JP2891005B2 - Electronic component chip holder - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component chip holder used for handling a plurality of electronic component chips at a time, and more particularly, to a plurality of electronic component chip resiliently receiving plural electronic component chips. The present invention relates to an overall flat electronic component chip holder having a plurality of holding holes.

[0002] In this specification, the term "electronic component chip" includes not only an electronic component chip as a finished product but also an electronic component chip as a semi-finished product with no external terminals formed yet. It is.

[0003]

2. Description of the Related Art FIG. 5 is a plan view showing an electronic component chip holder 1 conventionally used. FIG. 6 shows FIG.
FIG. 7 is an enlarged sectional view taken along line VI-VI of FIG.
FIG. 7 is an enlarged sectional view taken along line VII-VII of FIG. Holder 1
Includes a holder body 2 having a flat plate shape as a whole, and a core member 3 also having a flat plate shape embedded in the holder body 2 to reinforce the holder body 2.

The holder main body 2 is made of an elastic material such as an elastomer, for example, and has a central region in which a plurality of electronic component chips 4 are received one by one as shown in FIG. A plurality of holding holes 5 sized to hold each electronic component chip 4 are distributed.
The planar shape of the holding hole 5 is square in FIG.
Other shapes such as a rectangle and a circle may be used.

[0005] The core member 3 is made of a rigid body such as stainless steel. In the central region of the core member 3, for example, a lattice-shaped bone portion 6 that passes around each of the plurality of holding holes 5 of the holder body 2 is formed.

The electronic component chip 4 shown in FIG. 6 is, for example, a multilayer ceramic capacitor. In order to form an external electrode serving as an external terminal of such a multilayer ceramic capacitor on the electronic component chip 4, each electronic component chip 4 is inserted into each holding hole 5 as shown by an arrow 7 in FIG. At least one end is exposed from the holder 1. Then, the plurality of electronic component chips 4 are handled at a time while being held by the holder 1, and are subjected to a vapor phase plating process while using the holder 1 as a mask,
Also, it is subjected to a dipping process. After the dipping step, the conductor paste applied to the electronic component chip 4 is dried while being held by the holder 1.

As described above, the holding holes 5 are distributed in the central region of the holder 1, and the peripheral region of the holder 1 has the rigidity of the holder 1 when handling the holder 1 and chucks the holder 1. It is used as an area for positioning. Therefore, a plurality of positioning holes 8 are provided in the peripheral area of the holder 1 with, for example, through holes. These positioning holes 8 are used, for example, for engaging a claw of a chuck or fitting a positioning pin. In order to give the direction of the holder 1, a cutout 9 is formed in a part of the peripheral portion of the holder 1.

[0008]

As described above, the electronic component chip 4 held by the holder 1 is exposed to a relatively high temperature condition or a high vacuum in a process such as vapor phase plating and drying. The holder 1 is similarly exposed to such high temperature conditions and high vacuum. However, when the holder 1 is heated, the holder main body 2 made of an elastic body tends to be easily deformed thereby. In the region where the holding hole 5 is provided, the elastic body located on each main surface of the core material 3 is, as well shown in FIG.
Although they are connected to each other by an elastic body positioned around the through-hole 5, the core material 3 extends over a relatively large area around the holder 1 as well shown in FIG.
There is no portion connecting the elastic bodies located on the respective main surfaces of the above. Therefore, as shown by an imaginary line in FIG. 7, the elastic body constituting the holder main body 2 may be deformed by the above-mentioned heating so as to be separated from the core material 3. In particular, such a tendency appears more remarkably when the temperature varies between the central part and the peripheral part of the holder 1. Such deformation of the holder main body 2 hinders handling of the electronic component chip 4 and must be prevented.

Conventionally, in order to solve such a problem, a material having high heat resistance and excellent adhesion (adhesion) with the core material 3 is selected as an elastic body constituting the holder body 2. Although attempts have been made, the holder 1 is not only expensive due to such restrictions on material selection, but it is still often impossible to completely solve the problem.

SUMMARY OF THE INVENTION It is an object of the present invention to provide an electronic component chip holder capable of preventing thermal deformation of a holder body made of an elastic body as described above.

[0011]

SUMMARY OF THE INVENTION The present invention has a flat plate shape as a whole, and is sized to receive each of a plurality of electronic component chips one by one and to hold each electronic component chip in the received state. A plurality of holding holes are distributed in the center region thereof, a holder body made of an elastic body, and embedded in the holder body to reinforce the holder body, and made of a plate-like rigid body as a whole, The present invention is directed to an electronic component chip holder including a core material that forms a bone portion passing around each of a plurality of holding holes of the holder body in a central region thereof, and solves the above-described technical problem. Therefore, a plurality of through-holes are distributed in the peripheral region of the core material, and the elastic body constituting the holder body fills each of the through-holes, and the elastic body located in the through-hole is the main surface of the core material. Located on It is characterized in that it is a sexual body to connect to each other.

[0012]

According to the present invention, the elastic members forming the holder main body, which fill the plurality of through holes distributed in the peripheral region of the core member, connect the elastic members located on the respective main surfaces of the core member to each other. Therefore, it acts as a so-called pinning point.

[0013]

Therefore, according to the present invention, the holder main body is less likely to be separated from the core material at the peripheral portion of the holder, and since such separation is less likely to occur, the holder main body is less likely to be deformed. As a result, the holder can be used without any problem even under the condition of being heated, and it is not necessary to select a material that allows the holder body to provide high adhesion to the core material.
The holder can be provided at low cost.

