JPH0428468U - - Google Patents
Info
- Publication number
- JPH0428468U JPH0428468U JP6844490U JP6844490U JPH0428468U JP H0428468 U JPH0428468 U JP H0428468U JP 6844490 U JP6844490 U JP 6844490U JP 6844490 U JP6844490 U JP 6844490U JP H0428468 U JPH0428468 U JP H0428468U
- Authority
- JP
- Japan
- Prior art keywords
- board
- sides
- hole
- double
- printed circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
Description
第１図イはこの考案の一実施例を示す縦断正面
図、第１図ロ，ハはそれぞれ第１図イに示すスル
ーホールに部品の端子を挿入したときの状態を示
す縦断正面図、平面図、第２図は従来の両面プリ
ント基板のスルーホール部分を示す縦断正面図で
ある。
１……基板、２……スルーホール、４ａ，４ｂ
……配線、５ａ，５ｂ……ランド、６……部品、
７……ハンダ、８……シルクマーク。
Fig. 1A is a longitudinal sectional front view showing an embodiment of this invention, and Fig. 1B and C are a longitudinal sectional front view and a plan view respectively showing the state when the terminal of the component is inserted into the through hole shown in Fig. 1A. FIG. 2 is a longitudinal sectional front view showing a through-hole portion of a conventional double-sided printed circuit board. 1... Board, 2... Through hole, 4a, 4b
... Wiring, 5a, 5b ... Land, 6 ... Parts,
7...Solder, 8...Silk mark.
Claims (1)
基板において、前記基板を貫通し部品の端子を挿
入するスルーホールであつてその内壁にメツキ加
工がされないスルーホールと、前記基板の両面に
おける前記スルーホールの両側の開口部周囲のそ
れぞれに設けられた１対のランドとを備えている
ことを特徴とする両面プリント基板。 ２ 部品をハンダ付けしたランドの近傍にハンダ
付け確認用のマークを設けた請求項１記載の両面
プリント基板。[Claims for Utility Model Registration] 1. In a double-sided printed circuit board in which wiring is printed on both sides of the board, a through-hole that penetrates the board and into which a component terminal is inserted and whose inner wall is not plated; and a pair of lands provided around openings on both sides of the through hole on both sides of the board. 2. The double-sided printed circuit board according to claim 1, further comprising a mark for confirming soldering in the vicinity of the land to which the component is soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6844490U JPH0428468U (en) | 1990-06-29 | 1990-06-29 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6844490U JPH0428468U (en) | 1990-06-29 | 1990-06-29 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0428468U true JPH0428468U (en) | 1992-03-06 |
Family
ID=31602895
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6844490U Pending JPH0428468U (en) | 1990-06-29 | 1990-06-29 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0428468U (en) |
-
1990
- 1990-06-29 JP JP6844490U patent/JPH0428468U/ja active Pending