JPH02217187A - Laser beam machining for film coating material - Google Patents
Laser beam machining for film coating materialInfo
- Publication number
- JPH02217187A JPH02217187A JP1036388A JP3638889A JPH02217187A JP H02217187 A JPH02217187 A JP H02217187A JP 1036388 A JP1036388 A JP 1036388A JP 3638889 A JP3638889 A JP 3638889A JP H02217187 A JPH02217187 A JP H02217187A
- Authority
- JP
- Japan
- Prior art keywords
- laser beam
- vinyl
- coating material
- lens
- laser
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000463 material Substances 0.000 title claims abstract description 57
- 239000007888 film coating Substances 0.000 title claims description 14
- 238000009501 film coating Methods 0.000 title claims description 14
- 238000003754 machining Methods 0.000 title abstract 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 claims abstract description 36
- 229920002554 vinyl polymer Polymers 0.000 claims abstract description 36
- 239000011248 coating agent Substances 0.000 claims abstract description 20
- 238000000576 coating method Methods 0.000 claims abstract description 20
- 230000001678 irradiating effect Effects 0.000 claims abstract description 5
- 238000000034 method Methods 0.000 claims description 10
- 238000003698 laser cutting Methods 0.000 claims description 8
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000007796 conventional method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 241000270295 Serpentes Species 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 210000003127 knee Anatomy 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
［発明の目的］
（産業上の利用分野）
この発明は、例えばビニールコーテイング材などのフィ
ルムコーティング材をレーザ切断するノイルムコ−ティ
ングのレーザ加工方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Object of the Invention] (Industrial Field of Application) The present invention relates to a method for laser processing a noilum coating, which involves laser cutting a film coating material such as a vinyl coating material.
（従来の技術）
従来、レーザ加工機でフィルムコーティング材としての
例えばビニールニ１−ｊ゛イング材にレーザ切断を行な
うレーザ加工方法としては、集光レンズで集光されたレ
ーデビームをデフォーカスさせて、まずビニールのみを
溶かし、その後集光レンズの焦点を合わぜて母材を切断
する方法や、度にレーザ加二［を行なうと、ビニールと
母材の間にレーザガスが入り込む為予めビニールを母材
から剥してレーザ切断する方法が知られている。(Prior Art) Conventionally, as a laser processing method for laser cutting a film coating material such as a vinyl coating material using a laser processing machine, a laser beam focused by a condensing lens is defocused. If you first melt only the vinyl and then focus a condensing lens to cut the base material, or if you perform laser cutting at the same time, the laser gas will enter between the vinyl and the base material, so the vinyl must be cut into the base material beforehand. A known method is to peel it off and cut it with a laser.
（発明が解決しようとする課題）
ところで、前述した従来技術のうち、前者の方法では、
集光レンズの焦点をデフォーカスしてまずビニールを溶
かしてから焦点を合せて母材を切断しているため、レー
ザの加工時間が通常のレーｉｒ時間に比べて２倍程度か
かるという問題があった。(Problem to be Solved by the Invention) By the way, among the above-mentioned conventional techniques, in the former method,
Because the focus of the condensing lens is defocused, the vinyl is first melted, and then the base material is refocused and cut, the problem is that the laser processing time is about twice as long as the normal laser IR time. Ta.
また、後者の方法では、母材に傷が付くと共に後工程で
ビニールを母材に張り直さなければならないという問題
があった。In addition, the latter method has the problem that the base material is damaged and the vinyl must be reattached to the base material in a subsequent process.
この発明の目的は、フィルムコーディング材にレーザ切
断を行なう際、フィルムを剥さずに加工時間を従来に比
べて炉前間で行なうにうにしたフィルム」−ティング材
のレーザ加工方法を提供することにある。An object of the present invention is to provide a method for laser processing a film coating material, which allows the processing time to be cut between the furnace and the front of the furnace without peeling off the film when laser cutting the film coating material. It is in.
