JP2006261442A - Cap member and optical semiconductor device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a cap member and an optical semiconductor device which are capable of preventing damage to a window member. <P>SOLUTION: The cap member C1 seals an optical semiconductor device with an optical semiconductor element fixed thereto. The member C1 comprises an annular frame body 10, a transparent window member 11 arranged in a hole to blockade the hole of the frame body, and an adhesive member 12 positioned between the inner wall surface of the hole and the outer peripheral surface 11c of the window member 11 to bond the inner wall surface of the hole to the outer peripheral surface of the window member 11. The thermal expansion coefficient of the frame body 10 is larger than those of the window member 11 and the adhesive member 12. A rim between the lower side surface 11a as the inside surface of the window member 11 and the outer peripheral surface, and between the upper side surface 11b as the outside surface of the window member 11 and the outer peripheral surface is projected toward the direction of the thickness of the window member from a part with the adhesive member 12 bonded thereto on the outer peripheral surface thereof. <P>COPYRIGHT: (C)2006,JPO&NCIPI

Description

  The present invention relates to a cap member and an optical semiconductor device using the cap member.

2. Description of the Related Art As an optical semiconductor device that hermetically seals an optical semiconductor element such as a photodiode or a light emitting diode, a type in which a substrate on which the optical semiconductor element is mounted is covered with a cap member is known. As a cap member used in such an optical semiconductor device, a frame body in which a through-hole is formed, a glass transparent window material bonded to the frame body so as to close the hole, a frame body and a window material are used. What is equipped with the adhesive member made from glass to adhere | attach is known (for example, patent document 1 and 2). In the cap member described in Patent Documents 1 and 2, the adhesive member is covered with a protective film in order to prevent damage to the glass adhesive member.
JP-A-8-250616 JP 2002-76494 A

  In this type of optical semiconductor device, not only the glass adhesive member but also the glass window material is very easily damaged. This has been confirmed by the verification of the present inventors, but in particular, the window material is often damaged by the stress applied to bond the frame and the window material. The stress at the time of bonding increases as the strength of bonding between the frame and the window material increases.

  The stress acting on the window material is, for example, the stress acting when the substrate and the frame body of the optical semiconductor device are bonded, and the stress when bonding the substrate and the frame body is the optical semiconductor device. The smaller the size, the larger it becomes. That is, when the distance between the bonding portion between the substrate and the frame and the bonding portion between the frame and the window material is shortened, a larger stress acts on the window material.

  The present invention has been made in view of the above points, and an object thereof is to provide a cap member capable of preventing damage to a window member and an optical semiconductor device using such a cap member.

  The cap member according to the first aspect of the present invention is a cap member of an optical semiconductor device in which an optical semiconductor element is sealed, and is disposed inside the hole so as to close the annular frame and the hole of the frame. A transparent window material, and an adhesive member that is located between the inner wall surface of the hole and the outer peripheral surface of the window material, and bonds the window material to each other. The thermal expansion coefficient is greater, and the edge between the lower and upper side surfaces of the window material and the outer peripheral surface protrudes in the thickness direction of the window material than the portion where the adhesive member is bonded on the outer peripheral surface of the window material. It is characterized by being.

  According to the cap member of the present invention, the edge between the lower and upper side surfaces of the window material and the outer peripheral surface protrudes in the thickness direction of the window material from the portion where the adhesive member is bonded on the outer peripheral surface. Therefore, it can be set as the structure where the said edge part does not contact an adhesive member. As a result, it is possible to prevent the stress acting on the window material from the frame body via the adhesive member from being concentrated on the edge portion having a low strength in the window material, and thus it is possible to prevent damage to the window material. Become.

  In the cap member of the present invention, the edge portion on at least one of the lower surface and the upper surface of the window material is chamfered, and at least a part of the chamfered portion is bonded to the outer peripheral surface of the window material. By exposing from the portion covered by the member, the edge of the window material that has been chamfered may protrude in the thickness direction of the window material from the portion where the adhesive member adheres on the outer peripheral surface. .

  In this way, even if a part of the edge portion whose strength is increased by chamfering is in contact with the adhesive member, the entire edge portion is not covered with the adhesive member. Thus, the stress acting on the window material can be prevented from being concentrated on the edge portion that has been chamfered. Therefore, damage to the window material can be prevented.

  A cap member according to a second aspect of the present invention is a cap member that seals an optical semiconductor device to which an optical semiconductor element is fixed. The cap member is disposed inside the hole so as to close the annular frame and the hole of the frame. A transparent window material that is disposed, and an adhesive member that is positioned between the inner wall surface of the hole and the outer peripheral surface of the window material, and that has a thermal expansion coefficient of the frame body. And the lower side surface and the upper side surface of the window material are convex curved surfaces.

  According to the cap member according to the present invention, since the lower side surface and the upper side surface of the window material are convex curved surfaces, the strength of the edge portion is stronger than when the lower side surface and the upper side surface are flat surfaces. Therefore, even when the adhesive member reaches the edge of the window material and stress is applied to the edge of the window material, damage to the window material can be prevented.

  A cap member according to a third aspect of the present invention is a cap member that seals an optical semiconductor device to which an optical semiconductor element is fixed, and is disposed inside the hole so as to close the annular frame and the hole of the frame. A transparent window material that is disposed, and an adhesive member that is positioned between the inner wall surface of the hole and the outer peripheral surface of the window material, and that has a thermal expansion coefficient of the frame body. The lower surface or upper surface of the window material is a convex curved surface, and the edge between the opposite surface of the window material and the outer peripheral surface is an adhesive member on the outer peripheral surface of the window material. It protrudes in the thickness direction of the window material from the part which has adhered.

  According to the cap member according to the present invention, since the lower surface or upper surface of the window material is a convex curved surface, the strength of the edge between the convex curved surface and the outer peripheral surface is relatively strong. Moreover, since the edge part between the outer peripheral surface in the surface opposite to the convex curve of a window material protrudes in the thickness direction of a window material as above-mentioned, it becomes a structure which does not contact an adhesive member. Since the stress acting on the window material can be prevented from concentrating on the edge portion having a low strength, damage to the window material can be prevented.

