JPH02226674A - Hybrid integrated circuit module and manufacture thereof - Google Patents
Hybrid integrated circuit module and manufacture thereofInfo
- Publication number
- JPH02226674A JPH02226674A JP1045472A JP4547289A JPH02226674A JP H02226674 A JPH02226674 A JP H02226674A JP 1045472 A JP1045472 A JP 1045472A JP 4547289 A JP4547289 A JP 4547289A JP H02226674 A JPH02226674 A JP H02226674A
- Authority
- JP
- Japan
- Prior art keywords
- lead
- circuit board
- integrated circuit
- hybrid integrated
- external connection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 239000011347 resin Substances 0.000 claims abstract description 21
- 229920005989 resin Polymers 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims description 17
- 239000011248 coating agent Substances 0.000 claims description 15
- 238000000034 method Methods 0.000 claims description 7
- 238000005452 bending Methods 0.000 claims description 6
- 238000010422 painting Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 5
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000000758 substrate Substances 0.000 abstract description 4
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 3
- 239000002003 electrode paste Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract description 2
- 230000009977 dual effect Effects 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
- 239000003973 paint Substances 0.000 description 11
- 230000000694 effects Effects 0.000 description 2
- 238000007654 immersion Methods 0.000 description 2
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
- H05K1/141—One or more single auxiliary printed circuits mounted on a main printed circuit, e.g. modules, adapters
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
- H05K3/403—Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof
Landscapes
- Multi-Conductor Connections (AREA)
- Coupling Device And Connection With Printed Circuit (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は、外装樹脂塗装を施した混成集積回路モジュー
ルにおいて、リード端子の設は方に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method of providing lead terminals in a hybrid integrated circuit module having an exterior resin coating.
従来の混成集積回路モジュールとしては、第４図及び第
５図に示すように、電子部品を実装した回路基板の一辺
あるいは相対する２辺にそれぞれ複数の外部接続用リー
ド端子が電気的かつ機械的に接続された後、これらの接
続部分及び回路基板の外周が樹脂塗装された、いわゆる
外部樹脂塗装されたものが一般的である。As shown in FIGS. 4 and 5, conventional hybrid integrated circuit modules have a plurality of external connection lead terminals on one side or two opposing sides of a circuit board on which electronic components are mounted, for electrical and mechanical connections. After being connected to the circuit board, these connection parts and the outer periphery of the circuit board are generally coated with resin, so-called external resin coating.
これら混成集積回路モジュールのうち、第４図に示され
たものは、回路基板１１の一辺側のみから外部接続用リ
ード端子１２．１２・・が導出されたもので、ＳＩＰ
（ｓｉｎｇｌｅ １ｎｌｉｎｅ ｐａｃｋａｇｅ）型と
呼ばれるものであり、一方第５図に示されたものは、回
路基板１１”の相対する辺にリード端子１２’ 、１２
゜・−１１２”、１２”−−を有する１）ｌｐ（ｄＢｌ
ｉｎｌｉｎｅｐａｃｋａｇｅ）型と呼ばれるものであ
る。実装される側の母基板の平面に高密度実装が要求さ
れる場合には前者のＳＩＰ型が使用され、母基板の高さ
方向に寸法規制がある場合には後者のＤＩＰ型が使用さ
れる。Among these hybrid integrated circuit modules, the one shown in FIG. 4 has external connection lead terminals 12, 12, etc. led out from only one side of the circuit board 11, and is an SIP module.
(single 1nline package) type, and the one shown in FIG. 5 has lead terminals 12' and 12
1) lp (dBl
This is called the inlinepackage) type. The former SIP type is used when high-density mounting is required on the plane of the motherboard on which it is mounted, and the latter DIP type is used when there are size restrictions in the height direction of the motherboard. .
このような混成集積回路モジュールの外装樹脂塗装を行
うには、リード端子を接続した回路基板の被塗装該当部
分を絶縁塗料中に浸漬した後引き上げ、乾燥して固化さ
せる、いわゆるデイツブ方式塗装法が一般的に用いられ
ている。In order to paint the exterior resin of such a hybrid integrated circuit module, the so-called date coating method is used, in which the part of the circuit board to be painted to which the lead terminals are connected is immersed in insulation paint, then pulled up, dried and solidified. Commonly used.
