JPH02208993A - Printed board - Google Patents

Printed board

Info

Publication number
JPH02208993A
JPH02208993A JP2756889A JP2756889A JPH02208993A JP H02208993 A JPH02208993 A JP H02208993A JP 2756889 A JP2756889 A JP 2756889A JP 2756889 A JP2756889 A JP 2756889A JP H02208993 A JPH02208993 A JP H02208993A
Authority
JP
Japan
Prior art keywords
hole
slit
width
circuit board
printed circuit
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2756889A
Other languages
Japanese (ja)
Other versions
JP2737204B2 (en
Inventor
Motoo Yusa
遊佐 始男
Masayuki Osawa
大沢 正行
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sony Corp
Original Assignee
Sony Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sony Corp filed Critical Sony Corp
Priority to JP1027568A priority Critical patent/JP2737204B2/en
Publication of JPH02208993A publication Critical patent/JPH02208993A/en
Application granted granted Critical
Publication of JP2737204B2 publication Critical patent/JP2737204B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/4007Surface contacts, e.g. bumps
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/40Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/403Edge contacts; Windows or holes in the substrate having plural connections on the walls thereof

Abstract

PURPOSE:To obtain a printed board of excellent solderability on which the leads of an electronic component are set in position by a method wherein adjacent holes very close to each other on the board are connected to each other through a slit whose width is equal to a specified value or more end smaller than the length of minor axis of the hole. CONSTITUTION:A printed board is composed of a printed board main body 1, a first and a second hole, 2 and 3, and a slit 4 which connects the holes 2 and 3 together. Here, the width a of the slit 4 is set larger than 0.5mm and smaller than the length of minor axis of the smaller hole (when the hole is not a right circle, the length of minor axis of the hole). In the substrate main body 1 structured as mentioned above, as the width a is made equal to 0.5mm or more, a die can retain its strength, where a molding die does not collapse or a punch is not broken. And, as the width a is made smaller than the length of short axis of the smaller hole, the slit 4 is small in width and the leads of an electronic component are set in position, and a metal foil provided around the holes is small in cutout, so that a printed board of this design is excellent in solderability.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、プリント基板に関する。[Detailed description of the invention] [Industrial application field] The present invention relates to a printed circuit board.

〔発明の概要〕[Summary of the invention]

非常に接近した隣接孔間を幅が0.5 aua以上で前
記孔の短径より狭いスリットにより連結することにより
、電子部品のリード位置が定まり、はんだ付は性の良好
なプリント基板を提供する。
By connecting adjacent holes that are very close to each other with a slit having a width of 0.5 au or more and narrower than the short axis of the hole, the lead position of the electronic component is determined, and a printed circuit board with good soldering properties is provided. .

〔従来の技術〕[Conventional technology]

従来、プリント基板本体に穿設された非常に接近した隣
接孔がある場合、又は及びプリント基板本体の外形に近
接して孔がある場合、プリント基板本体に前記孔をプレ
スで打ち抜きする時、金型破損の原因となるため、隣接
孔間又は及びプリント基板本体の外形と孔間を連結して
つなげていた。
Conventionally, when there are very closely adjacent holes drilled in the printed circuit board body, or when there are holes close to the outline of the printed circuit board body, when punching the holes in the printed circuit board body with a press, metal To prevent damage to the mold, adjacent holes or the outer shape of the printed circuit board body and holes were connected.

このような例を第2図に示す。第2図(A)は、プリン
ト基板本体11の2個の丸孔12.13を連結して長孔
14にした例である。第2図(B)は、丸孔12と長孔
15を連結して一体孔16にした例である。
Such an example is shown in FIG. FIG. 2(A) shows an example in which two round holes 12 and 13 of the printed circuit board body 11 are connected to form a long hole 14. FIG. 2(B) shows an example in which a round hole 12 and a long hole 15 are connected to form an integral hole 16.

第2図(C)は、プリント基板本体11の外形に隣接し
て丸孔12があり、プリント基板本体11の外形と前記
丸孔12間を連結して切欠17にした例である。
FIG. 2(C) shows an example in which a round hole 12 is adjacent to the outer shape of the printed circuit board body 11, and a notch 17 is formed by connecting the outer shape of the printed circuit board body 11 and the round hole 12.

