JPH02214671A - Thermal head - Google Patents

Thermal head

Info

Publication number
JPH02214671A
JPH02214671A JP3363589A JP3363589A JPH02214671A JP H02214671 A JPH02214671 A JP H02214671A JP 3363589 A JP3363589 A JP 3363589A JP 3363589 A JP3363589 A JP 3363589A JP H02214671 A JPH02214671 A JP H02214671A
Authority
JP
Japan
Prior art keywords
power supply
heat generating
resistor
layer
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP3363589A
Other languages
Japanese (ja)
Other versions
JP2669881B2 (en
Inventor
Kyoji Shirakawa
白川 享志
Sunao Abe
直 阿部
Masakazu Kato
雅一 加藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Alps Alpine Co Ltd
Original Assignee
Alps Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Alps Electric Co Ltd filed Critical Alps Electric Co Ltd
Priority to JP3363589A priority Critical patent/JP2669881B2/en
Publication of JPH02214671A publication Critical patent/JPH02214671A/en
Application granted granted Critical
Publication of JP2669881B2 publication Critical patent/JP2669881B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PURPOSE:To enhance the thermal efficiency and the high-speed thermal response properties of a heat generating resistor by a construction wherein auxiliary current supplying conductor layers formed of a material with a low thermal conductivity is intermediately provided so that the widthwise interval thereof accords with a heat generating part of a heat generating resistor, and the widthwise spacing between a common current supplying conductor layer and a discrete current supplying conductor layer is set to be larger than the widthwise interval of the auxiliary current supplying conductor layers. CONSTITUTION:Auxiliary current supplying conductor layers 9 are formed of Ti, Zr or an alloy thereof which has a thermal conductivity of about 1/10 times that of Al used for common and discrete current supplying conductor layers 4a, 4b. Therefore, heat generated by passing an electric current to a heat generating resistor 3 is hardly transmitted to the conductor layers 4a, 4b. The widthwise spacing L between the current supplying conductor layers 4a and 4b is set to be greater than a heat generating part of a heat generating resistor 3, which construction increases the spacing between the contact part of the layer 4a and the resistor 3 and the contact part of the layer 4b and the resistor 3, so that it becomes more difficult for the heat of the resistor 3 to be transmitted to the layers 4a, 4b, and heat insulating property in the electrode direction at the location of the resistor 3 can be enhanced. It is thereby possible to increase the thermal output of the resistor 3, enhance thermal efficiency in printing, maintain a high printing energy density, and to obtain a high high-speed response property.

Description

【発明の詳細な説明】 〔産業上の利用分野) °本発明は、サーマルプリンタに搭載され、印字情報に
従って通電加熱することにより所望の印字を行なうサー
マルヘッドに係り、特に、その熱特性の改良にIllす
る。
[Detailed Description of the Invention] [Field of Industrial Application] °The present invention relates to a thermal head that is installed in a thermal printer and performs desired printing by heating and energizing according to printing information, and particularly relates to an improvement in its thermal characteristics. Ill do it.

(従来の技術) 一般に、サーマルプリンタに搭載されるサーマルヘッド
は、例えば、複数の発熱抵抗体を絶縁性基板上に直線的
に整列配置し、印字情報に従って前記各発熱抵抗体を選
択的に通電加熱さVて、感熱記録紙に発色記録さUるか
、あるいは、インクリボンのインクを溶融して普通紙に
転写記録するために用いられる。
(Prior Art) In general, a thermal head installed in a thermal printer has, for example, a plurality of heat generating resistors arranged in a straight line on an insulating substrate, and each of the heat generating resistors is selectively energized according to printed information. It is heated to perform color recording on thermosensitive recording paper, or is used to melt the ink on an ink ribbon and transfer it to plain paper.