  In the cap member of the present invention, the frame body has a thick frame main body portion and a thin and flange-shaped inner peripheral side protruding portion extending in an inner peripheral direction from the frame main body portion, and the inner peripheral side protruding portion. The lower surface is preferably in contact with the adhesive member. By doing in this way, the surface used as the lower side (outside of an optical semiconductor device) of an adhesion member can be protected.

  The cap member of the present invention has a thick frame main body portion and a thin and flange-shaped outer peripheral protrusion portion extending in the outer peripheral direction from the frame main body portion, and the lower surface of the outer peripheral protrusion portion is light. It is also preferable that it be an adhesive surface with the substrate for fixing the semiconductor element. By doing in this way, the stress to the outer peripheral part of the frame which acts when the optical semiconductor device is manufactured by sealing the substrate with the cap member can be concentrated on the frame main body. Therefore, since the stress transmitted from the frame to the window material is suppressed, damage to the window material can be prevented.

  In the cap member of the present invention, the frame body includes a frame body portion that holds the window material via the adhesive member, a cylindrical portion that extends from the outer peripheral portion of the frame body portion toward the substrate, and an outer periphery from the cylindrical portion. And an outer peripheral side protruding portion extending to the side, and a lower surface of the outer peripheral side protruding portion may be an adhesive surface with a substrate for fixing the optical semiconductor element. This configuration can also alleviate stress concentration and prevent damage to the window material.

  In the cap member of the present invention, it is also preferable that the window material is made of quartz glass and the adhesive member is made of refractory glass. The thermal expansion coefficient of the frame body is larger than the thermal expansion coefficient between the window material and the adhesive member, and the window material made of quartz glass is bonded to the frame body with the high melting point glass, so that the window material is firmly and closely bonded by a high temperature process. Can be attached to the frame.

  In the cap member of the present invention, it is also preferable that the window material is made of quartz glass and the frame is made of a Kovar alloy. The thermal expansion coefficient of the frame is greater than the thermal expansion coefficient between the window material and the adhesive member, and the frame made of Kovar alloy is bonded to the window material with a high melting point glass, so that the window material is firmly and closely bonded by a high temperature process. Can be attached to the frame.

  In the cap member of the present invention, it is also preferable that the frame is configured by covering a Kovar alloy with a nickel layer. Thereby, even if the constituent material of the frame is vaporized and adheres to the nickel layer in the manufacturing process, the constituent material is bonded to the nickel layer. Therefore, a change in the appearance of the frame is suppressed, and the attached constituent material of the frame is prevented from peeling off as dust.

  An optical semiconductor device of the present invention includes an optical semiconductor element, a substrate to which the optical semiconductor element is fixed, and a cap member that is bonded to the substrate and covers the optical semiconductor element. It has a characteristic configuration. The optical semiconductor device of the present invention has excellent airtightness and environmental resistance, and can prevent damage to the window material.

  According to the present invention, the frame member and the window material can be bonded firmly and tightly, and the cap member capable of preventing the window material from being damaged, and the environment resistance using the cap member is excellent. An optical semiconductor device can be provided.

  The best mode for carrying out the present invention will be described below in detail with reference to the accompanying drawings. In the description of the drawings, the same reference numerals are assigned to the same elements, and duplicate descriptions are omitted.

(First embodiment)
An optical semiconductor device and a cap member according to the first embodiment will be described with reference to a perspective view (a perspective view including a four-divided cross section) shown in FIG. 1 and a vertical cross-sectional view shown in FIG. An optical semiconductor device OS1 functioning as a light detection device includes a chip-shaped optical semiconductor element 2 that is a light detection element (photodiode or the like), a substrate 1 in which the optical semiconductor element 2 is fixed in a recessed portion in the center, A cap member C1 which is fixed to the substrate 1 so as to cover the semiconductor element 2 and forms a housing space for the optical semiconductor element 2.

  The substrate 1 is a so-called multilayer ceramic substrate, and has a container shape in which a central portion of a substantially square flat plate is recessed in two stages. The optical semiconductor element 2 is die-bonded with a brazing material 3 on the bottom surface of the recess (cavity). Bonding pads (not shown) electrically connected to terminals on the outer surface of the substrate 1 are provided on the middle step surface surrounding the bottom surface of the substrate 1, and the bonding pads are connected via Au wires 4. It is connected to an electrode (not shown) of the optical semiconductor element 2.

  The cap member C1 includes an annular frame 10 in which a circular hole is formed at the center of a substantially square flat plate, a disk-shaped transparent window member 11 disposed inside the hole so as to close the hole, a window An adhesive member 12 is provided which is interposed between the outer peripheral surface of the material 11 and the inner wall surface of the hole and adheres both. The bottom surface of the outer peripheral portion of the frame 10 is bonded to the upper surface of the convex portion (wall portion surrounding the cavity) of the outer peripheral portion of the substrate 1 via the brazing material 5.

  Hereinafter, the configuration of the cap member C1 will be described in detail with reference to the cross-sectional view of FIG. 3. In this specification, for the sake of convenience, the accommodation space side of the optical semiconductor element 2 in the optical semiconductor device OS1 is referred to as the “lower side”. The other side will be described as “upper side”.

  As for the planar shape of the frame body 10, the outer periphery is substantially square, the inner periphery of the central hole is approximately circular, and has a flange-like projecting portion on each of the inner periphery and the outer periphery. That is, the thin inner peripheral side protruding portion 10a is formed to extend over the entire circumference in the inner peripheral direction of the frame body 10 from the upper side of the inner wall surface of the frame main body portion 10b having a thick and substantially rectangular cross section. ing. Thereby, the inner wall surface of the circular hole of the frame 10 includes a lower inner wall surface 10d having a large inner diameter, an upper inner wall surface 10e having a small inner diameter, a lower side surface 11a of the window member 11 positioned between the inner wall surfaces, and It has a two-stage shape consisting of a step surface parallel to the upper side surface 11b. On the other hand, a thin outer peripheral projection 10c is formed so as to extend over the entire circumference in the outer peripheral direction from the lower side of the thick frame main body 10b toward the outer side. Thereby, the square-shaped outer peripheral wall surface of the frame 10 has a two-stage shape including the lower and upper outer wall surfaces and the stepped surface therebetween.

