JPH06176989A - Holder for electronic-component chip - Google Patents
Holder for electronic-component chipInfo
- Publication number
- JPH06176989A JPH06176989A JP32644892A JP32644892A JPH06176989A JP H06176989 A JPH06176989 A JP H06176989A JP 32644892 A JP32644892 A JP 32644892A JP 32644892 A JP32644892 A JP 32644892A JP H06176989 A JPH06176989 A JP H06176989A
- Authority
- JP
- Japan
- Prior art keywords
- holder
- core material
- electronic component
- holes
- elastic body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【産業上の利用分野】この発明は、複数個の電子部品チ
ップを一挙に取扱うのに用いられる電子部品チップ用ホ
ルダに関するもので、特に、複数個の電子部品チップの
各々を弾性的に受け入れる複数個の保持穴を有する全体
として平板状の電子部品チップ用ホルダに関するもので
ある。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component chip holder used for handling a plurality of electronic component chips at once, and more particularly to a plurality of electronic component chips which elastically receive each of the plurality of electronic component chips. The present invention relates to a holder for an electronic component chip, which has an individual holding hole and has a flat plate shape as a whole.
【０００２】なお、この明細書において、「電子部品チ
ップ」というときは、完成品としての電子部品チップの
ほか、たとえば外部端子が未だ形成されていない半製品
としての電子部品チップも包含されるものである。In this specification, the term "electronic component chip" includes not only a finished electronic component chip, but also a semi-finished electronic component chip in which external terminals are not yet formed. Is.
【０００３】[0003]
【従来の技術】図５は、従来から用いられている電子部
品チップ用ホルダ１を示す平面図である。図６は、図５
の線ＶＩ−ＶＩに沿う拡大断面図であり、図７は、図５
の線ＶＩＩ−ＶＩＩに沿う拡大断面図である。ホルダ１
は、全体として平板状のホルダ本体２と、このホルダ本
体２を補強するためホルダ本体２の内部に埋め込まれ
る、同じく平板状の芯材３とを備える。2. Description of the Related Art FIG. 5 is a plan view showing a conventionally used electronic component chip holder 1. 6 is shown in FIG.
FIG. 7 is an enlarged cross-sectional view taken along line VI-VI of FIG.
FIG. 7 is an enlarged sectional view taken along line VII-VII of FIG. Holder 1
Includes a holder body 2 having a flat plate shape as a whole and a core material 3 having a flat plate shape, which is embedded in the holder body 2 to reinforce the holder body 2.
【０００４】ホルダ本体２は、たとえばエラストマーの
ような弾性体からなり、その中央領域には、図６に示す
ように、複数個の電子部品チップ４の各々を１個ずつ受
け入れかつ受け入れた状態で各電子部品チップ４を挾持
する寸法とされた複数個の保持穴５を分布させている。
保持穴５の平面形状は、図５では、正方形とされたが、
長方形、円形等、他の形状とされてもよい。The holder main body 2 is made of an elastic material such as an elastomer, and in the central area thereof, as shown in FIG. A plurality of holding holes 5 sized to hold each electronic component chip 4 are distributed.
The planar shape of the holding hole 5 is square in FIG. 5, but
Other shapes such as a rectangle and a circle may be used.
【０００５】芯材３は、たとえばステンレス鋼のような
剛体からなる。芯材３の中央領域には、ホルダ本体２の
複数個の保持穴５の各々の周囲を通るたとえば格子状の
骨部分６を形成している。The core 3 is made of a rigid material such as stainless steel. In the central region of the core material 3, for example, a lattice-shaped bone portion 6 passing around each of the plurality of holding holes 5 of the holder body 2 is formed.
【０００６】図６に示した電子部品チップ４は、たとえ
ば積層セラミックコンデンサである。このような積層セ
ラミックコンデンサの外部端子となる外部電極を電子部
品チップ４に形成するため、各電子部品チップ４は、図
６の矢印７で示すように、各保持穴５内に挿入され、そ
の少なくとも一方端部がホルダ１から露出する状態とさ
れる。そして、複数個の電子部品チップ４がホルダ１に
よって保持された状態で一挙に取扱われ、ホルダ１をマ
スクとして用いながら、気相めっき工程に付されたり、
また、ディップ工程に付されたりする。ディップ工程後
においては、ホルダ１に保持されたまま、電子部品チッ
プ４に付与された導体ペーストが乾燥される。The electronic component chip 4 shown in FIG. 6 is, for example, a laminated ceramic capacitor. In order to form the external electrodes, which are the external terminals of such a monolithic ceramic capacitor, on the electronic component chip 4, each electronic component chip 4 is inserted into each holding hole 5 as shown by an arrow 7 in FIG. At least one end is exposed from the holder 1. Then, the plurality of electronic component chips 4 are handled at once in a state of being held by the holder 1, and subjected to a vapor phase plating process while using the holder 1 as a mask,
Also, it may be attached to the dipping process. After the dipping step, the conductor paste applied to the electronic component chip 4 is dried while being held by the holder 1.
