JPH02212785A - Screening apparatus for semiconductor integrated circuit - Google Patents

Abstract

PURPOSE:To add a mark easy to discern to an improper semiconductor pellet by breaking an electronic element through application of a voltage thereto of said inferior or improper semiconductor pellet, so that semiconductor pellets can be distinguished proper or improper with utilizing said broken electronic element. CONSTITUTION:This distinguished apparatus of a semiconductor integrated circuits is provided with a power source 4. A probe 5 connected to the power source 4 is brought into touch, e.g., with a bonding pad 2a connected to a collec tor 3a of a transistor 3 and bonding pad 2b connected to an emitter 3b of the transistor 3. A large voltage is applied to the probe 5 in a direction opposite to the polarity so that the bonding surface of the transistor is broken. The surface of the transistor 3 broken by this voltage changes its color or pitting on the surface. Accordingly, the transistor can be used to distinguish the semicon ductor integrated circuit irrespective of the surface state thereof since the color change or pitting on the surface is easy to discern.

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a semiconductor integrated circuit Ii+8 sorting device.

[Conventional technology]

Conventionally, this type of semiconductor integrated circuit sorting equipment has used a needle to scratch the surface of defective semiconductor pellets when sorting out the acceptability of semiconductor pellets, which are semiconductor integrated circuit devices, with electronic circuits formed on one main surface. The mark was used as a mark for selection.

[Problem to be solved by the invention]

In the conventional semiconductor integrated circuit sorting device described above, defective pellets are scratched with a needle, so depending on the surface condition of the pellet I-, for example, if it is a silicon oxide film, it is difficult to scratch and it is difficult to identify it as a mark. There is a drawback. For this reason, there is also a problem that the efficiency of the sorting operation after wafer berettization decreases.

SUMMARY OF THE INVENTION An object of the present invention is to provide a semiconductor integrated circuit sorting device that can attach marks that are easy to identify during sorting.

[Means to solve the problem]

A semiconductor integrated circuit sorting device of the present invention is a semiconductor integrated circuit sorting device for sorting out whether a semiconductor pellet having an electronic circuit formed on its main surface is good or bad, and in which a voltage is applied to an electronic element of a defective semiconductor pellet to remove the electronic element. The method includes the steps of: destroying the semiconductor chip, and using the destroyed electronic element as a mark to determine whether the semiconductor chip is good or bad.

[,Example〕 Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a schematic plan view showing a part of a semiconductor device I- for explaining one embodiment of the present invention. This semiconductor integrated circuit sorting device has a power source 4, and connects a probe 5 connected to the power source 4 to, for example, a bonder connected to the lids 3a of transistors 1 to 3 formed on the semiconductor bellet L-1. The ink pad 2a and the bonding pad 2b connected to the emitter 3b are contacted, respectively, and a large voltage of opposite polarity is applied so as to destroy the junction surface of this transistor. The surface of the transistor 3 destroyed by this voltage becomes discolored or has holes. Since this discoloration and holes are easy to identify, they can be used as marks for selecting good or bad semiconductor pellets, regardless of the surface condition of the semiconductor pellets 1 to 1.

〔Effect of the invention〕

As explained above, the present invention electrically destroys the electronic elements inside the defective pellets, and the surface condition [1] Since the broken state can be identified regardless of the surface condition, it is possible to identify the broken state regardless of the surface condition. This has the effect of providing a semiconductor integrated circuit sorting device that can detect

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating an embodiment of the present invention. It is a schematic plan view which shows a part of conductor pellet.

Claims (1)

[Claims] In a semiconductor integrated circuit sorting device that sorts semiconductor pellets with electronic circuits formed on one main surface to determine whether they are good or bad, a voltage is applied to the electronic elements of the defective semiconductor pellet to destroy the electronic elements, and the destroyed elements are marked as markers. A semiconductor integrated circuit sorting device characterized in that the semiconductor pellets are sorted to determine whether the semiconductor pellets are good or bad.