この場合、ＳＩＰ型では回路基板を塗料に垂直に侵入さ
せリード端子の接続部だけを浸漬でき、外装樹脂塗装が
比較的やり易い。In this case, with the SIP type, the circuit board can be inserted vertically into the paint and only the connecting portions of the lead terminals can be immersed, making the exterior resin coating relatively easy.
（発明が解決しようとする課題〕
しかしながら、上記のような外装樹脂塗装方法では、両
側にリード端子を有するＤＩＰ型の場合には少なくとも
その接続部のある回路基板主面が塗料に浸漬されるため
、その浸漬度合を浅くすると回路基板のリード端子導出
方向の主面側に塗料が回り込みにり（、塗装欠陥（塗装
ムラや塗装ダレ）が生じ、浸漬を深くすると外部接続用
リード端子に不必要な塗料が付着して母基板にこれを挿
入する際にスムーズに挿入できないということが多かっ
た。(Problem to be Solved by the Invention) However, in the above exterior resin coating method, in the case of a DIP type having lead terminals on both sides, at least the main surface of the circuit board where the connection part is located is immersed in the paint. If the degree of immersion is shallow, the paint will wrap around the main surface of the circuit board in the direction in which the lead terminals are led out, causing paint defects (uneven paint or paint sagging), and if the degree of immersion is too deep, it will cause unnecessary damage to the external connection lead terminals. In many cases, paint adhered to the motherboard, making it difficult to insert it smoothly into the motherboard.
本発明の目的は、外装塗装不良のないＤＩＰ型混成集積
回路モジュール及びその製造方法を提供することにある
。It is an object of the present invention to provide a DIP type hybrid integrated circuit module and a method for manufacturing the same without defective exterior coating.
本発明は、上記課題を解決するために、混成集積回路基
板の表面に外装樹脂塗装が施されるとともに、該混成集
積回路基板の相対する辺部から該混成集積回路基板に対
して垂直かつ同一方向に複数の外部接続用リード端子を
設けたＤＩＰ型混成集積回路モジュールにおいて、上記
相対する辺部に設けた外部接続用リード端子の基端部が
上記混成集積回路基板の一方の辺部に接続されるととも
に、該外部接続用リード端子の一部が上記混成集積回路
基板の主面に沿って延長され地方の辺部で折曲されて上
記残余の外部接続用リード端子と同一方向に設けられた
ことを特徴とする混成集積回路モジュールを提供するも
のである。In order to solve the above problems, the present invention provides an exterior resin coating on the surface of a hybrid integrated circuit board, and a coating that is perpendicular and uniform to the hybrid integrated circuit board from the opposing sides of the hybrid integrated circuit board. In a DIP type hybrid integrated circuit module in which a plurality of external connection lead terminals are provided in a direction, the base ends of the external connection lead terminals provided on the opposing sides are connected to one side of the hybrid integrated circuit board. At the same time, a part of the external connection lead terminal is extended along the main surface of the hybrid integrated circuit board, bent at a local edge, and provided in the same direction as the remaining external connection lead terminal. The present invention provides a hybrid integrated circuit module characterized by the following.
また、回路基板の一方の辺側に複数の外部接続用リード
片を電気的に接続しかつ機械的に取付ける工程と、上記
回路基板の外周及び上記外部接続用リード片の取付は部
分をディップ塗装し絶縁被覆する工程と、上記外部接続
用リード片のうちの少なくとも一部を上記回路基板の主
面に沿って曲げ加工しかつ上記回路基板に対して他の残
余のリード片とともに同一方向に曲げ加工しリード端子
とする工程を有することを特徴とする混成集積回路モジ
ュールの製造方法を提供するものである。In addition, the process of electrically connecting and mechanically attaching multiple external connection lead pieces to one side of the circuit board, and the process of attaching the outer periphery of the circuit board and the external connection lead pieces are dip-painted. and bending at least a part of the external connection lead pieces along the main surface of the circuit board and in the same direction with the other remaining lead pieces with respect to the circuit board. The present invention provides a method for manufacturing a hybrid integrated circuit module, which includes a step of processing it into lead terminals.