【０００７】保持穴５は、前述したように、ホルダ１の
中央領域に分布され、ホルダ１の周辺領域は、このホル
ダ１を取扱うに際して、ホルダ１の剛性をもたし、これ
をチャックしたり位置決めしたりするための領域として
用いられる。そのため、ホルダ１の周辺領域には、たと
えば貫通孔をもって複数個の位置決め穴８が設けられ
る。これら位置決め穴８は、たとえば、チャックの爪を
係合させたり、位置決めピンを嵌合させたりするのに用
いられる。また、ホルダ１の方向性を与えるため、ホル
ダ１の周縁部の一部には切欠き部９が形成される。As described above, the holding holes 5 are distributed in the central area of the holder 1, and the peripheral area of the holder 1 has rigidity of the holder 1 when the holder 1 is handled, and the holder 1 is chucked. It is used as an area for positioning. Therefore, in the peripheral area of the holder 1, a plurality of positioning holes 8 are provided with through holes, for example. These positioning holes 8 are used, for example, to engage the claws of the chuck and to fit the positioning pins. Further, in order to give the directionality of the holder 1, a cutout portion 9 is formed in a part of the peripheral edge portion of the holder 1.
【０００８】[0008]
【発明が解決しようとする課題】上述したように、ホル
ダ１によって保持された電子部品チップ４は、たとえば
気相めっきや乾燥といった工程において、比較的高温条
件や高真空にさらされるため、当然、ホルダ１も、同様
に、このような高温条件や高真空にさらされる。しかし
ながら、ホルダ１が加熱されると、弾性体からなるホル
ダ本体２は、それによって変形を生じやすい傾向にあ
る。保持穴５が設けられた領域では、芯材３の各主面上
に位置する弾性体は、図６によく示されているように、
貫通孔５の周囲に位置する弾性体によって互いに連結さ
れているが、ホルダ１の周辺部においては、図７によく
示されているように、比較的広い面積にわたって芯材３
の各主面上に位置する弾性体を互いに連結する部分が存
在しない。そのため、図７において想像線で示すよう
に、ホルダ本体２を構成する弾性体は、上述した加熱に
よって、芯材３から剥離されるように変形することがあ
る。特に、このような傾向は、ホルダ１の中央部と周辺
部とで温度のばらつきが生じた場合、より顕著に現れ
る。このようなホルダ本体２の変形は、電子部品チップ
４の取扱いに支障を来すので、防止されなければならな
い。As described above, the electronic component chip 4 held by the holder 1 is exposed to a relatively high temperature condition or a high vacuum in a process such as vapor phase plating or drying. The holder 1 is similarly exposed to such high temperature conditions and high vacuum. However, when the holder 1 is heated, the holder body 2 made of an elastic body tends to be deformed due to it. In the region where the holding hole 5 is provided, the elastic body located on each main surface of the core material 3 has a structure as shown in FIG.
The core members 3 are connected to each other by an elastic body located around the through hole 5, but in the peripheral portion of the holder 1, as shown in FIG.
There is no portion that connects the elastic bodies located on each of the main surfaces of the. Therefore, as shown by an imaginary line in FIG. 7, the elastic body forming the holder main body 2 may be deformed so as to be separated from the core material 3 by the above-mentioned heating. In particular, such a tendency becomes more prominent when the temperature varies between the central portion and the peripheral portion of the holder 1. Such deformation of the holder body 2 hinders the handling of the electronic component chip 4 and must be prevented.
