JPH0299342A - Thermal head - Google Patents
Thermal headInfo
- Publication number
- JPH0299342A JPH0299342A JP25356788A JP25356788A JPH0299342A JP H0299342 A JPH0299342 A JP H0299342A JP 25356788 A JP25356788 A JP 25356788A JP 25356788 A JP25356788 A JP 25356788A JP H0299342 A JPH0299342 A JP H0299342A
- Authority
- JP
- Japan
- Prior art keywords
- heating resistor
- substrate
- heating
- glaze layer
- platen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010438 heat treatment Methods 0.000 claims abstract description 65
- 239000000758 substrate Substances 0.000 claims abstract description 40
- 238000009434 installation Methods 0.000 claims description 16
- 230000002093 peripheral effect Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 27
- 238000004519 manufacturing process Methods 0.000 description 7
- 239000000463 material Substances 0.000 description 6
- 230000020169 heat generation Effects 0.000 description 5
- 239000011241 protective layer Substances 0.000 description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 3
- KRHYYFGTRYWZRS-UHFFFAOYSA-N Fluorane Chemical compound F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 2
- 229910003460 diamond Inorganic materials 0.000 description 2
- 239000010432 diamond Substances 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 230000003647 oxidation Effects 0.000 description 2
- 238000007254 oxidation reaction Methods 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910004479 Ta2N Inorganic materials 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 238000012840 feeding operation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000005338 heat storage Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41J—TYPEWRITERS; SELECTIVE PRINTING MECHANISMS, i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME; CORRECTION OF TYPOGRAPHICAL ERRORS
- B41J2/00—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed
- B41J2/315—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material
- B41J2/32—Typewriters or selective printing mechanisms characterised by the printing or marking process for which they are designed characterised by selective application of heat to a heat sensitive printing or impression-transfer material using thermal heads
- B41J2/335—Structure of thermal heads
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はサーマルヘッドに係り、特にコンピコ〜り等の
プリンタやファクシミリ等に用いられるいわゆるリアル
エツジタイプのサーマルヘッドに関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a thermal head, and particularly to a so-called real edge type thermal head used in printers such as computers, facsimile machines, and the like.
サーマルプリンタに搭載されるサーマルヘッドは、例え
ば、複数個の発熱抵抗体を同一基板上に直線的に配列し
、所望の印字情報にしたがってこの発熱抵抗体を通電加
熱させて、感熱記録紙に発色記録させるか、あるいは、
インクリボンを介して普通紙に転写記録するために用い
られている。The thermal head installed in a thermal printer, for example, has multiple heating resistors arranged linearly on the same substrate, and the heating resistors are heated with electricity according to the desired print information to produce color on thermal recording paper. record it or
It is used to transfer and record onto plain paper via an ink ribbon.
第５図および第６図は従来のサーマルヘッドを示したも
ので、セラミック等からなる絶縁性基板１上には、蓄熱
層として機能するガラス等からなるグレーズ層２が形成
されており、このグレーズ層２は、その発熱抵抗体形成
予定領域にお【ノる上面の新面形状が円弧状に形成され
ている。このグレーズ層２の上面には、Ｔａ２Ｎ等から
なる発熱抵抗体３が蒸着、スパッタリング等により被着
された後、エツチングされて、ドツトの数に応じて複数
個直線状に配置、形成されてＪ３す、この発熱抵抗体３
上の一側には、各発熱抵抗体３に接続される共通電極４
が形成されている。また、前記各発熱抵抗体３の他側に
は、各発熱抵抗体３に独立して通電を行なう個別電極５
がそれぞれ接続されており、前記共通？Ｕ極４および個
別電極５は、例えば、アルミニウム、銅または金等から
なり、蒸着、スパッタリング等により被着された後、エ
ツチングにより所望形状のパターンに形成されるもので
ある。さらに、これら発熱抵抗体３、共通電極４および
個別電極５の表面には、耐酸化、耐摩耗を図るＳｉＯや
Ｔａ ２０５等からなる保護層６が形成されている。5 and 6 show a conventional thermal head, in which a glaze layer 2 made of glass or the like that functions as a heat storage layer is formed on an insulating substrate 1 made of ceramic or the like. Layer 2 has a new arc-shaped upper surface in the area where the heating resistor is to be formed. On the upper surface of this glaze layer 2, a heating resistor 3 made of Ta2N or the like is deposited by vapor deposition, sputtering, etc., and then etched to form a plurality of dots arranged and formed in a straight line according to the number of dots. This heating resistor 3
On one side of the top, there is a common electrode 4 connected to each heating resistor 3.
is formed. Further, on the other side of each heat generating resistor 3, an individual electrode 5 is provided which supplies current to each heat generating resistor 3 independently.