〔発明が解決しようとする課H] ところで、このような従来のプリント基板においては、
プリン)!板本体に穿設された隣接孔間又は及びプリン
ト基板本体の外形と孔間が連結されて一体の孔になって
いるので、この連結部のため、電子部品のリードを挿入
した時、その位置が定まらない問題点があった。しかも
、孔の連結部には金属箔がないため、はんだ付は性が悪
いという問題点があった。
[Problem H to be solved by the invention] By the way, in such a conventional printed circuit board,
Pudding)! Adjacent holes drilled in the board body or the outer shape of the printed circuit board body and the hole are connected to form a single hole, so because of this connection, when the lead of the electronic component is inserted, its position There was a problem that it could not be determined. Moreover, since there is no metal foil in the connecting portions of the holes, there is a problem that soldering is poor.

本発明は斯る点に鑑みてなされたもので、電子部品のリ
ード位置が定まり、はんだ付は性の良好なプリント基板
を提供することを目的とする。
The present invention has been made in view of the above, and an object of the present invention is to provide a printed circuit board in which the lead positions of electronic components are determined and the soldering properties are good.

[課題を解決するための手段] 上述の目的を達成するために、本発明のプリント基板は
、プリント基板本体と、該プリント基板本体に穿設され
た第1及び第2の孔と、該第1及び第2の孔間を連結す
るスリットとから成り、該スリットの幅を0.5 mm
以上で前記第1及び第2の孔の短径よりも小さく設定す
る。
[Means for Solving the Problem] In order to achieve the above-mentioned object, the printed circuit board of the present invention includes a printed circuit board body, first and second holes bored in the printed circuit board body, and a first and second hole formed in the printed circuit board body. a slit connecting the first and second holes, and the width of the slit is 0.5 mm.
In the above manner, the width is set to be smaller than the short diameter of the first and second holes.

(作用) このようにプリント基板本体に穿設された前記第1及び
第2の孔間を連結するスリットの幅を0゜5 mm以上
で前記第1及び第2の孔の短径よりも小さく設定するこ
とにより、スリットの幅が狭いため、電子部品のリード
の位置が定まり、孔のまわりに設けた金属箔のなくなる
所が少ないので、はんだ付は性は良好である。
(Function) The width of the slit connecting the first and second holes drilled in the printed circuit board body in this way is 0.5 mm or more and smaller than the short diameter of the first and second holes. By setting the slit, the width of the slit is narrow, so the position of the lead of the electronic component is determined, and there are few places where the metal foil provided around the hole is lost, so the soldering properties are good.

〔実施例〕〔Example〕

以下、図面を参照しながら本発明のプリント基板の実施
例を説明する。第1図(A)に示すように、本発明のプ
リント基板は、プリント基板本体1と、該プリント基板
本体lに穿設された第1及び第2の孔2.3と、該第1
及び第2の孔2.3を連結するスリット4から成る。前
記第1の孔2の方が第2の孔3よりもその短径が小さい
。ここで短径としたのは、孔が真円であるとはかぎらな
いからである。前記スリット4の幅aは、0.5 mm
以上あり、前記小さい方の第1の孔2の短径よりも小さ
く設定する。
Embodiments of the printed circuit board of the present invention will be described below with reference to the drawings. As shown in FIG. 1(A), the printed circuit board of the present invention includes a printed circuit board main body 1, first and second holes 2.3 bored in the printed circuit board main body l, and the first and second holes 2.3.
and a slit 4 connecting the second hole 2.3. The short axis of the first hole 2 is smaller than that of the second hole 3. The short diameter is used here because the hole is not necessarily a perfect circle. The width a of the slit 4 is 0.5 mm
The diameter is set to be smaller than the short diameter of the first hole 2, which is the smaller one.

前記スリット4の幅aを0.5mm以上としたのは、金
型のダイか陥没したり、パンチが折れたりしない金型強
度が維持できる最低の幅が0.5 nunだからである
。また、前記スリット4の幅aを前記第1の孔2の短径
より小さくしたことにより、スリット4の幅が狭いため
、電子部品のリードの位置が定まり、孔のまわりに設け
た金属箔のなくなる所が少ないので、はんだ付は性が良
好である。
The reason why the width a of the slit 4 is set to 0.5 mm or more is that 0.5 nun is the minimum width that can maintain the mold strength without causing the die of the mold to cave in or the punch to break. Furthermore, by making the width a of the slit 4 smaller than the short diameter of the first hole 2, the narrow width of the slit 4 allows the position of the lead of the electronic component to be determined, and the position of the lead of the electronic component is determined. Since there are few parts to be lost, the soldering properties are good.