【０００９】従来、このような問題を解決するため、ホ
ルダ本体２を構成する弾性体として、耐熱性が高く、し
かも芯材３との密着性（接着性）の優れた材料を選定す
るように試みられていたが、このような材料選定の制約
からホルダ１が高価になるばかりでなく、それでもなお
問題の完全な解決を図り得ないことがしばしばあった。Conventionally, in order to solve such a problem, as the elastic body forming the holder body 2, a material having high heat resistance and excellent adhesion (adhesion) with the core material 3 is selected. Although it has been attempted, not only is the holder 1 expensive due to such material selection restrictions, but it is often impossible to completely solve the problem.
【００１０】それゆえに、この発明の目的は、上述した
ような弾性体からなるホルダ本体の熱変形を防止し得
る、電子部品チップ用ホルダを提供しようとすることで
ある。Therefore, an object of the present invention is to provide an electronic component chip holder which can prevent thermal deformation of the holder body made of the elastic body as described above.
【００１１】[0011]
【課題を解決するための手段】この発明は、全体として
平板状であって、複数個の電子部品チップの各々を１個
ずつ受け入れかつ受け入れた状態で各電子部品チップを
挾持する寸法とされた複数個の保持穴をその中央領域に
分布させた、弾性体からなるホルダ本体、および、ホル
ダ本体を補強するためホルダ本体の内部に埋め込まれる
ものであって、全体として平板状の剛体からなり、その
中央領域に前記ホルダ本体の複数個の保持穴の各々の周
囲を通る骨部分を形成する芯材を備える、電子部品チッ
プ用ホルダに向けられるものであって、上述した技術的
課題を解決するため、芯材の周辺領域には複数個の貫通
孔が分布され、ホルダ本体を構成する弾性体は、各貫通
孔内を埋め、当該貫通孔内に位置する弾性体が芯材の各
主面上に位置する弾性体を互いに連結するようにされた
ことを特徴としている。The present invention has a flat plate shape as a whole and is sized to receive one electronic component chip and hold each electronic component chip in a received state. A plurality of holding holes distributed in the central region of the holder main body made of an elastic body, and embedded in the holder main body to reinforce the holder main body, and made of a rigid body as a whole, The present invention is directed to a holder for electronic component chips, which is provided with a core material that forms a bone portion that passes around each of a plurality of holding holes of the holder body in its central region, and solves the above-mentioned technical problem. Therefore, a plurality of through holes are distributed in the peripheral region of the core material, and the elastic body that constitutes the holder body fills the inside of each through hole, and the elastic body located in the through hole has each main surface of the core material. Located on top It is characterized in that it is a sexual body to connect to each other.
【００１２】[0012]
【作用】この発明において、芯材の周辺領域に分布され
た複数個の貫通孔内を埋める、ホルダ本体を構成する弾
性体は、芯材の各主面上に位置する弾性体を互いに連結
するので、いわゆるピンニング点として作用する。In the present invention, the elastic body forming the holder main body, which fills the plurality of through holes distributed in the peripheral region of the core, connects the elastic bodies located on the respective main surfaces of the core to each other. Therefore, it acts as a so-called pinning point.
【００１３】[0013]
【発明の効果】したがって、この発明によれば、ホルダ
の周辺部において、ホルダ本体が芯材から剥離しにくく
なるとともに、このような剥離が生じにくいために、ホ
ルダ本体の変形も生じにくくなる。その結果、ホルダ
を、加熱される条件下でも問題なく使用することができ
るようになり、また、ホルダ本体が芯材に対して高い密
着性を与え得る材料選定を行なう必要がなくなるので、
ホルダを安価に提供することができる。Therefore, according to the present invention, in the peripheral portion of the holder, the holder main body is less likely to be separated from the core material, and since such separation is less likely to occur, the holder main body is less likely to be deformed. As a result, the holder can be used without problems even under heated conditions, and there is no need to select a material that allows the holder body to provide high adhesion to the core material.
The holder can be provided at low cost.
【００１４】[0014]
【実施例】図１は、この発明の一実施例による電子部品
チップ用ホルダ１１を示す平面図である。図２は、図１
の線ＩＩ−ＩＩに沿う拡大断面図である。1 is a plan view showing an electronic component chip holder 11 according to an embodiment of the present invention. 2 is shown in FIG.
11 is an enlarged cross-sectional view taken along line II-II of FIG.