第2図は従来のこの秤のサーマルヘッドの一般構造を示
すものであり、アルミナ等の絶縁性U板1の上面には、
蓄熱層として機能する平板状のガラスからなるグレーズ
WJ2が形成されており、このグレーズf!2の上面に
は、Ta2N等からなる複数の発熱抵抗体3が、蒸着、
スパッタリング等により被着された後にエツチングを行
なうことにより直線状に整列して形成されている。これ
らの各発熱抵抗体3の両側上面には、各発熱抵抗体3に
対して給電するための共通給電体層4aおよび個別給電
体層4bがそれぞれ形成されており、これらの各給電体
層4a、4bは、例えば、All、Cu 、Au等の軟
質金属からなり、蒸着、スパッタリング等により所望形
状のパターンに形成されている。そして、前記各発熱抵
抗体3は、前記共通給電体層4aおよび個別給電体層4
b間に、最小印字単位たる1ドツト相当分の発熱領域を
形成して各個独立に形成され、この発熱抵抗体3は、前
記各給電体層4a、4b間に電圧を印加することにより
発熱されるようになされている。
Figure 2 shows the general structure of the conventional thermal head of this scale.
A glaze WJ2 made of flat glass that functions as a heat storage layer is formed, and this glaze f! On the upper surface of 2, a plurality of heating resistors 3 made of Ta2N or the like are deposited,
They are formed by being deposited by sputtering or the like and then etching to be aligned in a straight line. A common power supply layer 4a and an individual power supply layer 4b for supplying power to each heat generating resistor 3 are formed on both upper surfaces of each of these heat generating resistors 3, and each of these power supply layers 4a , 4b are made of a soft metal such as All, Cu, or Au, and are formed into a desired pattern by vapor deposition, sputtering, or the like. Each heating resistor 3 is connected to the common power supply layer 4a and the individual power supply layer 4.
A heating area corresponding to one dot, which is the minimum printing unit, is formed between the heating resistors 3 and 4b, and each heating resistor 3 generates heat by applying a voltage between each of the power supply layers 4a and 4b. It is designed so that

前記発熱抵抗体3および給電体層4a、4bの上面には
、これら発熱抵抗体3および給電体層4a、4bを保護
するほぼ7〜10μmの膜厚の保護層5が形成されてお
り、この保31!!5は、発熱抵抗体3を酸化による劣
化から保護する5ho2等からなるほぼ2μmの膜厚の
耐酸化層6と、この酸化層61にl?4FMされインク
リボン笠との接触による摩耗から発熱抵抗体3および給
電体層4a。
A protective layer 5 having a thickness of approximately 7 to 10 μm is formed on the upper surface of the heat generating resistor 3 and the power supply layers 4a and 4b to protect the heat generating resistor 3 and the power supply layers 4a and 4b. Ho 31! ! 5 is an oxidation-resistant layer 6 with a thickness of about 2 μm made of 5ho2 or the like that protects the heating resistor 3 from deterioration due to oxidation, and this oxidized layer 61 is coated with l? The heating resistor 3 and the power supply layer 4a are damaged due to abrasion due to contact with the ink ribbon cap.

4bを保護する1−a205等からなるほぼ5〜8μm
の膜厚の耐摩耗層7とにより構成されてa3す、この保
護15は、前記各給電体層4a、4bの端子部以外の表
面のすべてを被覆するようになって。
Approximately 5-8 μm consisting of 1-a205 etc. that protects 4b
This protection 15 is made up of a wear-resistant layer 7 having a film thickness of 13, and covers the entire surface of each power supply layer 4a, 4b other than the terminal portion.

いる。この保護層5の耐酸化層6および耐摩耗層7は、
スパッタリング等の手段により順次形成され、その後、
最終工程にJ3いて前記絶縁性基板1を分割して所望の
ザーマルヘッドf−ツブを1!1ろようになっている。
There is. The oxidation-resistant layer 6 and the wear-resistant layer 7 of this protective layer 5 are
are sequentially formed by means such as sputtering, and then
In the final process, the insulating substrate 1 is divided into 1:1 parts of the desired thermal head f-tube.

