JPH02187075A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To obtain the interchangeability of a receptacle with a device having no built-in peripheral circuit component by a method wherein a piercing hole is drilled at the center of a board and a protrusion formed on a bottom case is inserted through the piercing hole and an optical semiconductor element is mounted on the top of the protrusion. CONSTITUTION:A protrusion 11a formed on a bottom case 11 is inserted through a piercing hole 12a drilled at the center of an insulating board 12 on which peripheral circuit components 13a and 13b are mounted so as to make it protrude from the upper surface of the insulating board 12 and an optical semiconductor element 16 is mounted on the top of the protrusion 11a. With this constitution, as the optical semiconductor element 16 can be provided most closely to a window glass 18, it is not necessary to expand a mutual distance L2 between the optical semiconductor element 16 and the window glass 18 in order to avoid the interference between the window glass 18 and the peripheral circuit components 13a and 13b, so that the mutual distance L2 can be determined freely. Therefore, the optical semiconductor device can be coupled with an optical fiber without degrading a light coupling efficiency by using a receptacle for an optical semiconductor device having no built-in peripheral circuit component.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to optical semiconductor devices such as light emitting devices or light receiving devices that are optically coupled to optical fibers, and transistors, chip capacitors, chip resistors, etc. that are electrically connected thereto. The present invention relates to an optical semiconductor device having peripheral circuit components.

[Conventional technology]

FIG. 3 shows a conventionally known optical semiconductor device.

As shown in the figure, in a conventional optical semiconductor device, a chip-shaped optical semiconductor element (light emitting element or light receiving element) 1 is mounted singly on an insulating substrate 2, and this insulating substrate 2 is mounted on a metal bottom case 3. After being fixed, it is covered with a metal window cap 5 into which a window glass 4 is fitted.

The optical semiconductor device configured in this manner is optically coupled with an optical fiber and used for optical communication.

FIG. 4 shows a receptacle 6 used when optically coupling the above-described optical semiconductor device and a destination fiber.

The receptacle 6 is formed into a substantially cylindrical shape, supports one end of the optical fiber 7 at its lower end, and has a fitting recess formed at the other end into which the above-mentioned optical semiconductor device is removably fitted. ing. Inside the receptacle 6 are an optical semiconductor element (light emitting element or light receiving element) 1 of an optical semiconductor device and an optical fiber 7.
A lens 8 is provided for optically coupling the two. Then, in accordance with the focal length of this lens 8, a distance S1 between the lens 8 and the window glass 4 of the optical semiconductor device is set so that the coupling efficiency of light between the optical fiber 7 and the optical semiconductor device is maximized.
And a distance S2 between one end of the optical fiber 7 and the lens 8 is determined.

[Problem to be solved by the invention]

Incidentally, recently there has been a demand for the above-mentioned optical semiconductor device to have peripheral circuit components built therein. For example, in the case of an optical semiconductor device having a light-receiving element such as a photodiode as the optical semiconductor element 1, the peripheral circuit components include an amplifier IC and a chip capacitor that constitute an amplifier circuit for amplifying a signal extracted from the light-receiving element. , a field effect transistor (FET), a chip resistor, etc., and in the case of an optical semiconductor device having a light emitting element such as a laser diode as the optical semiconductor element 1, it constitutes a drive circuit for driving the light emitting element. It is a part.

However, as shown in FIG.
If 0a and 10b are simply mounted on the insulating substrate 2 on which the optical semiconductor element 1 is mounted, the height of the peripheral circuit components (e.g., 200 to 600 μm for an amplifier IC, 0°6 to 1 μm for a single chip capacitor) .2 mte) is larger than the height of the optical semiconductor element 1 (140 μm for a photodiode), so the window cap and peripheral circuit components 10
In order to avoid interference with a or 10b, it becomes necessary to increase the height dimension of the window cap 5. Therefore, the distance between the window glass 4 fitted into the window cap 5 and the optical semiconductor element 1 is increased. (shown in Figure 3) will be expanded to . As a result, when the optical semiconductor device shown in FIG. 5 is fitted into the fitting recess of the receptacle 6 shown in FIG. However, the window glass 4 and the optical semiconductor element 1
The gap between the two. The optical path length between the lens 8 and the optical semiconductor element 1 becomes longer due to the expansion of the optical semiconductor element 1, which causes a disadvantage that the coupling efficiency of light decreases.In order to prevent this decrease in the coupling efficiency, For this purpose, it was necessary to prepare a receptacle 6 with a shortened distance S between the lens 8 and the window glass 4 of the optical semiconductor device.

