JPH0217483Y2 - - Google Patents
Info
- Publication number
- JPH0217483Y2 JPH0217483Y2 JP10557984U JP10557984U JPH0217483Y2 JP H0217483 Y2 JPH0217483 Y2 JP H0217483Y2 JP 10557984 U JP10557984 U JP 10557984U JP 10557984 U JP10557984 U JP 10557984U JP H0217483 Y2 JPH0217483 Y2 JP H0217483Y2
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor stack
- support frame
- adapter
- airtight
- airtight terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 36
- 239000003507 refrigerant Substances 0.000 claims description 14
- 238000009835 boiling Methods 0.000 claims description 13
- 238000001816 cooling Methods 0.000 claims description 13
- 230000008878 coupling Effects 0.000 claims description 7
- 238000010168 coupling process Methods 0.000 claims description 7
- 238000005859 coupling reaction Methods 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 3
- PXBRQCKWGAHEHS-UHFFFAOYSA-N dichlorodifluoromethane Chemical compound FC(F)(Cl)Cl PXBRQCKWGAHEHS-UHFFFAOYSA-N 0.000 description 6
- 230000008602 contraction Effects 0.000 description 3
- 239000007791 liquid phase Substances 0.000 description 3
- 239000012071 phase Substances 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 2
- 238000009833 condensation Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 239000002826 coolant Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000012808 vapor phase Substances 0.000 description 1
Landscapes
- Die Bonding (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557984U JPS6122357U (ja) | 1984-07-12 | 1984-07-12 | 半導体スタツクの支持装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10557984U JPS6122357U (ja) | 1984-07-12 | 1984-07-12 | 半導体スタツクの支持装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6122357U JPS6122357U (ja) | 1986-02-08 |
| JPH0217483Y2 true JPH0217483Y2 (enrdf_load_stackoverflow) | 1990-05-16 |
Family
ID=30664894
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10557984U Granted JPS6122357U (ja) | 1984-07-12 | 1984-07-12 | 半導体スタツクの支持装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6122357U (enrdf_load_stackoverflow) |
-
1984
- 1984-07-12 JP JP10557984U patent/JPS6122357U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6122357U (ja) | 1986-02-08 |