【００１５】ホルダ１１は、前述した従来のホルダ１と
同様、平板状の弾性体からなるホルダ本体１２、および
ホルダ本体１２を補強するためホルダ本体１２の内部に
埋め込まれる、全体として平板状の剛体からなる芯材１
３を備える。The holder 11 is, like the conventional holder 1 described above, a holder body 12 made of a flat plate-like elastic body, and a rigid body as a whole which is embedded in the holder body 12 to reinforce the holder body 12. Core material 1
3 is provided.
【００１６】ホルダ本体１２の中央領域には、複数個の
電子部品チップの各々を１個ずつ受け入れかつ受け入れ
た状態で各電子部品チップを挾持する寸法とされた複数
個の保持穴１４が分布される。他方、芯材１３の中央領
域には、上述したホルダ本体１２の複数個の保持穴１４
の各々の周囲を通る骨部分１５が形成されている。ま
た、ホルダ１１の周辺領域には、複数個の位置決め穴１
６が設けられ、ホルダ１１の周縁部の一部には、切欠き
部１７が形成される。In the central region of the holder body 12, a plurality of holding holes 14 each having a size for holding each electronic component chip and holding each electronic component chip in a received state are distributed. It On the other hand, in the central region of the core material 13, a plurality of holding holes 14 of the holder body 12 described above are provided.
Bone portions 15 are formed to pass around each of the. In addition, a plurality of positioning holes 1 are provided in the peripheral area of the holder 11.
6 is provided, and a notch 17 is formed in a part of the peripheral edge of the holder 11.
【００１７】なお、以上述べた構成は、前述した従来の
ホルダ１の場合と実質的に同様である。The structure described above is substantially the same as that of the conventional holder 1 described above.
【００１８】芯材１３の周辺領域には、複数個の貫通孔
１８が分布される。図２によく示されているように、ホ
ルダ本体１２を構成する弾性体は、各貫通孔１８内を埋
めている。したがって、貫通孔１８内に位置する弾性体
は、ピンニング点として作用すべく、芯材１３の各主面
上に位置する弾性体を互いに連結している。これによっ
て、ホルダ１１の周辺部において、ホルダ本体１２を構
成する弾性体が芯材１３から剥離しにくくなり、よっ
て、ホルダ本体１２が熱変形しにくくなる。A plurality of through holes 18 are distributed in the peripheral region of the core material 13. As shown in FIG. 2, the elastic body forming the holder body 12 fills the inside of each through hole 18. Therefore, the elastic bodies located in the through holes 18 connect the elastic bodies located on the respective main surfaces of the core 13 to each other so as to act as pinning points. As a result, in the peripheral portion of the holder 11, the elastic body that constitutes the holder body 12 is less likely to be separated from the core material 13, and thus the holder body 12 is less likely to be thermally deformed.
【００１９】この実施例では、図２に示すように、貫通
孔１８の内周面のほぼ中央部には、突起１９が形成され
ている。このような突起１９は、たとえばステンレス鋼
のような金属からなる芯材１３に対してエッチングによ
り貫通孔１８を形成するときに形成することができる。
突起１９の存在は、ホルダ本体１２と芯材１３との係合
状態をより確実なものとし、上述したような剥離や変形
をより抑制する効果を有する。In this embodiment, as shown in FIG. 2, a protrusion 19 is formed on the inner peripheral surface of the through hole 18 substantially at the center thereof. Such protrusions 19 can be formed when the through holes 18 are formed by etching the core material 13 made of metal such as stainless steel.
The presence of the projections 19 makes the engagement state between the holder body 12 and the core material 13 more reliable, and has an effect of further suppressing the above-described peeling and deformation.
【００２０】上述したホルダ１１において、芯材１３
は、たとえばステンレス鋼のような剛体から構成され、
ホルダ本体１２は、たとえばエラストマーのような弾性
体から構成される。ここで、ホルダ１１は、たとえば１
００〜３００℃に加熱されて使用されるので、ホルダ本
体１２に用いられる材料は、このような耐熱性を有して
いなければならない。コストの点を考慮して、たとえば
耐熱フッ素系ゴムが、ホルダ本体１２を構成する好まし
い材料として選定され得るが、この耐熱フッ素系ゴム
は、金属との密着性が劣るという欠点を有している。し
かしながら、この実施例において、ホルダ本体１２を耐
熱フッ素系ゴムで与え、芯材１３をステンレス鋼から構
成しても、実際の使用において上述のように加熱されて
も、ホルダ本体１２が芯材１３から剥離する現象が見ら
れなかったことを確認している。In the holder 11 described above, the core material 13
Consists of a rigid body such as stainless steel,
The holder body 12 is made of an elastic body such as an elastomer. Here, the holder 11 is, for example, 1
The material used for the holder body 12 must have such heat resistance because it is used after being heated to 00 to 300 ° C. From the viewpoint of cost, for example, heat-resistant fluorinated rubber can be selected as a preferable material for forming the holder body 12, but this heat-resistant fluorinated rubber has a drawback of poor adhesion to metal. . However, in this embodiment, even if the holder body 12 is made of heat-resistant fluorinated rubber and the core material 13 is made of stainless steel, even if the holder body 12 is heated as described above in actual use, the holder body 12 does not have the core material 13. It was confirmed that the phenomenon of peeling from the surface was not seen.
