JPH0218273U - - Google Patents
Info
- Publication number
- JPH0218273U JPH0218273U JP9743888U JP9743888U JPH0218273U JP H0218273 U JPH0218273 U JP H0218273U JP 9743888 U JP9743888 U JP 9743888U JP 9743888 U JP9743888 U JP 9743888U JP H0218273 U JPH0218273 U JP H0218273U
- Authority
- JP
- Japan
- Prior art keywords
- insulating substrate
- terminal
- protrusion
- receiving surface
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000758 substrate Substances 0.000 claims description 10
- 238000005452 bending Methods 0.000 claims 1
- 239000004020 conductor Substances 0.000 claims 1
- 238000000605 extraction Methods 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
Landscapes
- Multi-Conductor Connections (AREA)
- Non-Reversible Transmitting Devices (AREA)
Description
第1図は本考案に係る回路部品の分解斜視図、
第2図は同じく組立状態での要部拡大断面図、第
3図は同じく別の実施例における要部拡大断面図
、第4図は本考案に係る回路部品の分解斜視図、
第5図は同じく組立状態での要部拡大断面図、第
6図は本考案に係る非可逆回路素子の平面図、第
7図は同じくその底面図、第8図は第6図A1―
A1線上における断面図、第9図は従来の回路部
品の分解斜視図、第10図は同じくその要部の拡
大断面図、第11図は別の従来における回路部品
の分解斜視図、第12図は同じくその要部の拡大
断面図である。
1……回路、2……絶縁基板、21〜24……
端子取付用孔、31〜36……導電膜、71,7
2……端子、711,721……受面、712,
722……突起。
FIG. 1 is an exploded perspective view of circuit components according to the present invention;
FIG. 2 is an enlarged sectional view of the main parts in an assembled state, FIG. 3 is an enlarged sectional view of the main parts in another embodiment, and FIG. 4 is an exploded perspective view of the circuit components according to the present invention.
FIG. 5 is an enlarged cross-sectional view of the main parts in the assembled state, FIG. 6 is a plan view of the nonreciprocal circuit element according to the present invention, FIG. 7 is a bottom view thereof, and FIG. 8 is the same as that shown in FIG .
9 is an exploded perspective view of a conventional circuit component, FIG. 10 is an enlarged sectional view of the main part thereof, FIG. 11 is an exploded perspective view of another conventional circuit component, and FIG. The figure is also an enlarged sectional view of the main part. 1...Circuit, 2...Insulating substrate, 21-24...
Terminal mounting hole, 31-36... Conductive film, 71, 7
2...Terminal, 711, 721...Receiving surface, 712,
722...protrusion.
Claims (1)
回路の引出電極となる導電膜と導通するように金
属端子を取付けた回路部品において、前記絶縁基
板は端縁寄りの前記導電膜の領域内に端子取付用
孔を有し、前記端子は平面状の受面とこの受面と
同体に立設して設けられた突起とを有し、前記突
起を前記端子取付用孔内に挿入すると共に、その
先端部を前記絶縁基板の一面側に圧着させ、前記
突起と前記受面との間で前記絶縁基板を両面側か
ら挾持して、前記絶縁基板に取付けたことを特徴
とする回路部品。 (2) 前記端子の前記突起は前記受面の中央部に
立設された筒状体でなり、前記突起を内径側から
外側に押開いて前記絶縁基板の一面側に圧着させ
たことを特徴とする実用新案登録請求の範囲第1
項に記載の回路部品。 (3) 前記端子は、前記受面に隣接して前記絶縁
基板の端縁に当接する突片を有し、前記突片から
間隔をおいて前記受面の先端部を折曲げて前記突
起を形成し、前記突起を前記絶縁基板の一面に折
曲げて圧着させたことを特徴とする実用新案登録
請求の範囲第1項に記載の回路部品。 (4) 前記絶縁基板上に120度の角度で交叉す
る3つのストリツプ導体を備える非可逆回路であ
ることを特徴とする実用新案登録請求の範囲第1
項、第2項または第3項に記載の回路部品。[Claims for Utility Model Registration] (1) A circuit component in which a metal terminal is attached to an insulating substrate having a circuit on its main surface so as to be electrically connected to a conductive film serving as an extraction electrode of the circuit, wherein the insulating substrate is A terminal mounting hole is provided in a region of the conductive film near the edge, and the terminal has a planar receiving surface and a protrusion that is provided upright in the same manner as the receiving surface. While inserting the terminal into the terminal mounting hole, the tip thereof is crimped to one side of the insulating substrate, and the insulating substrate is held between the protrusion and the receiving surface from both sides, and the terminal is attached to the insulating substrate. A circuit component characterized by being attached. (2) The protrusion of the terminal is a cylindrical body erected at the center of the receiving surface, and the protrusion is pushed open from the inner diameter side to the outside and crimped to one side of the insulating substrate. Scope of claim for utility model registration No. 1
Circuit components listed in Section. (3) The terminal has a protrusion that is adjacent to the receiving surface and comes into contact with an edge of the insulating substrate, and the protrusion is formed by bending the tip of the receiving surface at a distance from the protruding piece. The circuit component according to claim 1, which is a registered utility model, characterized in that the projection is bent and crimped onto one surface of the insulating substrate. (4) Utility model registration claim 1, which is a non-reciprocal circuit comprising three strip conductors intersecting at an angle of 120 degrees on the insulating substrate.
The circuit component according to item 2, item 3, or item 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9743888U JPH0218273U (en) | 1988-07-23 | 1988-07-23 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9743888U JPH0218273U (en) | 1988-07-23 | 1988-07-23 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0218273U true JPH0218273U (en) | 1990-02-06 |
Family
ID=31322908
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9743888U Pending JPH0218273U (en) | 1988-07-23 | 1988-07-23 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0218273U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012146609A (en) * | 2011-01-14 | 2012-08-02 | Yazaki Corp | Terminal for board connection |
JP2021190677A (en) * | 2020-05-27 | 2021-12-13 | 深▲セン▼桑椹電子商務有限公司Shenzhen Sangshen E−commerce Co., Ltd. | Manufacturing method of led substrate |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814682B2 (en) * | 1978-07-04 | 1983-03-22 | ニツポ−電気株式会社 | temperature control device |
JPS6237180B2 (en) * | 1980-10-17 | 1987-08-11 | Caterpillar Mitsubishi Ltd | |
JPS6249304B2 (en) * | 1979-12-10 | 1987-10-19 | Toyo Boseki Kk |
-
1988
- 1988-07-23 JP JP9743888U patent/JPH0218273U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5814682B2 (en) * | 1978-07-04 | 1983-03-22 | ニツポ−電気株式会社 | temperature control device |
JPS6249304B2 (en) * | 1979-12-10 | 1987-10-19 | Toyo Boseki Kk | |
JPS6237180B2 (en) * | 1980-10-17 | 1987-08-11 | Caterpillar Mitsubishi Ltd |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2012146609A (en) * | 2011-01-14 | 2012-08-02 | Yazaki Corp | Terminal for board connection |
JP2021190677A (en) * | 2020-05-27 | 2021-12-13 | 深▲セン▼桑椹電子商務有限公司Shenzhen Sangshen E−commerce Co., Ltd. | Manufacturing method of led substrate |
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