［発明の構成］
（課題を解決覆るための手段）
上記目的を達成するために、この発明は、レーザ加」−
機でレーザビームをフィルムコープ−ｒング材に照射せ
しめてレーザ切断を行なう際、レザビームを集光レンズ
で熱強度分布の強いレーザビームと弱いレーザビームに
分けてビニールコーテイング材に照射し、熱強度分布の
弱いレーザビムでフィルムを溶かしながら、同時に熱強
度の強いレーザビームで母材を切断するフィルムコティ
ング材のレーザ加圧方法である。[Structure of the Invention] (Means for Solving and Overcoming the Problems) In order to achieve the above object, the present invention utilizes laser processing.
When performing laser cutting by irradiating a laser beam onto a film coating material using a machine, the laser beam is divided into a laser beam with a strong thermal intensity distribution and a laser beam with a weak thermal intensity distribution using a condensing lens and is irradiated onto the vinyl coating material. This is a laser pressurizing method for film coating materials, in which the film is melted with a laser beam with a weak distribution, and at the same time, the base material is cut with a laser beam with high heat intensity.
（作用）
この発明のフィルムコーディング材のレーザ加工方法を
採用することにより、レーザビームを例えば組合せレン
ズによる集光レンズで熱強度分布の強いレーザビームと
弱いレーザビームに分けてフィルムコーティング材に照
射し℃レーザ切断を行なうと、熱強度分布の弱いレーザ
ビームでフィルムを溶かしながら、同口♂ｔに熱強度分
布の強いレーザビームで母材にレーザ切断が行なわれる
。(Function) By adopting the laser processing method for film coating material of the present invention, the laser beam can be divided into a laser beam with a strong heat intensity distribution and a laser beam with a weak heat intensity distribution, for example, using a condensing lens using a combination lens, and irradiated onto the film coating material. When C laser cutting is performed, while the film is melted with a laser beam with a weak thermal intensity distribution, the base material is laser cut with a laser beam with a strong thermal intensity distribution at the same opening ♂t.
而しで、フィルムの溶解と母材の切断が同時に行なわれ
ることにより、加工時間が従来に比ベニ９．Ｃノ時間に
行なわれると共に、フィルムを剥さないから母材に傷が
（ｊかない。さらに後」二稈でフィルムを張り直す必要
もなくなる。By melting the film and cutting the base material at the same time, the processing time is reduced by 9.9 seconds compared to conventional methods. This is done at time C, and since the film is not removed, there is no damage to the base material.Furthermore, there is no need to reapply the film at the second culm later.
（実施例）
以下、この発明の実施例を図面に基づいて詳細に説明づ
る。(Example) Hereinafter, an example of the present invention will be described in detail based on the drawings.
第４図を参照するに、レーザ加二１機１は、水平に敷設
された固定のＸＹデープル３十−に例えばノイルムコ−
ディング月どし−（へのビニールコーテイング材Ｗを案
内し、このビニールコーディング材Ｗをレーザご−ムＩ
Ｂで熱切断するものである。Referring to FIG. 4, the laser machine 1 is installed on a horizontally laid fixed
Guide the vinyl coating material W to the base plate, and apply the vinyl coating material W to the laser beam I.
B is for thermal cutting.
レーザビームＬ Ｆ３はレーザ加工機１の機械本体に設
Ｃプたレーザ発振装置５で発振され、強度調整装置７、
反射鏡９を介して加工ヘッド１１に案内されている。加
工ヘッド１１の内部には集光レンズ１３が設置）られ、
レーザビームＬ Ｂはこの集光レンズ１３で集光され、
焦点位置でワークＷを熱切断覆る。また、ワークＷはク
ランプ１５で把持されて、切断寸゛べき位置が加工ヘッ
ド１１の直下に来るように、ＸＹテーブル３上で水平移
動されるようになっている。The laser beam L F3 is oscillated by a laser oscillation device 5 installed in the main body of the laser processing machine 1, and is transmitted through an intensity adjustment device 7,
It is guided to a processing head 11 via a reflecting mirror 9. A condensing lens 13 is installed inside the processing head 11,
The laser beam LB is focused by this condensing lens 13,
Thermal cutting covers the workpiece W at the focal position. Further, the workpiece W is held by a clamp 15 and moved horizontally on the XY table 3 so that the position at which it is to be cut is directly below the processing head 11.
