JPH02218516A - Polishing device for plate material - Google Patents

Abstract

PURPOSE:To enable mirror-like polishing of the surface of a plate material to be performed at high speeds continuously and effectively by finishing the surface of a polished material by means of electro-polishing with specified voltage applied between the polished material and a cathode using electrolyte, and thereby concurrently polishing mechanically the surface of the polished material by a polishing buff which is rotated while coming in contact with the polished material. CONSTITUTION:A polishing buff device 2 is made up out of a cylindrical metallic spindle 13 and of a tubular type unwoven cloth great in gas permeability while being equipped with a polishing buff 14 with electrolyte flow paths 14a in such a way that the spindle 13 is inserted into the center section of the buff 14 so that the polishing buff 14 absorbs electrolyte in order to make electrolyte held by the buff 14 soak through onto a plate material 10. When the plate material 10 is polished, the spindle 13 is made to be a cathode, which makes the cathode 13 opposite to the plate material 10 via the electrolyte paths 14a of the buff 14. When the buff 14 is rotated with the spindle 13 driven, the surface of the plate material 10 coming in contact with the upper outer surface of the buff 14 is mechanically polished by the buff 14, electrolyte in a tank 1 is concurrently fed to the plate material 10 so that the surface of the plate material 10 is thereby finished by means of electropolishing.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a polishing device for metal plate materials such as stainless steel hoops, and more specifically, mechanical polishing using a polishing belt and polishing buff and electrolytic polishing using an electrolytic polishing liquid. The present invention relates to a polishing device that continuously and efficiently polishes the surface of a plate material to a mirror finish by combining polishing.

[Problems to be solved by conventional techniques and inventions] In recent years,
There is a demand for polishing the surface of metal plate materials such as stainless steel hoops to a high gloss. In this case, mechanical polishing methods such as belt polishing and buff polishing have been conventionally used to polish the plate material, but these methods have limited brightening and smoothing effects, and are not suitable for mirror finishing, which is required in recent years. There are problems in that it is difficult to deal with in some cases and work efficiency is poor.

On the other hand, electrolytic composite polishing devices that combine electrolytic polishing and mechanical polishing have been proposed (for example, in Japanese Patent Application Laid-open No. 52-14
However, conventional electrolytic composite polishing devices of this type employ a flat polishing method in which the surface of a polishing tool such as a grindstone or felt pad that contacts the object to be polished is made flat. Therefore, it is effective when the flatness or levelness of the workpiece is important, but it is useful for applications where flatness or levelness is not important as long as the surface is simply a mirror surface, such as building materials and plant materials. Productivity was extremely poor when polishing plate materials used for.

The present invention was developed in view of the above circumstances, and is a polishing device that can continuously mirror-finish metal plates such as stainless steel hoops by electrolytic composite polishing, which combines electrolytic polishing and mechanical polishing, and has an extremely fast processing speed. The purpose is to provide

[Means to solve the problem]

In order to achieve the above object, the present invention provides a spindle that can rotate once, a non-conductive polishing buff that is made of a liquid-permeable material and rotates together with the rotation of the spindle, and an electrolytic polishing liquid that is supplied to the polishing buff. and a cathode provided on the spindle so as to face the metal plate material of the object to be polished, which is in contact with the polishing buff, with a predetermined distance from the metal plate material through the electrolyte flow path of the polishing buff. Then, the metal plate material is brought into contact with the outer surface of the polishing buff, the spindle is rotated, and the electrolytic polishing liquid is absorbed and impregnated into the polishing buff from the above means, and the plate material is electrolytically polished through the flow path of the polishing buff. The plate material is mechanically polished by the polishing buff by supplying a liquid and passing electricity between the plate material as an anode and the cathode.

A plate material polishing apparatus is provided, which is configured to electrolytically polish a plate material using the electrolytic polishing liquid described above.