  The window member 11 is a quartz glass disc having a lower side surface 11a and an upper side surface 11b which are parallel to each other and an outer peripheral surface 11c perpendicular to both sides thereof, and the lower side surface 11a and the upper side surface 11b are mirror-finished. When a light detection element is used as the optical semiconductor element 2, the window material 11 functions as an incident surface plate, and when a light emitting element is used, the window material 11 functions as a light projecting surface plate. The window member 11 has the same surface position between the upper surface of the frame member 10 and the upper surface 11b of the window member 11, and between the upper inner wall surface 10e of the frame member 10 and the outer peripheral surface 11c of the window member 11. It arrange | positions inside the circular hole of the frame 10 so that it may oppose with a slight clearance gap.

  The adhesive member 12 is formed by melting after the adhesive is melted, and is formed by a lower inner wall surface 10d of the frame body 10 and an intermediate portion (a lower portion portion) of the outer peripheral surface 11c of the window member 11 opposed thereto. Between the upper portion and the lower surface of the flange-like inner protrusion 10a. In this way, the adhesive member 12 is in a recess formed by the lower inner wall surface 10d of the frame body 10, the outer peripheral surface 11c of the window member 11, and the lower surface of the inner peripheral protrusion 10a of the frame body 10. Since it is hardened so as to be filled, the inner peripheral protrusion 10a can cover and protect the upper surface (outside in the optical semiconductor device) of the adhesive member 12.

  In the above configuration, the adhesive member 12 is in contact with the window member 11 only in the middle portion of the outer peripheral surface 11c of the window member 11, and the adhesive member 12 does not reach the lower portion and the upper portion of the outer peripheral surface 11c. . That is, since the lower side surface 11a and the upper side surface 11b of the window material 11 are both positioned further below and above the lower side and upper end portion of the adhesive member 12, the lower side surface 11a of the window material 11 is used. In addition, the lower edge and the upper edge between the upper surface 11b and the outer peripheral surface 11c protrude in the thickness direction of the window member 11 from the lower and upper edges of the adhesive member 12. Become. For this reason, even when the stress in the shrinking direction from the frame body 10 is applied to the window material 11 via the adhesive member 12, no stress is directly applied to the lower edge and the upper edge of the window material 11. .

  In the first embodiment, the material for forming the adhesive member 12 is a material that has a higher coefficient of thermal expansion than the window material 11 made of, for example, quartz glass and melts at a temperature lower than the softening point of the window material 11. A melting point glass is used. Since the cap member C1 is formed using the high melting point glass as the adhesive member 12, even when the optical semiconductor device including the cap member C1 is used in a severe environment of high temperature and high humidity, the adhesive member 12 may melt. There will be no problems with moisture resistance.

  As the high melting point glass used as the constituent material of the adhesive member 12, a material having a softening point of 600 ° C. or higher is suitable, and includes, for example, borosilicate glass, silica glass, silica alumina glass, silica alumina calcium glass, and the like as a main component. It is glass. More specifically, glass obtained by adding 30 to 70% of alumina or zirconia to borosilicate glass or soda glass is applicable. In addition, the high melting point glass higher than the softening point of each constituent material of the frame body 10 and the window material 11 cannot be used in principle as the adhesive member 12 of the present invention.

  The annular frame 10 is preferably made of a Kovar alloy (Fe—Ni—Co alloy) having a thermal expansion coefficient larger than that of the window member 11 and the adhesive member 12, and by selecting a material having such a thermal expansion coefficient. In the curing process of the adhesive member 12, shrinkage stress can be generated. For this reason, since the disk-shaped window material 11 can be surrounded by the annular frame 10 from the periphery via the adhesive member 12 and the stress that shrinks as a whole can be contained, the frame 10 and the window material 11 Can be firmly and tightly bonded. In addition, since a nickel layer having a thickness of about 2 μm is formed on the upper surface of the frame body 10, appearance defects in the manufacturing process can be reduced.

  A metallized layer in which a W (tungsten) layer, a Ni (nickel) layer, and an Au (gold) layer are laminated in this order is formed on a predetermined portion of the surface of the ceramic substrate 1 such as a cavity. Bonding with the cap member C1, die bonding of the optical semiconductor element 2, bonding of a bonding pad, etc. are possible (none of them are shown). As the brazing material 3 for die-bonding the optical semiconductor element 2 to the ceramic substrate 1, an Au brazing material to which 20% of Sn is added is suitable. For bonding and bonding the ceramic substrate 1 and the cap member C1. As the brazing material 5 to be used, an Ag brazing material having a melting point of 780 ° C. is suitable.

  Next, the outline of the manufacturing process of the cap member C1 and the assembly process of the optical semiconductor device using the cap member C1 will be described specifically for the operation and effect of the cap member C1 according to the present embodiment.

  First, prepare a preform of an adhesive member 12 made of a high melting point glass formed in a ring shape, an annular frame body 10, a disk-shaped window material 11, and sandwich these with a pair of carbon jigs, It is fixed at a predetermined position (a position where the ring-shaped adhesive member 12 is sandwiched between the frame body 10 and the window member 11). Next, this is introduced into an electric furnace or the like, and heated to a temperature lower than the softening points of the frame body 10 and the window member 11 and the adhesive member 12 is melted. At this time, if the inner peripheral side protruding portion 10a of the frame 10 is set so as to face downward, the lower inner wall surface 10d of the frame 10, the outer peripheral surface 11c of the window member 11, and the frame 10 The solution of the adhesive member 12 melted by gravity can be stored in a portion surrounded by the lower surface of the inner peripheral protrusion 10a.

  Thereafter, when cooled to the softening point of the high melting point glass, the adhesive member 12 is cured, and in the process of cooling to room temperature, the frame body 10, the window material 11, and the adhesive member 12 are subjected to a thermal expansion coefficient specific to each constituent material. Shrink. At this time, the amount of contraction of the frame body 10 is larger than the amount of contraction of the window member 11 and the adhesive member 12, and therefore contracts in the direction from the frame member 10 to the window member 11 (the direction perpendicular to the thickness direction of the window member 11). Force will act.