クランプ１５は、ワークＷを把持した状態で、ＸＹ軸軸
状サーボモータ平面Ｘ、Ｙ方向に駆動されるようになっ
ている。加工ヘッド１１はＺ軸角サーボモータでト下方
向に駆動されるようになっている。又、レーザ加工機１
にはＮＣ装置１７が備えられ、このＮＣ装置１７の操作
部にはいわゆる手動パルス発生器１９が備えられている
。The clamp 15 is configured to be driven in the X and Y directions on the XY-axis servo motor plane while gripping the workpiece W. The processing head 11 is driven downward by a Z-axis angle servo motor. Also, laser processing machine 1
is equipped with an NC device 17, and the operation section of this NC device 17 is equipped with a so-called manual pulse generator 19.
」−記構成により、レーザ発振器５で発振されたレーザ
ビームＩ−，Ｂは、強度調整装置７を経て反射鏡９で折
曲げられ、さらに集光レンズ１３で集光される。集光レ
ンズ１３で集光され１＝レーザビームＩＢはビニールコ
ーテイング材Ｗへ向けて照射されると共に、クランプ１
５にクランプされたビニールコーディング材ＷをＸ、Ｙ
軸方向へＮＣＲ置装７で制御して移動し位置決めするこ
とによってビニールコーテイング材Ｗの所望位置に熱切
断加工が行われることになる。With the configuration described above, the laser beams I- and B oscillated by the laser oscillator 5 pass through the intensity adjustment device 7, are bent by the reflecting mirror 9, and are further condensed by the condensing lens 13. The laser beam IB is focused by the condensing lens 13 and is irradiated toward the vinyl coating material W, and the clamp 1
5. Vinyl coating material W clamped to X, Y
By moving and positioning the vinyl coating material W in the axial direction under control by the NCR device 7, thermal cutting is performed at a desired position on the vinyl coating material W.
前記集光レンズ１３は組合せレンズで構成されており、
集光レンズ１３で集光されたレーザビムＬＢがビニール
コーテイング材Ｗに照射されてレーザ切断される状態が
第１図に示されている。The condensing lens 13 is composed of a combination lens,
FIG. 1 shows a state in which the vinyl coating material W is irradiated with the laser beam LB focused by the focusing lens 13 and cut by the laser beam.
すなわち、第１図において、ビニールコーテイング材Ｗ
は母材Ｗ１と、この母材Ｗ＋ 上に張られたビニールＷ
２とからなっている。また、集光レンズ１３は、平面レ
ンズ１３Ａと、この平面レンズ１３Ａのレーザビームｌ
−Ｂの入射側（第１図において」−側）に設けられてい
る凸レンズ１３Ｂと、平面レンズ１３Ａのレーザビーム
ＬＢの出射側（第１図において下側）に隔離した凹レン
ズ１３Ｃからなる組合せレンズで構成されている。That is, in FIG. 1, the vinyl coating material W
is the base material W1 and the vinyl W stretched over this base material W+
It consists of 2. Further, the condensing lens 13 includes a plane lens 13A and a laser beam l of this plane lens 13A.
-A combination lens consisting of a convex lens 13B provided on the incident side of the laser beam LB (- side in FIG. 1) and a concave lens 13C isolated on the exit side of the laser beam LB of the plane lens 13A (lower side in FIG. 1). It is made up of.
上記構成により、集光レンズ１３のうちの平面レンズ１
３△と凸レンズ１３Ｂの組合せレンズに入射されるレー
ザビームＬＢは第２図（Ａ）に示寸ごとき熱強度分布の
状態となっている。この状態のレーザビームしＢは、平
面レンズ１３Ａと凸レンズ１３１３の組合セレンズに入
射されると、第２図（Ｂ）に示された熱強度分布の弱い
レーザビムＬＢ１と、第２図（Ｃ）に示され熱強１１分
布の強いレーザビームし［３２とに分けられる。With the above configuration, the plane lens 1 of the condensing lens 13
The laser beam LB incident on the combination lens of 3Δ and the convex lens 13B has a thermal intensity distribution as shown in FIG. 2(A). When the laser beam B in this state is incident on the combination of the planar lens 13A and the convex lens 1313, the laser beam LB1 with a weak heat intensity distribution as shown in FIG. 2(B) and the laser beam LB1 as shown in FIG. 2(C) are formed. The thermal intensity shown is a strong laser beam with a distribution of 11 and 32.