両方の側のリード端子の基端部が一方の辺の側に接続さ
れかつその一部が他方の側に延長されて両方の側のリー
ド端子先端が同一方向に向くように形成されたので、こ
れらのリード端子を取りつけるに当たって、一方の側に
のみリード端子を設けておき、この状態で外装樹脂塗装
を行い、この後一部のリード端子を主面に沿って曲げ加
工し、さらに両方の側のリード端子を同一方向に曲げ加
工してリード端子を作成することができるため、外装樹
脂塗装をＳＩＰ型の混成集積回路モジュールの場合と同
じように塗装欠陥なく行うことができる。The proximal ends of the lead terminals on both sides were connected to one side and a portion thereof was extended to the other side so that the tips of the lead terminals on both sides faced in the same direction. When installing these lead terminals, the lead terminals are provided only on one side, the exterior resin is painted in this state, and then some of the lead terminals are bent along the main surface, and then both sides are Since the lead terminals can be formed by bending the lead terminals in the same direction, the exterior resin coating can be performed without any coating defects as in the case of the SIP type hybrid integrated circuit module.
また、ＳＩＰ型、ＤＩＰ型のいずれも選択して製造でき
る。Furthermore, either the SIP type or the DIP type can be selected for manufacturing.
実施例１
次に本発明の一実施例を第１図及び第２図に基づいて説
明する。Embodiment 1 Next, an embodiment of the present invention will be described based on FIGS. 1 and 2.
第１図中、１はアルミナ基板に回路配線をプリントした
回路基板であり、電子回路素子２．３がその一方の主面
に実装されている。４．４・・は回路基板１の一方の辺
側の設けられたリードランド５．５ ・・・に１つおき
に半田付けされたリード端子であり、６．６ ・・はこ
れらの残りの他のリードランド５．５ ・・に半田付け
されたリード片が曲げ加工されて池の辺側にブリフジ状
に導出され、リード端子４．４ ・・と同一方向に突出
されたブリフジ型リード端子である。そして、回路基板
１の外周部とリード端子４．４ ・・及びリード端子６
．６ ・・のリードランドとの接続部が想像線で示した
ように外装樹脂塗１１’！４７により被覆されている。In FIG. 1, reference numeral 1 denotes a circuit board in which circuit wiring is printed on an alumina substrate, and an electronic circuit element 2.3 is mounted on one main surface of the circuit board. 4.4... are lead terminals soldered to every other lead land 5.5... provided on one side of the circuit board 1, and 6.6... are the remaining lead terminals. The lead pieces soldered to the other lead lands 5.5... are bent and led out to the side of the pond in the form of a bulge, and the lead terminals are protruded in the same direction as the lead terminals 4.4... It is. Then, the outer periphery of the circuit board 1, the lead terminals 4.4, and the lead terminals 6.
．． 6. The connection part with the lead land is coated with exterior resin 11' as shown by the imaginary line! 47.
このようにしてＤＩＰ型混成集積回路モジュールができ
あがるが、その製造方法は、■ アルミナ基板に電極ペ
ースト及び抵抗体ペーストを用いて所定のパターンにス
クリーン印刷し、部品ランド及びリードランドを形成し
、第２図に示すように回路基板１を作成する。■ 上記
部品ランドに半田ペーストを印刷し、電子部品２．３を
半田付けして実装する。■ リード片８ａを搬送帯８ｂ
に多数櫛歯状に取付けた外部接続用リード部材８を用意
し、リード片８ａのそれぞれの先端をリードランド５．
５ ・・に半田付けする。■ リード片８ａ、８ａ・・
を搬送帯８ｂから切断する。■ 回路基板１及び上記外
部接続用リード片８ａ、８ａ・・の接続部分を回路基板
を絶縁樹脂塗料中に垂直に浸漬した後引き上げ、乾燥さ
せて第１図に示すような外装樹脂塗ｌｌｌ７を形成する
。■ 複数の外部接続用リード片８ａ、 ８ａ・・のう
ちの一部のリード片を回路基板の主面に沿って曲げ加工
したのち、その先端を回路基板に対して上記電子部品と
反対側に垂直に曲げて導出し、他方の側のリード端子６
．６ ・・を形成した。■ その他の残余のリード片を
上記曲げ加工したリード端子と同じ方向に曲げ加工しリ
ード端子４．４ ・・を形成した。In this way, a DIP type hybrid integrated circuit module is completed, and its manufacturing method is as follows: (1) Screen printing a predetermined pattern using electrode paste and resistor paste on an alumina substrate to form component lands and lead lands; 2. A circuit board 1 is created as shown in FIG. ■ Print solder paste on the above component land, and solder and mount electronic components 2.3. ■ Transfer the lead piece 8a to the conveyor belt 8b.