  The cap member C1 and the substrate 1 are fixed as follows. Between the convex part of the outer periphery of the substrate 1 and the outer peripheral side protruding part 10c of the frame 10, a film-shaped brazing material 5 formed in an annular shape is arranged, and the cap member C1 and the substrate 1 are sandwiched between jigs. In the pressed state, an electron beam is irradiated from the upper side to the outer peripheral side protruding portion 10 c of the frame body 10. When an electron beam is irradiated on the outer peripheral side protruding portion 10c of the frame body 10 covered with the nickel layer, the irradiated portion of the nickel layer and the outer peripheral side protruding portion 10c is heated to a high temperature and melts to be a molten region in a liquid metal state. (Melting pool) is formed. At this time, since the outer peripheral side protruding portion 10c is thinner than the frame main body portion 10b, the heat in the melting region is easily transmitted to the Ag brazing material 5 and the Ag brazing material 5 is melted. Then, it cools to normal temperature and the board | substrate 1 and the outer peripheral side protrusion part 10c of the frame 10 are brazed and fixed.

  Further, the frame body 10 has a frame main body portion 10b between the inner peripheral side protruding portion 10a and the outer peripheral side protruding portion 10c, and the outer peripheral side protruding portion 10c is thin and the frame main body portion 10b is sufficiently thick. In addition, since the inner peripheral side protruding portion 10a and the outer peripheral side protruding portion 10c are stepped with the frame main body portion 10b interposed therebetween, the outer peripheral side protruding portion is fixed when the cap member C1 and the substrate 1 are fixed. The stress acting on the portion 10c can be concentrated on the frame main body portion 10b. Therefore, when the cap member C1 and the substrate 1 are bonded, the stress transmitted from the frame 10 to the window member 11 via the bonding member 12 is suppressed, so that the window member 11 can be prevented from being damaged.

  Further, since the frame 10 is made of a Kovar alloy in which a nickel layer is formed on the outer surface of the optical semiconductor device OS1, the constituent materials of the frame 10 are vaporized by electron beam irradiation and adhere to the nickel layer. Even so, the constituents bind to the nickel layer. Therefore, a change in the appearance of the frame body 10 can be suppressed, and the attached constituent material of the frame body 10 can be prevented from peeling off as dust. Further, since the electron beam can move faster than the conventionally used roller electrode for seam welding, the working time can be shortened.

  According to the first embodiment, in the cap member C1, the lower edge between the lower side surface 11a and the outer peripheral surface 11c of the window member 11 and the upper side between the upper side surface 11b and the outer peripheral surface 11c of the window member 11 are used. Since both of the edge portions protrude in the thickness direction of the window material 11 from the upper and lower portions to which the adhesive member 12 is bonded on the outer peripheral surface 11c of the window material 11, the edge portion and the adhesive member 12 It can be set as the structure which does not contact. As a result, the stress acting on the window material 11 from the frame body 10 through the adhesive member 12 can be prevented from being concentrated on the weak edge portions on the lower side surface 11a and the upper side surface 11b. Can prevent damage.

  The verification result of the effect by 1st Embodiment is demonstrated with reference to FIG.4 and FIG.5.

  FIG. 4A is a cross-sectional perspective view of the cap member C1 of the comparative example. The difference from the example described later is that the edge between the lower surface and the outer peripheral surface of the window member 11 constituting the cap member C1 of the comparative example is in contact with the edge of the adhesive member 12, and the lower surface of the window member 11 That is, the surface positions of the inner surface of the adhesive member 12 and the lower surface of the frame 10 are equal. FIG. 4B shows the stress distribution in the cap member C1 of the comparative example. The region 11x that receives the greatest stress overlaps the edge of the lower side of the window material (the side where the semiconductor optical device is accommodated). The region 11y that receives the next largest stress is a region including a portion in contact with the outer edge of the adhesive member 12 on the outer peripheral surface. In such a comparative cap member C1, occurrence of cracks at the edge of the window material was confirmed in 10% of the total.

  FIG. 5A is a schematic cross-sectional perspective view of the cap member C1 according to the example, and the configuration is the same as that of the first embodiment shown in FIGS. FIG.5 (b) has shown the stress distribution of the window material 11 contained in the cap member C1. The region 11x and the region 11y are regions that receive the greatest stress, and are portions that are in contact with the inner and outer edges of the adhesive member 12 on the outer peripheral surface 11c of the window material. Further, the stress acting on the region 11x and the region 11y in FIG. 5 was as large as the second largest stress in the window material 11 of the comparative example received by the region 11y in FIG. The magnitude | size of the stress which acts on the edge between the lower surface 11a and the outer peripheral surface 11c of the window material 11 in an Example is 1/10 of the stress which acts on the edge contained in the cap member C1 of a comparative example. It is reduced to about 1/100. In the cap member C1 of such an example, generation of cracks, cracks, and chips was not confirmed in all the portions as well as the edge of the window material.

  Subsequently, the first to ninth modifications of the first embodiment will be described. In each of these modifications, the lower surface 11a of the window member 11 and the edge between the upper surface 11b and the outer peripheral surface 11c are This is a modification of the type in which the outer peripheral surface 11c of the window member 11 protrudes in the thickness direction of the window member 11 from the portion where the adhesive member 12 is bonded.

  FIG. 6 is a cross-sectional view of a cap member C1 according to a first modification of the first embodiment, and is different from FIG. 3 in that an R chamfering process is performed on the edge of the window member 11 constituting the cap member C1. It has been applied. By chamfering the edge portion having low strength, the strength of the edge portion of the window material 11 itself can be increased. Therefore, the window material 11 can be prevented from being damaged and can be handled more easily in the manufacturing process. In addition, you may give not only R chamfering but C chamfering. Further, chamfering may be performed only on one side of the upper surface side or the lower surface side, and one may be chamfered while the other is chamfered.

