JPH02198148A - Semiconductor device and manufacture thereof - Google Patents

Semiconductor device and manufacture thereof

Info

Publication number
JPH02198148A
JPH02198148A JP1614989A JP1614989A JPH02198148A JP H02198148 A JPH02198148 A JP H02198148A JP 1614989 A JP1614989 A JP 1614989A JP 1614989 A JP1614989 A JP 1614989A JP H02198148 A JPH02198148 A JP H02198148A
Authority
JP
Grant status
Application
Patent type
Prior art keywords
connector
formed
mounting
semiconductor
semiconductor chip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1614989A
Other versions
JP2695893B2 (en )
Inventor
Michiharu Honda
Aizo Kaneda
Toshio Kanno
Takeshi Komaru
Koji Nagaoka
Atsushi Nakamura
Kunihiko Nishi
Masaru Sakaguchi
Koji Serizawa
Michio Tanimoto
Seiichiro Tsukui
Yoshiaki Wakashima
Masayuki Watanabe
Toru Yoshida
Original Assignee
Hitachi Device Eng Co Ltd
Hitachi Ltd
Hitachi Tobu Semiconductor Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/18Printed circuits structurally associated with non-printed electric components
    • H05K1/181Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components

Abstract

PURPOSE: To obtain a semiconductor device with a higher mounting density by a method wherein a connector on which a wiring pattern is formed is provided at the position of an outer lead formed by a tape automated bonding(TAB) method and a plurality of semiconductor chips are piled.
CONSTITUTION: The connector 9a of a semiconductor chip 15a with a connector on a lowest stage is formed on a substrate 20 made of glass epoxy and having a rear pattern 11a and electrically connected to a wiring pattern 19 formed by Cu-Sn plating or the like with solder through a third connection layer 18. A semiconductor chip 15 with a connector on a second lowest stage is electrically connected to the semiconductor chip 15a with the connector with solder or the like through a second connection layer 14b. By piling and mounting a plurality of film-carriered semiconductor chips like this, a memory capacity which is a result of multiplying the capacity of each chip by the number of chips can be easily obtained with the conventional mounting area. With this constitution, a high density mounting type package can be obtained.
COPYRIGHT: (C)1990,JPO&Japio
JP1614989A 1989-01-27 1989-01-27 Semiconductor device and manufacturing method thereof Expired - Fee Related JP2695893B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1614989A JP2695893B2 (en) 1989-01-27 1989-01-27 Semiconductor device and manufacturing method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1614989A JP2695893B2 (en) 1989-01-27 1989-01-27 Semiconductor device and manufacturing method thereof

Publications (2)

Publication Number Publication Date
JPH02198148A true true JPH02198148A (en) 1990-08-06
JP2695893B2 JP2695893B2 (en) 1998-01-14

Family

ID=11908449

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1614989A Expired - Fee Related JP2695893B2 (en) 1989-01-27 1989-01-27 Semiconductor device and manufacturing method thereof

Country Status (1)

Country Link
JP (1) JP2695893B2 (en)

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5394010A (en) * 1991-03-13 1995-02-28 Kabushiki Kaisha Toshiba Semiconductor assembly having laminated semiconductor devices
WO1998025305A1 (en) * 1996-12-04 1998-06-11 Hitachi, Ltd. Method for manufacturing semiconductor device
WO1998025304A1 (en) * 1996-12-04 1998-06-11 Hitachi, Ltd. Semiconductor device
US6297074B1 (en) * 1990-07-11 2001-10-02 Hitachi, Ltd. Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
US6492719B2 (en) 1999-07-30 2002-12-10 Hitachi, Ltd. Semiconductor device
US6555399B1 (en) * 1991-03-26 2003-04-29 Micron Technology, Inc. Double-packaged multichip semiconductor module
JP2007214583A (en) * 1999-07-22 2007-08-23 Seiko Epson Corp Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US7321165B2 (en) 2003-08-28 2008-01-22 Elpida Memory, Inc. Semiconductor device and its manufacturing method
US10014248B2 (en) 2014-06-27 2018-07-03 Sony Corporation Semiconductor device with less positional deviation between aperture and solder

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2015198838A1 (en) * 2014-06-27 2015-12-30 ソニー株式会社 Semiconductor device and manufacturing method therefor
JPWO2015198837A1 (en) * 2014-06-27 2017-04-20 ソニー株式会社 Semiconductor device and manufacturing method thereof

Cited By (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6297074B1 (en) * 1990-07-11 2001-10-02 Hitachi, Ltd. Film carrier tape and laminated multi-chip semiconductor device incorporating the same and method thereof
US5394010A (en) * 1991-03-13 1995-02-28 Kabushiki Kaisha Toshiba Semiconductor assembly having laminated semiconductor devices
US7259450B2 (en) 1991-03-26 2007-08-21 Micron Technology, Inc. Double-packaged multi-chip semiconductor module
US6555399B1 (en) * 1991-03-26 2003-04-29 Micron Technology, Inc. Double-packaged multichip semiconductor module
WO1998025305A1 (en) * 1996-12-04 1998-06-11 Hitachi, Ltd. Method for manufacturing semiconductor device
US6335565B1 (en) 1996-12-04 2002-01-01 Hitachi, Ltd. Semiconductor device
US6611012B2 (en) 1996-12-04 2003-08-26 Hitachi, Ltd. Semiconductor device
WO1998025304A1 (en) * 1996-12-04 1998-06-11 Hitachi, Ltd. Semiconductor device
US7138722B2 (en) 1996-12-04 2006-11-21 Renesas Technology Corp. Semiconductor device
JP4562006B2 (en) * 1999-07-22 2010-10-13 セイコーエプソン株式会社 Semiconductor device and manufacturing method thereof, the circuit board and electronic equipment
JP2007214583A (en) * 1999-07-22 2007-08-23 Seiko Epson Corp Semiconductor device, method of manufacture thereof, circuit board, and electronic device
US6630731B2 (en) 1999-07-30 2003-10-07 Hitachi, Ltd. Semiconductor device
US6900074B2 (en) 1999-07-30 2005-05-31 Renesas Technology Corp. Method of manufacturing a semiconductor device having plural semiconductor chips, wherein electrodes of the semiconductor chips are electrically connected together via wiring substrates of the semiconductor chips
US6492719B2 (en) 1999-07-30 2002-12-10 Hitachi, Ltd. Semiconductor device
US7321165B2 (en) 2003-08-28 2008-01-22 Elpida Memory, Inc. Semiconductor device and its manufacturing method
US10014248B2 (en) 2014-06-27 2018-07-03 Sony Corporation Semiconductor device with less positional deviation between aperture and solder

Also Published As

Publication number Publication date Type
JP2695893B2 (en) 1998-01-14 grant

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