JPH0217725Y2 - - Google Patents
Info
- Publication number
- JPH0217725Y2 JPH0217725Y2 JP1984151263U JP15126384U JPH0217725Y2 JP H0217725 Y2 JPH0217725 Y2 JP H0217725Y2 JP 1984151263 U JP1984151263 U JP 1984151263U JP 15126384 U JP15126384 U JP 15126384U JP H0217725 Y2 JPH0217725 Y2 JP H0217725Y2
- Authority
- JP
- Japan
- Prior art keywords
- bending
- link
- cutting
- lead wire
- fixed blade
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000005452 bending Methods 0.000 claims description 56
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 34
- 230000007246 mechanism Effects 0.000 claims description 23
- 230000003028 elevating effect Effects 0.000 claims description 12
- 238000001514 detection method Methods 0.000 description 5
- 230000001105 regulatory effect Effects 0.000 description 4
- 230000000694 effects Effects 0.000 description 2
- 238000003780 insertion Methods 0.000 description 2
- 230000037431 insertion Effects 0.000 description 2
- 230000000630 rising effect Effects 0.000 description 2
- 230000001154 acute effect Effects 0.000 description 1
- 230000001174 ascending effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
Landscapes
- Wire Processing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984151263U JPH0217725Y2 (fr) | 1984-10-08 | 1984-10-08 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1984151263U JPH0217725Y2 (fr) | 1984-10-08 | 1984-10-08 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6167940U JPS6167940U (fr) | 1986-05-09 |
| JPH0217725Y2 true JPH0217725Y2 (fr) | 1990-05-17 |
Family
ID=30709385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1984151263U Expired JPH0217725Y2 (fr) | 1984-10-08 | 1984-10-08 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0217725Y2 (fr) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP7349657B2 (ja) * | 2018-10-15 | 2023-09-25 | パナソニックＩｐマネジメント株式会社 | 部品実装装置および部品実装基板の製造方法 |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532676U (fr) * | 1978-08-24 | 1980-03-03 |
-
1984
- 1984-10-08 JP JP1984151263U patent/JPH0217725Y2/ja not_active Expired
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5532676U (fr) * | 1978-08-24 | 1980-03-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6167940U (fr) | 1986-05-09 |
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