JPH02196610A - Resin tablet for sealing and production of resin sealing material utilizing the same - Google Patents

Abstract

PURPOSE:To prevent powder from being scattered from thermosetting resin for molding a scaling material by incorporating both a tablet main body wherein powder of thermosetting resin is compressed and solidified and a coated film for coating the surface of this tablet main body. CONSTITUTION:Powder of thermosetting resin is obtained by mixing e.g. cresol novolak epoxy resin, novolak phenol resin of a thermosetting agent, silica of a filler, a fire retardant and a catalyst, etc. A tablet main body 2 is obtained by compressing and solidifying this powder of thermosetting resin and then molding the solidified material. Then a resin tablet 1 is obtained by coating the tablet main body 2 with a film 3 consisting of a contractive and expansive material such as heat resistant silicone rubber in a stretched state. In this resin tablet 1, powder of resin, etc., of the inside is unscattered so far as the rubber film 3 is unbroken. The tablet main body 2 is formed into a columnar shape e.g. having 10-20mm diameter and about 10-30mm height. The end part thereof is formed into a shape having roundness and the rubber film 3 is made contractive. Thickness of the rubber film 3 is regulated to about several mum-several tens mum.

Description

[Detailed Description of the Invention] [Summary] Regarding a resin tablet used for encapsulating a semiconductor device, etc., and a method for manufacturing a resin encapsulation body such as a resin encapsulation semiconductor device using the same, thermosetting for encapsulation molding. The purpose of this technology is to obtain resin tablets that do not allow the powder from the thermosetting resin to scatter and prevent quality deterioration of the thermosetting resin for a long period of time, as well as to obtain resin encapsulated bodies of good quality. A resin tablet used for forming a resin sealing body by molding, characterized by having a tablet body made of compressed and solidified thermosetting resin powder, and a coating film that covers the surface of the tablet body. In the manufacturing method of molding a resin sealing body by molding a resin tablet for sealing and a resin sealant by transfer molding, a resin tablet whose main body surface is coated with a coating film made by compressing and solidifying thermosetting resin powder is placed in a mold for transfer molding. a supply step of supplying the resin tablet to a pot, an exposing step of breaking the coating film of the resin tablet in the pot to expose the surface of the tablet body, pressing the resin tablet with the broken coating film with a plunger, causing the thermosetting resin of the tablet body to flow into the resin encapsulant molding part of the transfer molding die;
a molding process of curing by heating and molding a resin sealing body;
It is configured to have the following.

[Industrial application field]

TECHNICAL FIELD The present invention relates to a resin tablet used for encapsulating a semiconductor device, and a method of manufacturing a resin-sealed body such as a resin-sealed semiconductor device using the same.

In the manufacture of resin-sealed semiconductor devices, so-called plastic-packaged semiconductor devices, resin encapsulation is performed by transfer molding using resin tablets obtained by compressing and solidifying molding resin powder as a supply material.

[Conventional technology]

In the above-mentioned transfer molding, the pot of the mold serves as the supply part for the molding material, and the molding resin is injected from there into the resin channel of the mold by the pressure of the plunger inserted into the pot. , the feed material is in tablet form suitable for feeding into the pot.

In conventional molding, a resin tablet in which the resin is exposed is used as a supply material by simply compressing and solidifying powder of a thermosetting resin for molding.

Therefore, when this resin tablet comes in contact with an object, powder such as resin is easily released and scattered from the surface.

[Problem to be solved by the invention]

Therefore, if this resin tablet is used, the powder will scatter during handling until it is supplied to the mold pot, and it will stick everywhere and contaminate the transfer molding equipment. The powder also adheres to electrical contacts and optical sensors, causing problems such as malfunctions due to contact failure and erroneous recognition.Furthermore, after curing has progressed, the powder re-adheres to new resin tablets and can cause problems during molding. It penetrates into the injected resin and causes problems that reduce molding quality.

Therefore, even if it is attempted to implement dustproof measures for the transfer molding process, it is extremely difficult to do so as long as the above-mentioned conventional resin tablets are used.

In addition, resin tablets are made by pressure molding a resin that is a mixture of a base cresol novolac epoxy resin, etc., a thermosetting agent phenol novolac resin, a filler silica, a flame retardant, a catalyst, and other additives. be. This resin tablet will change in quality due to moisture absorption (change in the flow characteristics of the resin), compared to the one immediately after opening and taking out the sealed container, and the one after 4 to 5 hours has passed. There are problems that reduce quality. In addition, if the sealed product is used immediately after opening and after 4 to 5 hours have passed for sealing molding, there is a problem in that the molding quality of the sealed body greatly varies.