Are each connected and the common? The U-pole 4 and the individual electrodes 5 are made of, for example, aluminum, copper, or gold, and are deposited by vapor deposition, sputtering, etc., and then formed into a desired pattern by etching. Furthermore, a protective layer 6 made of SiO, Ta 205, or the like is formed on the surfaces of the heat generating resistor 3, the common electrode 4, and the individual electrodes 5 to provide oxidation resistance and wear resistance.
また、第６図に示すように、前記基板１上には、サーマ
ルヘッドの発熱抵抗体３がプラテン７に圧接された場合
に、前記プラテン７に接触しないでかつ用紙の送り動作
を妨げない位置に前記発熱抵抗体３への通電制御を行な
う駆動索子８が搭載され、かつ保護層８ａによって被覆
されている。Further, as shown in FIG. 6, there is a position on the substrate 1 where, when the heating resistor 3 of the thermal head is pressed against the platen 7, it does not come into contact with the platen 7 and does not interfere with the paper feeding operation. A driving rope 8 for controlling the supply of electricity to the heating resistor 3 is mounted on the heating resistor 3, and is covered with a protective layer 8a.
前記従来のサーマルヘッドにおいては、前記駆動素子８
に入力される印字信号に基づいて選択された発熱抵抗体
３の個別電極５に通電を行ない、所望の発熱抵抗体３を
発熱させることにより、この発熱抵抗体３部分に送られ
るインクリボンのインクを溶融する等して用紙に転写し
、用紙上に所望の印字を行なうようにしている。In the conventional thermal head, the drive element 8
By energizing the individual electrodes 5 of the heating resistor 3 selected based on the printing signal input to the heating resistor 3 and causing the desired heating resistor 3 to generate heat, the ink of the ink ribbon sent to the 3 portions of the heating resistor 3 is energized. The image is transferred onto paper by melting or otherwise, and desired printing is performed on the paper.
しかし、前記従来のサーマルヘッドにおいては、グレー
ズ層２を円弧状に形成し、その種部に発熱抵抗体３を配
設することにより、プラテン７に対する発熱抵抗体３の
圧接力を高めるようになされているものであるが、前記
駆動索子８を、発熱抵抗体３から大きく離隔した位置に
搭載する必要があるので、基板１の幅寸法が大きくなっ
てしまい、基板材料が高価であるため、材料コストおよ
び製造コストが増大してしまうという問題を有している
。特に、真空機器を用いて製造する薄膜タイプのサーマ
ルヘッドにおいては、製造装置の大きさの制限からこの
問題点が顕著である。However, in the conventional thermal head, the glaze layer 2 is formed in a circular arc shape, and the heating resistor 3 is disposed at the seed portion of the glaze layer 2, thereby increasing the pressing force of the heating resistor 3 against the platen 7. However, since it is necessary to mount the driving cable 8 at a position far away from the heating resistor 3, the width dimension of the substrate 1 becomes large, and the substrate material is expensive. There is a problem in that material costs and manufacturing costs increase. This problem is particularly noticeable in thin film type thermal heads manufactured using vacuum equipment due to the size limitations of the manufacturing equipment.
そのため、基板の端部に傾斜面を形成し、この傾斜面に
、発熱抵抗体および電極を形成することにより、基板を
小型化したサーマルヘッドが提案されているが、この場
合は、前記傾斜面に発熱抵抗体および電極を配置してい
るので、各電極により発熱抵抗体が電極より低く形成さ
れてしまい、発熱抵抗体をプラテンに対して適正に圧接
させることができず、印字品質の低下、発熱効率の（ｌ
（十を眉いていた。Therefore, a thermal head has been proposed in which the substrate is miniaturized by forming an inclined surface at the end of the substrate and forming a heating resistor and an electrode on this inclined surface. Since the heating resistor and the electrodes are arranged in the 2nd position, each electrode causes the heating resistor to be formed lower than the electrode, making it impossible to properly press the heating resistor against the platen, resulting in deterioration of printing quality and Heat generation efficiency (l
(He was frowning.