  FIG. 7 is a schematic cross-sectional perspective view of an optical semiconductor device OS1 according to a second modification of the first embodiment, and is different from FIG. 1 in that the frame body 10b in the frame 10 constituting the cap member C1. Is not a rectangular ring but a circular ring, and thus, a convex portion having a substantially circular step is formed on the upper surface of the frame 10. If the shape of the frame main body portion 10b is used, the cost can be reduced because the frame body 10 is formed by press working. In addition, the convex shape of the upper surface of the frame main body 10b is not limited to a rectangle or a circle, but may be a shape in which the four corners of the rectangular convex portion are obliquely cut or the four corners are chamfered into a circle.

  In the second modified example shown in FIG. 7, the outer peripheral side protruding portion 10c of the frame body 10 included in the cap member C1 is substantially square, but the planar shape of the outer peripheral side protruding portion 10c is also the frame main body on the upper side surface. Similar to the convex shape of the part 10b, it may be substantially circular. If it does in this way, the frame 10 can be easily formed by press work.

  FIG. 8 is a schematic cross-sectional view of an optical semiconductor device OS1 according to a third modification of the first embodiment. The difference from FIG. 2 is that the frame 10 has a flange-like projecting portion extending outward. It is not provided, and the thickness of the outer peripheral portion is about the same as the thickest portion (frame main body portion) of the frame body 10. In other words, the frame body 10 has a thick frame main body portion 10b and an inner peripheral side protruding portion 10a extending along the entire inner periphery so as to go from the inner wall toward the hole. Does not have a flange-like protrusion.

  In this modification, a reflow method is used for fixing the frame 10 and the substrate 1. That is, the brazing material 5 is disposed between the frame 10 and the substrate 1, and the substrate 1 is heated to melt the brazing material 5. As the brazing material 5, for example, an Au brazing material having a melting point of 280 ° C. and containing 20% Sn is used. In this case, as the brazing material 3 for die-bonding the semiconductor optical device 2 to the substrate 1, for example, an Au brazing material having a melting point of 380 ° C. higher than that of the brazing material 5 and containing 3.15% Si is used. desirable.

  FIG. 9 is a cross-sectional view of a cap member C1 according to a fourth modification of the first embodiment. The difference from FIG. 3 is the flange-shaped outer peripheral side of the frame 10 constituting the cap member C1. That is, the protruding portion 10 c is formed on the upper side of the frame body 10. Therefore, the upper surface of the outer peripheral protrusion 10c has the same surface position as the upper surface of the window member 11, and the lower surface of the outer peripheral protrusion 10c that adheres to the upper surface of the substrate 1 is the upper surface of the adhesive member 12 (the inner peripheral protrusion 10a). Above the upper surface).

  FIG. 10 is a cross-sectional view of a cap member C1 according to a fifth modification of the first embodiment. The difference from FIG. 3 is that of the frame main body portion 10b of the frame body 10 constituting the cap member C1. The thickness is equal to the thickness of the window member 11. Thereby, the lower side surface and the upper side surface of the frame 10 are equal to the surface positions of the lower side surface 11a and the upper side surface 11b of the window member 11, respectively. This type of cap member C1 can be said to be close to a can type (cylindrical type) while being a flat package type.

  FIG. 11 is a cross-sectional view of a cap member C1 according to a sixth modification of the first embodiment. The difference from FIG. 3 is that the inner wall from the thick frame main body portion 10b constituting the frame body 10 is shown in FIG. It exists in the position which the peripheral side protrusion part 10a and the outer peripheral side protrusion part 10c protrude. That is, both the inner peripheral side protruding portion 10a and the outer peripheral side protruding portion 10c are thinner than the frame main body portion 10b, and the inner peripheral side protruding portion 10a protrudes in a flange shape from the intermediate portion on the outer peripheral side of the frame main body portion 10b. The outer peripheral side protruding portion 10c protrudes in a flange shape from the intermediate portion on the inner peripheral side of the frame main body portion 10b.

  The adhesive member 12 that bonds the outer peripheral surface 11c of the window member 11 and the inner wall surface of the hole of the frame body 10 includes the lower inner wall surface 10d of the frame main body portion 10b and the outer peripheral surface 11c of the window member 11 facing this. It is interposed only between the lower portion of the frame 10 and is not interposed in the gap between the front end surface 10 e of the inner projecting portion 10 a of the frame 10 and the outer peripheral surface of the window member 11. And the adhesive member 12 is not exposed in the lower part and the upper part of the outer peripheral surface 11c of the window member 11.

  By making the shape as described above, the protruding portion 10a covering the outer region of the adhesive member 12, the frame main body portion 10b for absorbing the stress, and the outer peripheral portion 10c for absorbing the stress and adhering to the substrate 1 are provided. In addition, it is possible to obtain a vertically symmetrical frame 10. Further, since the frame body is formed by pressing, the frame body 10 having such a vertically symmetrical shape can be easily processed. Moreover, the edge part between the lower surface 11a and the upper side surface 11b of the window material 11 and the outer peripheral surface 11c is in the thickness direction of the window material 11 rather than the part where the adhesive member 12 adheres on the outer peripheral surface of the window material 11. Since it protrudes, damage to the window material 11 can be prevented as described above.

  FIG. 12A is a cross-sectional view of a cap member C1 according to a seventh modification of the first embodiment, and the difference from FIG. 3 is from the thick frame main body 10b constituting the frame 10. The protruding portion of the thin outer peripheral side protruding portion 10c that protrudes in a flange shape from the frame main body portion 10b to the outer peripheral direction is not formed on the outer peripheral side of the frame main body portion 10b. It is a point that consists of parts. The window material 11 has the same thickness as the frame body 10, and the lower side surface 11 a and the upper side surface 11 b of the window material 11 are equal to the surface positions of the lower surface and the upper surface of the frame body 11, respectively. The adhesive member 12 that bonds the outer peripheral surface 11 c of the window material 11 and the inner wall surface of the hole does not reach the edge of the window material 11. Also in this modified example, the lower and upper edges of the window material 11 protrude in the thickness direction of the window material 11 rather than the portion where the adhesive member 12 is bonded to the outer peripheral surface 11c. Damage to the material 11 can be prevented.