A lead member 8 for external connection is prepared in which multiple comb-like teeth are attached to the lead land 5.
5 Solder to... ■ Lead pieces 8a, 8a...
is cut from the conveyor belt 8b. ■ The connection parts of the circuit board 1 and the external connection lead pieces 8a, 8a, etc. are dipped vertically into an insulating resin paint, then pulled up, dried, and coated with an exterior resin paint 7 as shown in FIG. Form. ■ After bending some of the plurality of external connection lead pieces 8a, 8a, etc. along the main surface of the circuit board, the tips are placed on the opposite side of the circuit board from the electronic component. Bend vertically and lead out the lead terminal 6 on the other side.
．． 6... was formed. (2) The remaining lead pieces were bent in the same direction as the lead terminals bent above to form lead terminals 4.4.
このようにして混成集積回路モジュールが出来上がるが
、いわばＳＩＰ型モジュールと同様に■において外部樹
脂塗装を行なうので、塗装がスムーズに行なわれる。In this way, a hybrid integrated circuit module is completed, but since the external resin coating is applied in step (3) in the same way as a SIP type module, the coating is carried out smoothly.
実施例２
実施例１において、■の代わりに、■°外部接続用リー
ド片８ａ、 ８ａ・・のそれぞれの先端にクリツブ部５
ａを形成したものを用意し、これをリードランド５．５
・・に嵌合させて半田付けすることによりリード端子
を形成した以外は同様にして混成集積回路モジュールを
作製した。Embodiment 2 In Embodiment 1, in place of
Prepare a piece with a shape formed on it and attach it to the lead land 5.5
A hybrid integrated circuit module was produced in the same manner except that lead terminals were formed by fitting and soldering.
このようにすると、リード端子とリードランドの接続の
作業性が良いのみならず、確実に両者を接続できる。In this way, not only the workability of connecting the lead terminal and the lead land is improved, but also the connection between the two can be ensured.
【発明の効果〕
本発明によれば、ＤＩＰ型混成集積回路モジュールにお
いて、他方の側のリード端子を一方の側から導出したリ
ード片により構成したので、その製造過程において外部
接続用リード片を回路基板の一方の辺部のみに設けるこ
とができる。これにより、外装樹脂塗装をＳＩＰ型の混
成集積回路モジュールと同様に欠陥なく行える。そして
この後リード片の一部を回路基板の主面に沿って曲げ加
工し、さらに一方の側のリード片とともに同一方向に曲
げ加工することより１Ｐ型の混成集積回路モジュールを
製造することができ、これにより外装樹脂塗装欠陥のな
いＤＩＰ型の混成集積回路モジュールを提供することが
できる。[Effects of the Invention] According to the present invention, in the DIP type hybrid integrated circuit module, the lead terminals on the other side are formed by the lead pieces led out from one side, so that the lead pieces for external connection are connected to the circuit during the manufacturing process. It can be provided only on one side of the substrate. As a result, the exterior resin coating can be performed without defects in the same way as with SIP type hybrid integrated circuit modules. Then, by bending a part of the lead piece along the main surface of the circuit board and further bending it in the same direction together with the lead piece on one side, a 1P type hybrid integrated circuit module can be manufactured. As a result, it is possible to provide a DIP type hybrid integrated circuit module free from exterior resin coating defects.
また、外装樹脂塗装を行った後ＳＩＰ型混成集積回路モ
ジュールとすることもでき、その選択範囲を広げること
ができる。Further, it is possible to form a SIP type hybrid integrated circuit module after applying an exterior resin coating, thereby widening the range of selection.