Therefore, it is desirable to have a resin tablet that can prevent moisture absorption for a long time after opening the sealed container and can be used for a long time without changing the flow characteristics of the resin.

An object of the present invention is to provide a resin tablet in which powder from a thermosetting resin for sealing molding does not scatter.

Another object of the present invention is to provide a resin tablet that can prevent deterioration of the quality of thermosetting resin for a long time.

Still another object of the present invention is to provide a method for manufacturing a resin-sealed body that can obtain a resin-sealed body of good quality by transfer molding.

[Means to solve the problem]

The above object is a resin tablet used for molding a resin sealing body by transfer molding, which comprises a tablet body made of compressed and solidified thermosetting resin powder, and a coating film that covers the surface of the tablet body. This is achieved by the sealing resin tablet of the present invention.

In addition, the above purpose is to use a resin tablet whose surface is coated with a coating film, which is obtained by compressing and solidifying thermosetting resin powder, in a pot of a transfer mold in a manufacturing method of molding a resin sealing body by transfer molding. an exposing step of breaking the coating film of the resin tablet in the pot to expose the surface of the tablet body; pressing the resin tablet with the broken coating film with a plunger; A molding step of flowing the thermosetting resin of the tablet body into the resin molding part of the transfer mold and curing it by heating to form a resin mold. This is achieved by the manufacturing method.

In the resin tablet described above, the coating film may be made of a stretchable material and may cover the surface of the tablet body in a stretched state.

Furthermore, in the resin tablet described above, the coating film may have a portion that is easily torn.

Further, in the method for manufacturing a resin-sealed body, in the supplying step, the coating film covering the resin tablet is made of a stretchable material and covers the tablet main body in a stretched state, and In the exposing step, the coating film may be broken by a blade provided in the pot.

Furthermore, in the method for producing a resin-sealed body, in the supplying step, the coating film covering the resin tablet is made of a stretchable material and covers the tablet main body in a stretched state, and The resin tablet is supplied with the blade protruding from the opening in the pot and hidden in the opening, and in the exposing step, the blade is made to protrude from the opening and is hidden in the opening. The coating may be broken.

[For production]

Since the surface of the resin tablet of the present invention is coated with a coating film, the resin inside will not turn into powder and scatter unless the coating film is broken, making dustproof measures possible. . In addition, the coating film plays a role such as moisture proofing,
Deterioration of resin quality can be prevented for a long time. As a result, according to the manufacturing method of the present invention, sealing molding can be performed using a high-quality resin.

Furthermore, according to the manufacturing method of the present invention, the coating film can be easily broken in the pot, and the broken coating film can be allowed to flow into the resin channel of the mold, and the coating film can be used to flow the resin. It is also possible to perform resin sealing molding by transfer molding using a high quality resin without blocking the passages.

〔Example〕

FIG. 1 shows a resin tablet according to an embodiment of the present invention. The resin tablet 1 is a tablet body 2 formed by compressing and solidifying thermosetting resin powder made by mixing, for example, Talesol novolac epoxy resin, thermosetting agent novolac phenol resin, filler silica, flame retardant, catalyst, etc. is coated in a stretched state with a film 3 made of a stretchable material such as heat-resistant silicone rubber.

This resin tablet 1 does not break the rubber film 3, and powder such as resin inside the tablet does not scatter.

Moreover, since the rubber film 3 is non-dust-producing, no dust is generated from the surface of the resin tablet 1 even if it comes into contact with an object. Therefore, by using this resin tablet 1 as a supply material for resin sealing, dustproof measures can be taken.

The rubber film 3 is formed at a temperature of the molding die during molding (for example, 170″
It does not lose its elasticity even if it reaches about C), but if any part breaks, it contracts and exposes most of the surface of the tablet body 2. This fact is utilized during molding, as will be described later.

In this resin tablet 1, since the tablet body 2 is covered with the rubber film 3, changes in the resin quality of the tablet body 2 are prevented, and the tablet body 2 can be easily exposed by supplying it to a mold.

The tablet body 2 of the resin tablet 1 has a diameter of 1, for example.
The rubber film 3 is formed into a cylindrical shape with a diameter of 0 to 20 m and a height of about 10 to 30 m, with rounded edges.
makes it easy to contract. The thickness of the rubber film 3 is approximately several μm to several tens of μm.