Here, the plate material to be polished by the apparatus of the present invention may be any material to which ordinary electrolytic polishing can be applied, such as products whose surfaces are made of metals such as steel, stainless steel, titanium, nickel, aluminum, and chromium. It will be done. In this case, the width and length of the plate material are not limited, and the apparatus of the present invention can efficiently mirror-polish a wide and long plate material. The device of the present invention can efficiently mirror-finish the surface of the object to be polished, but if necessary, the object to be polished can be polished in advance by
It can be polished using a belt, emery, etc. of about 20 to 400 grit.

Further, in the present invention, as the polishing buff, it is preferable to use a polishing buff made of a flexible material having an internal communication space, such as a nonwoven fabric, a woven fabric, a synthetic resin, or a sponge. Incidentally, abrasive grains can be fixed to the polishing buff if necessary.

Furthermore, the cathode can be formed by a spindle, but is not limited thereto.

The electrolytic solution used in the present invention is composed of an electrolyte and a solvent that dissolves the electrolyte. In this case, the electrolyte may be one that is commonly used for electrolytic polishing, and is selected depending on the material of the object to be polished. Examples include sodium nitrate, aluminum nitrate, and common salt. Water is used.

The concentration of this electrolyte can also be made similar to that of a normal electrolytic polishing solution. Note that the electrolytic solution can contain abrasive grains as necessary, and in this case, it is preferable to add abrasive grains and a surfactant for dispersing the abrasive grains to the electrolytic solution to form a slurry.

In the present invention, when fixing abrasive grains to a polishing buff or adding abrasive grains to an electrolytic solution, the type of abrasive grains may be a powder type commonly used as an abrasive material. is a common abrasive, abrasive, and polishing material such as white alundum, zirconia, carborundum, alundum, silicon carbide, alumina, alumina hydrate, chromium oxide, iron oxide, red iron, titanium oxide, intensified cerium, calcium carbonate, etc. One or more of these materials can be used, with white alundum and alumina being particularly preferred. The particle size of the abrasive grains is not particularly limited.

1- or less is preferable.

Further, when abrasive grains are added to the electrolytic solution, the content of the abrasive grains in the electrolytic solution is preferably 2 to 20% by weight, particularly 5 to 10% by weight. In this case, it is particularly preferable that the abrasive grains are negatively charged in the electrolyte, and abrasive grains that are not negatively charged should be pretreated with a silane coupling agent to become negatively charged in the electrolyte. It is effective to do so. That is, when the abrasive grains are negatively charged, they are attracted to the positively charged object to be polished, and their electrophoretic action provides better and more reliable abrasive polishing action. Note that the type of surfactant for dispersing the abrasive grains in the electrolytic solution may be any surfactant as long as it can disperse the abrasive grains without being affected by the electrolyte, and examples thereof include sodium alkylbenzenesulfonate. Its content can be 0.1 to 5% by weight of the electrolyte.

In the present invention, the method of supplying and impregnating the polishing buff with the electrolytic polishing solution is not limited, but there are methods such as impregnating the buff into the electrolyte in an electrolyte tank and having the buff absorb the electrolyte, and A method of spraying the electrolytic solution onto the buff from a supply pipe, etc. may be adopted.

In the device of the present invention, by applying a predetermined voltage between the object to be polished (anode) and the cathode, the surface of the object to be polished is electrolytically polished by the action of the electrolytic solution, and the surface of the object to be polished is electrolytically polished. Since the surface of the object to be polished is mechanically polished by the polishing buff that rotates while in contact, the surface of the object to be polished is efficiently and continuously polished by both electrolytic polishing and mechanical polishing with excellent surface gloss and smoothness. . In this case, in the present invention, the plate material is brought into contact with the outer surface of a cylindrical polishing buff rotated by a spindle, and polishing can be performed continuously while moving the plate material in one direction. This device can polish plates much more efficiently than the previous device.

EXAMPLES Next, the present invention will be specifically explained with reference to Examples, but the present invention is not limited to the following Examples.