  FIG. 12B is a cross-sectional view of the cap member C1 according to the eighth modification of the first embodiment. The difference from FIG. 12A is that the window material 11 is first a frame body. 10 is thicker than the frame main body portion 10b, and secondly, an adhesive member only between the entire inner wall surface of the frame main body portion 10b of the frame body 10 and the intermediate portion of the outer peripheral surface of the window member 11 facing this. Is intervening. For this reason, the adhesive member 12 does not reach the edge of the window material 11. Also in this modified example, the inner and outer edges of the window member 11 protrude in the thickness direction of the window member 11 from the portion where the adhesive member 12 is bonded to the outer peripheral surface 11c. 11 damage can be prevented.

  FIG. 13 is a cross-sectional view of a cap member C1 according to a ninth modification of the first embodiment. The difference from FIG. 12A is that first, the edge of the window member 11 is chamfered. Secondly, the adhesive member 12 reaches the intermediate position of the chamfered portion.

  Since the frame 10 has no protrusion on the inner wall surface of the hole, the contact area between the window member 11 and the adhesive member 12 is further increased. The lower side surface 11a and the upper side surface 11b of the window member 11 are equal to the surface positions of the lower surface and the upper surface of the frame body 10, respectively, and protrude in the thickness direction of the window member 11 from the lower side surface and the upper side surface of the adhesive member 12, respectively.

  Since a part of the chamfered portion of the window material 11 protrudes in the thickness direction of the window material 11 rather than a portion where the adhesive member 12 is bonded on the outer peripheral surface 11c, the lower side of the window material 11 and The upper edge protrudes in the thickness direction of the window member 11 from the portion where the adhesive member 12 is bonded to the outer peripheral surface 11c.

  Thus, even if a part of the edge portion whose strength is enhanced by chamfering is in contact with the adhesive member 12, the entire edge portion is not covered with the adhesive member 12. Therefore, the stress acting on the window material 11 can be prevented from concentrating on the chamfered edge portion, so that the window material 11 can be prevented from being damaged.

  FIG. 20 is a cross-sectional view of a cap member C1 according to a tenth modification of the first embodiment. The difference from FIG. 3 is that C is formed on the lower edge of the window member 11 constituting the cap member C1. It is that chamfering is performed. In the window member 11, when a sufficient amount of protrusion cannot be secured as the lower protrusion, the high melting point glass melted when the high melting point glass is melted scoops along the outer peripheral surface of the window member 11 to the lower edge. It can happen that it goes up. As a result, the window material 11 is damaged. Therefore, by applying C chamfering to the lower edge, even when the high melting point glass is melted, the creeping of the high melting point glass can be stopped up to the edge between the C chamfering and the outer peripheral surface. Therefore, stress is not concentrated on the edge of the window material, and damage to the window material can be prevented. Furthermore, the strength of the edge of the window member 11 itself can be increased by chamfering the weak edge. Therefore, the window material 11 can be prevented from being damaged and can be handled more easily in the manufacturing process.

(Second Embodiment)
In the second embodiment, the lower and upper side surfaces of the window material protrude in the thickness direction in that the lower and upper surfaces of the window material are convex curved surfaces. This is different from the first embodiment of the type. In addition, if the curvature radius of the convex curved surface of the lower surface and the upper surface of the window material becomes relatively small at the edge, it is equivalent to “the edge protrudes”, so the first and second embodiments. Are not technical concepts that exclude each other, and it is natural that the cap member of one example can be a subordinate concept of both the first and second embodiments.

  FIG. 14 is a cross-sectional view of the cap member C2 according to the second embodiment. The difference from FIG. 13A is the shape of the window member 11 constituting the cap member C2 and the bonding state of the adhesive member 12. is there. The window material 11 has a convex curved surface on both the lower side surface and the upper side surface, and its radius of curvature is very large at the central portion, gradually decreases as it approaches the outer periphery, and is smallest before the outer peripheral surface. The adhesive member 12 is bonded on the entire outer peripheral surface of the window member 11, and the thickness of the window member 11 on the outer peripheral surface (the vertical width of the outer peripheral surface) and the thickness of the frame main body portion 10 b of the frame body 10. That is almost the same.

  Thus, since the lower side surface and upper side surface of the window material 11 are convex curved surfaces, the strength of the edge of the window material 11 is stronger than when the lower side surface and the upper side surface are flat surfaces. Therefore, even if the edge part of the outer peripheral surface of the window material 11 and the edge part of the adhesive member 12 are in contact, stress concentration can be suppressed and damage to the window material 11 can be prevented.

  In particular, in the present embodiment, the curvature of the convex curved surface of the window material 11 is reduced as it approaches the outer peripheral surface, so that the effect of preventing damage is excellent, and the curvature at the central portion of the convex curved surface of the window material 11 is improved. Since the radius is sufficiently large, the lens effect does not work carelessly. Of course, positively utilizing the lens effect is optional, and there are many applications where it is preferable.

  FIG. 15 is a cross-sectional view of a cap member C2 according to a modification of the second embodiment. The difference from FIG. 14 is the maximum thickness of the window member 11 constituting the cap member C2 (the thickness of the central portion). ) Is substantially the same as the thickness of the thickest frame main body 30b in the frame 10. The adhesive member 12 is in contact with the entire outer peripheral surface of the window member 11, while the frame main body portion 10 b of the frame body 10 is in contact only with an intermediate portion of the inner wall surface. This modified example is also highly effective in preventing damage to the window material as in FIG.

(Third embodiment)
FIG. 16 is a cross-sectional view of the cap member C3 according to the third embodiment. The difference from FIG. 15 is the shape of the window member 11 constituting the cap member C3 and the bonding state of the adhesive member 12. The window material 11 has a substantially disk shape, the lower side surface is a flat surface, and the upper side surface is a convex curved surface. The adhesive member 12 is bonded to the inner wall surface of the frame 10 and the outer peripheral surface of the window member 11, and the lower end of the adhesive member 12 does not reach the lower edge of the window member 11, The lower part of the surface is exposed. On the other hand, the upper end of the adhesive member 12 reaches the upper edge of the window member 11, and the upper portion of the outer peripheral surface is covered with the adhesive member 12.