前記従来のり一マルヘッドを用いた熱転写プリンタにお
いては、このサーマルヘッドをインクリボンを介して用
紙に圧接させ、所定の印字情報に基づいて所望の発熱抵
抗体3に対応する個別給電体WJ4bに通電することに
より、その発熱抵抗体3を選択的に発熱さじ、前記イン
クリボンのインクを前記用紙に溶融転写させることによ
り、前記用紙上に所望の印字を行なうようになっている
In the thermal transfer printer using the conventional adhesive head, the thermal head is brought into pressure contact with the paper via the ink ribbon, and electricity is applied to the individual power supply WJ4b corresponding to the desired heating resistor 3 based on predetermined printing information. As a result, desired printing is performed on the paper by selectively using the heating resistor 3 to melt and transfer ink from the ink ribbon onto the paper.

しかしながら、前述した従来の号−マルヘッドにおいて
は、通電により前記発熱抵抗体3に発生した熱畠は、グ
レーズwJ2方向に伝達されてそのほぼ40%の熱量が
失われるとともに、各給電体J14a、4b方向にもほ
ぼ40%の熱分が伝達されて失われてしまうことから、
わずか20%の熱最のみが実質的に印字エネルー1!と
じて有効に利用されることになり、したがって、熱効率
が茗しく低下してしまい、印字エネルギvf!度を高く
保持することができず、大きなエネルギ損失を生じでい
た。
However, in the conventional multi-head described above, the heat generated in the heat generating resistor 3 due to energization is transmitted in the direction of the glaze wJ2, and approximately 40% of the heat is lost, and each of the power feeders J14a, 4b Approximately 40% of the heat is transferred and lost in the direction.
Only 20% of the heat is used to effectively reduce the printing energy to 1! Therefore, the thermal efficiency decreases considerably, and the printing energy vf! The temperature could not be maintained at a high level, resulting in a large energy loss.

また、熱効率を高めるために前記グレーズ[12の厚さ
寸法を大きく形成すると、グレーズII!12の熱容口
が大きくなって蓄熱mが増大し、高速印字に必要な高速
熱応答性を得ることができなくなってしまうという問題
点があった。
Furthermore, if the thickness of the glaze [12 is made large in order to increase thermal efficiency, glaze II! There was a problem in that the heat capacity opening of No. 12 became large and the heat storage m increased, making it impossible to obtain the high-speed thermal response required for high-speed printing.

第3図は前記発熱抵抗体の熱効率を向上させるようにし
たサーマルヘッドを示すものであり、給電体114a、
4bを2JI式に形成し、前記発熱抵抗体3の発熱部の
近傍の前記各給電体1m4a、4bes肉状の薄肉部8
に形成するようにしたちのである。
FIG. 3 shows a thermal head designed to improve the thermal efficiency of the heat generating resistor, which includes a power supply body 114a,
4b is formed in a 2JI style, and each of the power supply bodies 1m 4a, 4bes is formed into a thin-walled portion 8 near the heat-generating portion of the heat-generating resistor 3.
This is how it is formed.

このサーマルヘッドにおいては、前記各給電体層4a、
4bの薄肉部8により、前記各給電体層4a、4bの断
面積を小さくすることができるので、前記発熱抵抗体3
からの熱が各給電体層4a。
In this thermal head, each of the power supply layers 4a,
Since the cross-sectional area of each of the power supply layers 4a and 4b can be reduced by the thin wall portion 8 of 4b, the heating resistor 3
The heat from the power supply layer 4a.

4b側に伝達することを多少減少することができる。The transmission to the 4b side can be somewhat reduced.