この弱いレーザビームＬＢ１は平面レンズ１３Ａで集光
させられることなく直進し、レーザビームＬ Ｂが入射
する側からみてリング状となり、凹レンズ１３Ｃを通っ
て集光される。一方、曲率の付いた面より集光された熱
強度分布の強いレーザビームｌ−８２は完全に集光され
る前に凹レンズ１３Ｃに入射し完全に集光される。This weak laser beam LB1 travels straight without being focused by the plane lens 13A, becomes ring-shaped when viewed from the side into which the laser beam LB is incident, and is focused through the concave lens 13C. On the other hand, the laser beam l-82, which is focused from the curved surface and has a strong thermal intensity distribution, enters the concave lens 13C and is completely focused before being completely focused.
しかも、この熱強度分布の弱いレーザビーム１−Ｂ１と
強いレーザビーム１−８２の焦点位置を結ぶ位置が異な
る。また、熱強度分布の弱いレーザビム１−８１は強い
レーザビーム１Ｂ２から離れたかつ強いレーザビーム１
−８１と中心を同じくする円周上に位置することになる
。Moreover, the positions connecting the focal positions of the laser beam 1-B1 with a weak thermal intensity distribution and the focal position of the laser beam 1-82 with a strong thermal intensity distribution are different. Also, the laser beam 1-81 with a weak thermal intensity distribution is located away from the strong laser beam 1B2 and
It will be located on the circumference having the same center as -81.
而して、同じ円」−にある熱強度分布の弱いレーザビー
ムＬＢＩと強いレーザビーム１−Ｂ２のうち、まず、リ
ング状に位置する弱いレーザビームＬ １３１がビニー
ルＷ２を溶かず１．ビニールＷ２を溶か寸には、この弱
いレーザビームＬ Ｂ １で充分である。次に、中央に
位置する強いレーザビームＩ８２が母材ＷＩのみをスム
ースに切断して第３図に示したごとく、ビニールＷ２は
切断幅Ｌ１に、母材Ｗ１は切断幅Ｌ２（Ｌ２ ＜１．−
１ ＞となる。Therefore, among the laser beam LBI with a weak heat intensity distribution and the laser beam 1-B2 with a strong heat intensity distribution located in the same circle, the weak laser beam L131 located in a ring shape does not melt the vinyl W2.1. This weak laser beam L B 1 is sufficient to melt the vinyl W2. Next, the strong laser beam I82 located at the center smoothly cuts only the base material WI, and as shown in FIG. 3, the vinyl W2 has a cutting width L1, and the base material W1 has a cutting width L2 (L2 < 1. −
1 >.
このように、集光レンズ１３に組合せレンズを用いで、
レーザビームＬ Ｂを熱強度分布の弱いレーザビームＬ
１と強いレーザビームＬ２に分けてビニールコーテイン
グ材Ｗへ照射Ｊることによって、ビニールＷ２の溶融と
母材Ｗ１の切断を同時に行なうことができる。In this way, by using a combination lens as the condenser lens 13,
Laser beam L B is a laser beam L with weak thermal intensity distribution.
By irradiating the vinyl coating material W with two strong laser beams L2 and 1, it is possible to melt the vinyl W2 and cut the base material W1 at the same time.
したがって、ビニールＷ２に傷を伺（プることなく、ま
た短時間でビニールコーテイング材Ｗの切断を行なうこ
とができる。しかも、後工程でビニールＷ２を張り直す
必要がなくなる。Therefore, the vinyl coating material W can be cut in a short time without damaging the vinyl W2. Moreover, there is no need to re-stick the vinyl W2 in a subsequent process.
なお、この発明は、前述した実施例に限定されることな
く、適宜の変更を行なうことによって、その他の態様で
実施し得るものである。本実施例ではフィルムコーティ
ング材としてビニールコーテイング材を例にとって説明
したが、それ以外のどんなフィルムであっても構わない
。Note that this invention is not limited to the embodiments described above, and can be implemented in other forms by making appropriate changes. In this embodiment, a vinyl coating material is used as an example of the film coating material, but any other film may be used.
