JPH02187074A - Optical semiconductor device - Google Patents

Abstract

PURPOSE:To obtain the interchangeability of a receptacle with a device having no built-in peripheral circuit component by a method wherein one of lead wires is extended to a part above the center of a board on which the peripheral circuit components are mounted and an optical semiconductor element is mounted on the upper surface of the lead wire. CONSTITUTION:One 15a of lead wires fixed to a bottom case 11 is extended to a part above the center of an insulating board 12 on which peripheral circuit components 13a and 13b are mounted and an optical semiconductor element 16 is mounted on the upper surface of the lead wire 15a. With this constitution, as the optical semiconductor element 16 can be provided most closely to a window glass 18, it is not necessary to expand a mutual distance L2 between the optical semiconductor element 16 and the window glass 18 in order to avoid the interference between the window glass 18 and the peripheral circuit components 13a and 13b, so that the mutual distance L2 can be determined freely. Therefore, the optical semiconductor device can be coupled with an optical fiber without degrading a light coupling efficiency by using a receptacle for an optical semiconductor device having no built-in peripheral circuit component.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to optical semiconductor devices such as light emitting devices or light receiving devices that are optically coupled to optical fibers, and transistors, chip capacitors, chip resistors, etc. that are electrically connected thereto. The present invention relates to an optical semiconductor device having peripheral circuit components.

[Conventional technology]

FIG. 3 shows a conventionally known optical semiconductor device.

As shown in the figure, in a conventional optical semiconductor device, a chip-shaped optical semiconductor element (light emitting element or light receiving element) 1 is mounted singly on an insulating substrate 2, and this insulating substrate 2 is mounted on a metal bottom case 3. After it is fixed, it is covered with a metal window cap into which the window glass 4 is fitted.

The optical semiconductor device configured in this manner is optically coupled with an optical fiber and used for optical communication.

FIG. 4 shows a receptacle 6 used for optically coupling the above-described optical semiconductor device and an optical fiber.

The receptacle 6 is formed into a substantially cylindrical shape, supports one end of the optical fiber 7 at its lower end, and has a fitting recess formed at the other end into which the above-mentioned optical semiconductor device is removably fitted. ing. Inside the receptacle 6 are an optical semiconductor element (light emitting element or light receiving element) 1 of an optical semiconductor device and an optical fiber 7.
A lens 8 is provided for optically coupling the two. Then, in accordance with the focal length of this lens 8, the distance S between the lens 8 and the window glass 4 of the optical semiconductor device is adjusted such that the coupling efficiency of light between the optical fiber 7 and the optical semiconductor device is maximized.
And a distance S2 between one end of the optical fiber 7 and the lens 8 is determined.

[Problem to be solved by the invention]

Incidentally, recently there has been a demand for the above-mentioned optical semiconductor device to have peripheral circuit components built therein. For example, in the case of an optical semiconductor device having a light-receiving element such as a photodiode as the optical semiconductor element 1, the peripheral circuit components include an amplifier IC and a chip capacitor that constitute an amplifier circuit for amplifying a signal extracted from the light-receiving element. , a field effect transistor (FET), a chip resistor, etc., and in the case of an optical semiconductor device having a light emitting element such as a laser diode as the optical semiconductor element 1, it constitutes a drive circuit for driving the light emitting element. It is a part.

However, as shown in FIG.
If 0a and 10b are simply mounted on the insulating substrate 2 on which the optical semiconductor element 1 is mounted, the height dimensions of the peripheral circuit components (for example, 200 to 600 μm for an amplifier IC and 0.6 to 1 μm for one chip capacitor) .2 mm) is larger than the height dimension of the optical semiconductor element 1 (140 μm for a photodiode), the window cap 5 and the peripheral circuit component 10a
Alternatively, in order to avoid interference with 10b, it becomes necessary to increase the height dimension of the window cap 5.