(発明が解決しようとする課題) ところで、このような改良した従来のり一一マルヘッド
は、前記薄肉pH8により発熱抵抗体3の発熱部の凹凸
を小さく形成して、プリンタのプラテンへの前記発熱部
の当接性を向上させることを1目的とするものであり、
前記薄肉部8により熱伝達を多少小さくすることはでき
るが、前記給電体114a、4bは、Al1等の電気伝
々1率および熱伝導率の極めて高い材料により形成され
ているので、前記発熱抵抗体3の熱の伝達を著しく低減
させることはできないという問題点を有している。
(Problems to be Solved by the Invention) By the way, such an improved conventional adhesive head has a thin wall with a pH of 8, so that the unevenness of the heat generating part of the heat generating resistor 3 is made small, and the heat generating part is attached to the platen of the printer. One purpose is to improve the contact property of the
Although heat transfer can be somewhat reduced by the thin wall portion 8, since the power feeders 114a and 4b are made of a material such as Al1 that has extremely high electrical conductivity and thermal conductivity, the heating resistor This method has the problem that the heat transfer of No. 3 cannot be significantly reduced.

さらに、前記薄肉部8のみを熱伝導率の小さな材料で形
成することも考えられるが、この薄肉部8は、そのパタ
ーン形成を前記発熱抵抗体3と同時に行なうことになる
ので、薄肉部8の材料を前記発熱抵抗体3に対してエツ
チングの選択性の良好な材料に限定する必要があり、材
料選択の幅が少なくなってしまうという問題点を有して
いる。
Furthermore, it is conceivable to form only the thin part 8 with a material with low thermal conductivity, but since the pattern of the thin part 8 is formed at the same time as the heating resistor 3, the thin part 8 is It is necessary to limit the materials to materials that have good etching selectivity for the heat generating resistor 3, resulting in a problem that the range of material selection is limited.

本発明は、前述した従来のちのにおける問題点を解決し
、発熱抵抗体の熱効率を高めるとともに、高速熱応答性
を高めることのできるサーマルヘッドを提供することを
目的とづる。
SUMMARY OF THE INVENTION An object of the present invention is to provide a thermal head capable of solving the above-mentioned problems of the prior art, increasing the thermal efficiency of a heating resistor, and improving high-speed thermal response.

〔課題を解決するための手段〕[Means to solve the problem]

前記目的を達成するため本発明に係るサーマルヘッドは
、絶縁基板上にグレーズ層を形成し、このグレーズ層上
に長手方向の中央部を発熱部とされたm数の発熱抵抗体
を整列状に形成し、前記各発熱抵抗体上に、各発熱抵抗
体に選択的に給電するための共通給電体層および個別給
電体層をそれぞれ積層してなるサーマルヘッドにおいて
、前記グレーズ層と前記発熱抵抗体との間に、前記発熱
抵抗体の発熱部の両側に位置し熱伝導率の小さい材料か
らなる補助給電体層をその幅間隔が前記発熱抵抗体の発
熱部に対応するように介設し、両給電体層の端部が補助
給電体層の端部より後退づるように前記共通給電体層お
よび個別給電体層間の幅間隔を前記補助給電体層間の幅
間隔より大きく形成したことを特徴としている。
In order to achieve the above object, the thermal head according to the present invention includes a glaze layer formed on an insulating substrate, and a number of meters of heat-generating resistors, each having a longitudinal center portion as a heat-generating portion, arranged on the glaze layer in an array. and a common power supply layer and an individual power supply layer for selectively supplying power to each heat generation resistor are laminated on each of the heat generation resistors, the glaze layer and the heat generation resistor. auxiliary power supply layers made of a material with low thermal conductivity are interposed on both sides of the heat generating part of the heat generating resistor so that the width interval thereof corresponds to the heat generating part of the heat generating resistor; The width interval between the common power supply layer and the individual power supply layers is formed to be larger than the width interval between the auxiliary power supply layers so that the ends of both power supply layers are set back from the end of the auxiliary power supply layer. There is.

