JPH0217834U - - Google Patents
Info
- Publication number
- JPH0217834U JPH0217834U JP9637788U JP9637788U JPH0217834U JP H0217834 U JPH0217834 U JP H0217834U JP 9637788 U JP9637788 U JP 9637788U JP 9637788 U JP9637788 U JP 9637788U JP H0217834 U JPH0217834 U JP H0217834U
- Authority
- JP
- Japan
- Prior art keywords
- shaft body
- hole
- semiconductor substrate
- fixed plate
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005498 polishing Methods 0.000 claims description 16
- 239000004065 semiconductor Substances 0.000 claims description 7
- 239000000758 substrate Substances 0.000 claims description 6
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- QWPPOHNGKGFGJK-UHFFFAOYSA-N hypochlorous acid Chemical compound ClO QWPPOHNGKGFGJK-UHFFFAOYSA-N 0.000 description 1
Description
第１図はこの考案の一実施例を示す半導体研磨
治具の構造を示す模式断面図、第２図ａは第１図
の実施例を用いた１次の研磨方法を示す断面図、
第２図ｂは２次の研磨方法を示す断面図、第３図
ａは従来の１次の研磨方法を説明する要部断面図
、第３図ｂは２次の研磨方法を説明する要部断面
図である。
図において、１は固定盤、２は軸体、３は貫通
穴、４はコツク、４ａは閉じた状態のコツク、５
は半導体基板、５ａは１次研磨後の半導体基板、
６は水、７は第１の研磨装置、８は第２の研磨装
置、９，１０は研磨板、１１は研磨剤、１２はメ
カノケミカル研磨液、２１，２１ａは治具取付部
、２２，２２ａははりつけ盤、２３，２３ａは軸
体、２４，２４ａは貫通穴、２５，２５ａは研磨
板、２６，２６ａは半導体基板、２７は水、２８
は研磨剤、２９は次亜塩素酸系研磨液である。
FIG. 1 is a schematic sectional view showing the structure of a semiconductor polishing jig showing an embodiment of this invention, FIG. 2a is a sectional view showing a primary polishing method using the embodiment of FIG. 1,
Figure 2b is a sectional view showing the secondary polishing method, Figure 3a is a sectional view of the main part explaining the conventional primary polishing method, and Figure 3b is the main part explaining the secondary polishing method. FIG. In the figure, 1 is a fixed plate, 2 is a shaft body, 3 is a through hole, 4 is a cock, 4a is a cock in a closed state, 5
5a is a semiconductor substrate, 5a is a semiconductor substrate after primary polishing,
6 is water, 7 is a first polishing device, 8 is a second polishing device, 9 and 10 are polishing plates, 11 is a polishing agent, 12 is a mechanochemical polishing liquid, 21 and 21a are jig attachment parts, 22, 22a is a mounting plate, 23, 23a are shaft bodies, 24, 24a are through holes, 25, 25a are polishing plates, 26, 26a are semiconductor substrates, 27 are water, 28
29 is a polishing agent, and 29 is a hypochlorous acid polishing liquid.
Claims (1)
及び固定盤の中心軸方向に貫通する穴を有し、上
記軸体側の穴から排気しこの穴の空間を減圧して
、上記軸体の取付け面と反対側の上記固定盤面に
設置した被研磨半導体基板を拘持する半導体基板
の研磨治具において、 上記軸体に上記穴の空間の吸・排気及び減圧状
態の保持を兼ねるコツクを設けたことを特徴とす
る半導体基板の研磨治具。[Claim for Utility Model Registration] Consisting of a fixed plate integrally formed with a shaft body, having a hole penetrating in the central axis direction of the shaft body and the fixed plate, and exhausting air from the hole on the shaft side to fill the space in this hole. In a semiconductor substrate polishing jig that holds a semiconductor substrate to be polished, which is placed on the fixed platen surface opposite to the mounting surface of the shaft body under reduced pressure, the shaft body is provided with suction, exhaust, and depressurization of the space in the hole. A semiconductor substrate polishing jig characterized by being provided with a pot that also serves to maintain the state.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9637788U JPH0217834U (en) | 1988-07-22 | 1988-07-22 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9637788U JPH0217834U (en) | 1988-07-22 | 1988-07-22 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0217834U true JPH0217834U (en) | 1990-02-06 |
Family
ID=31321267
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9637788U Pending JPH0217834U (en) | 1988-07-22 | 1988-07-22 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217834U (en) |
-
1988
- 1988-07-22 JP JP9637788U patent/JPH0217834U/ja active Pending
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