本発明はこれらの点に篤みてなされたものであり、発熱
抵抗体を適正にプラテンに圧接させることができるとと
もに、基板面積を減少さけて安価に％ｌ ’Ａすること
ができる１ノー−マルヘッドを提供することを目的とす
るものである。The present invention has been made in consideration of these points, and provides a normal head that can properly press the heating resistor to the platen and that can reduce the substrate area by %l'A at low cost. The purpose is to provide the following.
前記目的を達成するため本発明に係るり′−マルヘッド
は、絶縁性基板の上面の一端側にグレーズ層を設け、こ
のグレーズ層の発熱抵抗体設置面上にドツトの数に応じ
た複数の発熱抵抗体を配設し、これらの発熱抵抗体に接
続される電極を連設し、前記基板上に前記′Ｆｉ極への
通電制御を行なう駆動素子を装着してなるサーマルヘッ
ドにおいて、前記発熱抵抗体設置面を前記グレーズ層の
端縁部において前記基板の上面に対して傾むけて形成し
、その発熱抵抗体設置面に配設されている前記発熱抵抗
体をこれらに連設される前記電極より外方へ突出づるよ
うに形成するように構成されている。In order to achieve the above object, the linear head according to the present invention includes a glaze layer provided on one end side of the upper surface of an insulating substrate, and a plurality of heat generating dots corresponding to the number of dots on the surface of the glaze layer on which the heat generating resistor is installed. In a thermal head in which resistors are arranged, electrodes connected to these heat generating resistors are arranged in series, and a drive element for controlling energization to the 'Fi pole is mounted on the substrate, the heat generating resistor A body installation surface is formed at an edge of the glaze layer so as to be inclined with respect to the upper surface of the substrate, and the heating resistor disposed on the heating resistor installation surface is connected to the electrode connected thereto. It is configured to be formed so as to protrude further outward.
本発明によれば、発熱抵抗体を基板の上面に対して傾い
ているグレーズ層の端縁部の発熱抵抗体、ｌＱ直面に配
設するとともに、連設される電極にり外方へ突出するよ
うに形成しているので、発熱抵抗体を電極に邪魔される
ことなくプラテンに東１的に圧接さＶることができ、印
字品質の向上および発熱効率の向上を図ることができる
。また、前記基板をプラテンに対して傾斜して配置する
ようにしており、基板の上面とプラテンとの間隙を大き
く確保することができるので、前記駆動素子を基板の発
熱抵抗体配設部分に近接して装着することができ、その
結果、基板の幅１法を小さく形成することができ、１渉
板材料コストの低減等を図ることができ、製造コストを
署しく低減さけることができるものである。According to the present invention, the heating resistor is disposed on the edge of the glaze layer that is inclined with respect to the upper surface of the substrate, and the heating resistor is disposed on the lQ surface, and protrudes outward from the continuous electrode. Since the heat generating resistor is formed in this way, it is possible to press the heat generating resistor directly against the platen without being obstructed by the electrodes, and it is possible to improve printing quality and heat generation efficiency. In addition, since the substrate is arranged at an angle with respect to the platen, a large gap can be secured between the upper surface of the substrate and the platen, so that the driving element can be placed close to the portion of the substrate where the heating resistor is arranged. As a result, the width of the board can be made smaller, the cost of materials for the board can be reduced, and manufacturing costs can be significantly reduced. be.
（実施例）
以下、本発明の実施例を第１図から第４図を参照し、第
５図Ｊ３よび第６図と同一部分には同一符号を付して説
明する。(Example) Hereinafter, an example of the present invention will be described with reference to FIGS. 1 to 4, and the same parts as in FIG. 5 J3 and FIG. 6 are given the same reference numerals.
