JPH02218142A - Bonding of inner lead - Google Patents

Abstract

PURPOSE:To bond a work accurately by detecting the central positions of inner leads in the direction X and the direction Y, comparing the positions with reference positions, and correcting the amount of the position deviation of a carrier tape according to the difference. CONSTITUTION:An X-Y table 2 is provided at the side surface of a carrier tape 3 on which inner leads 4 are formed. The right end of an arm 2b is fixed to a moving table 2a of the table 2. The tip of the arm 2b is made to protrude toward the upper surface of the carrier tape 3. A lighting position and a camera 1 are attached so as to face downward. The output of the camera 1 is connected to a position-deviation operating unit 11. The central positions of the inner leads 4 in the direction X and the direction Y are detected. The results are compared with reference central positions which are inputted into the position- deviation operating unit 11. The position deviation of the carrier tape 3 is corrected according to the difference. In this way, the positions of the inner leads are accurately detected, and a work can be bonded accurately.

Description

[Detailed description of the invention] [Purpose of the invention] (Industrial application field) The present invention relates to an inner lead bonding method.

(Prior Art) In conventional inner lead bonders, methods for detecting positional deviation of carrier tape that is intermittently fed sequentially at the pitch of device holes include a method of recognizing positioning marks provided in advance in device holes, There is a method for recognizing the tip of the inner lead.

(Problems to be Solved by the Invention) However, the former method requires positioning marks to be provided on the carrier tape, and the latter method requires high precision for the inner lead. In this method, as shown in Fig. 4, the inner lead 1
This can be handled by finding the center in the width direction of 2.13, but
Variations in the length direction determined from the center of the recognition object 14 directly result in variations 15 in recognition accuracy, and it is not possible to cope with warping in the vertical direction of the paper surface, further reducing recognition accuracy. Then, the workpiece cannot be bonded accurately.

SUMMARY OF THE INVENTION Therefore, an object of the present invention is to provide an inner lead bonding method that can accurately detect the position of an inner lead and bond a workpiece accurately.

[Structure of the Invention] (Means and Effects for Solving the Problems) The present invention detects the position of a carrier tape that has inner leads formed in device holes in the X direction and the Y direction and is intermittently fed sequentially at a predetermined pitch. In the inner lead bonding method in which the position of the carrier tape is corrected by comparing this result with a reference position input in advance to a positional deviation calculation unit, the center position of the inner lead in the X direction and the Y direction is detected, This result is compared with the reference center position input in advance to the positional deviation calculation unit, and the difference is used to correct the positional deviation of the carrier tape, thereby accurately detecting the position of the inner lead and bonding the workpiece accurately. This is an inner lead bonding method.

(Example) Hereinafter, an example of the inner lead bonding method of the present invention will be described with reference to the drawings.

In FIG. 1, an X-Y table 2 is provided on the side surface of the carrier tape 3 on which inner leads 4 are formed in the X and Y directions within the device hole a. The right end of an arm 2b is fixed to the moving table 2a, and the tip of this arm 2b protrudes from the top surface of the carrier tape 3, and the illumination position and camera 1 are installed facing downward, and the output of this camera 1 is installed separately. It is connected to the positional deviation amount calculation unit 11.

FIG. 2 is an enlarged detailed view of the device hole of FIG. 1;

In FIG. 2, in the device hole 3a of the carrier tape 3, a recognition target lead 4a is formed in the X direction in the front and back direction of the paper, and a recognition target lead 4b in the Y direction is formed in the left and right direction of the paper.
is formed.

In the inner lead bonder having such a configuration, the carrier tape 3 is intermittently fed sequentially at a predetermined pitch by a tape feeding device (not shown), and is positioned based on the perforations of the carrier tape. Further, the camera 1 is first moved to the position of the recognition field of view 9 shown by the chain line in FIG. 2 on the X-Y table 2, and recognizes the widthwise center position Direction recognition target lead 4
b is driven to the position of the recognition target visual field 10, and the center position y@: of the recognition target lead 4b in the width direction is recognized.

Next, the center positions X and y recognized by the camera in the above operation are input into the positional deviation detection sieve unit 11, and the center positions X and y in the width direction of the Center X. and the center y in the width direction of the Y-direction reference lead 5B. Which difference, ΔX”=X X□
and Δ'/='! '10 is calculated to detect the amount of positional deviation of the recognition target carrier tape 3 with respect to the reference carrier tape.

This result is sent from the positional deviation calculation unit 11 to a motor drive device for automatic fine adjustment (not shown), and a carrier tape adjustment table (not shown) is driven to correct the bonding position.

As a result, the workpiece (not shown) is accurately bonded to the inner lead.

FIG. 3 shows another embodiment of the inner lead bonding method of the present invention.

In FIG. 3, similar recognition is performed on the diagonal portion of the recognition target in FIG. 2 (for example, the diagonal of the device hole), and the recognition data for reference data x01 = "01 x
1. By obtaining y1, it is possible to detect the positional deviation amounts ΔX, Δy and the rotational deviation amount Δθ of the recognition target carrier tape with respect to the reference Kyrelia tape.

This method may be used in combination with the method of detecting the amount of deviation in the X and Y directions shown in FIG. Compare the value and use the result to determine the carrier tape's
By correcting the position and angle in the Y direction, the workpiece can be bonded accurately.

[Effects of the Invention] As described above, according to the present invention, the position of a carrier tape having inner leads formed in the X direction and the Y direction and which is intermittently fed sequentially at a predetermined pitch is detected and inputted in advance to the positional deviation amount calculation unit. In an inner lead bonding method that corrects the position of the carrier tape by comparing it with the
The center position of the inner lead in the direction and Y direction was detected, and this result was compared with the reference center position input in advance to the position deviation calculation unit, and the positional deviation amount of the carrier tape was corrected based on the difference. It is possible to obtain an inner lead bonding method that can accurately correct the positional deviation of the lead and accurately bond the inner lead to the workpiece.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing an embodiment of the inner lead bonding method of the present invention, FIG. 2 is a partial detailed view showing the main parts of the inner lead bonding method of the present invention, and FIG. 3 is a perspective view showing an embodiment of the inner lead bonding method of the present invention. FIG. 4 is a diagram showing another embodiment of the method, and FIG. 4 is a diagram showing a conventional inner lead bonding method. 3...Carrier tape 3a...Device hole 4a...Inner lead in X direction 4b...Inner lead in Y direction 11...Positional deviation amount manipulation unit (8733) Agent Patent attorney Sho Inomata Akira (and others)
1 person) Figure 2

Claims (1)

[Claims] The position of the carrier tape, which has inner leads in the X and Y directions formed in the device hole and is fed intermittently at a predetermined pitch, is detected, and the position data is transferred to the reference position of the positional deviation calculation unit. In the inner lead bonding method for correcting the position of the carrier tape in comparison with the position of the carrier tape, the center position of the inner lead in the X direction and the Y direction is detected, and this result is used as a reference center input in advance into the positional deviation amount calculation unit. An inner lead bonding method characterized in that the positional deviation of the carrier tape is corrected based on the difference between the positions of the carrier tapes.