Next, an example of a method for manufacturing the resin tablet 1 will be described using FIG. 1O. First, as shown in FIG. 10(a), insert the four rods 70 of the expansion jig into one end of the tube 43 made of silicone rubber, and use these rods to expand the rubber tube 43 as shown in FIG. 10(6). Spread and stretch one end and insert the tablet body 2 there. Figure 10 (C) is X-X in Figure 10 (℃)
FIG. Next, as shown in FIG. 10(d), the tablet body 2 is pushed into the rubber tube 43 with the push rod 71, and the tablet body 2 is held in the chuck 72 through the stretched rubber.
Fix it with. Next, after retracting the push rod 71, the width between the four rods 70 is narrowed and the four rods 70 of the expansion jig are further retracted. Figure 10(e) and the 1st O in the Y-Y cross-sectional view thereof
As shown in Figure (f), the rubber is clamped between the first clampers 73, a mixture 75 of uncured silicone rubber dissolved in a solvent such as toluene is charged, and the charged portion is clamped by the second clamper. Find it, glue it and seal it. Next, when the rubber tube 43 at this bonded portion is cut, the rubber shrinks and the first
Figure 0 (It will look like a barrel. Next, make the sealed rubber tube 43 on the other side to a predetermined length, fix the tablet main body 2 with the chuck 72 as shown in Figure 10 (C), and close the rubber tube 43. Bar 7
Spread with 0 and seal as before.

A resin tablet according to another embodiment of the present invention is shown in FIG. The resin tablet 11 of this embodiment has a tablet main body 12 covered with a film made of a stretchable material, for example, a rubber film 13, similar to the resin tablet shown in FIG. The tablet body 12 of this resin tablet 11 is formed in a shape closer to a sphere than the tablet body shown in FIG.

A resin tablet 21 according to still another embodiment of the present invention shown in FIG.
3, and a part of the dust-proof paper 23 that is to be easily torn, for example, a perforation 4, is provided at a part of the dust-proof paper 23 that should face the resin flow path of the molding die. This perforation 4 is for specifying the part where the dustproof paper 23 is torn due to the internal pressure when pressure is applied to the tablet body 22. Therefore, as long as the portion to be torn can be identified, the means for identifying the portion need not be a perforation; for example, the portion may be made thinner than other portions to make it easier to tear.

In the resin tablet 21, the dust-proof paper 23 prevents powder scattering from inside, and in combination with the non-dust-generating property of the dust-proof paper 23, the resin tablet 21 enables the above-mentioned dust-proof measures like the resin tablets 11 and 11. The heat resistance and perforations 4 of the dustproof paper 23 are utilized during molding, as will be described later.

FIG. 4 shows a resin tablet of still another example. The resin tablet 31 of this embodiment uses an aluminum book 33 instead of the dustproof paper 23 of the resin tablet 21 described above, and like the resin tablet 21, the perforation 1
4 is provided. This resin tablet 31 also contributes to the non-dusting property of the aluminum foil 33, making it possible to take dust-proof measures. Although the aluminum foil 33 makes it difficult for the resin tablet 31 to be heated by high frequency waves, it is extremely effective in moisture-proofing the tablet body 23. The heat resistance of the aluminum foil 33 and the perforations 14 are utilized during molding, as will be described later.

The material of the coating film covering the tablet body 22, 23, which is the dustproof paper 23 in FIG. 3 and the aluminum foil 33 in FIG. 4, is an appropriate heat-resistant metal foil or an appropriate heat-resistant plastic. etc. Further, the perforations may be replaced with other easily tearable parts.

Next, a method for manufacturing a resin-sealed body of the present invention will be explained.

Figures 5(a) and (b) show the resin tablet l shown in Figure 1.
This is an example using. (a) shows the state before resin injection, and (ra) shows the state after resin injection molding. In the figure, 5 is the lower mold of the molding die, 6 is the upper mold, 7 is the resin flow path called the runner, 50 is the cavity, 8 is the pot to which the resin tablet is supplied, and 9 is the resin tablet. It is a plunger that presses. A semiconductor chip 60 is placed in the cavity 50 .

The semiconductor chip 60 is bonded to a stage 63 and connected to leads 61 sandwiched between the lower mold 5 and the upper mold 6 by wires 62.

A protruding blade for piercing the rubber film 3 of the resin tablet 1 is provided at the center of the bottom surface of the bot 8 of the lower mold 5.

In the manufacturing method of this embodiment, first, the resin tablet 1 is supplied to the pot 8 as shown in FIG. 5(a).

The resin tablet 1 supplied to the pot 8 is made of rubber Y43.
covers the tablet body 2. next,
The plunger 9 is lowered to press the resin tablet 1. As a result, the rubber film 3 is torn by the blade 20 and instantly contracts so as to concentrate on the upper surface of the tablet body 2, exposing the lower and side surfaces of the tablet body 2. After that,
The plunger 9 is continuously pressed to cause the resin of the tablet body 2 to flow into the resin channel 7, and resin sealing molding is performed as shown in FIG. 5(b). Here, the resin of the tablet main body 2 is thermally cured by heating at, for example, about 170°C.