【００２１】図３および図４は、それぞれ、この発明の
他の実施例を示している。なお、図３および図４におい
て、図１に示した要素に相当する要素には、同様の参照
符号を付し、重複する説明は省略する。3 and 4 each show another embodiment of the present invention. In FIGS. 3 and 4, elements corresponding to those shown in FIG. 1 are designated by the same reference numerals, and redundant description will be omitted.
【００２２】図３に示したホルダ１１ａでは、図１に示
すような円形の貫通孔１８に代えて、スロット状の貫通
孔２０が設けられている。このように、芯材１３の周辺
領域に分布される貫通孔は、その形状および数において
任意である。In the holder 11a shown in FIG. 3, a slot-like through hole 20 is provided instead of the circular through hole 18 as shown in FIG. As described above, the through holes distributed in the peripheral region of the core material 13 are arbitrary in shape and number.
【００２３】また、図４に示したホルダ１１ｂでは、ス
ロット状の貫通孔２１が千鳥状に配置されている。この
ように、貫通孔２１を千鳥状に配置することにより、ホ
ルダ本体１２がその面方向に膨張したとき、それによっ
て発生する応力を有利に逃がすことができる。この実施
例から、芯材１３の周辺領域に設けられる貫通孔の分布
状態は、任意であることがわかる。Further, in the holder 11b shown in FIG. 4, the slot-shaped through holes 21 are arranged in a staggered manner. By arranging the through holes 21 in a zigzag manner in this manner, when the holder body 12 expands in its surface direction, the stress generated thereby can be advantageously released. From this example, it is understood that the distribution state of the through holes provided in the peripheral region of the core material 13 is arbitrary.
【図１】この発明の一実施例による電子部品チップ用ホ
ルダ１１を示す一部破断平面図である。FIG. 1 is a partially cutaway plan view showing an electronic component chip holder 11 according to an embodiment of the present invention.
【図２】図１の線ＩＩ−ＩＩに沿う拡大断面図である。FIG. 2 is an enlarged cross-sectional view taken along the line II-II in FIG.
【図３】この発明の他の実施例による電子部品チップ用
ホルダ１１ａの一部を示す一部破断平面図である。FIG. 3 is a partially cutaway plan view showing a part of an electronic component chip holder 11a according to another embodiment of the present invention.
【図４】この発明のさらに他の実施例による電子部品チ
ップ用ホルダ１１ｂの一部を示す一部破断平面図であ
る。FIG. 4 is a partially cutaway plan view showing a part of an electronic component chip holder 11b according to still another embodiment of the present invention.
【図５】従来の電子部品チップ用ホルダ１を示す一部破
断平面図である。FIG. 5 is a partially cutaway plan view showing a conventional electronic component chip holder 1.
【図６】図５の線ＶＩ−ＶＩに沿う拡大断面図であり、
併せて電子部品チップ４を示している。6 is an enlarged cross-sectional view taken along line VI-VI of FIG.
The electronic component chip 4 is also shown.
【図７】図５の線ＶＩＩ−ＶＩＩに沿う拡大断面図であ
る。7 is an enlarged cross-sectional view taken along the line VII-VII in FIG.