Therefore, the distance Lo (shown in FIG. 3) between the window glass 4 fitted into the window cap 5 and the optical semiconductor element 1 is increased. As a result, when the optical semiconductor device shown in FIG. 5 is fitted into the fitting recess of the receptacle 6 shown in FIG. 4, the distance S between the lens 8 and the window glass 4 of the optical semiconductor device does not change. However, the distance between the window glass 4 and the optical semiconductor element 1 is large. As it was expanded from Ll,
There is an inconvenience that the optical path length between the lens 8 and the optical semiconductor element 1 becomes long, and the coupling efficiency of light decreases.In order to prevent this decrease in coupling efficiency, the lens 8 is
It was necessary to prepare a receptacle 6 in which the distance S1 between the optical semiconductor device and the window glass 4 of the optical semiconductor device was shortened.

Therefore, in view of the above-mentioned circumstances, the present invention does not require a dedicated receptacle even if peripheral circuit components are built-in.
It is compatible with conventional optical semiconductor devices that do not have built-in peripheral circuit components, and even when using a receptacle for optical semiconductor devices that do not have built-in peripheral circuit components, the coupling efficiency of light with optical fibers decreases. The purpose of the present invention is to provide an optical semiconductor device that does not require any damage.

[Means to solve the problem]

In order to achieve the above-mentioned object, in the optical semiconductor device according to the present invention, the lead wires are extended to above the center of the board on which peripheral circuit components are mounted, and the upper surface of the lead wires located above the center of the board is It has a configuration in which an optical semiconductor element is mounted on the board.

[Effect]

With this configuration, it is possible to place the optical semiconductor element at a higher position than the peripheral circuit components,
It becomes possible to bring the optical semiconductor element closer to the window glass.

〔Example〕

Embodiments of the present invention will be described below with reference to FIGS. 1 and 2.

FIG. 1 is a longitudinal sectional view of an embodiment in which the present invention is applied to an optical semiconductor device having a light receiving element, and FIG. 2 is a perspective view of a bone portion of the optical semiconductor device shown in FIG. 1.

The illustrated optical semiconductor device includes a bottom case 11, an insulating substrate 12 supported by the bottom case 11, peripheral circuit components 13a and 13b mounted on the insulating substrate 12, and the bottom case 11.
1 from below to above and extending to above the center of the insulating substrate 12; an optical semiconductor element 16 mounted on the upper surface of the lead wire 15a located above the center of the insulating substrate 12; A cap 1 with a window is fixed to the bottom case 11 while covering the optical semiconductor element 16 from above.
7.

The bottom case 11 is made of metal, and includes four lead wires 15a to 15d passing through it from below to above.
However, except for the grounding lead wire of the case, it is fixed and insulated with resin or the like. An insulating substrate 12 is fixed to the upper surface of the bottom case 11. Further, on the upper surface of the insulating substrate 12, peripheral circuit components 13a and 13b, etc. are mounted. Although not shown, a metallized pattern is formed on the upper surface of the insulating substrate 12 by thick film printing using a screen, thin film formation by vapor deposition, sputtering, or the like.

Lead wires 15a to 1 fixed to the bottom case 11
One of the wires 15a is bent at the upper side of the insulating substrate 12, and extends to above the center of the insulating substrate 12.

A chip-shaped optical semiconductor cable 16 such as a photodiode is die-bonded to the upper surface of a portion of the lead wire 15a located above the center of the insulating substrate 12. Note that the upper surface of the portion of the lead wire 15a located above the center of the insulating substrate 12 is flat in order to facilitate die bonding of the optical semiconductor element 16.

The thickness of the lead wire is, for example, about 0.511I11, and the part located above the center of the insulating substrate 12 is formed by bending it and processing the top surface to be flat, so the thickness is also small. , is approximately 0.5 mm.

The optical semiconductor cable 16 is connected to the peripheral circuit components 13a, 13b or the metallized pattern on the insulating substrate 12 by wire bonding. Lead wire 15a by
~15b. Peripheral circuit components 13a and 1
3b is, for example, a field effect transistor and a chip resistor, which are interconnected by a metallized pattern,
Along with other peripheral circuit components not shown, the optical semiconductor cable 16
An amplifier circuit is configured to amplify the signal extracted from the.