〔作 用〕[For production]

前述した構成の本発明によれば、補助給電体層が熱伝導
率の小ざい材料により形成されているので、発熱抵抗体
への通電により発生しIご熱は、グレーズ層側に伝達し
にくくなり、しかも、前記両給電体層間の幅間隔を両補
助給電体層間の幅間隔より大きく形成しているので、前
記給電体層と発熱抵抗体との接触部位が遠くなり、前記
発熱抵抗体部位の電極方向の断熱性を著しく高めること
ができる。したがって、発熱抵抗体の発熱mが増大する
ことになり、印字熱効率を著しく高めることができ、印
字エネルギ密度を高く保持して、高い高速熱応答性を得
ることができるし、ざらに、補助給電体層を発熱抵抗体
の下面側に形成し、前記補助給電体層のパターン形成を
前記発熱抵抗体と別個に行なうことができるので、前記
補助給電体層の材料を前記発熱抵抗体に対してエツチン
グの選択性の良好な材料に限定する必要がなく、所望の
材料で形成することができる。
According to the present invention having the above-described structure, since the auxiliary power supply layer is formed of a material with low thermal conductivity, the heat generated by energizing the heating resistor is difficult to transfer to the glaze layer side. Moreover, since the width interval between both the power supply layers is formed to be larger than the width interval between both the auxiliary power supply layers, the contact portion between the power supply layer and the heat generating resistor becomes distant, and the distance between the heat generating resistor portions increases. The insulation properties in the electrode direction can be significantly improved. Therefore, the heat generation m of the heating resistor increases, the printing thermal efficiency can be significantly increased, the printing energy density can be kept high, high high-speed thermal response can be obtained, and the auxiliary power supply Since the body layer is formed on the lower surface side of the heat generating resistor and the patterning of the auxiliary power supply layer can be performed separately from the heat generating resistor, the material of the auxiliary power supply layer is different from that of the heat generating resistor. It is not necessary to limit the material to a material with good etching selectivity, and it can be formed of any desired material.

〔実施例〕〔Example〕

以下、本発明を図面に示す実施例により説明する。 The present invention will be explained below with reference to embodiments shown in the drawings.

第1図は本発明に係るサーマルヘッドの実施例を示すも
のであり、アルミノ゛等の絶縁性基板1の上面には、蓄
熱層としてg1能するガラスからなるグレーズ層2が形
成されており、このグレーズ層2の上面には、熱伝導率
が八1の約1/10と小さいTiまたは7rまたはそれ
らの合金等からなる補助給電体層9がエツチングにより
約0.3μmの厚さに形成されている。この補助給電体
層9は、前記グレーズli!2上に形成された後、フォ
トリソグラフィ技術等により発熱抵抗体3の長手方向の
中央の発熱部に対応する幅間隔が1となるようにパター
ン形成されてなる。
FIG. 1 shows an embodiment of a thermal head according to the present invention, in which a glaze layer 2 made of glass, which functions as a heat storage layer, is formed on the upper surface of an insulating substrate 1 made of aluminum or the like. On the upper surface of this glaze layer 2, an auxiliary power supply layer 9 made of Ti, 7R, or alloys thereof, etc., which has a low thermal conductivity of about 1/10 of 81, is formed to a thickness of about 0.3 μm by etching. ing. This auxiliary power supply layer 9 is made of the glaze li! After being formed on the heat generating resistor 2, a pattern is formed by photolithography or the like so that the width interval corresponding to the heat generating portion at the center in the longitudinal direction of the heat generating resistor 3 is 1.

また、前記補助給電体!19の上面には、Ta2N等か
らなる長手方向の中央部を発熱部とされた複数の発熱抵
抗体3が、蒸着、スパッタリング等により直線状に整列
して形成されており、これらの各発熱抵抗体3の両側の
上面には、各発熱抵抗体3に対して給電するためのAn
等からなる共通給電体114aおよび個別給電体14b
がそれぞれ2μmの厚さに形成されている。
Also, the auxiliary power feeder! On the upper surface of the heating resistor 19, a plurality of heating resistors 3 made of Ta2N or the like and having a heat generating portion in the center in the longitudinal direction are formed in a linear arrangement by vapor deposition, sputtering, etc., and each of these heating resistors An ann for supplying power to each heating resistor 3 is provided on the upper surface of both sides of the body 3.
A common power supply body 114a and an individual power supply body 14b consisting of
are each formed to have a thickness of 2 μm.