４ 電子部品チップ １１，１１ａ，１１ｂ 電子部品チップ用ホルダ １２ ホルダ本体 １３ 芯材 １４ 保持穴 １５ 骨部分 １８，２０，２１ 貫通孔 4 Electronic Component Chip 11, 11a, 11b Holder for Electronic Component Chip 12 Holder Body 13 Core Material 14 Holding Hole 15 Bone Part 18, 20, 21 Through Hole
Claims (1)
子部品チップの各々を１個ずつ受け入れかつ受け入れた
状態で各電子部品チップを挾持する寸法とされた複数個
の保持穴をその中央領域に分布させた、弾性体からなる
ホルダ本体、および前記ホルダ本体を補強するためホル
ダ本体の内部に埋め込まれるものであって、全体として
平板状の剛体からなり、その中央領域に前記ホルダ本体
の前記複数個の保持穴の各々の周囲を通る骨部分を形成
する芯材を備える、電子部品チップ用ホルダにおいて、 前記芯材の周辺領域には複数個の貫通孔が分布され、前
記ホルダ本体を構成する弾性体は、各前記貫通孔内を埋
め、当該貫通孔内に位置する弾性体が前記芯材の各主面
上に位置する弾性体を互いに連結するようにされたこと
を特徴とする、電子部品チップ用ホルダ。1. A plurality of holding holes, each of which has a flat plate shape as a whole and which is sized to hold each of the plurality of electronic component chips and holds each of the electronic component chips in a state where the electronic component chips are received. A holder main body made of an elastic body distributed in a region, and embedded in the holder main body to reinforce the holder main body, which is made of a rigid body as a whole and has a central region of the holder main body. In a holder for an electronic component chip, comprising a core material that forms a bone portion that passes around each of the plurality of holding holes, a plurality of through holes are distributed in a peripheral region of the core material, and the holder body is The constituting elastic body is characterized in that the inside of each through hole is filled, and the elastic body located in the through hole connects the elastic bodies located on each main surface of the core member to each other. , Electric Holder for the component chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32644892A JP2891005B2 (en) | 1992-12-07 | 1992-12-07 | Electronic component chip holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32644892A JP2891005B2 (en) | 1992-12-07 | 1992-12-07 | Electronic component chip holder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06176989A true JPH06176989A (en) | 1994-06-24 |
| JP2891005B2 JP2891005B2 (en) | 1999-05-17 |
Family
ID=18187923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32644892A Expired - Lifetime JP2891005B2 (en) | 1992-12-07 | 1992-12-07 | Electronic component chip holder |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2891005B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007269352A (en) * | 2006-03-31 | 2007-10-18 | Shin Etsu Polymer Co Ltd | Reinforcing member and member for mask |
| KR100929263B1 (en) * | 2009-01-09 | 2009-12-01 | (주)지텍 | A exfoliation prevention type carrier plate |
| KR100946593B1 (en) * | 2009-05-28 | 2010-03-09 | 유한회사 디알텍 | Career plate and manufacturing method thereof |
| JP2012523128A (en) * | 2009-04-07 | 2012-09-27 | ジーテック | Carrier plate for external electrode formation and manufacturing method thereof |
| KR101218578B1 (en) * | 2012-04-03 | 2013-01-21 | (주)한올페이 | Carrier plate for holding chips and method for manufacturing the same |
| KR101251932B1 (en) * | 2011-10-27 | 2013-04-08 | 유한회사 디알텍 | Career plate |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2010141235A (en) * | 2008-12-15 | 2010-06-24 | Shin Etsu Polymer Co Ltd | Thin sheet type holding tool |
-
1992
- 1992-12-07 JP JP32644892A patent/JP2891005B2/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007269352A (en) * | 2006-03-31 | 2007-10-18 | Shin Etsu Polymer Co Ltd | Reinforcing member and member for mask |
| KR100929263B1 (en) * | 2009-01-09 | 2009-12-01 | (주)지텍 | A exfoliation prevention type carrier plate |
| JP2012523128A (en) * | 2009-04-07 | 2012-09-27 | ジーテック | Carrier plate for external electrode formation and manufacturing method thereof |
| KR100946593B1 (en) * | 2009-05-28 | 2010-03-09 | 유한회사 디알텍 | Career plate and manufacturing method thereof |
| KR101251932B1 (en) * | 2011-10-27 | 2013-04-08 | 유한회사 디알텍 | Career plate |
| KR101218578B1 (en) * | 2012-04-03 | 2013-01-21 | (주)한올페이 | Carrier plate for holding chips and method for manufacturing the same |
| JP2013214749A (en) * | 2012-04-03 | 2013-10-17 | Hanol Fei Co Ltd | Carrier plate for holding chip and method for manufacturing the same |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2891005B2 (en) | 1999-05-17 |
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