Note that the rubber film 3 remains in the pot 8 without being dispersed. If the blade 20 is sharp, add 1 resin tablet to the pot 8.
When the resin tablet 1 is supplied, the rubber membrane 3 may be torn before the resin tablet 1 is pressed by the plunger 9.

In the method of this embodiment, the rubber film 3 does not flow into the resin flow path 7, and the resin sealing molding of the semiconductor device can be performed, and no new problems regarding the resin sealing occur.

Note that it is convenient if the plunger 9 has a protrusion 90 because the rubber film contracts in the area pressed by the rubber film.

As shown in FIG. 5(C), a blade 41 may be provided on the surface of the plunger 49 that presses the resin tablet 1. This is because the behavior of the rubber film 3 is only upside down, and the rest is the same as described above. In this case, the blade is not provided on the lower mold 45.If the blade is provided on the lower mold than when it is provided on the plunger, the rubber film will be thicker (separated) from the entrance of the resin flow path, so the rubber film will not flow into the resin flow path. It is unlikely that the road will be blocked.

FIGS. 7(a) to 7(C) show a method of manufacturing a resin-sealed body according to another embodiment of the present invention. In the figure, 15 is the lower mold, 16
17 is an upper mold, 17 is a resin flow path, 18 is a pot, 19 is a plunger, and 90 is a protrusion. An opening 80 is provided in the pot 8 portion of the lower die 15, and the movable part 40 having the blade 30 provided therein is assembled in the opening 80.

First, as shown in FIG. 7(a), the resin tablet 1 is fed into the pot 18 with the movable part 40 lowered so that the tip of the blade 30 is lower than the bottom surface of the pot 18. Next, see Figure 7 (
As in b), raise the movable part 40 and apply the blade 30 to the resin tablet 1. When the plunger 19 is lowered and the resin tablet 1 is pushed, the rubber film 3 that the blade 30 is in contact with is broken by the pressure. When the plunger 19 is further lowered, sealing is performed as shown in FIG. 7(C).

In this way, when the blade 30 is lowered during the supply process of the resin tablet 1, the rubber film 3 will not be torn unless it is pressed by the plunger 19 during supply, and if it is made to soften when pressed by the plunger 19, the plunger Since the rubber film 3 contracts in the part pressed by 19, it is difficult for the rubber film 3 to block the resin flow path, which is preferable.

FIG. 6 shows an example of a method for manufacturing a resin-sealed body using the resin tablet 11 in FIG. 2, in which the tablet body 12 has a shape close to a sphere. This resin tablet 11 is used in the same manner as the resin tablet 1.

FIGS. 8(a) and 8(b) show yet another embodiment of the present invention. In the figure, 25 is the lower mold of the molding die, 26 is the upper mold, 27 is the resin flow path, 50 is the cavity, 28 is the pot into which the resin tablet is supplied, and 29 is the plunger that presses the resin tablet. be. In this example, the resin tablet 21 shown in FIG. 3 or the resin tablet 31 shown in FIG. 4 is used, and the blade 20.41 required when using the resin tablet 1.11 shown in FIGS.
does not require.

In this embodiment, first, as shown in FIG. 8(a), the pot 28
The resin tablet 21 is supplied to the machine. Easily torn parts such as perforations 4 provided in the coating film 23 covering the tablet body 22 of the resin tablet 21 supplied to the pot 28 are arranged at positions corresponding to the resin flow paths 27. Next, the plunger 29 is lowered to press the resin tablet 21 to break the perforation 6 and expose the tablet body 22. Further, the resin tablet 21 is continuously pressed by the plunger 29 to cause the resin in the tablet main body 22 to flow into the resin channel 27, and resin-to-soil molding is performed as shown in FIG. 8(b). In this Figure 8, etc.), the tablet body 2
The resin No. 2 is heated and hardened by the mold. Coating film 2
3 remains in the pot 28 without being dispersed.

In this molding, the coating film 23 such as dustproof paper does not flow into the resin flow path 27, and the semiconductor device can be sealed with resin, and no new problems regarding resin sealing occur.

Although each of the embodiments described above is for a molding die in which the plunger descends within the upper mold, the same can be applied to a molding die in which the plunger ascends within the lower mold. An example of this is shown in FIG. 9(a) and (bl).

FIG. 9(a) shows an example in which the blade 20 is provided on the upper die 36, and FIG. 9(b) shows an example in which the blade 42 is provided on the plunger 59 side.