［発明の構成１
以」二のごとき実施例の説明より理解されるように、こ
の発明によれば、レーザビームを例えば組合ゼレンズに
よる集光レンズで熱強度分布の強いレーザビームと弱い
レーザビームに分けてフィルムコーティング材に照射し
てレーザ切断を行なうと、熱強度分布の弱いレーザビー
ムでフィルムを溶かしながら、同時に熱強度分布の強い
レーザビームで母材にレーザ切断を行なうことができる
。[Configuration 1 of the Invention] As can be understood from the description of the embodiments described in 2 below, according to the present invention, a laser beam is divided into a laser beam with a strong thermal intensity distribution and a laser beam with a weak thermal intensity distribution, for example, using a condensing lens using a combined ZELENS. By irradiating the film coating material separately and performing laser cutting, it is possible to melt the film with a laser beam with a weak thermal intensity distribution and simultaneously cut the base material with a laser beam with a strong thermal intensity distribution.
したがって、フィルムの溶融と母材の切断を同時に行な
うことができるから、加工時間を従来に比べて短時間で
行なうことができると共に、フィルムを剥さないから母
材に傷が付かない。さらに後工程でフィルムを張り直す
必要がない１゜Therefore, since the film can be melted and the base material cut at the same time, the processing time can be shortened compared to the conventional method, and since the film is not peeled off, the base material is not damaged. Furthermore, there is no need to reapply the film in the subsequent process.
第１図はこの発明の主要部を示し、集光レンズで集光さ
れｌｃレーザビームがフィルムコーティング材に照射さ
れる状態を示した説明図、第２図（△）、（Ｂ）および
（Ｃ）はレーザビームの熱強度分布状態を示した図、第
３図はこの実施例によりビニールの溶融と母材の切断が
行なわれＩＣ状態の平面図、第４図はこの発明を実施覆
る一実施例のレーザ加工機の側面図である。
１・・・レーザ加工機 １３・・・集光レンズ１３Ａ・
・・平面レンズ １３Ｂ・・・凸レンズ１３Ｃ・・・凹
レンズ ＩＢ・・・レーザビームＬＢ１・・・熱強度分
布の弱いレーデビームＬ８２・・・熱強度分布の強いレ
ーザビームＷ・・・ビニールコーテイング材
Ｗｌ・・・ビニール Ｗ２・・・母材
代理人 弁理士 三 好 秀 和
Ｒ４４４
ド 八
、＼ Δ Ｉｉ、ｌ 運 υ
Δ屯トトト
七 二
綜 ω Δ Δ Δ 莫 莫
： ＣＱ ｉ ｆ＞−＞ べ 財Ｃ７の寂に八
：
「 」 Ｇ Ｃマ ヘ
ト 担 Ｊ！ｅ＋ト ≧
蛇 、＼ ド 屯 東
ＨΔ ２＼ 郵 悩 ロー −
ｌ：ｉ：ｉ Ｉ ’ｌＪ
Δく○、ＣＸＪυ：
：０の山のニー
、−１「 」 」 ≧ ≧Fig. 1 shows the main part of the present invention, and is an explanatory diagram showing a state in which a film coating material is irradiated with an LC laser beam focused by a condensing lens, and Fig. 2 (△), (B) and (C). ) is a diagram showing the heat intensity distribution state of the laser beam, FIG. 3 is a plan view of an IC state in which vinyl is melted and the base material is cut according to this embodiment, and FIG. 4 is an embodiment of the present invention. FIG. 2 is a side view of an example laser processing machine. 1...Laser processing machine 13...Condensing lens 13A・
...Plane lens 13B...Convex lens 13C...Concave lens IB...Laser beam LB1...Lede beam L82 with weak thermal intensity distribution...Laser beam W with strong thermal intensity distribution...Vinyl coating material Wl... ...Vinyl W2...Base material agent Patent attorney Hide Miyoshi KazuR444 Do 8, \ Δ Ii, l Luck υ Δtun Tototo 7 2 heirs ω Δ Δ Δ Mo Mo: CQ i f>-> Be wealth C7 No Jaku Ni Hachi: `` '' G C ma heto dan J! e + To ≧ Snake, \ Do Tun East H Δ 2 \ Post Trouble Low - l:i:i I 'lJ ∆ku○, CXJυ: :0 mountain knee, -1 `` '' ≧ ≧
Claims (1)
に照射せしめてレーザ切断を行なう際、レーザビームを
集光レンズで熱強度分布の強いレーザビームと弱いレー
ザビームに分けてビニールコーディング材に照射し、熱
強度分布の弱いレーザビームでフィルムを溶かしながら
、同時に熱強度の強いレーザビームで母材を切断するこ
とを特徴とするフィルムコーティング材のレーザ加工方