第１図および第２図は本発明の一実施例を示したもので
、アルミナ等のセラミックからなる絶縁性基板１の上面
には、厚さ約５０μｍのグレーズ層２が形成されており
、このグレーズ層２を形成した後、グレーズ層２にフォ
トリソ技術によりマスキングを行ない、フッ酸を用いて
グレーズ層２に対して角度θ１傾斜した発熱抵抗体設置
面９を端縁部に形成する。その後、このグレーズ層２の
形成された基板１を前記発熱抵抗体設置面９を含むよう
にダイヤモンドブレード等により研削して前記発熱抵抗
体設置面９より大きい角度θ２で傾斜する電極用傾斜面
１０を形成する。1 and 2 show an embodiment of the present invention, in which a glaze layer 2 with a thickness of approximately 50 μm is formed on the upper surface of an insulating substrate 1 made of ceramic such as alumina. After forming the glaze layer 2, the glaze layer 2 is masked by photolithography, and a heating resistor mounting surface 9 inclined at an angle θ1 with respect to the glaze layer 2 is formed at the edge using hydrofluoric acid. Thereafter, the substrate 1 on which the glaze layer 2 has been formed is ground with a diamond blade or the like so as to include the heating resistor installation surface 9, and an electrode slope 10 is inclined at an angle θ2 larger than the heating resistor installation surface 9. form.
また、前記グレーズ層２の発熱抵抗体設置面９には、Ｔ
ａ２Ｎ等からなり、ドツトの数に応じた複数の発熱抵抗
体３が形成されており、前記電極用傾斜面１０には、ア
ルミニウム等からなり前記発熱抵抗体３に接続される共
通電ｌＬｉ４が形成されている。前記グレーズ層２の上
面には、アルミニウム等からなり前記発熱抵抗体３に接
続される個別電極５が形成されている。これにより、発
熱抵抗体設置面９上に形成された発熱抵抗体３が他の電
極４．５より外方へ突出した状態となる。そして、これ
ら発熱抵抗体３および各電極４．５の表面には、ＳｉＯ
２やＴａ２０５等からなる耐酸化、耐摩耗用の保２！層
６が被覆形成されている。ざらに、前記基板１のグレー
ズ層２の上面には、前記発熱抵抗体３への通電υ制御を
行なう駆動素子８が装着されている。その後、前記基板
１の＃Ｊ記電電極用傾斜面１０端部部分を明所すること
により個々のサーマルヘッドデツプが形成される。Further, on the heating resistor installation surface 9 of the glaze layer 2, T
A plurality of heating resistors 3 made of a2N or the like are formed in accordance with the number of dots, and a common electric current lLi4 made of aluminum or the like and connected to the heating resistors 3 is formed on the electrode slope 10. has been done. On the upper surface of the glaze layer 2, individual electrodes 5 made of aluminum or the like and connected to the heating resistor 3 are formed. As a result, the heat generating resistor 3 formed on the heat generating resistor installation surface 9 is in a state of protruding outward from the other electrodes 4.5. The surfaces of these heating resistors 3 and each electrode 4.5 are coated with SiO
Oxidation-resistant and wear-resistant protective material made of 2, Ta205, etc. A layer 6 is applied. Roughly speaking, a driving element 8 is mounted on the upper surface of the glaze layer 2 of the substrate 1 to control the current υ applied to the heating resistor 3. Thereafter, individual thermal head depths are formed by exposing the end portion of the #J charging electrode inclined surface 10 of the substrate 1 to a bright spot.
前記のように形成されたサーマルヘッドは、第２図に示
すように、発熱抵抗体３が形成されたグレーズ層２の発
熱抵抗体設置面９部分が用紙を巻回するプラテン７の外
周面に対向するように、基板１を角度θ１だけ傾斜させ
て配置するようになされている。In the thermal head formed as described above, as shown in FIG. 2, the heating resistor installation surface 9 of the glaze layer 2 on which the heating resistor 3 is formed is located on the outer peripheral surface of the platen 7 around which the paper is wound. The substrates 1 are arranged so as to be inclined at an angle θ1 so as to face each other.
次に、本実施例の作用について説明する。Next, the operation of this embodiment will be explained.