In FIG. 9 CO>, the blade 42 is placed in a recess on the upper end surface of the plunger 59 so that the tip of the blade 42 is slightly lower than the upper end surface so that the coating film is not broken when the resin tablet 1 is supplied. After the pressing starts, the movable part 40 is moved to project the blade 42 and break the coating film.

In addition, in FIGS. 9(a) and 9(b), a mold with a blade is used, but the resin tablet 1-1 in FIGS. 3 and 4 is used.
When using 21.31, a mold without a blade is used.

[Effects of the Invention] As explained above, according to the configuration of the present invention, in the transfer molding process for resin sealing in the manufacture of resin-sealed semiconductor devices, etc., the thermosetting resin powder for molding is compressed and solidified. It is possible to prevent the generation of dust such as resin powder from the resin tablets used as the supplied material during handling thereof, and it is also possible to prevent the quality of the thermosetting resin from deteriorating over a long period of time. moreover,
According to the present invention, there is an effect that a resin molded body of good quality can be obtained.

[Brief explanation of the drawing]

Fig. 1 is a partially broken perspective view of one embodiment of the resin tablet, Fig. 2 is a partially broken perspective view of another embodiment of the resin tablet, and Fig. 3 is a partially broken perspective view of another embodiment of the resin tablet. 4 is a partially cutaway perspective view of yet another embodiment of the resin tablet; FIGS. 5(a) and 5(b) illustrate a method for manufacturing a semiconductor device according to the embodiment using the resin tablet shown in FIG. 1; FIG. FIG. 5(C) is a side sectional view showing an example using a transfer molding die different from FIGS. 5(a) and 5(b). FIG. 6 is a side cross-sectional view for explaining the method of manufacturing a semiconductor device according to the embodiment using the resin tablet shown in FIG. 2, and FIG. A side cross-sectional view showing an example of a manufacturing method using a mold, FIGS. 8(a) and Φ) are shown in FIGS. FIG. 9(a) is a side sectional view for explaining a method of manufacturing a semiconductor device of still another embodiment, FIG. 10(a)
) to (c) are diagrams for explaining an example of manufacturing the resin tablet of FIG. 1. In the figure, 1.11.21.31...resin tablet 2.12
．． 22.32... Tablet body 3.13...
・・・・・・Rubber membrane (membrane of elastic material) 23 ・
...... Dustproof paper 33 ...... 4.14 ...... 5.15.25, 35 6.16, 26, 36 7.17, 27 8.18. 28.38 9.19, 29.39 20.30.42 50 60 .・・Aluminum foil・・Perforation・・Lower mold・・Upper mold・・Resin channel・・Pot・・Plunging・・Blade・・Cavity・・Semiconductor chip pug dog (b) Figure 7 (in 2) No. 1 (b) Manufacturing method based on the large kneeling case E Side view of the exclamation of joy Figure 8 U〕 N Grand plan N

Claims (1)

[Scope of Claims] 1. A resin tablet used for molding a resin sealing body by transfer molding, comprising: a tablet body made of compressed and solidified thermosetting resin powder; and a coating that covers the surface of the tablet body. A sealing resin tablet characterized by having a film. 2. The resin tablet for sealing according to claim 1, wherein the coating film is made of a stretchable material and covers the surface of the tablet main body in a stretched state. 3. The resin tablet for sealing according to claim 1, wherein the coating film is a film having a portion that is easily torn. 4. In the manufacturing method of molding a resin sealing body by transfer molding, supplying a resin tablet whose main body surface is covered with a coating film by compressing and solidifying thermosetting resin powder into a pot of a transfer molding mold. a step of breaking the coating film of the resin tablet in the pot to expose the surface of the tablet body; pressing the resin tablet with the broken coating film with a plunger to release the heat of the tablet body; A method for manufacturing a resin-sealed body, comprising a molding step of flowing a cured resin into a resin-sealed body molding portion of the transfer mold and curing the resin by heating to form a resin-sealed body. 5. In the method for manufacturing a resin-sealed body according to claim 4, in the supplying step, the coating film covering the resin tablet is made of a stretchable material and covers the tablet body in a stretched state. A method for producing a resin-sealed body, wherein in the exposing step, the coating film is broken by a blade provided in the pot. 6. The method for manufacturing a resin-sealed body according to claim 4, wherein in the supplying step, the coating film covering the resin tablet is made of a stretchable material and covers the tablet body in a stretched state. and supplying the resin tablet with a blade that protrudes from an opening in the pot and is hidden within the opening, and in the exposing step, the blade protrudes from the opening. A method for manufacturing a resin-sealed body, characterized in that the coating film is broken by causing the coating film to break.