前記各給電体層4a、4bは、各給電体層4a。Each of the power supply layers 4a and 4b is a power supply layer 4a.

4bの端部が各補助給電体F119の端部より復退する
ように、フォトリソグラフィ技術等により、前記補助給
電体層9の幅間隔pよりも大きな幅間隔りを#するよう
にエツチングされて前記発熱抵抗体3が露出され、その
後、前記発熱抵抗体3、各給電体VA4a、4bおよび
補助給電体層9をエツチングして、それぞれ個別のもの
を整列させるように櫛型に分割形成してなる。そして、
前記補助給電体層9の幅間隔1により、前記発熱抵抗体
3の発熱部のドツトの幅寸法が決定されることになる。
4b is etched by a photolithography technique or the like so that the width interval # is larger than the width interval p of the auxiliary power supply layer 9 so that the end portion of the auxiliary power supply layer F119 is retracted from the end of each auxiliary power supply body F119. The heat generating resistor 3 is exposed, and then the heat generating resistor 3, each of the power feeders VA4a, 4b, and the auxiliary power feeder layer 9 are etched and divided into comb shapes so that the individual parts are aligned. Become. and,
The width interval 1 of the auxiliary power supply layer 9 determines the width dimension of the dots of the heat generating portion of the heat generating resistor 3.

さらに、前記発熱抵抗体3および給電体層4a。Furthermore, the heating resistor 3 and the power supply layer 4a.

4b上には、前記発熱抵抗体3および給電体層4a、4
bを酸化および摩耗から保護する保護層5が形成されて
いる。
4b, the heating resistor 3 and the power supply layers 4a, 4
A protective layer 5 is formed which protects b from oxidation and wear.

前述した構成の実施例のサーマルヘッドを用いた熱転写
プリンタにおいては、このサーマルヘッドを図示しない
インクリボンを介して用紙にIf接させ、所定の印字情
報に基づいて所望の発熱抵抗体3に対応する個別給電体
層4bおよび補助給電体層9に通電することにより、そ
の発熱抵抗体3を発熱さゼ、前記インクリボンのインク
を前記用紙に溶融転写させることにより、前記用紙上に
所望の印字を行なうようになっている。
In the thermal transfer printer using the thermal head of the embodiment with the above-described configuration, the thermal head is brought into contact with the paper via an ink ribbon (not shown), and the thermal head is connected to a desired heating resistor 3 based on predetermined printing information. By energizing the individual power supply layer 4b and the auxiliary power supply layer 9, the heating resistor 3 generates heat, and the ink of the ink ribbon is melted and transferred to the paper, thereby making a desired print on the paper. It is supposed to be done.

このとき、前記補助給電体層9が各給電体層4a、4b
に用いられる八1の約1/10の熱伝導率を有する7i
またはlrまたはそれらの合金により形成されているの
で、発熱抵抗体3への通電により発生した熱は、給電体
14a、4b側に伝達しにくくなり、しかも、前記自給
電休11!f48゜4b間の幅間隔りを発熱抵抗体3の
発熱部よりも大き(形成しているので、前記給電体ff
148.4bと発熱抵抗体3との接触部位が遠くなり、
前記発熱抵抗体3の熱が各給電体層4a、4blllに
も伝達しにくくなり、前記発熱抵抗体aalS位のt′
電極方向断熱性を茗しく高めることができる。
At this time, the auxiliary power supply layer 9 is connected to each power supply layer 4a, 4b.
7i, which has a thermal conductivity about 1/10 of that of 81 used in
or Lr or an alloy thereof, the heat generated by energizing the heating resistor 3 is difficult to be transmitted to the power supply bodies 14a and 4b, and moreover, the self-supply power interruption 11! Since the width interval between f48°4b is larger than the heat generating part of the heat generating resistor 3, the power supply body ff
The contact area between 148.4b and the heating resistor 3 becomes distant,
The heat of the heat generating resistor 3 becomes difficult to be transmitted to each power supply layer 4a, 4bll, and the temperature of the heat generating resistor aalS becomes t'
The insulation properties in the electrode direction can be significantly improved.

