JPH0221612U - - Google Patents
Info
- Publication number
- JPH0221612U JPH0221612U JP9990088U JP9990088U JPH0221612U JP H0221612 U JPH0221612 U JP H0221612U JP 9990088 U JP9990088 U JP 9990088U JP 9990088 U JP9990088 U JP 9990088U JP H0221612 U JPH0221612 U JP H0221612U
- Authority
- JP
- Japan
- Prior art keywords
- washer
- optical fiber
- spherical surface
- holding
- semiconductor module
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 claims description 6
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000013307 optical fiber Substances 0.000 claims description 4
- 230000008878 coupling Effects 0.000 claims 1
- 238000010168 coupling process Methods 0.000 claims 1
- 238000005859 coupling reaction Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Description
第1図は本考案に係わる光半導体モジユールの
一実施例を示す断面図、第2図は同光半導体モジ
ユールの光軸調整を説明するための図、第3図は
従来の光半導体モジユールの一例を示す断面図で
ある。
10……半導体レーザ素子、11……レーザ出
力モニタ素子、12……レンズ、13……保持台
、14……格納部材、15……端末部材、16…
…光フアイバ、17……保持部材、17a……基
底部、18……座金、18a……面。
Fig. 1 is a sectional view showing an embodiment of the optical semiconductor module according to the present invention, Fig. 2 is a diagram for explaining the optical axis adjustment of the optical semiconductor module, and Fig. 3 is an example of a conventional optical semiconductor module. FIG. DESCRIPTION OF SYMBOLS 10... Semiconductor laser element, 11... Laser output monitor element, 12... Lens, 13... Holding stand, 14... Storage member, 15... Terminal member, 16...
...Optical fiber, 17... Holding member, 17a... Base portion, 18... Washer, 18a... Surface.
Claims (1)
る端末部材と、この端末部材を保持する保持部材
と、発受光素子と、この発受光素子を前記光フア
イバに光結合させるレンズとを有し、高出力レー
ザの光ビームで前記端末部材を格納部材に溶融固
定する光半導体モジユールにおいて、前記保持部
材と格納部材の間に凹球面を設けた座金を介在せ
しめ、かつこの座金と接する保持部材の基底部に
座金の凹球面と同一曲率の凸球面を設けたことを
特徴とする光半導体モジユール。 An optical fiber, a terminal member for fixing an end of the optical fiber, a holding member for holding the terminal member, a light emitting/receiving element, and a lens for optically coupling the light emitting/receiving element to the optical fiber, In the optical semiconductor module in which the terminal member is melted and fixed to the storage member with a light beam of a high-power laser, a washer with a concave spherical surface is interposed between the holding member and the storage member, and the base of the holding member is in contact with the washer. An optical semiconductor module characterized by having a convex spherical surface having the same curvature as the concave spherical surface of the washer.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9990088U JPH0221612U (en) | 1988-07-29 | 1988-07-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9990088U JPH0221612U (en) | 1988-07-29 | 1988-07-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0221612U true JPH0221612U (en) | 1990-02-14 |
Family
ID=31327486
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9990088U Pending JPH0221612U (en) | 1988-07-29 | 1988-07-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0221612U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001051068A (en) * | 1999-08-17 | 2001-02-23 | Hightech Research Kk | Freezing detection sensor and its sensor element |
JP2010263070A (en) * | 2009-05-07 | 2010-11-18 | Nichia Corp | Semiconductor laser module and manufacturing method thereof |
-
1988
- 1988-07-29 JP JP9990088U patent/JPH0221612U/ja active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2001051068A (en) * | 1999-08-17 | 2001-02-23 | Hightech Research Kk | Freezing detection sensor and its sensor element |
JP2010263070A (en) * | 2009-05-07 | 2010-11-18 | Nichia Corp | Semiconductor laser module and manufacturing method thereof |
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