JPH02190299A - Electronic circuit substrate dividing device - Google Patents

Abstract

PURPOSE:To mechanically divide a first substrate in directions X and Y by providing a first securing pressing means to divide the first substrate along a division groove in the direction of an X-axis and a second securing pressing means to divide a second substrate, divided from the first substrate, along a division groove in the direction of an Y-axis. CONSTITUTION:Both end parts in the direction of an X-axis of a first substrate 12 in which division grooves are formed in the directions of an X-axis and an Y-axis are secured by a first securing means 34 based on the division groove in the direction of the X-axis. Further, an end part in the direction of the X-axis is pressed by a first press means 40, and a first substrate 12 is divided along a division groove, serving as a reference, in the direction of the X-axis to form a second substrate. The two end parts in the direction of the Y-axis of the second substrate are secured based a division groove, serving as a reference, in the direction of the Y-axis by means of a second securing means. Simultaneously, the end parts in the direction of the Y-axis of the second substrate are pressed by means of a second press means, and by exerting a rotation force, around a shaft extending in parallel of the division groove in the direction of the Y-axis serving as a reference, the second substrate is divided along the division groove in the direction of the Y-axis to form a third substrate.

Description

DETAILED DESCRIPTION OF THE INVENTION [Technical Field] The present invention relates to an electronic circuit board dividing apparatus, and more particularly to a board dividing apparatus suitable for dividing a ceramic substrate on which chip components, surface-mounted elements, etc. are mounted on both sides.

[Prior art and its problems] The packaging density of hybrid ICs is becoming higher and higher due to the development and improvement of chip components and surface-mounted elements.

For example, when manufacturing a hybrid IC with the same circuit, multiple hybrid modules with the same circuit are manufactured on a relatively large ceramic substrate, and the board is divided along the substrate dividing grooves cut in advance on the substrate, and the divided modules are External leads are attached to create a completed hybrid IC.

By the way, in the past, board division was performed by humans, resulting in extremely low productivity.

[Objective] Therefore, an object of the present invention is to provide an apparatus that divides an electronic circuit board, particularly a ceramic board, not by hand but by a machine.

Another object of the present invention is to provide an automatic dividing device for electronic circuit boards, especially ceramic boards.

[Example] The present invention will be described in detail below with reference to the attached drawings.The present invention is not limited to ceramic substrates, but can be applied to any substrate that can be divided along dividing grooves.
A ceramic substrate will be explained below as an example.

FIG. 1 is a diagram illustrating the steps of an automatic ceramic substrate dividing apparatus to which the present invention is applied. In FIG. 1, a magazine 10 stores a plurality of boards (first boards) before being divided.
into the specified position on the device. As mentioned above, the ceramic substrates stored in the magazine 10 have chip components etc. already mounted thereon, and the dividing grooves are arranged in the right angle direction (X
axial and Y-axis directions). Note that the peripheral portion of the substrate 12 is an unnecessary portion. A method for taking out substrates one by one from the magazine 10 is well known.

The undivided substrate 12 supplied to the device consisting of a magazine is first divided in the X-axis direction by an X-axis divider (second substrate 14).Before dividing in the X-axis direction, The direction of the board can be changed by 90 degrees, so that the initial dividing direction can be freely selected.
Unwanted end portions are removed from the process line. The direction of the second substrate 14 divided in the X-axis direction is changed by 90 degrees by a direction changer, and the second substrate 14 is divided in the Y-axis direction by a next-stage Y-axis direction divider (third substrate 16). Also in the divider, the end portion of the second substrate is removed as an unnecessary part. Third
The board 13 is carried to the next step, where external leads are soldered to complete the hybrid IC.

In the above explanation, the board is first divided in the X-axis direction, and then the Y-axis
Although the substrate is divided in the axial direction, since the X-axis and Y-axis directions of the substrate can be determined freely, it does not specify from which side of the orthogonal dividing grooves the substrate should be divided. Although the dividing grooves are shown in , in reality, the dividing grooves are difficult to see with the naked eye.Furthermore, although the direction of the second substrate 14 is changed by 90 degrees after the X-axis division, the flow of the substrate itself after the X-axis division is 9
If the direction is changed by 0 degrees, there is no need to change the direction of the second substrate 14 itself.

Next, a substrate splitter directly related to the present invention will be explained with reference to FIG. FIG. 2 shows an X-axis splitter for obtaining a second substrate 14 from a first substrate 12. Since the Y-axis direction divider has the same configuration as the X-axis direction divider shown in FIG. 2, illustration and explanation of the Y-axis direction divider will be omitted.