第1図(B)は、本発明のプリント基板の第2の実施例
を示す。該プリント基板は、プリント基板本体1と、該
プリント基板本体1に穿設された第1及び第2の孔2.
3と、該第1及び第2の孔2.3を連結するスリット4
から成る。該第2の孔3は長孔で、該長孔の短径(長孔
の長手方向と直交する方向の幅)は、第1の孔2の短径
より小さい。前記スリット4の幅aは、0.5 mm以
上あり、前記第2の孔3(長孔)の短径よりも小さく設
定する。
FIG. 1(B) shows a second embodiment of the printed circuit board of the present invention. The printed circuit board includes a printed circuit board main body 1, and first and second holes 2 formed in the printed circuit board main body 1.
3, and a slit 4 connecting the first and second holes 2.3.
Consists of. The second hole 3 is a long hole, and the short axis of the long hole (the width in the direction orthogonal to the longitudinal direction of the long hole) is smaller than the short axis of the first hole 2. The width a of the slit 4 is 0.5 mm or more, and is set smaller than the breadth of the second hole 3 (elongated hole).

第1図(C)は、本発明のプリントa板の第3の実施例
を示す。該プリント基板は、プリント基板本体1と、該
プリント基板本体1に穿設された第1及び第2の孔2.
3と、該第1及び第2の孔2.3を連結するスリット4
から成る。前記第2の孔3は長孔である。前記第1の孔
2は、前記第2の孔3(長孔)の長手方向と直交する方
向に配される。前記スリット4の幅aは、0.5 mm
以上あり、前記第1の孔2の短径よりも小さく設定する
FIG. 1(C) shows a third embodiment of the printed A board of the present invention. The printed circuit board includes a printed circuit board main body 1, and first and second holes 2 formed in the printed circuit board main body 1.
3, and a slit 4 connecting the first and second holes 2.3.
Consists of. The second hole 3 is a long hole. The first hole 2 is arranged in a direction perpendicular to the longitudinal direction of the second hole 3 (long hole). The width a of the slit 4 is 0.5 mm
This is set smaller than the short diameter of the first hole 2.

第1図(D)は、本発明のプリント基板の第4の実施例
を示す。°該プリント基板は、プリント基板本体1と、
プリント基板本体1の外形に隣接して穿設された第1の
孔2と、前記プリント基板本体1の外形と前記第1の孔
2を連結するスリット4から成る。これは、前記第1の
実施例の第2の孔3の大きさを無限大にしたのに相当す
る。前記スリット4の幅aは、0.5鴫以上あり、前記
第1の孔2の短径よりも小さく設定する。
FIG. 1(D) shows a fourth embodiment of the printed circuit board of the present invention. °The printed circuit board includes a printed circuit board body 1,
It consists of a first hole 2 bored adjacent to the outer shape of the printed circuit board body 1, and a slit 4 connecting the outer shape of the printed circuit board body 1 and the first hole 2. This corresponds to making the size of the second hole 3 of the first embodiment infinite. The width a of the slit 4 is 0.5 mm or more, and is set smaller than the short diameter of the first hole 2.