Therefore, in view of the above-mentioned circumstances, the present invention does not require a dedicated receptacle even if peripheral circuit components are built-in.
It is compatible with conventional optical semiconductor devices that do not have built-in peripheral circuit components, and even when using a receptacle for optical semiconductor devices that do not have built-in peripheral circuit components, the coupling efficiency of light with optical fibers decreases. The purpose of the present invention is to provide an optical semiconductor device that does not require any damage.

[Means to solve the problem]

In order to achieve the above object, in the optical semiconductor device according to the present invention, a through hole is formed in the center of a substrate on which peripheral circuit components are mounted, a convex portion is formed in a bottom case supporting this substrate, and the convex portion is formed in a bottom case that supports the substrate. The structure is such that the optical semiconductor element is mounted on the top of the through hole.

[Effect]

With this configuration, it is possible to place the optical semiconductor element at a higher position than the peripheral circuit components,
It becomes possible to bring the optical semiconductor element closer to the window glass.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a longitudinal sectional view of an embodiment in which the present invention is applied to an optical semiconductor device having a light receiving element, and FIG. 2 is a partial perspective view of the optical semiconductor device shown in FIG. 1.

The illustrated optical semiconductor device includes a bottom case 11, an insulating substrate 12 supported by the bottom case 11, peripheral circuit components 13a and 13b etc. mounted on the insulating substrate 12, a lead wire 15, an optical semiconductor element 16, A cap 17 with a window is provided which covers the optical semiconductor element 16 from above and is fixed to the bottom case 11.

The bottom case 11 is made of metal, and has several lead wires 15, except for a lead wire for grounding the case.
It is fixed and insulated with resin or the like. An insulating substrate 12 is fixed to the upper surface of the bottom case 11. Further, peripheral circuit components 13a are provided on the upper surface of the insulating substrate 12.
and 13b etc. are implemented. Although not shown in the drawings, a metallized pattern is formed on the upper surface of the insulating substrate 12.
It is formed by a method such as thick film printing using a screen, or thin film formation by vapor deposition or sputtering.

A through hole 12a is formed in the center of the insulating substrate 12, and a convex portion 11 is formed in the center of the bottom case 11.
For example, a is press-molded.

The convex portion 11a is inserted into the through hole 12a, and the top thereof protrudes upward from the upper surface of the insulating substrate 12, and a chip-shaped optical semiconductor element 16 such as a photodiode is mounted on the top of the convex portion 11a.
is die bonded.

Note that the upper surface of the top portion is formed flat to facilitate die bonding of the optical semiconductor element 16.

The optical semiconductor element 16 is connected to the peripheral circuit components 13a, 13b or the metallized pattern on the insulating substrate 12 by wire bonding, and the peripheral circuit components 13a, 13b or the metallized pattern on the insulating substrate 12 are connected to It is connected to the lead wire 15.

The peripheral circuit components 13a and 13b are, for example, field effect transistors and chip resistors, and are connected to each other by a metallized pattern, and are used together with other peripheral circuit components (not shown) to amplify the signal taken out from the optical semiconductor element 16. Configure the circuit.

The insulating substrate 12, peripheral circuit components 13aq 13b% optical semiconductor element 16, etc. are covered with a window cap 17, as shown in FIG. The window cap 17 is
It is a substantially cylindrical metal member, and its bottom part is fitted onto and fixed to the outer peripheral part of the bottom case 11. Cap with window 1
A window glass 18 is fitted into the top of the optical semiconductor cable 7 so as to face the top surface of the optical semiconductor cable 16 .

