続端子である。この接続端子４とプ
リント配線板１の表面に配設された導体パターン２との
接合は一般に半田付けでおこなわれる。この接合は導体
バクーン２の表面に回路保護層３が形成されないために
できる凹部７に露出した導体パターン２の接続箇所６に
おいてなされる。接続端子４の肉厚の凸部状の接合部５
を導体パターン２に適合させることによって容易に行う
ことがでる。The connection terminal shown in FIG. 2 is a connection terminal that is made of a homogeneous material and has a thick convex joint portion. The connection terminal 4 and the conductor pattern 2 disposed on the surface of the printed wiring board 1 are generally joined by soldering. This bonding is performed at the connection point 6 of the conductor pattern 2 exposed in the recess 7 that is formed because the circuit protection layer 3 is not formed on the surface of the conductor bag 2. Thick convex joint portion 5 of connection terminal 4
This can be easily done by adapting the conductor pattern 2 to the conductor pattern 2.
特に、プリント配線板から形成されるＰＧＡやＰＬＣＣ
などにおいては、プリント配線板の端部の導体パターン
の１１１離を防止するために、プリント配線板の周縁部
上にも必ず回路保護層が設けられ、接続端子と導体パタ
ーンの接続箇所は回路保護層によって凹部を形成してし
まう。しかし、本発明に基すき、特に、肉厚の凸部状の
接合部を端部に有する接続端子を用いることによって導
体パターンと接続端子との接合を容易に行うことがでる
。In particular, PGA and PLCC formed from printed wiring boards
In order to prevent the conductor patterns at the ends of the printed wiring board from becoming separated, a circuit protection layer is always provided on the peripheral edge of the printed wiring board, and the connection points between the connection terminals and the conductor patterns are protected from circuit protection. The layers form recesses. However, according to the present invention, the conductive pattern and the connecting terminal can be easily joined by using a connecting terminal having a thick convex joint at the end thereof.
また、このような接続端子４の接合部５は、般に電気配
線で発熱し易い回路の箇所にあたり、熱放散性に優れた
金属を用い、接続端子の他の部分より厚みの大きな凸部
を設けることによって、熱放散性にも優れた効果もたら
すのである。In addition, the joint 5 of the connecting terminal 4 is generally a part of the circuit where electrical wiring tends to generate heat, so it is made of metal with excellent heat dissipation properties and has a protrusion that is thicker than other parts of the connecting terminal. By providing this, an excellent effect on heat dissipation is brought about.
次に、本発明の接続端子４の製造方法の一例を示す。Next, an example of a method for manufacturing the connecting terminal 4 of the present invention will be described.
■金属板の端部にマスキングフィルムを張る。■Place masking film on the edge of the metal plate.
■次にエツチング液でマスキングフィルムをない部分の
金属板を侵食する。■Next, use etching solution to erode the metal plate in areas where there is no masking film.
■マスキングフィルムを剥がし、十分に水洗する。■Peel off the masking film and wash thoroughly with water.
同質材料で接続端子４に肉厚の凸部状の接合部５を形成
する方法は、上記のものに、特に、限定されるものでは
なく、鍛造など他の一般に用いられる方法を用いること
もできる。The method of forming the thick convex joint 5 on the connecting terminal 4 using the same material is not particularly limited to the above method, and other commonly used methods such as forging may also be used. .
接続端子４に形成される同質材料の肉厚の凸部状の接合
部５は、プリント配線板１の導体パターン２と接続を取
りたい箇所に相当する接続端子４の任意の位置に設ける
ことができるものである。The thick convex joint portion 5 formed on the connecting terminal 4 can be provided at any position on the connecting terminal 4 corresponding to the location where the connection with the conductive pattern 2 of the printed wiring board 1 is desired. It is possible.
凸部状の接合部５の形状は、矩形でも略半球でもよく、
特に限定するものではない。また、半田付は時の接合面
を増大させる目的で、プリント配線板ｌの導体パターン
２と接合する凸部状の接合部５の面に凹凸や溝を設けて
もよい。The shape of the convex joint 5 may be rectangular or approximately hemispherical,
It is not particularly limited. Further, in order to increase the bonding surface during soldering, unevenness or grooves may be provided on the surface of the convex joint portion 5 that is bonded to the conductor pattern 2 of the printed wiring board 1.
接続端子４に形成される肉厚の凸部５は、接続端子４の
他の部分と同質材料でなければならないのは、接続端子
が異種金属の組合せの場合、バイメタル効果で温度によ
り歪みなどの変形が生しるのを阻止するためである。The thick convex portion 5 formed on the connecting terminal 4 must be made of the same material as the other parts of the connecting terminal 4, because when the connecting terminal is a combination of different metals, distortion due to temperature due to the bimetallic effect can occur. This is to prevent deformation from occurring.
接続端子４の材料としは、銅や鉄、およびこれらとクロ
ム、ニッケル、コバルト、リン、亜鉛、錫などの合金か
らなる板状材料を用いて所定の長さ、幅、厚みに加工し
て用いることができる。The material of the connection terminal 4 is a plate-shaped material made of copper, iron, or an alloy of these with chromium, nickel, cobalt, phosphorus, zinc, tin, etc., and is processed into a predetermined length, width, and thickness. be able to.
その形状は、条板状が通常用いられるが、他に、円柱状
など、特に制限するものではない。Its shape is usually a striped plate, but it may also be cylindrical or otherwise limited, but is not particularly limited.
本発明は肉厚の同質材料で形成された凸部状の接合部を
有する接続端子によって、時間経過とともに接続端子が
歪みを生じることなく、接合する場合の熱で接続端子が
歪みを生じることがない効果を奏するのである。The present invention uses a connecting terminal having a convex joint formed of a thick homogeneous material, so that the connecting terminal does not become distorted over time, and the connecting terminal does not become distorted due to the heat during joining. It has a unique effect.
第１図は本発明の一実施例の平面図、
第２図はその断面図。
第３図は従来例の断面図。
ｌ・・・プリント配線板 ２・・・導電パターン３・・
・回路保護層 ４・・・接続端子５・・・接合部FIG. 1 is a plan view of an embodiment of the present invention, and FIG. 2 is a sectional view thereof. FIG. 3 is a sectional view of a conventional example. l...Printed wiring board 2...Conductive pattern 3...
・Circuit protection layer 4... Connection terminal 5... Joint part
Claims (1)
凸部状の接合部を有することを特徴とする接続端子。(1) A connecting terminal characterized in that the connecting terminal has a thick convex joint made of a homogeneous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1278031A JPH03138874A (en) | 1989-10-24 | 1989-10-24 | Connecting terminal |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1278031A JPH03138874A (en) | 1989-10-24 | 1989-10-24 | Connecting terminal |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH03138874A true JPH03138874A (en) | 1991-06-13 |
Family
ID=17591688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1278031A Pending JPH03138874A (en) | 1989-10-24 | 1989-10-24 | Connecting terminal |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH03138874A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7121893B2 (en) | 2003-01-22 | 2006-10-17 | Marquardt Gmbh | Electrical switch having an electrical connection element |
-
1989
- 1989-10-24 JP JP1278031A patent/JPH03138874A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7121893B2 (en) | 2003-01-22 | 2006-10-17 | Marquardt Gmbh | Electrical switch having an electrical connection element |
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