このように、本実施例においては、前記発熱抵抗体3部
位の電極方向の断熱性を茗しく高めることができるので
、前記発熱抵抗体3の発熱部が増大することになり、印
字熱効率を著しく高めることができ、印字エネルギ密度
を高く保持しで、高い高速熱応答性を1!?ることがで
きる。また、萌記両給電体1!14a、4b間の幅間隔
を大きく形成しているので、前記発熱抵抗体3の発熱部
の凹凸を小さく形成することができ、プリンタのプラテ
ンへの前記発熱部の当接性を向FざLることがC・きる
。さらに、前記補助給電体層9を発熱抵抗体3の下面側
に形成するようにしており、前記補助給電体WJ9のパ
ターン形成を前記発熱抵抗体3と別個に行なうことがで
きるので、眞記補助給1・h体層9の材料を前記発熱抵
抗体3に対してエツチングの選択性の良好な材料に限定
する必要がなく、前記補助給電体層9にTiまたは2「
またはそれらの合金を用いた場合で・6、前記補助給電
体II!9を良好に形成することができる。
In this way, in this embodiment, the heat insulation properties of the heat generating resistor 3 portion in the electrode direction can be greatly improved, so the heat generating portion of the heat generating resistor 3 increases, and the printing thermal efficiency is significantly improved. It can increase printing energy density, maintain high printing energy density, and provide high-speed thermal response. ? can be done. In addition, since the width interval between the two power feeders 1!14a and 4b is formed large, the unevenness of the heat generating part of the heat generating resistor 3 can be made small, and the heat generating part to the platen of the printer can be formed small. It is possible to reverse the contact property of C. Furthermore, the auxiliary power supply layer 9 is formed on the lower surface side of the heating resistor 3, and the patterning of the auxiliary power supply WJ9 can be performed separately from the heating resistor 3. There is no need to limit the material of the feeder layer 9 to materials with good etching selectivity with respect to the heating resistor 3, and the auxiliary power feeder layer 9 may be made of Ti or 2'.
Or when using those alloys - 6, the auxiliary power supply II! 9 can be formed satisfactorily.

なお、本発明は前記実施例に限定されるものではなく、
必要に応じて種々の変更が可能であり、例えば、前記補
助給電体1lI9の材料は、熱伝導率が小さいものであ
れば、他の種々の材料を選択することができる。
Note that the present invention is not limited to the above embodiments,
Various changes can be made as necessary. For example, various other materials can be selected as the material of the auxiliary power supply body 1lI9 as long as it has a low thermal conductivity.

(発明の効果) 以上、説明したように本発明に係るサーマルヘッドによ
れば、発熱抵抗体の熱の各給電体層側への伝達を低減さ
せることができ、前記発熱抵抗体部1シのmi力方向断
熱性を茗しく^めることができるので、発熱抵抗体の発
熱化が増大することになり、印字熱効率を著しく^める
ことができ、印字エネルギ密度を^く保持して、高い高
速熱応答性を得ることができるという効果を奏する。
(Effects of the Invention) As described above, according to the thermal head according to the present invention, it is possible to reduce the transfer of heat of the heating resistor to each power supply layer side, and the heat generating resistor portion 1 can be reduced. Since the thermal insulation properties in the force direction can be moderated, the heat generation of the heating resistor will increase, the printing thermal efficiency can be significantly increased, and the printing energy density can be maintained high. This has the effect that high high-speed thermal response can be obtained.