In the optical semiconductor device according to the present invention configured as described above, the convex portion 11a formed on the bottom case 11 is
A protruding portion 1 is inserted into a through hole 11a formed in the center of the insulating substrate 12 and protrudes from the upper surface of the insulating substrate 12.
Since the optical semiconductor element 16 is mounted on the top of 1a, the optical semiconductor element 16 can be placed closest to the window glass 18.

As a result, the window glass 18 and the peripheral circuit components 13a, 1
In order to avoid interference with 3b, it is no longer necessary to extend the mutual distance L2 between the optical semiconductor element 16 and the window glass 18,
The mutual spacing L2 can be freely determined. Therefore, L2 is shown in FIG. The receptacle for optical semiconductor devices, which does not have conventional peripheral circuit components built in, can be used to optically couple optical fibers without reducing the optical coupling efficiency.

Note that in the above embodiment, a light receiving element such as a photodiode is used as the optical semiconductor element 15;
The optical semiconductor element 15 may be a light emitting element such as a laser diode. In this case, the peripheral circuit components are components that constitute a drive circuit that drives the light emitting element.

〔Effect of the invention〕

As explained above, in the optical semiconductor device according to the present invention, a through hole is formed in the center of the board on which peripheral circuit components are mounted, a convex part is formed in the bottom case that supports this board, and this convex part is formed in the bottom case that supports the board. Since the optical semiconductor element is inserted into the through hole and mounted on the top, it is possible to place the optical semiconductor element at a higher position than the peripheral circuit components, allowing the optical semiconductor element to be placed close to the window glass. can be done.

Therefore, by incorporating peripheral circuit components whose height dimension is larger than that of the optical semiconductor element, it is possible to prevent the mutual distance between the optical semiconductor element and the window glass from increasing, and to reduce the distance between the optical semiconductor element and the window glass. It becomes possible to match that of a conventional optical semiconductor device in which peripheral circuit components are not built-in. Therefore, it is now compatible with conventional optical semiconductor devices that do not have built-in peripheral circuit components, and even if a receptacle manufactured for an optical semiconductor device that does not have built-in peripheral circuit components is used, it will not work with optical fibers. The coupling efficiency of light does not decrease.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view of an optical semiconductor device according to the present invention, FIG. 2 is a partial perspective view of the optical semiconductor device according to the present invention shown in FIG. 1, and FIG. 3 is a vertical cross-sectional view of a conventional optical semiconductor element. Figure 4 is a partial cross-sectional perspective view showing optical coupling between an optical semiconductor device and an optical fiber using a receptacle, and Figure 5 shows peripheral circuit components on the insulating substrate of the optical semiconductor device shown in Figure 3. FIG. 1.16... Optical semiconductor element, 2.12... Insulating substrate, 3.11... Bottom case, 4.18... Window glass, 5.17... Cap with window, 6...・Receptacle, 7... Optical fiber, 8... Lens, 10 a
, 10 b+13a, 13b... peripheral circuit components, 11
a...Convex portion, 12a...Through hole, 15...Lead wire. Pod) Female Example Figure 1 Sozuda J Figure 1 Role Ten Zua] Figure 3 Seven-Gear" Book $1 Receptacle Figure 4

Claims (1)

[Scope of Claims] An optical semiconductor device in which an optical fiber and the optical semiconductor element are optically coupled through a window provided in a case housing the optical semiconductor element, comprising a peripheral circuit electrically connected to the optical semiconductor element. a component, a substrate on which the peripheral circuit component is mounted and a through hole is bored in the center thereof, and a protrusion that supports the substrate and forms a lower part of the case and is inserted into the through hole. What is claimed is: 1. An optical semiconductor device, comprising: a bottom case having a bottom case, the optical semiconductor element being mounted on the top of the convex portion inserted into the through hole.