The insulating substrate 12, peripheral circuit components 13a, 13bs, optical semiconductor element 16, etc. are covered with a window cap 17, as shown in FIG. The window cap 17 is
It is a substantially cylindrical metal member, and its bottom part is fitted onto and fixed to the outer peripheral part of the bottom case 11. Cap with window 1
A window glass 18 is fitted into the top of 7 so as to face the top surface of the optical semiconductor element 16 .

In the optical semiconductor device according to the present invention configured as described above, the lead wire 15a extends above the central portion of the insulating substrate 12, and the optical semiconductor element 16 is mounted on the upper surface of the lead wire 15a. can be placed closest to the window glass 18, and the window glass 18 and peripheral circuit components 13a, 1
3b, it is not necessary to extend the mutual distance L2 between the optical semiconductor element 16 and the window glass 18, and the mutual distance L2 can be determined freely.

Therefore, L2 is shown in FIG. The optical fiber can be optically coupled to the optical fiber without reducing the optical coupling efficiency using a receptacle for an optical semiconductor device that does not have conventional peripheral circuit components built-in.

Note that in the above embodiment, a light receiving element such as a photodiode is used as the optical semiconductor element 15;
The optical semiconductor element 15 may be a light emitting element such as a laser diode. In this case, the peripheral circuit components are components that constitute a drive circuit that drives the light emitting element.

Further, in the embodiment described above, the present invention is applied to an optical semiconductor device having four lead wires, but the number of lead wires is not limited to this.

〔Effect of the invention〕

As explained above, in the optical semiconductor device according to the present invention, the lead wires are extended to above the center of the board on which peripheral circuit components are mounted, and light is emitted onto the upper surface of the lead wires located above the center of the board. Since the semiconductor element is mounted, the optical semiconductor element can be placed at a higher position than peripheral circuit components, and the optical semiconductor element can be placed close to the window glass. Therefore, by incorporating peripheral circuit components whose height dimension is larger than that of the optical semiconductor element, it is possible to prevent the mutual distance between the optical semiconductor element and the window glass from increasing, and to reduce the distance between the optical semiconductor element and the window glass. It becomes possible to match that of a conventional optical semiconductor device in which peripheral circuit components are not built-in. Therefore, it is now compatible with conventional optical semiconductor devices that do not have built-in peripheral circuit components, and even if a receptacle manufactured for an optical semiconductor device that does not have built-in peripheral circuit components is used, it will not work with optical fibers. The coupling efficiency of light does not decrease.

3.11...Bottom case, 4.18...Window glass, 5.17...Cap with window, 6...Receptacle, 7...Optical fiber, 8...Lens, l Q a
110 b+13a, 13b-...peripheral circuit parts, 1
5a to 15d...Lead wires.

[Brief explanation of the drawing]

FIG. 1 is a vertical cross-sectional view of an optical semiconductor device according to the present invention, FIG. 2 is a partial perspective view of the optical semiconductor device according to the present invention shown in FIG. 1, and FIG. 3 is a vertical cross-sectional view of a conventional optical semiconductor element. Figure 4 is a partial cross-sectional perspective view showing optical coupling between an optical semiconductor device and an optical fiber using a receptacle, and Figure 5 shows peripheral circuit components on the insulating substrate of the optical semiconductor device shown in Figure 3. FIG. 1゜16...Optical semiconductor device, 2.12...Insulating substrate, Patent applicant: Sumitomo Electric Industries Co., Ltd. Representative Patent Attorney Yoshiki Hase p? i
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) Moxibustion 1st figure

Claims (1)

[Scope of Claims] An optical semiconductor device in which an optical fiber and the optical semiconductor element are optically coupled through a window provided in a case housing the optical semiconductor element, comprising a peripheral circuit electrically connected to the optical semiconductor element. a component, a board on which the peripheral circuit component is mounted, and a lead wire that penetrates into the case from the outside and extends at least partially above the center of the board, the lead wire extending above the center of the board. An optical semiconductor device characterized in that the optical semiconductor element is mounted on the upper surface of the lead wire located above.