本実施例においては、前記駆動素子８に入力される印字
信号に基づいて選択された発熱抵抗体３の個別電極５に
通電を行ない、所望の発熱抵抗体３を発熱させることに
より、この発熱抵抗体３部分に送られるインクリボンの
インクを溶融して用紙に転写し、用紙上に所望の印字を
行なうようにしている。In this embodiment, the individual electrodes 5 of the heat generating resistors 3 selected based on the print signal input to the drive element 8 are energized to cause the desired heat generating resistors 3 to generate heat. The ink of the ink ribbon sent to the body 3 is melted and transferred onto the paper, so that desired printing is performed on the paper.
したがって、本実施例においては、発熱抵抗体３を発熱
抵抗体設置面９に形成し、共通電極４および個別電極５
がそれぞれこの発熱抵抗体設置面９に対して角度を有す
る電極用傾斜面１０およびグレーズｒ！Ｊ２の上面に形
成するようにしているので、発熱抵抗体３のみをインク
リボンを介してプラテン７に集中的に圧接させることが
でき、印字品質の向上および発熱効率の向上を図ること
ができる。また、前記基板１を傾斜して配置するように
しており、基板１の上面とプラテン７との間隙を大きく
確保することができるので、前記駆動素子８を基板１の
発熱抵抗体３の形成部分に近接して装着することができ
、その結果、基板１の幅間法を小さく形成することがで
き、基板１の材料コストの低減および多数のザーマルへ
ラドチップを形成する場合における真空機器等にょる処
即徂の増大等を図ることができ、製造コストを著しく低
減させることができる。Therefore, in this embodiment, the heat generating resistor 3 is formed on the heat generating resistor installation surface 9, and the common electrode 4 and the individual electrodes 5
The electrode slope 10 and the glaze r! each have an angle with respect to the heating resistor installation surface 9. Since it is formed on the upper surface of J2, only the heat generating resistor 3 can be intensively pressed against the platen 7 via the ink ribbon, and it is possible to improve print quality and heat generation efficiency. Further, since the substrate 1 is arranged at an angle, and a large gap can be secured between the upper surface of the substrate 1 and the platen 7, the drive element 8 can be moved to the area where the heating resistor 3 of the substrate 1 is formed. As a result, the width of the substrate 1 can be made small, reducing the material cost of the substrate 1 and reducing the need for vacuum equipment, etc. when forming a large number of thermal Rad chips. It is possible to increase the processing speed, etc., and to significantly reduce manufacturing costs.
また、第３図および第４図は本発明の他の実施例を示し
たもので、基板１の上面に、グレーズ層２を形成し、こ
のグレーズ層２の端縁部に、最強部の接線とグレーズ層
２および絶縁性基板１の上面と角度が０１となる凸円弧
曲面状の発熱抵抗体設置面９としている。その後、この
グレーズｌｌ！Ｊ２の形成された基板１を前記発熱抵抗
体設置面９を含むようにダイヤモンドブレード等により
研削して前記角度θ１より大きい角度θ２ （２０°〜
４０°）の電極用傾斜面１０を形成する。Further, FIGS. 3 and 4 show another embodiment of the present invention, in which a glaze layer 2 is formed on the upper surface of the substrate 1, and a tangent line of the strongest part is formed on the edge of the glaze layer 2. The heating resistor mounting surface 9 has a convex arc curved surface and forms an angle of 01 with the upper surface of the glaze layer 2 and the insulating substrate 1. After that, this glaze ll! The substrate 1 on which J2 is formed is ground with a diamond blade or the like so as to include the heating resistor mounting surface 9, and an angle θ2 (20° to
40°) is formed.
そして、前記グレーズ層２の発熱抵抗体設置面９には、
複数の発熱抵抗体３が形成されており、前記電極用傾斜
面１０には、ｊｔ通電！４４が形成されるとともに、グ
レーズ層２の上面には、個別電極５が形成されている。Then, on the heating resistor installation surface 9 of the glaze layer 2,
A plurality of heating resistors 3 are formed, and the electrode slope 10 is electrically conductive! 44 are formed, and individual electrodes 5 are also formed on the upper surface of the glaze layer 2.