[Embodiment 1] FIG. 1 shows an embodiment of the present invention. In the figure, 1 is an electrolyte storage tank, 2 is a polishing buff device installed in this tank 1 with its lower part immersed in the electrolyte in tank 1, and 3
4 is an electrolyte supply tank; 4 is an electrolyte supply pipe provided between the electrolyte supply tank 3 and the electrolyte distillate tank 1;
and 6 indicate a pump and filter installed in this pipe 4, 7 indicates an electrolyte reflux pipe provided between both tanks 3 and 1, and 8 and 9 indicate a pump and filter installed in this pipe 7. Further, in the figure, 10 is a metal plate placed horizontally in contact with the polishing buff device 2, 11 is an energized roller that contacts the plate 10, and 12 is a feed roller that supports the plate 10 and sends it in the direction of the arrow in the figure. It is.

Here, the polishing and buffing device 2 includes a
A polishing buff 14 made of a cylindrical highly breathable nonwoven fabric and having an electrolyte flow path (internal communication space) 14a inside is attached to a cylindrical metal spindle 13. The spindle 13 is inserted into the hollow part of the buff 14. The polishing buff 14 absorbs the electrolyte, and the electrolyte held by the buff 14 reaches the plate material 10.

When the plate material 10 is polished by this apparatus, the spindle 13 is used as a cathode, so that the cathode 13 is opposed to the plate material 10 via the electrolyte flow path 14a of the buff 14. Also.

The anode is energized by the energizing roller 14, so that the plate material 10 becomes the anode. When the spindle 13 is driven to rotate the buff 14, the surface of the plate 10 in contact with the upper outer surface of the buff 14 is mechanically polished by the buff 14, and the electrolyte in the tank 1 is supplied to the plate 10. The surface of the plate material 10 is electrolytically polished using an electrolytic solution.

Note that the plate material 10 is fed by a feed roller 12 at a predetermined speed in the direction of the arrow in the figure. Further, in this device, it is possible to filter the electrolyte by operating the pumps 5 and 8 as necessary.

Therefore, according to the apparatus of the above embodiment, the surface of the plate material can be polished to a good mirror finish by using both mechanical polishing and electrolytic polishing, and the plate material is brought into contact with the polishing buff and polished while moving the plate material. It is capable of polishing plate materials continuously at high speed. In this case, in the apparatus of the embodiment, the spindle is used as a cathode, so that electrolytic polishing can be performed without causing a short circuit between the anode and the cathode.

In addition, in the above-mentioned apparatus, it is possible to perform more uniform polishing by performing polishing while swinging the spindle from side to side.

〔Effect of the invention〕

As explained above, the polishing apparatus of the present invention is capable of polishing the surface of a plate material to a mirror finish continuously and efficiently at high speed.

[Brief explanation of the drawing]

FIG. 1 is a schematic view showing one embodiment of the present invention, and FIG. 2 is an enlarged sectional view showing a polishing buff device on the same side. Applicant Uemura Kogyo Co., Ltd. Agent Patent Attorney Takashi Kojima

Claims (1)

[Claims] 1. A rotatable spindle, a non-conductive polishing buff formed of a liquid-permeable material and rotating in unison with the rotation of the spindle, means for supplying and impregnating the polishing buff with an electrolytic polishing solution, A cathode is provided so as to face the metal plate material of the object to be polished, which is in contact with the polishing buff, through the electrolyte flow path of the polishing buff, with a predetermined distance therebetween; The metal plates are brought into contact with each other, the spindle is rotated, the polishing buff is absorbed and impregnated with an electrolytic polishing liquid from the means, and the electrolytic polishing liquid is supplied to the plate through the channel of the polishing buff, and the plate is used as an anode. A polishing apparatus for a plate material, characterized in that the plate material is mechanically polished by the polishing buff and the plate material is electrolytically polished by the electrolytic polishing liquid by passing electricity between the polishing buff and the cathode.