  The upper edge of the window member 11 has a stronger strength than the lower edge of the window member 11 because the upper side surface is a convex curved surface. Since the lower edge portion of the window material 11 protrudes in the thickness direction of the window material 11 rather than the portion where the adhesive member 12 is bonded on the outer peripheral surface, the edge portion of the window material 11 via the adhesive member 12 The stress acting on can be reduced. Therefore, damage to the window material 11 can be prevented as described above.

  In the third embodiment, the lower surface 11a of the window member 11 is a flat surface and protrudes at the edge, and the upper surface 11b is a convex curved surface, so to speak, the first embodiment and the second embodiment. It is a composite type. Accordingly, which of the lower side surface 11a and the upper side surface 11b of the window material 11 is curved is appropriately selected, and the edge of the window material 11 on the plane side (lower side) may be chamfered. Is possible.

(Fourth embodiment)
In the first to third embodiments, the schematic shape of the frame body is a flat plate shape or a shape similar to a flat plate, but in this embodiment, the frame body is cylindrical. That is, the frame constituting the cap member includes a frame portion that holds the window material via the adhesive member, and a cylindrical portion that extends in the direction of the substrate for fixing the optical semiconductor element from the outer peripheral portion of the frame portion. And an outer peripheral side protruding portion extending from the cylindrical portion to the outer peripheral side, and a lower surface of the outer peripheral side protruding portion is an adhesive surface with the substrate for fixing the optical semiconductor element. . The cap member including the cylindrical frame is applied to a can type optical semiconductor device instead of a so-called flat package type.

  FIG. 17 is a perspective view of a cap member C4 according to the fourth embodiment, and FIG. 18 is a longitudinal sectional view thereof. The cap member C4 has a substantially hollow cylindrical frame 20 whose upper end is bent inward and whose lower end is bent outward, and a hole formed inside the hole formed in the upper end of the frame 20. And a transparent window member 11 having a substantially disk shape disposed so as to close the window, and an adhesive member 12 for bonding the outer peripheral surface of the window member 11 and the inner wall surface of the hole. The materials of the members constituting the cap member C4 are the same as the materials of the cap members according to the first to third embodiments.

  The frame 20 is formed by processing a cylindrical body having a constant thickness, and a portion bent inward on the upper end side forms a frame body portion 20a that holds a window member, and is bent outward on the lower end side. The formed portion forms an outer peripheral side protruding portion 20c for adhering to the substrate, and the portion between them forms a cylindrical portion 20b that forms an accommodation space for accommodating a semiconductor element.

  Also in this embodiment, the window member 11 is a disk composed of a lower side surface (inner surface of the cylinder) and an upper side surface that are parallel to each other, and an outer peripheral surface perpendicular to both surfaces. The upper part of the outer peripheral surface of the window member 11 and the upper part of the inner wall surface of the hole in the frame body part 20a are opposed to each other with a gap, and the upper edge of the window member 11 is the edge of the inner wall surface of the hole in the frame body 20 It is arranged so as not to protrude more.

  The adhesive member 12 is adhered to the upper inner surface of the cylindrical portion 20 b, the lower surface of the frame body portion 20 a, and the outer peripheral surface of the window member 11. By doing in this way, the upper surface (outside of the optical semiconductor device) of the adhesive member 12 can be covered and protected by the frame body portion 20a of the frame body 20.

  The adhesive member 12 does not reach the inner and outer edges of the outer peripheral surface of the window material 11. An edge between the lower surface and upper surface of the window material 11 and the outer peripheral surface protrudes in the thickness direction of the window material 11 from a portion where the adhesive member 12 is bonded to the outer peripheral surface of the window material 11. Since the edge portion of the window material 11 can be configured not to contact the adhesive member 12 in this way, the stress acting on the window material 11 from the frame 20 through the adhesive member 12 is not concentrated on the edge portion. It is possible to prevent the window material 11 from being damaged.

  FIG. 19A is a cross-sectional view of a cap member C4 according to a first modification of the fourth embodiment. The difference from FIG. 18 is that the lower portion of the inner wall surface of the frame body portion 20a is notched. Thus, a recess extending in the inner circumferential direction is formed, and the adhesive member 12 is located in this recess. Also in this modification, the adhesive member 12 does not reach the inner and outer edges of the outer peripheral surface of the window material 11. Since the edge between the lower surface and upper surface of the window material 11 and the outer peripheral surface protrudes in the thickness direction of the window material 11 rather than the portion where the adhesive member 12 is bonded to the outer peripheral surface of the window material 11, Damage to the window material 11 can be prevented.

  FIG. 19B is a cross-sectional view of the cap member C4 according to the second modification of the fourth embodiment. The difference from FIG. 18 is that the lower portion of the inner wall surface of the frame body portion 20a is notched. Accordingly, a concave portion extending in the inner circumferential direction is formed, and the upper outer peripheral end portion of the window member 11 is located in the concave portion. The adhesive 12 is not filled in the recess, but is bonded to the inner surface of the upper portion of the cylindrical portion 20 b, the lower surface of the frame body portion 20 a, and the outer peripheral surface of the window member 11.

  Thus, the outer surface of the adhesive member 12 is covered and protected by the frame body portion 20a. Moreover, the edge part between the lower surface of the window material 11 and an upper side surface, and an outer peripheral surface protrudes in the thickness direction of the window material 11 rather than the part to which the adhesive member 12 adhere | attaches in the outer peripheral surface of the window material 11. Therefore, damage to the window material 11 can be prevented.

  In FIG. 19B, the upper surface of the outer peripheral end portion of the window member 11 located in the concave portion is not in contact with the lower surface of the concave portion, and is arranged with a certain gap. The upper surface may be in contact with the frame body portion 20a on the lower surface of the recess. Further, in the contacted state, another step of the concave portion may be formed on the lower side surface of the frame body portion 20a, and the adhesive 12 may be accumulated therein.

FIG. 19C is a cross-sectional view of a cap member C4 according to a third modification of the fourth embodiment. The difference from FIG. 19B is the lower portion of the inner wall surface of the frame body portion 20a. Is formed so that the upper surface of the frame body portion 20a protrudes accordingly. In this way,
The thickness of the frame part 20a can be made uniform.