法。When performing laser cutting by irradiating a laser beam onto a film coating material using a laser processing machine, the laser beam is divided into a laser beam with a strong thermal intensity distribution and a laser beam with a weak thermal intensity distribution using a condenser lens, and is irradiated onto the vinyl coating material. A method for laser processing film coating materials, which is characterized by melting the film with a laser beam with a weak distribution and simultaneously cutting the base material with a laser beam with high thermal intensity.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1036388A JP2724192B2 (en) | 1989-02-17 | 1989-02-17 | Laser processing method of film coating material |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1036388A JP2724192B2 (en) | 1989-02-17 | 1989-02-17 | Laser processing method of film coating material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH02217187A true JPH02217187A (en) | 1990-08-29 |
| JP2724192B2 JP2724192B2 (en) | 1998-03-09 |
Family
ID=12468470
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1036388A Expired - Lifetime JP2724192B2 (en) | 1989-02-17 | 1989-02-17 | Laser processing method of film coating material |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2724192B2 (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5690845A (en) * | 1994-10-07 | 1997-11-25 | Sumitomo Electric Industries, Ltd. | Optical device for laser machining |
| JPH1071481A (en) * | 1997-08-01 | 1998-03-17 | Tanaka Seisakusho Kk | Laser beam cutting method for coated steel |
| US5728993A (en) * | 1995-08-05 | 1998-03-17 | The Boc Group Plc | Laser cutting of materials with plural beams |
| US6489588B1 (en) | 1999-11-24 | 2002-12-03 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| CN102500935A (en) * | 2011-09-30 | 2012-06-20 | 夏致俊 | Light harvesting cutter |
| CN107335915A (en) * | 2017-06-12 | 2017-11-10 | 大族激光科技产业集团股份有限公司 | Laser soldering device and its welding method |
| JP2020179403A (en) * | 2019-04-24 | 2020-11-05 | 株式会社アマダ | Laser beam machine and laser beam machining method |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5018240A (en) * | 1973-06-22 | 1975-02-26 | ||
| JPS5752585A (en) * | 1980-09-16 | 1982-03-29 | Mitsubishi Electric Corp | Laser cutting method |
| JPS60174289A (en) * | 1984-02-17 | 1985-09-07 | Toshiba Corp | Cutting method of material having film by laser light |
-
1989
- 1989-02-17 JP JP1036388A patent/JP2724192B2/en not_active Expired - Lifetime
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5018240A (en) * | 1973-06-22 | 1975-02-26 | ||
| JPS5752585A (en) * | 1980-09-16 | 1982-03-29 | Mitsubishi Electric Corp | Laser cutting method |
| JPS60174289A (en) * | 1984-02-17 | 1985-09-07 | Toshiba Corp | Cutting method of material having film by laser light |
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5690845A (en) * | 1994-10-07 | 1997-11-25 | Sumitomo Electric Industries, Ltd. | Optical device for laser machining |
| US5728993A (en) * | 1995-08-05 | 1998-03-17 | The Boc Group Plc | Laser cutting of materials with plural beams |
| JPH1071481A (en) * | 1997-08-01 | 1998-03-17 | Tanaka Seisakusho Kk | Laser beam cutting method for coated steel |
| US6489588B1 (en) | 1999-11-24 | 2002-12-03 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| US6660963B2 (en) | 1999-11-24 | 2003-12-09 | Applied Photonics, Inc. | Method and apparatus for separating non-metallic materials |
| CN102500935A (en) * | 2011-09-30 | 2012-06-20 | 夏致俊 | Light harvesting cutter |
| CN107335915A (en) * | 2017-06-12 | 2017-11-10 | 大族激光科技产业集团股份有限公司 | Laser soldering device and its welding method |
| JP2020179403A (en) * | 2019-04-24 | 2020-11-05 | 株式会社アマダ | Laser beam machine and laser beam machining method |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2724192B2 (en) | 1998-03-09 |
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