を示す縦断面図、第2図および第3図はそれぞれ従来の
す一マルヘッドの縦断面図である。
FIGS. 2 and 3 are longitudinal sectional views of a conventional linear head, respectively.

1・・・絶縁性基板、2・・・グレーズ層、3・・・発
熱抵抗体、4a・・・共通給電体層、4b・・・個別給
電体層、5・・・保護層、9・・・補助給電体層。
DESCRIPTION OF SYMBOLS 1... Insulating substrate, 2... Glaze layer, 3... Heat generating resistor, 4a... Common power supply layer, 4b... Individual power supply layer, 5... Protective layer, 9. ...Auxiliary power supply layer.

Claims (1)

【特許請求の範囲】[Claims] 絶縁基板上にグレーズ層を形成し、このグレーズ層上に
長手方向の中央部を発熱部とされた複数の発熱抵抗体を
整列状に形成し、前記各発熱抵抗体上に、各発熱抵抗体
に選択的に給電するための共通給電体層および個別給電
体層をそれぞれ積層してなるサーマルヘッドにおいて、
前記グレーズ層と前記発熱抵抗体との間に、前記発熱抵
抗体の発熱部の両側に位置し熱伝導率の小さい材料から
なる補助給電体層をその幅間隔が前記発熱抵抗体の発熱
部に対応するように介設し、両給電体層の端部が補助給
電体層の端部より後退するように前記共通給電体層およ
び個別給電体層間の幅間隔を前記補助給電体層間の幅間
隔より大きく形成したことを特徴とするサーマルヘッド
A glaze layer is formed on an insulating substrate, a plurality of heating resistors each having a longitudinal center portion as a heating portion are formed in an array on the glaze layer, and each heating resistor is placed on each of the heating resistors. In a thermal head formed by laminating a common power supply layer and individual power supply layers for selectively supplying power to the
Between the glaze layer and the heat generating resistor, auxiliary power supply layers made of a material with low thermal conductivity are provided on both sides of the heat generating part of the heat generating resistor, and the width interval thereof is the same as the heat generating part of the heat generating resistor. The common power supply layer and the individual power supply layers are arranged so that the width interval between the common power supply layer and the individual power supply layer is set to the width interval between the auxiliary power supply layers so that the ends of both power supply layers are set back from the end of the auxiliary power supply layer. A thermal head characterized by being larger.
JP3363589A 1989-02-15 1989-02-15 Thermal head Expired - Fee Related JP2669881B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP3363589A JP2669881B2 (en) 1989-02-15 1989-02-15 Thermal head

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP3363589A JP2669881B2 (en) 1989-02-15 1989-02-15 Thermal head

Publications (2)

Publication Number Publication Date
JPH02214671A true JPH02214671A (en) 1990-08-27
JP2669881B2 JP2669881B2 (en) 1997-10-29

Family

ID=12391913

Family Applications (1)

Application Number Title Priority Date Filing Date
JP3363589A Expired - Fee Related JP2669881B2 (en) 1989-02-15 1989-02-15 Thermal head

Country Status (1)

Country Link
JP (1) JP2669881B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009015323A3 (en) * 2007-07-26 2009-03-12 Hewlett Packard Development Co Heating element

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7862156B2 (en) * 2007-07-26 2011-01-04 Hewlett-Packard Development Company, L.P. Heating element

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2009015323A3 (en) * 2007-07-26 2009-03-12 Hewlett Packard Development Co Heating element
JP2010534580A (en) * 2007-07-26 2010-11-11 ヒューレット−パッカード デベロップメント カンパニー エル.ピー. Heating element
US7837886B2 (en) 2007-07-26 2010-11-23 Hewlett-Packard Development Company, L.P. Heating element
US8141986B2 (en) 2007-07-26 2012-03-27 Hewlett-Packard Development Company, L.P. Heating element

Also Published As

Publication number Publication date
JP2669881B2 (en) 1997-10-29

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