JPH021812Y2 - - Google Patents
Info
- Publication number
- JPH021812Y2 JPH021812Y2 JP17487587U JP17487587U JPH021812Y2 JP H021812 Y2 JPH021812 Y2 JP H021812Y2 JP 17487587 U JP17487587 U JP 17487587U JP 17487587 U JP17487587 U JP 17487587U JP H021812 Y2 JPH021812 Y2 JP H021812Y2
- Authority
- JP
- Japan
- Prior art keywords
- connection terminal
- single wire
- terminal housing
- wire connection
- case body
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005192 partition Methods 0.000 claims description 16
- 230000017525 heat dissipation Effects 0.000 claims description 11
- 238000003780 insertion Methods 0.000 claims description 8
- 230000037431 insertion Effects 0.000 claims description 8
- 230000004308 accommodation Effects 0.000 claims description 7
- 229920003002 synthetic resin Polymers 0.000 claims description 5
- 239000000057 synthetic resin Substances 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 3
- 229910001369 Brass Inorganic materials 0.000 claims description 2
- 239000010951 brass Substances 0.000 claims description 2
- 239000002184 metal Substances 0.000 claims description 2
- 229910052751 metal Inorganic materials 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims 1
- 239000011248 coating agent Substances 0.000 claims 1
- 238000000576 coating method Methods 0.000 claims 1
- 229910052802 copper Inorganic materials 0.000 claims 1
- 239000010949 copper Substances 0.000 claims 1
- 230000002093 peripheral effect Effects 0.000 claims 1
- 230000000694 effects Effects 0.000 description 10
- 238000001816 cooling Methods 0.000 description 9
- 230000005855 radiation Effects 0.000 description 5
- 230000004048 modification Effects 0.000 description 4
- 238000012986 modification Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000009413 insulation Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000000470 constituent Substances 0.000 description 1
- 230000002542 deteriorative effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 230000000191 radiation effect Effects 0.000 description 1
Landscapes
- Insertion, Bundling And Securing Of Wires For Electric Apparatuses (AREA)
- Connections By Means Of Piercing Elements, Nuts, Or Screws (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17487587U JPH021812Y2 (pt) | 1987-11-16 | 1987-11-16 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP17487587U JPH021812Y2 (pt) | 1987-11-16 | 1987-11-16 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH0179271U JPH0179271U (pt) | 1989-05-29 |
JPH021812Y2 true JPH021812Y2 (pt) | 1990-01-17 |
Family
ID=31466707
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP17487587U Expired JPH021812Y2 (pt) | 1987-11-16 | 1987-11-16 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH021812Y2 (pt) |
-
1987
- 1987-11-16 JP JP17487587U patent/JPH021812Y2/ja not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPH0179271U (pt) | 1989-05-29 |
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