JPH02198121A - Manufacture of film capacitor - Google Patents

Abstract

PURPOSE:To ensure good electrical connection of an electric layer to an edge face electrode by cutting the lamination of the electrode layer and a dielectric film with a saw-shaped cutter in the position of an electrode lead-out edge face to increase unevenness of the electrode lead-out edge face more than before. CONSTITUTION:Between the layers of a lamination part 13b consisting of an electrode layer and a dielectric film, gaps 13c are uniformly generated being partially up and down spread extending the whole layers by being scratched with a rotary saw cutter 12. Next, a lamination 13 is made to contact with oxygen gas plasma by a hydrogen plasma treatment device to chemically and selectively remove the part of an electrode lead-out edge face 13a of the dielectric film. Later, zinc is sprayed on the electrode lead-out edge faces 13a on both sides by a metal spraying method to arrange edge face electrodes. Accordingly, interlayers of electrode layers and dielectric films come to a state of being vertically and at random spread so that gas invades also the vertically spread interlayers to partially generate a difference in a removal amount of dielectric films and form unevenness on the electrode lead-out edge faces. Thereby, good electrical connection and sufficient adhesive strength of the electrode layers and the edge face electrodes can be ensured.

Description

DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method of manufacturing a film capacitor used in electrical equipment and electronic equipment.

Conventional technology In recent years, electronic components have become smaller, lighter, higher-performance, and
There is a demand for lower prices, and film capacitors are being actively developed to be smaller and have higher performance.

An example of a conventional film capacitor manufacturing method will be described below.

FIG. 6 is a ms sectional view of a conventional film capacitor. As shown in FIG. 6, each of the laminated single-sided metallized films 1 has an electrode 1b made of a metal thin film formed on one side (upper surface) of the dielectric film 1a. Each single-sided metallized film 1 has a narrow groove-shaped non-metalized part 2 formed along the edge at opposite ends of the stack, and the end on the side where the non-metalized part 2 is formed. The sides of the upper and lower single-sided metallized films 1 are alternately shifted and laminated so that they are positioned inward from the edge sides, and further, end electrodes 3 are formed by metal spraying on both end faces on which the non-metalized portions 2 are formed. A film gap 4 is formed at a location of the single-sided metallized film 1 stacked with the end sides shifted inward.

Conventionally, when drawing out the electrode from the electrode 1b made of a metal thin film to the end electrode 3, one side was used to form the film gap 4 as described above on the end face on which the end electrode was to be formed (hereinafter referred to as the electrode drawing end face). The metallized film 1 is wound in a state in which the metallized film 1 is alternately shifted by, for example, a minimum of about 0.2 degrees in the width direction so that the non-metalized portion 2 side is on the inside.

By forming the film gap 4 in this way and exposing the upper surface of the single-sided metallized film 1 below that part, the end electrode 3 formed by metal spraying or the like and the upper surface of the single-sided metalized film 1 are exposed. A good electrical connection with the electrode i1b and sufficient adhesion strength of the end electrode 3 were obtained.

However, such a method requires high precision in winding the single-sided metallized film 1, and when the film width is narrowed or the film thickness is thinned to increase capacity, the film may meander. If the winding accuracy is low, good electrical connection may not be obtained. Furthermore, in order to form staggered stacked layers, each individual capacitor must be individually wound, resulting in a problem of low productivity.

In addition, in order to improve productivity, there is a manufacturing method (hereinafter referred to as the wide winding method) in which a wide metallized film having multiple capacitor elements is wound and then cut into unit capacitors. Since the film is cut into capacitors, in order to form the film gap 4, there is a method of forming a dielectric layer with a constant width on at least one side of the metallized film, or a method of forming a dielectric layer with a constant width on at least one side of the metallized film, or a method of forming a dielectric layer in the film thickness direction at the position that will become the electrode extraction end surface of the unit capacitor. unevenness (hereinafter referred to as emboss)
A method has been developed in which a hole is provided in the metallized film at a position that will become the electrode lead-out end surface so that a hole is formed in the shape of a notch when cut.

However, in the above structure, when the thickness of the single-sided metallized film 1 or the dielectric film 1a becomes thinner, the portion that should become the film gap 4 formed before winding becomes
There was a problem in that it was crushed due to cutting, which prevented electrical connection between the end electrode 3 and the @pole 1b of the single-sided metallized film 1.