  The present invention is not limited to the embodiment described above. For example, although the optical semiconductor devices OS1 and OS2 are optical detection devices including a photodetection element that is a photodiode as the optical semiconductor element 2, the optical semiconductor device is a semiconductor that is a semiconductor laser or a light emitting diode as the optical semiconductor element. A light emitting element may be provided to function as a light emitting device. Further, the present invention is not limited to these, and the present invention can also be applied to an optical semiconductor device having another configuration that functions as a light emitting device and a light detection element.

1 is a schematic cross-sectional perspective view of an optical semiconductor device according to a first embodiment. 1 is a schematic cross-sectional view of an optical semiconductor device according to a first embodiment. It is sectional drawing of the cap member which concerns on 1st Embodiment. It is a figure for demonstrating the stress distribution which acts on the window material contained in the cap member of a comparative example. It is a figure for demonstrating the stress distribution which acts on the window material contained in the cap member which concerns on 1st Embodiment. It is sectional drawing of the cap member which concerns on the 1st modification of 1st Embodiment. It is a schematic cross-sectional perspective view of the optical semiconductor device which concerns on the 2nd modification of 1st Embodiment. It is a schematic sectional drawing of the optical semiconductor device which concerns on the 3rd modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on the 4th modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on the 5th modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on the 6th modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on the 7th, 8th modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on the 9th modification of 1st Embodiment. It is sectional drawing of the cap member which concerns on 2nd Embodiment. It is sectional drawing of the cap member which concerns on the modification of 2nd Embodiment. It is sectional drawing of the cap member which concerns on 3rd Embodiment. It is a perspective view of the cap member which concerns on 4th Embodiment. It is sectional drawing of the cap member which concerns on 4th Embodiment. It is sectional drawing of the cap member which concerns on the 1st-3rd modification of 4th Embodiment. It is sectional drawing of the cap member which concerns on the 10th modification of 1st Embodiment.

Explanation of symbols

OS1 ... optical semiconductor device, C1 ... cap member, 1 ... substrate, 2 ... optical semiconductor element, 3 ... brazing material, 4 ... Au wire, 5 ... brazing material, 10 ... frame body, 10a ... inner peripheral side protruding portion, 10b ... Frame main body part, 10c ... Outer peripheral side protruding part, 10d ... Lower inner wall surface, 10e ... Upper inner wall surface, 11 ... Window material, 11a ... Lower side surface, 11b ... Upper side surface, 11c ... Outer surface, 12 ... Adhesive member.

Claims (11)

An optical semiconductor device cap member in which an optical semiconductor element is sealed,
An annular frame;
A transparent window material disposed inside the hole so as to close the hole of the frame,
Located between the inner wall surface of the hole and the outer peripheral surface of the window material, an adhesive member that bonds them,
With
The thermal expansion coefficient of the frame body is larger than the thermal expansion coefficient between the window material and the adhesive member,
The edge between the lower and upper side surfaces of the window material and the outer peripheral surface protrudes in the thickness direction of the window material from the portion where the adhesive member is bonded to the outer peripheral surface of the window material. A cap member. Chamfering is applied to the edge portion of at least one of the lower surface and the upper surface of the window material,
At least a part of the chamfered portion is chamfered by protruding in the thickness direction of the window material from a portion where the adhesive member is bonded to the outer peripheral surface of the window material. The cap member according to claim 1, wherein an edge portion protrudes in a thickness direction of the window material from a portion where the adhesive member is bonded to the outer peripheral surface. An optical semiconductor device cap member in which an optical semiconductor element is sealed,
An annular frame;
A transparent window material disposed inside the hole so as to close the hole of the frame,
Located between the inner wall surface of the hole and the outer peripheral surface of the window material, an adhesive member that bonds them,
With
The thermal expansion coefficient of the frame body is larger than the thermal expansion coefficient between the window material and the adhesive member,
The cap member, wherein the lower surface and the upper surface of the window material are convex curved surfaces. An optical semiconductor device cap member in which an optical semiconductor element is sealed,
An annular frame;
A transparent window material disposed inside the hole so as to close the hole of the frame,
Located between the inner wall surface of the hole and the outer peripheral surface of the window material, an adhesive member that bonds them,
With
The thermal expansion coefficient of the frame body is larger than the thermal expansion coefficient between the window material and the adhesive member,
One of the lower surface or upper surface of the window material is a convex curved surface,
The edge between the opposite surface of the convex surface of the window material and the outer peripheral surface of the window material protrudes in the thickness direction of the window material from the portion of the outer peripheral surface of the window material to which the adhesive member is bonded. A cap member characterized by the above. The frame is
A thick frame body,
A thin and flange-shaped inner peripheral side protruding portion extending in an inner peripheral direction from the frame main body,
The cap member according to any one of claims 1 to 4, wherein a lower surface of the inner peripheral protruding portion is in contact with the adhesive member. The frame is
A thick frame body,
A thin, flange-shaped outer peripheral side projecting portion extending in an outer peripheral direction from the frame main body portion,
6. The cap member according to claim 1, wherein a lower surface of the outer peripheral protruding portion is an adhesive surface with a substrate for fixing the optical semiconductor element. The frame is
A frame portion for holding the window material via the adhesive member;
A cylindrical portion extending in the direction of the substrate for fixing the optical semiconductor element from the outer peripheral portion of the frame body portion;
An outer peripheral side protruding portion extending from the cylindrical portion to the outer peripheral side,
The cap member according to any one of claims 1 to 5, wherein a lower surface of the outer peripheral protruding portion is an adhesive surface with the substrate. The cap member according to any one of claims 1 to 7, wherein the window material is made of quartz glass, and the adhesive member is made of high-melting glass. The cap member according to any one of claims 1 to 8, wherein the window material is made of quartz glass, and the frame is made of Kovar alloy. The cap member according to claim 9, wherein the frame is configured by coating a nickel layer on a Kovar alloy. An optical semiconductor element;
A substrate on which the optical semiconductor element is fixed;
An optical semiconductor device comprising: the cap member according to any one of claims 1 to 9 which is bonded to the substrate and covers the optical semiconductor element.

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