第１図は本発明の混成集積回路モジュールの一実施例の
斜視図、第２図はその製造の一過程を示す斜視図、第３
図は他の実施例の混成集積回路モジュールの斜視図、第
４図はＳＩＰ型混成集積回路モジュールの正面側面図及
び右側面図、第５図はＤＩＰ型混成集積回路モジュール
の平面図、正面図、右側面図である。
図中、１は回路基板、５．５ ・・はリードランド、４
．４ ・・は一方の辺部のリード端子、６．６ ・・は
他方の辺部のリード端子、７は外装樹脂塗膜である。
平成１年２月２８日
第
図
第２図
第４図
第５
図
第３図FIG. 1 is a perspective view of an embodiment of the hybrid integrated circuit module of the present invention, FIG. 2 is a perspective view showing one manufacturing process thereof, and FIG.
The figure is a perspective view of a hybrid integrated circuit module of another embodiment, FIG. 4 is a front side view and right side view of a SIP type hybrid integrated circuit module, and FIG. 5 is a plan view and front view of a DIP type hybrid integrated circuit module. , right side view. In the figure, 1 is the circuit board, 5.5... is the lead land, 4
．． 4... is a lead terminal on one side, 6.6... is a lead terminal on the other side, and 7 is an exterior resin coating film. February 28, 1999 Figure 2 Figure 4 Figure 5 Figure 3
Claims (2)
るとともに、該混成集積回路基板の相対する辺部から該
混成集積回路基板に対して垂直かつ同一方向に複数の外
部接続用リード端子を設けたＤＩＰ型混成集積回路モジ
ュールにおいて、上記相対する辺部に設けた外部接続用
リード端子の基端部が上記混成集積回路基板の一方の辺
部に接続されるとともに、該外部接続用リード端子の一
部が上記混成集積回路基板の主面に沿って延長され他方
の辺部で折曲されて上記残余の外部接続用リード端子と
同一方向に設けられたことを特徴とする混成集積回路モ
ジュール。(1) Exterior resin coating is applied to the surface of the hybrid integrated circuit board, and a plurality of lead terminals for external connection are arranged perpendicularly and in the same direction to the hybrid integrated circuit board from opposing sides of the hybrid integrated circuit board. In the DIP type hybrid integrated circuit module, the base ends of the external connection lead terminals provided on the opposing sides are connected to one side of the hybrid integrated circuit board, and the external connection leads are connected to one side of the hybrid integrated circuit board. A hybrid integrated circuit characterized in that a part of the terminal extends along the main surface of the hybrid integrated circuit board, is bent at the other side, and is provided in the same direction as the remaining external connection lead terminals. module.
片を電気的に接続しかつ機械的に取付ける工程と、上記
回路基板の外周及び上記外部接続用リード片の取付け部
分をディップ塗装し絶縁被覆する工程と、上記外部接続
用リード片のうちの少なくとも一部を上記回路基板の主
面に沿って曲げ加工しかつ上記回路基板に対して他の残
余のリード片とともに同一方向に曲げ加工しリード端子
とする工程を有することを特徴とする混成集積回路モジ
ュールの製造方法。(2) The process of electrically connecting and mechanically attaching multiple external connection lead pieces to one side of the circuit board, and dip painting the outer periphery of the circuit board and the mounting area of the external connection lead pieces. and bending at least a part of the external connection lead pieces along the main surface of the circuit board and in the same direction with the other remaining lead pieces with respect to the circuit board. 1. A method for manufacturing a hybrid integrated circuit module, comprising the step of processing it into lead terminals.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045472A JPH02226674A (en) | 1989-02-28 | 1989-02-28 | Hybrid integrated circuit module and manufacture thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1045472A JPH02226674A (en) | 1989-02-28 | 1989-02-28 | Hybrid integrated circuit module and manufacture thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02226674A true JPH02226674A (en) | 1990-09-10 |
Family
ID=12720332
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1045472A Pending JPH02226674A (en) | 1989-02-28 | 1989-02-28 | Hybrid integrated circuit module and manufacture thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02226674A (en) |
-
1989
- 1989-02-28 JP JP1045472A patent/JPH02226674A/en active Pending
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