JPH02224399A - Magnetic shield material - Google Patents
Magnetic shield materialInfo
- Publication number
- JPH02224399A JPH02224399A JP1043227A JP4322789A JPH02224399A JP H02224399 A JPH02224399 A JP H02224399A JP 1043227 A JP1043227 A JP 1043227A JP 4322789 A JP4322789 A JP 4322789A JP H02224399 A JPH02224399 A JP H02224399A
- Authority
- JP
- Japan
- Prior art keywords
- substrate
- oxide superconductor
- film
- ceramic film
- silver
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000463 material Substances 0.000 title claims abstract description 20
- 239000000758 substrate Substances 0.000 claims abstract description 32
- 239000002887 superconductor Substances 0.000 claims abstract description 26
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 16
- 229910052709 silver Inorganic materials 0.000 abstract description 16
- 239000004332 silver Substances 0.000 abstract description 16
- 239000000919 ceramic Substances 0.000 abstract description 11
- 238000007650 screen-printing Methods 0.000 abstract description 2
- 238000000034 method Methods 0.000 abstract 3
- 239000007921 spray Substances 0.000 abstract 1
- 238000007669 thermal treatment Methods 0.000 abstract 1
- 238000010438 heat treatment Methods 0.000 description 6
- 230000008602 contraction Effects 0.000 description 2
- -1 12...Oxide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E40/00—Technologies for an efficient electrical power generation, transmission or distribution
- Y02E40/60—Superconducting electric elements or equipment; Power systems integrating superconducting elements or equipment
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Superconductors And Manufacturing Methods Therefor (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は磁気シールド材に関し、特に酸化物超電導体膜
を用いたに磁気シールド材に関する。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a magnetic shielding material, and particularly to a magnetic shielding material using an oxide superconductor film.
(従来の技術)
従来セラミクスや金属の基板上に数ミクロンから数10
0ミクロンの酸化物超電導体の膜を形成した後、熱処理
し、これを磁気シールド体として用いることが試みられ
ている。(Conventional technology) Conventionally, on ceramics or metal substrates, from several microns to several dozen
Attempts have been made to form a 0 micron oxide superconductor film, heat-treat it, and use it as a magnetic shield.
(発明が解決しようとする課題)
しかしながら、上記の従来の磁気シールド材は、前記基
板と前記酸化物超電導体の膜にとの熱膨張率に差がある
ため、前記熱処理の際に、クラックや、前記酸化物超電
導体の膜の前記基板からの剥離等が生じやすかった。(Problem to be Solved by the Invention) However, in the conventional magnetic shielding material described above, there is a difference in thermal expansion coefficient between the substrate and the oxide superconductor film, so that cracks and , peeling of the oxide superconductor film from the substrate was likely to occur.
本発明は上記の欠点を除去し、熱処理の際のクラックや
、酸化物超電導体の膜の基板からの剥離等を防ぐことが
できる、酸化物超電導体膜を用い、たに磁気シールド材
を提供することを目的とするものである。The present invention eliminates the above-mentioned drawbacks and provides a magnetic shielding material using an oxide superconductor film that can prevent cracks during heat treatment and peeling of the oxide superconductor film from the substrate. The purpose is to
(:11題を解決するための手段)
本発明によれば、基板上に酸化物超電導体膜を形成した
後、熱処理してなる磁気シールド材において、前記基板
として前記酸化物超電導体膜の熱膨張率と実質的に等し
い熱膨張率を有するものを選択したことを特徴とする磁
気シールド材が得られる。(Means for Solving Problem 11) According to the present invention, in a magnetic shielding material formed by forming an oxide superconductor film on a substrate and then heat-treating the material, the heat treatment of the oxide superconductor film as the substrate is performed. A magnetic shielding material characterized by selecting a material having a coefficient of thermal expansion substantially equal to the coefficient of expansion can be obtained.
(実施fll)
次に、本発明の実施例について図面を参照して説明する
。(Embodiment) Next, embodiments of the present invention will be described with reference to the drawings.