〔発明の効果] 以°上の説明で明らかなように、本発明のプリント基板
は、プリント基板本体と、該プリント基板本体に穿設さ
れた第1及び第2の孔と、前記第1及び第2の孔間を連
結するスリットとから成り、該スリットの幅を0.5 
am以上で前記第1及び第2の孔の短径よりも小さく設
定することにより、スリットの幅が狭いため、電子部品
のリードの位置が定まり、孔のまわりに設けた金属箔の
なくなる所が少ないので、はんだ付は性は良好である。
[Effects of the Invention] As is clear from the above description, the printed circuit board of the present invention includes a printed circuit board body, first and second holes drilled in the printed circuit board body, and the first and second holes. slit connecting the second holes, and the width of the slit is 0.5
By setting the width of the slit to be larger than am and smaller than the short diameter of the first and second holes, the width of the slit is narrow, so the position of the lead of the electronic component is determined, and the place where the metal foil provided around the hole disappears. Since the amount is small, soldering properties are good.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明のプリント基板の実施例を示す平面図で
ある。第1図(A)は2個の丸孔の場合、第1図(B)
は丸孔と長孔の場合、第1図(C)は他の丸孔と長孔の
場合、第1図(D)はプリント基板本体の外形と丸孔の
場合を示す。第2図は従来例を示す平面図である。第2
図(A)は丸孔の場合、第2図(B)は丸孔と長孔の場
合、第2図(C)はプリント基板本体の外形と丸孔の場
合を示す。 1−・−・−・・−・・プリント基板本体2・・−・・
・・−・−・・第1の孔 3−・・・・・・・・−・−第2の孔 4−・−・−・−・−・・・スリット (A)2個のALLの場合 (B)丸孔と長孔の場合 (A)丸孔の場合 1日 (C)他の丸孔と長孔の場合 (B)丸孔と長孔の場合 (D)ブリレト基板刷本のタト形と丸孔の場合本発明の
実売例の平面図 第1図 (C)プリント基板木(木の外形と丸孔の場合従来例の
平面図 第2図
FIG. 1 is a plan view showing an embodiment of the printed circuit board of the present invention. Figure 1 (A) is for two round holes, and Figure 1 (B) is for two round holes.
shows the case of a round hole and a long hole, FIG. 1(C) shows the case of another round hole and a long hole, and FIG. 1(D) shows the outer shape of the printed circuit board body and the case of a round hole. FIG. 2 is a plan view showing a conventional example. Second
FIG. 2(A) shows the case of a round hole, FIG. 2(B) shows the case of a round hole and a long hole, and FIG. 2(C) shows the outer shape of the printed circuit board body and the case of a round hole. 1−・−・−・・−・・Printed circuit board body 2・・−・・
・・−・−・・First hole 3−・・・・・・・・・・−・−Second hole 4−・−・−・−・−・・Slit (A) 2 ALL Case (B) Case of a round hole and a long hole (A) Case of a round hole (C) Case of another round hole and a long hole (B) Case of a round hole and a long hole (D) Printed version of a Brireto board Fig. 1 (C) A plan view of a commercial example of the present invention in the case of a tatto shape and a round hole. Fig. 2 (C) A plan view of a conventional example in the case of a wood external shape and a round hole.

Claims (1)

【特許請求の範囲】 プリント基板本体と、該プリント基板本体に穿設された
第1及び第2の孔と、該第1及び第2の孔間を連結する
スリットとから成り、 該スリットの幅が0.5mm以上で前記第1及び第2の
孔の短径よりも小さいことを特徴とするプリント基板。
[Scope of Claims] Consisting of a printed circuit board body, first and second holes bored in the printed circuit board body, and a slit connecting the first and second holes, the width of the slit is is 0.5 mm or more and smaller than the short diameter of the first and second holes.
JP1027568A 1989-02-08 1989-02-08 Printed board Expired - Lifetime JP2737204B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1027568A JP2737204B2 (en) 1989-02-08 1989-02-08 Printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1027568A JP2737204B2 (en) 1989-02-08 1989-02-08 Printed board

Publications (2)

Publication Number Publication Date
JPH02208993A true JPH02208993A (en) 1990-08-20
JP2737204B2 JP2737204B2 (en) 1998-04-08

Family

ID=12224625

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1027568A Expired - Lifetime JP2737204B2 (en) 1989-02-08 1989-02-08 Printed board

Country Status (1)

Country Link
JP (1) JP2737204B2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004014034A1 (en) * 2004-03-19 2005-10-06 Endress + Hauser Gmbh + Co. Kg Printed circuit board with at least one connection hole for a lead or pin of a wired electronic component
JP2011155210A (en) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp Printed circuit board

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493765U (en) * 1977-12-16 1979-07-03
JPS5936273U (en) * 1982-08-31 1984-03-07 日本メクトロン株式会社 Structure of lead wire fixing part of flexible circuit board with reinforcing plate

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5493765U (en) * 1977-12-16 1979-07-03
JPS5936273U (en) * 1982-08-31 1984-03-07 日本メクトロン株式会社 Structure of lead wire fixing part of flexible circuit board with reinforcing plate

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102004014034A1 (en) * 2004-03-19 2005-10-06 Endress + Hauser Gmbh + Co. Kg Printed circuit board with at least one connection hole for a lead or pin of a wired electronic component
JP2011155210A (en) * 2010-01-28 2011-08-11 Mitsubishi Electric Corp Printed circuit board

Also Published As

Publication number Publication date
JP2737204B2 (en) 1998-04-08

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