これにより、発熱抵抗体設置面９に形成された発熱抵抗
体３が、他の電極４．５より外方へ突出した状態となる
。そして、これら発熱抵抗体３および各電極４，５の表
面には、保護層６が被覆形成されており、さらに、前記
基板１のグレーズ層２の上面には、前記発熱抵抗体３へ
の通電制御を行なう駆動系子８が装着されている。As a result, the heat generating resistor 3 formed on the heat generating resistor installation surface 9 comes to protrude outward from the other electrodes 4.5. A protective layer 6 is formed on the surface of the heating resistor 3 and each of the electrodes 4 and 5, and a protective layer 6 is formed on the upper surface of the glaze layer 2 of the substrate 1. A drive system element 8 for controlling is installed.
その他の部分は、第１図および第２図に示す実施例のも
のと同様であるので、その説明を省略する。The other parts are the same as those of the embodiment shown in FIGS. 1 and 2, so their explanation will be omitted.
したがって、本実施例においても前記実施例と同様に、
発熱抵抗体３のみをインクリボンを介してプラテン７に
集中的に圧接させることができ、印字品質の向上および
発熱効率の向上を図ることができる。また、基板１の幅
寸法を小さく形成することができ、基板１の材料コスト
の低減等を図ることができ、製造コス１−を著しく低減
させることができる。Therefore, in this example as well, as in the previous example,
Only the heating resistor 3 can be brought into intensive pressure contact with the platen 7 via the ink ribbon, and printing quality and heat generation efficiency can be improved. Moreover, the width dimension of the substrate 1 can be formed small, the material cost of the substrate 1 can be reduced, and the manufacturing cost 1- can be significantly reduced.
なお、前記実施例はインクリボンを用いて印字する場合
について説明したが、感熱記録紙に直接印字する場合に
も適用することができる。Although the above embodiments have been described with respect to printing using an ink ribbon, the present invention can also be applied to printing directly onto heat-sensitive recording paper.
また、本発明は前記実施例に限定されるものではなく、
必要に応じて変更（ることができる。Furthermore, the present invention is not limited to the above embodiments,
You can change it if necessary.
以上述べたように本発明に係る勺−マルヘッドは、発熱
抵抗体を絶縁性基板の上面に対して角度を有する発熱抵
抗体設置面に形成して、電極より外方へ突出するように
形成しているので、発熱抵抗体が電極面より低くなるこ
とがなく、発熱抵抗体のみをプラテンに集中的に圧接さ
せることができ、印字品質の向上および発熱効率の向上
を図ることができる。また、前記基板をプラテンに対し
て傾斜して配置するようにしたので、駆動素子を基板の
発熱抵抗体の形成部分に近接して装着することができ、
その結果、基板の幅寸法を小さく形成することができ、
製造コストを著しく低減さＶることができる等の効果を
奏する。As described above, in the multi-head according to the present invention, the heat generating resistor is formed on the heat generating resistor installation surface that is at an angle with respect to the upper surface of the insulating substrate, and is formed so as to protrude outward from the electrodes. Therefore, the heat generating resistor does not become lower than the electrode surface, and only the heat generating resistor can be brought into intensive pressure contact with the platen, thereby improving print quality and heat generation efficiency. Further, since the substrate is arranged at an angle with respect to the platen, the drive element can be mounted close to the portion of the substrate where the heating resistor is formed.
As a result, the width of the board can be made smaller,
This has the advantage that manufacturing costs can be significantly reduced.
第１図は本発明の一実施例を示す一部の縦断面図、第２
図は第１図のサーマルヘッドのプラテンへの圧接状態を
示す正面図、第３図は本発明の他の実施例を示す一部の
縦断面図、第４図は第３図のサーマルヘッドのプラテン
への圧接状態を示Ｊ正面図、第５図は従来のナーマルヘ
ッドを示す一部の縦断面図、第６図は第５図のサーマル
ヘッドのプラテンへの圧接状態を示す正面図である。
１・・・基板、２・・・グレーズ層、３・・・発熱抵抗
体、４・・・共通電極、５・・・個別電極、６・・・保
護層、７・・・プラテン、８・・・駆動素子、９・・・
発熱抵抗体設置面、１０・・・電極用傾斜面。
尾２回FIG. 1 is a partial vertical sectional view showing one embodiment of the present invention, and FIG.