[0014]

FIG. 1 is a plan view showing an electronic component chip holder 11 according to one embodiment of the present invention. FIG. 2 shows FIG.
FIG. 2 is an enlarged sectional view taken along line II-II of FIG.

The holder 11 is, like the conventional holder 1 described above, a holder main body 12 made of a flat elastic body, and a rigid flat body as a whole embedded inside the holder main body 12 to reinforce the holder main body 12. Core material 1 consisting of
3 is provided.

In the central region of the holder main body 12, a plurality of holding holes 14 having a size for receiving each of the plurality of electronic component chips one by one and holding the respective electronic component chips in the received state are distributed. You. On the other hand, a plurality of holding holes 14 of the holder body 12 described above
A bone portion 15 passing around each of is formed. Further, a plurality of positioning holes 1 are provided around the holder 11.
6 is provided, and a cutout 17 is formed in a part of the peripheral edge of the holder 11.

The configuration described above is substantially the same as that of the conventional holder 1 described above.

A plurality of through holes 18 are distributed in a peripheral region of the core material 13. As shown in FIG. 2, an elastic body constituting the holder main body 12 fills each through hole 18. Therefore, the elastic members located in the through holes 18 connect the elastic members located on the respective main surfaces of the core member 13 to each other to act as pinning points. Thereby, in the peripheral portion of the holder 11, the elastic body constituting the holder main body 12 is hardly peeled off from the core material 13, and therefore, the holder main body 12 is hardly thermally deformed.

In this embodiment, as shown in FIG. 2, a projection 19 is formed substantially at the center of the inner peripheral surface of the through hole 18. Such projections 19 can be formed when the through holes 18 are formed by etching the core material 13 made of a metal such as stainless steel.
The presence of the projections 19 has the effect of making the engagement between the holder body 12 and the core 13 more reliable, and further suppressing the above-described peeling and deformation.

In the holder 11 described above, the core 13
Is composed of a rigid body such as stainless steel,
The holder body 12 is made of an elastic body such as an elastomer. Here, the holder 11 is, for example, 1
Since it is used after being heated to 00 to 300 ° C., the material used for the holder main body 12 must have such heat resistance. In consideration of cost, for example, heat-resistant fluorine-based rubber can be selected as a preferable material for forming the holder main body 12, but this heat-resistant fluorine-based rubber has a disadvantage that adhesion to metal is poor. . However, in this embodiment, the holder main body 12 is made of heat-resistant fluorine-based rubber, and the core 13 is made of stainless steel, or the holder 13 is heated in the above-described manner in actual use. It was confirmed that no phenomenon of peeling from the substrate was observed.

3 and 4 show another embodiment of the present invention. In FIGS. 3 and 4, elements corresponding to the elements shown in FIG. 1 are denoted by the same reference numerals, and redundant description will be omitted.

In the holder 11a shown in FIG. 3, a slot-shaped through hole 20 is provided instead of the circular through hole 18 as shown in FIG. As described above, the through holes distributed in the peripheral region of the core 13 are arbitrary in shape and number.

In the holder 11b shown in FIG. 4, slot-shaped through holes 21 are arranged in a staggered manner. Thus, by disposing the through holes 21 in a staggered manner, when the holder main body 12 expands in the plane direction, the stress generated by the expansion can be advantageously released. From this example, it can be seen that the distribution state of the through holes provided in the peripheral region of the core material 13 is arbitrary.

[Brief description of the drawings]

FIG. 1 is a partially broken plan view showing an electronic component chip holder 11 according to an embodiment of the present invention.

FIG. 2 is an enlarged sectional view taken along line II-II in FIG.

FIG. 3 is a partially broken plan view showing a part of an electronic component chip holder 11a according to another embodiment of the present invention.

FIG. 4 is a partially broken plan view showing a part of an electronic component chip holder 11b according to still another embodiment of the present invention.

FIG. 5 is a partially broken plan view showing a conventional electronic component chip holder 1.

6 is an enlarged sectional view taken along line VI-VI in FIG. 5;
The electronic component chip 4 is also shown.

FIG. 7 is an enlarged sectional view taken along line VII-VII in FIG. 5;

[Explanation of symbols]

 4 Electronic component chip 11, 11a, 11b Electronic component chip holder 12 Holder body 13 Core material 14 Holding hole 15 Bone portion 18, 20, 21 Through hole

Continuation of the front page (56) References JP-A-4-291712 (JP, A) JP-A-3-99429 (JP, U) (58) Fields investigated (Int. Cl. ⁶ , DB name) H01G 13 / 00

Claims (1)

(57) [Claims] 1. A plurality of holding holes, each of which has a plate shape as a whole and is sized to receive each of a plurality of electronic component chips one by one and to hold each of the electronic component chips in the received state. The holder main body made of an elastic body distributed in the region, and embedded in the holder main body to reinforce the holder main body, which is made of a flat plate-like rigid body as a whole, and has a central region where the holder main body An electronic component chip holder comprising a core forming a bone portion passing around each of the plurality of holding holes, wherein a plurality of through holes are distributed in a peripheral region of the core, and the holder body is The constituent elastic body fills each of the through holes, and the elastic body located in the through hole connects the elastic bodies located on each main surface of the core material to each other. , Holder for the component chips.