As a method to solve such problems, after cutting a laminate or a wound product of the dielectric film 1a made of an organic material and the electrode 1b at the electrode lead end surface position, the dielectric film 1b made of the organic material and the electrode 1b are cut. The dielectric film 1 is brought into contact with a gas containing at least a reactive component.
A method has been proposed in which the pole 3 is formed on the end surface after selectively chemically removing a portion of the electrode lead end surface of b. In this method, t[+dielectric film 1a near the drawer end face
Only the electrode 1b is selectively removed. Since the adjacent dielectric films 1a exposed on the 4-pole lead-out end face are slightly misaligned and unevenness is formed on the electrode lead-out end face, the electrode 1b between the end face electrode 3 and the dielectric film 1a
A good electrical connection can be obtained with the

Problem to be Solved by the Invention However, in the above method, the size of the unevenness formed on the electrode lead-out end face is caused only by accidental variations in the speed at which the dielectric film 1a is removed, and therefore the unevenness is Because of the small size, the adhesion strength of the end face electrode 3 was insufficient and there was a problem in that it was difficult to maintain a good electrical connection.

The present invention solves the above-mentioned problems by chemically selectively forming the electrode lead-out end surface side portion of the dielectric film in a laminate or a wound product in which dielectric films made of organic materials and electrodes are alternately stacked. To efficiently manufacture a laminated or wound type film capacitor that can be removed and have sufficient adhesion strength to maintain good electrical connection between an end face electrode and the electrode. The purpose of the present invention is to provide a method for manufacturing a film capacitor that enables the following.

Means for Solving the Problems In order to solve the above problems, the method for manufacturing a film capacitor of the present invention includes a method for manufacturing a film capacitor according to the present invention, in which a laminate or a wound product of an electrode layer and a dielectric film made of an organic material is stacked at the end face portion of the electrode drawer. After cutting with a serrated knife, and then chemically selectively removing the electrode lead end side portion of the dielectric film by contacting it with a gas containing a component that is reactive with at least the organic material of the dielectric film. It is characterized by forming a seat surface electrode.

Effect With the above configuration, the electrode lead-out end face of a laminate or a wound product of a plurality of electrode layers and a dielectric film made of an organic material can be cut with a saw-like blade to separate the electrode layers and the dielectric film from each other. A state in which the eyebrows were randomly spread vertically was formed on the entire surface of the electrode lead-out end surface, and in this state, the gas containing at least the organic material of the dielectric film and a reactive component was brought into contact with it, thereby causing the gas to spread vertically. The dielectric film can be removed by a chemical reaction by penetrating between the layers, and the removal amount is partially different, so that unevenness is formed on the electrode lead-out end surface, which causes the electrode layer and the end electrode to be separated from each other. A good electrical connection and sufficient adhesion strength are ensured.

EXAMPLES Hereinafter, the method for manufacturing a film capacitor of the present invention will be explained based on examples.

FIG. 1 is a schematic cross-sectional view of a laminated film capacitor obtained by a method for manufacturing a film capacitor according to an embodiment of the present invention, and FIG. 2 is a schematic perspective view showing one step in the method for manufacturing the film capacitor. .

Multiple film capacitors can be obtained by winding a polyphenylene sulfide film with aluminum vapor-deposited (thickness: 300 mm) on one wide side (top surface), heat-setting it with a heat press, and then cutting it from a flat bobbin to reduce the thickness. 21 wide laminates were obtained. Next, as shown in FIG. 2, the wide lamination '! IJ11 thickness 0.2am
, a rotary saw blade 12 made of cemented carbide with a diameter of 100 mm and a number of blades of 300 is used to set the electrode drawer end face position 1 at a predetermined width.
Cut at 1a to form a plurality of narrow 8-layer products 13 having a predetermined width. As shown in FIGS. 3(a) and 3(b), the cut surface of this narrow laminate 13, that is, the electrode lead-out end surface 13a, is located between the eyebrows of the laminate portion 13b consisting of an electrode layer and a dielectric film. As the blade 12 scratched, it partially expanded upward and downward, and gaps 13c were uniformly formed over the entire layer. Furthermore, the wide lamination mentioned above! T! ! Each of the electrode layers 111 is provided with a narrow insulating part in the length direction at a position that is an end on the side of one electrode extraction end surface 13a that is opposite to each other in the upper and lower directions when the narrow laminate 13 is formed. It is set up.

Next, the narrow laminate 1 is processed using an oxygen plasma treatment device.
No. 3 was brought into contact with oxygen gas plasma to chemically and selectively remove the portion of the dielectric film at the lead-out end face 13a of the dielectric film. Thereafter, zinc was thermally sprayed onto the electrode lead-out end faces 13a on both sides by a metal spraying method to provide end face electrodes to form a parent capacitor. This parent capacitor was cut into a predetermined length to obtain a unit capacitor (film capacitor). In addition, the processing conditions by the oxygen plasma processing apparatus are an oxygen flow rate of 60S.
CCH pressure 1. o Torr, frequency 13.56MH
z, high frequency power is 400W.