The figure is a front view showing the state in which the thermal head shown in FIG. 1 is pressed against the platen, FIG. 5 is a longitudinal cross-sectional view of a portion of a conventional thermal head, and FIG. 6 is a front view showing the thermal head of FIG. 5 in a state of pressure contact with the platen. DESCRIPTION OF SYMBOLS 1... Substrate, 2... Glaze layer, 3... Heat generating resistor, 4... Common electrode, 5... Individual electrode, 6... Protective layer, 7... Platen, 8... ...Drive element, 9...
Heating resistor installation surface, 10... sloped surface for electrodes. tail twice
Claims (1)
レーズ層の発熱抵抗体設置面上にドットの数に応じた複
数の発熱抵抗体を配設し、これらの発熱抵抗体に接続さ
れる電極を連設し、前記基板上に前記電極への通電制御
を行なう駆動素子を装着してなるサーマルヘッドにおい
て、前記発熱抵抗体設置面を前記グレーズ層の端縁部に
おいて前記基板の上面に対して傾むけて形成し、その発
熱抵抗体設置面に配設されている前記発熱抵抗体をこれ
らに連設される前記電極より外方へ突出するように形成
したことを特徴とするサーマルヘッド。A glaze layer is provided on one end side of the upper surface of the insulating substrate, and a plurality of heating resistors corresponding to the number of dots are arranged on the heating resistor installation surface of this glaze layer, and the heating resistors are connected to the heating resistors. In a thermal head in which electrodes are arranged in series and a drive element for controlling energization to the electrodes is mounted on the substrate, the heating resistor installation surface is placed at the edge of the glaze layer with respect to the upper surface of the substrate. 1. A thermal head, characterized in that the heating resistor is formed so as to be inclined, and the heating resistor disposed on the heating resistor installation surface is formed so as to protrude outward from the electrode connected thereto.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25356788A JPH0299342A (en) | 1988-10-07 | 1988-10-07 | Thermal head |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25356788A JPH0299342A (en) | 1988-10-07 | 1988-10-07 | Thermal head |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0299342A true JPH0299342A (en) | 1990-04-11 |
Family
ID=17253165
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25356788A Pending JPH0299342A (en) | 1988-10-07 | 1988-10-07 | Thermal head |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0299342A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04244861A (en) * | 1991-01-30 | 1992-09-01 | Rohm Co Ltd | Thermal head |
| JPH04244862A (en) * | 1991-01-30 | 1992-09-01 | Rohm Co Ltd | Thermal head |
| JPH04246551A (en) * | 1991-01-31 | 1992-09-02 | Rohm Co Ltd | Manufacture of thermal head |
| EP0764539A2 (en) * | 1993-06-08 | 1997-03-26 | Rohm Co., Ltd. | End-contact type thermal head and manufacturing method therefor |
| US10883945B2 (en) | 2016-03-08 | 2021-01-05 | Rigaku Corporation | Simultaneous multi-elements analysis type X-ray fluorescence spectrometer, and simultaneous multi-elements X-ray fluorescence analyzing method |
-
1988
- 1988-10-07 JP JP25356788A patent/JPH0299342A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH04244861A (en) * | 1991-01-30 | 1992-09-01 | Rohm Co Ltd | Thermal head |
| JPH04244862A (en) * | 1991-01-30 | 1992-09-01 | Rohm Co Ltd | Thermal head |
| JPH04246551A (en) * | 1991-01-31 | 1992-09-02 | Rohm Co Ltd | Manufacture of thermal head |
| EP0764539A2 (en) * | 1993-06-08 | 1997-03-26 | Rohm Co., Ltd. | End-contact type thermal head and manufacturing method therefor |
| EP0764539A3 (en) * | 1993-06-08 | 1997-04-02 | Rohm Co., Ltd. | End-contact type thermal head and manufacturing method therefor |
| US5745148A (en) * | 1993-06-08 | 1998-04-28 | Rohm Co., Ltd. | Corner head type thermal head and manufacturing method therefor |
| US10883945B2 (en) | 2016-03-08 | 2021-01-05 | Rigaku Corporation | Simultaneous multi-elements analysis type X-ray fluorescence spectrometer, and simultaneous multi-elements X-ray fluorescence analyzing method |
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