第1図は本発明の一実施例による磁気シールド材の側面
図であるが、図示するように銀基板11上に酸化物超電
導体セラミック膜12を塗布法、スプレー法、スクリー
ン印刷法等により数ミクロンから数100ミクロンの厚
さで形成した後、熱処理を施す。このように、基板とし
て、酸化物超電導体セラミック膜12の熱膨張率と実質
的に等しい熱膨張率を有し、しかも、可撓性を有する銀
基板11を選択する。さらに、酸化物超電導体セラミッ
ク膜12の厚さt a、を銀基板11の厚さt6、の2
倍以上となるように形成する。これは熱処理により超電
導体セラミック膜12に生ずる10〜20%の収縮に対
して銀基板11も同程度に収縮し収縮量の差を少なくす
るためである。FIG. 1 is a side view of a magnetic shielding material according to an embodiment of the present invention. As shown in the figure, an oxide superconductor ceramic film 12 is coated on a silver substrate 11 by coating, spraying, screen printing, etc. After being formed to a thickness of from microns to several hundred microns, heat treatment is performed. In this manner, the silver substrate 11 is selected as the substrate, which has a thermal expansion coefficient substantially equal to that of the oxide superconductor ceramic film 12 and is flexible. Furthermore, the thickness t a of the oxide superconductor ceramic film 12 is equal to the thickness t 6 of the silver substrate 11 .
Form it so that it is more than double the size. This is because when the superconductor ceramic film 12 shrinks by 10 to 20% due to the heat treatment, the silver substrate 11 also shrinks to the same extent, thereby reducing the difference in the amount of shrinkage.
第2図は第1図の銀基板11の構造を示す上面図である
。銀基板11には複数本の円弧状のスリット13および
14が同心的に配列形成されている。これらのスリット
は前記熱処理の際の銀基板11の収縮を容易にするため
に設けられる。すなわち酸化物超電導体セラミック膜1
2の収縮は基板11全面において周辺部から中心部方向
に生ずるため同心円状に配置されたスリット13.14
により銀基板11の収縮を有効に吸収することができる
。FIG. 2 is a top view showing the structure of the silver substrate 11 shown in FIG. 1. A plurality of arc-shaped slits 13 and 14 are concentrically arranged on the silver substrate 11. These slits are provided to facilitate contraction of the silver substrate 11 during the heat treatment. That is, oxide superconductor ceramic film 1
Since the contraction of No. 2 occurs from the periphery to the center on the entire surface of the substrate 11, the slits 13 and 14 are arranged concentrically.
Therefore, the shrinkage of the silver substrate 11 can be effectively absorbed.
第3図は第1図の銀基板11の他の実施例の構。FIG. 3 shows the structure of another embodiment of the silver substrate 11 shown in FIG. 1.
造を示す上面図である。同図の銀基板11には複数本の
線状のスリット15および16が同心的に配列形成され
ている。FIG. A plurality of linear slits 15 and 16 are arranged concentrically on the silver substrate 11 shown in the figure.
(発明の効果)
以上説明したように、本発明の磁気シールド材によれば
、基板として酸化物超電導体膜の熱膨張率と実質的に等
しい熱膨張率を有するものを選択したので、熱処理の際
、前記超電導体膜に生ずる収縮に対して前記基板も同程
度に収縮し得るため、クラックや、前記超電導体膜の前
記基板からの剥離等を防止することができる。(Effects of the Invention) As explained above, according to the magnetic shielding material of the present invention, since a substrate having a thermal expansion coefficient substantially equal to that of the oxide superconductor film is selected, heat treatment is not required. In this case, since the substrate can also shrink to the same extent as the superconductor film contracts, cracks, peeling of the superconductor film from the substrate, etc. can be prevented.