The obtained unit capacitor (film capacitor) 14 has an electrode layer 13A connected to a dielectric film 1 as shown in FIG.
3B, and an insulating section 13 at one end.
C, and the narrow laminate 13 is stacked so that the upper and lower insulating parts 13C are located on opposite sides of each other,
It has a structure in which end face electrodes 15 are provided on both electrode lead-out end faces 13a, and in addition, on the electrode lead-out end faces 13a, the dielectric film 13B is partially removed between the upper and lower electrode layers 13A to form a gap 13D. and the gap 13
The sprayed metal forming the end electrode 15 entered D and was sufficiently electrically and mechanically connected and bonded to the lower electrode layer 13A.

As a comparative example, a wide laminate similar to that used in the above example was cut with a razor blade instead of the rotary saw blade in the example to form a narrow laminate. The cut surface of this narrow laminate is as shown in Fig. 4fa) and (b), and the cut surface 21a of the narrow 8! There is a large scratch 21 between the eyebrows in part 21b.
Although there were several layers of laminated portions 21b, overall, the overlapping state of the laminated portions 21b was orderly, with almost no vertical spread observed.

Next, with respect to the width measurement laminate 21 of this comparative example, the cut surface 2 was also cut by oxygen gas plasma under the same conditions as in the above example.
Chemical selective removal of the dielectric film in 1a;
Furthermore, zinc metal spraying was applied, end electrodes were arranged to form a parent capacitor, and this was cut to obtain a unit capacitor.

A charge/discharge test was conducted on each of the film capacitors obtained in the above examples and comparative examples at a voltage of 75 V DC. The results are shown in Figure 5.As is clear from the results shown in Figure 5, the film capacitor obtained in this example has better resistance to charging and discharging than the film capacitor obtained in the comparative example. It can be seen that a good electrical connection is ensured.

Note that the materials used in this example are not limited to those used in this example, and include dielectric films, electric '! f! All the materials used for ordinary film capacitors can be used for the layers and end electrodes.

In addition, gases that have components reactive with dielectric films made of organic materials are not limited to oxygen gas plasma.
If selective removal is possible, various gases and mixed gases can be used, such as plasma in which at least one of CF4, SF6, and N20 is added to a gas containing oxygen.

Effects of the Invention As described above, in the method for manufacturing a film capacitor of the present invention, a laminated product or a wound product of an electrode layer and a dielectric film is cut with a saw-like blade at the position of the electrode lead-out end surface. A gap created by partially expanding vertically between the eyebrows of the electrode lead-out end face is created uniformly on one side of the cut I, and the dielectric film is brought into contact with a gas reactive with the organic material of the dielectric film. By removing the portion of the dielectric film on the side of the electrode lead-out end face, the unevenness of the electrode lead-out end face is increased compared to the conventional method, thereby improving the electrical connection between the electrode layer and the end face electrode disposed on the electrode lead-out end face. is ensured, sufficient adhesion strength of the end electrodes is obtained, and small-sized film capacitors with excellent characteristics can be mass-produced with good efficiency.

[Brief explanation of the drawing]

FIG. 1 is a schematic cross-sectional view of a multilayer film capacitor obtained by the method for manufacturing a film capacitor according to an embodiment of the present invention, FIG. 2 is a schematic perspective view showing one step of the method for manufacturing the film capacitor, and FIG. Figures 3 (a) and 3 (b) show the electrode lead-out end face of a narrow laminate formed by the same film capacitor manufacturing method, where (a) is a schematic side view, (b) is an enlarged side view, and Figure 4 ( a) and (b) show the electrode lead-out end faces of the narrow laminate formed in the comparative example, where (a) is a schematic side view, (b) is an enlarged side view, and Fig. 5 shows the results of the present example and the comparative example. A diagram showing the charging/discharging test results of the obtained film capacitor,
FIG. 6 is a schematic sectional view showing a conventional example. DESCRIPTION OF SYMBOLS 11... Laminate, 12... Rotating saw blade (saw blade-like blade), 13A... Electrode layer, 13B... Dielectric film, 13C... Insulating part, 13D... Gap , 13a・
... Electrode drawer end face, 15... End face electrode. Agent Yoshihiro Morimoto No. 1! Figure j

Claims (1)

[Claims] 1. An electrode layer made of metal and having an insulating part at the end position and a dielectric film made of an organic material are alternately arranged.
and a multi-layer laminate or a wound product in which the ends of the electrode layer on the insulating part side are located on opposite sides of each other,
The electrode lead end face of the dielectric film is cut with a saw blade at the electrode lead end face formation position of the end portion, and then brought into contact with a gas containing a component that is reactive with at least the organic material of the dielectric film. A method for manufacturing a film capacitor, comprising forming end electrodes after chemically removing side portions.