The first substrate 12 supplied from the magazine 10 in FIG.
The substrate support 32 of the divider 30 is moved in the direction of the arrow 24 by a suitable substrate transport means (not shown) such as a stepping motor.
a, 32b (a portion of the support 32a is a cutout); as mentioned above, the orientation of the substrate may be changed by 90 degrees before the divider 30; 32a.

32b has a step as shown, and supports the end of the substrate 12 with this step. The X-axis and Y-axis illustrated on the top surface of the substrate 12
Thin lines in the axial direction indicate substrate dividing grooves.

In actual applications, electronic components are mounted on one or both sides of the board 12, but the electronic components and printed circuits are not shown to simplify the drawing.

Since the information on the dimensions of the ceramic substrate 12 and the positions and spacings of the dividing grooves are input in advance into the storage section of the dividing device, the substrate 12 can be moved to a desired position on the substrate supports 32a, 32b by the control device.

In order to divide the substrate 12 along the dividing groove, it is necessary to fix the substrate with a fixing means a little before the groove to be divided.
4 fixes the board. That is, the fixing means 34 presses and fixes the end portion of the substrate in the Y-axis direction to one member 32b of the supporting means using a rod-shaped pressing tool 36. Incidentally, as the fixing means 34, an appropriate means such as an electric plunger or compressed air may be used.

After the substrate is fixed with reference to the groove to be divided as described above, the substrate end pressing means 40 is lowered. The pressing means 40 applies a rotational force to the edge of the substrate around the dividing groove itself to be divided or an axis parallel to the dividing groove. For this reason, the illustrated embodiment has a flat abutment portion 42 that obliquely abuts on the edge of the substrate. A member 44 with this planar abutment 42 is exchangeably secured to a member 48 by suitable fittings 46. In addition, member 48
is lowered or raised by a suitable power source. What should be noted here is that the member 50 that receives and stops the substrate to be divided at the same time as the substrate end pressing means 40 is lowered is the pressing means 40.
It means descending while making contact with the The reason for this is to accurately receive the divided substrates and reliably send them to the next stage.

According to the inventor's experiments, very high efficiency results were obtained when the contact portion 42 was made of an elastic material such as silicone rubber or urethane rubber.

It has already been stated that the same applies to substrate division in the Y-axis direction.

As described above, the pressing means 40 applies a rotational force to the edge of the substrate around the dividing groove itself to be divided or an axis parallel to the dividing groove. Therefore, instead of using the flat abutment part 42 shown in the drawings, for example, a cylinder made of an elastic body may be used to press the edge of the substrate while rotating very slowly (or without rotating it).

[Effects] As described above, according to the present invention, board division, which until now could only be done manually, can now be done by machine, so it has the extremely remarkable effect that hybrid ICs can be automatically manufactured. Furthermore, since the abutting portion 42 of the pressing means 40 abuts the edge of the board obliquely, there are very few cases in which the mounted component becomes an obstacle and cannot be pressed.

[Brief explanation of the drawing]

FIG. 1 is a diagram illustrating a process to which the apparatus according to the present invention is applied, and FIG. 2 is a partially cutaway perspective view of a substrate divider directly related to the present invention. In the figure, 12 is a first substrate, 14 is a second substrate, 16 is a third substrate, 30 is a substrate divider, 34 is a substrate end fixing means, and 40
is a substrate edge pressing means.

Claims (2)

[Claims] (1) A first substrate with dividing grooves cut in the X-axis and Y-axis directions,
After dividing the second substrate along the dividing groove in the X-axis direction,
A device for dividing the second substrate into third substrates by dividing the second substrate along a dividing groove in the Y-axis direction, the device fixing both ends of the first substrate in the X-axis direction with reference to the dividing groove in the X-axis direction. a first fixing means that presses an end of the first substrate in the X-axis direction and applies a rotational force about an axis parallel to the dividing groove in the X-axis direction that is the reference; , a second fixing means for fixing both ends of the second substrate in the Y-axis direction with reference to the dividing groove in the Y-axis direction;
A second pressing means for pressing the end in the axial direction and applying a rotational force about an axis parallel to the dividing groove in the Y-axis direction which is the reference. Device. (2) The electronic circuit board dividing apparatus according to claim 1, wherein the pressing means has a flat contact part that obliquely contacts the end of the board, and the flat contact part is made of an elastic member.