第1図は本発明の一実施例による磁気シールド材の側面
図、第2図は第1図の銀基板−11の構造を示す上面図
、第3図は第1図の銀基板11の他の実施例の構造を示
す上面図である。
第1図
11・・・銀基板、12・・・酸化物、超電導体セラミ
・ンク膜、 13〜16 ・・・スリット。
第2図
第3図1 is a side view of a magnetic shielding material according to an embodiment of the present invention, FIG. 2 is a top view showing the structure of the silver substrate 11 in FIG. 1, and FIG. 3 is a side view of a magnetic shielding material according to an embodiment of the present invention. FIG. 3 is a top view showing the structure of the embodiment. FIG. 1 11...Silver substrate, 12...Oxide, superconductor ceramic ink film, 13-16...Slit. Figure 2 Figure 3
Claims (1)
てなる磁気シールド材において、前記基板として前記酸
化物超電導体膜の熱膨張率と実質的に等しい熱膨張率を
有するものを選択したことを特徴とする磁気シールド材
。1. In the magnetic shielding material formed by forming an oxide superconductor film on a substrate and then heat-treating the material, the substrate has a coefficient of thermal expansion substantially equal to that of the oxide superconductor film. A magnetic shielding material featuring:
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1043227A JPH02224399A (en) | 1989-02-27 | 1989-02-27 | Magnetic shield material |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1043227A JPH02224399A (en) | 1989-02-27 | 1989-02-27 | Magnetic shield material |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02224399A true JPH02224399A (en) | 1990-09-06 |
Family
ID=12658030
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1043227A Pending JPH02224399A (en) | 1989-02-27 | 1989-02-27 | Magnetic shield material |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02224399A (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04216699A (en) * | 1990-12-17 | 1992-08-06 | Ngk Insulators Ltd | Superconducting magnetic shield cylinder and its manufacture |
JP2010192116A (en) * | 2009-02-13 | 2010-09-02 | Sumitomo Electric Ind Ltd | Superconductive wire rod, and superconductive cable using the same |
-
1989
- 1989-02-27 JP JP1043227A patent/JPH02224399A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH04216699A (en) * | 1990-12-17 | 1992-08-06 | Ngk Insulators Ltd | Superconducting magnetic shield cylinder and its manufacture |
JP2010192116A (en) * | 2009-02-13 | 2010-09-02 | Sumitomo Electric Ind Ltd | Superconductive wire rod, and superconductive cable using the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US3785895A (en) | Tape transfer of sinterable conductive,semiconductive or insulating patterns to electronic component substrates | |
JPH04129267A (en) | Semiconductor substrate and manufacture thereof | |
CA1161967A (en) | Process for the preparation of large area tft arrays | |
JPH02224399A (en) | Magnetic shield material | |
BR8306485A (en) | METAL AND / OR CERAMIC PROTECTION LAYER PROCESSING PROCESS ON A SUBSTRATE | |
US3605999A (en) | Insulative coated metal substrates and apparatus for holding substrates | |
JPH06176989A (en) | Holder for electronic-component chip | |
JPH0533915B2 (en) | ||
JP2680941B2 (en) | Wafer transfer holder for semiconductor manufacturing equipment | |
JPH03190762A (en) | Manufacture of thermal head | |
JPH0332268B2 (en) | ||
JPS63118062A (en) | Sputtering method | |
JP2533088B2 (en) | Method of manufacturing thermal head | |
JPH01132008A (en) | Superconductor and its manufacture | |
JP3026224B2 (en) | Manufacturing method of bismuth / lead / strontium / calcium / copper oxide superconductor wiring | |
JP2750711B2 (en) | Integrated circuit | |
CA2056309A1 (en) | Oxide superconductor magnetic shielding material and method of manufacturing the same | |
JP2003179152A (en) | Method of compensating shrinkage of exposed edge, and capacitor compensating shrinkage of exposed edge | |
JPS5583122A (en) | Flat lamination cathode | |
JPS6193601A (en) | Thin film resistor and manufacture thereof | |
JPH01122920A (en) | Superconductor | |
JPS5799736A (en) | Fabrication of semiconductor substrate | |
JPH03206620A (en) | Manufacture of semiconductor device | |
JPH11150215A (en) | Semiconductor device and manufacture thereof | |
JPH10150062A (en) | Tape carrier package and resin coating for the package |