JPH02169045A - Method and device for moistening and milling barley grains - Google Patents
Method and device for moistening and milling barley grainsInfo
- Publication number
- JPH02169045A JPH02169045A JP32236488A JP32236488A JPH02169045A JP H02169045 A JPH02169045 A JP H02169045A JP 32236488 A JP32236488 A JP 32236488A JP 32236488 A JP32236488 A JP 32236488A JP H02169045 A JPH02169045 A JP H02169045A
- Authority
- JP
- Japan
- Prior art keywords
- wheat
- grains
- grinding
- milling
- barley
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 235000013339 cereals Nutrition 0.000 title claims abstract description 82
- 238000003801 milling Methods 0.000 title claims abstract description 39
- 235000007340 Hordeum vulgare Nutrition 0.000 title claims abstract description 29
- 238000000034 method Methods 0.000 title claims description 37
- 240000005979 Hordeum vulgare Species 0.000 title 1
- 238000000227 grinding Methods 0.000 claims abstract description 67
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims abstract description 48
- 241000209219 Hordeum Species 0.000 claims abstract description 28
- 238000003860 storage Methods 0.000 claims abstract description 3
- 230000000887 hydrating effect Effects 0.000 claims abstract 3
- 241000209140 Triticum Species 0.000 claims description 101
- 235000021307 Triticum Nutrition 0.000 claims description 101
- 238000005496 tempering Methods 0.000 claims description 19
- 238000007670 refining Methods 0.000 claims description 4
- 230000003750 conditioning effect Effects 0.000 abstract description 9
- 210000003491 skin Anatomy 0.000 description 36
- 238000005498 polishing Methods 0.000 description 18
- 238000003756 stirring Methods 0.000 description 10
- 238000007517 polishing process Methods 0.000 description 8
- 241000209094 Oryza Species 0.000 description 6
- 235000007164 Oryza sativa Nutrition 0.000 description 6
- 235000013312 flour Nutrition 0.000 description 6
- 239000000047 product Substances 0.000 description 6
- 235000009566 rice Nutrition 0.000 description 6
- 230000002087 whitening effect Effects 0.000 description 6
- 238000001514 detection method Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 4
- 210000002615 epidermis Anatomy 0.000 description 4
- 239000002245 particle Substances 0.000 description 4
- 239000002994 raw material Substances 0.000 description 4
- 238000002156 mixing Methods 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 238000009423 ventilation Methods 0.000 description 3
- FFBHFFJDDLITSX-UHFFFAOYSA-N benzyl N-[2-hydroxy-4-(3-oxomorpholin-4-yl)phenyl]carbamate Chemical compound OC1=C(NC(=O)OCC2=CC=CC=C2)C=CC(=C1)N1CCOCC1=O FFBHFFJDDLITSX-UHFFFAOYSA-N 0.000 description 2
- 239000010419 fine particle Substances 0.000 description 2
- 239000012466 permeate Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 239000002699 waste material Substances 0.000 description 2
- GXCLVBGFBYZDAG-UHFFFAOYSA-N N-[2-(1H-indol-3-yl)ethyl]-N-methylprop-2-en-1-amine Chemical compound CN(CCC1=CNC2=C1C=CC=C2)CC=C GXCLVBGFBYZDAG-UHFFFAOYSA-N 0.000 description 1
- 239000006061 abrasive grain Substances 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000010903 husk Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- RYZCLUQMCYZBJQ-UHFFFAOYSA-H lead(2+);dicarbonate;dihydroxide Chemical compound [OH-].[OH-].[Pb+2].[Pb+2].[Pb+2].[O-]C([O-])=O.[O-]C([O-])=O RYZCLUQMCYZBJQ-UHFFFAOYSA-H 0.000 description 1
- 239000010985 leather Substances 0.000 description 1
- 210000001161 mammalian embryo Anatomy 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001151 other effect Effects 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 238000007781 pre-processing Methods 0.000 description 1
- 210000000582 semen Anatomy 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Landscapes
- Adjustment And Processing Of Grains (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
上記発明は小麦等の製粉工程に係り、特に麦粒の加水精
麦に関する。DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The above invention relates to the process of milling wheat, etc., and particularly relates to hydrated and refined wheat grains.
一般的に小麦から小麦粉を間装する場合、段階的に外皮
をできるだけ損傷しないように小麦の胚乳部だけを取出
し、この胚乳部を順次細かく粉砕してゆく方法がとられ
る。Generally, when preparing flour from wheat, a method is used in which only the endosperm of the wheat is removed in stages so as not to damage the outer husk as much as possible, and this endosperm is successively finely ground.
つまり、まず原料小麦に含まれる夾雑物が取り除かれる
。小麦の特徴として必要とされる胚乳部の外側は数層か
ら形成される皮部で包まれており、この皮部を取り除き
胚浮り部だけを採取する。このため小麦は加水により調
質され、皮部は強じんに、胚乳部は軟かくして粉砕され
る。In other words, the impurities contained in the raw wheat are first removed. The outside of the endosperm, which is a necessary characteristic of wheat, is surrounded by a skin made of several layers, and this skin is removed and only the floating part of the embryo is collected. For this purpose, the wheat is tempered by adding water, making the skin tough and the endosperm soft before being ground.
粉砕は挽砕工程と呼ばれ、調質された小麦は何段階かの
ロール機で破砕され胚乳部が粗粒として取出される。こ
のロールdで破砕される間にロール機の後工程に設けた
ふるいで分級され、混在した皮部が取り除かれた胚乳部
は粉砕ロールで粉砕され、目的の小麦粉が採取される。Grinding is called a grinding process, and tempered wheat is crushed in several stages of roll machines, and the endosperm is extracted as coarse grains. While being crushed by this roll d, the endosperm part is classified by a sieve provided in the subsequent process of the roll machine, and the mixed skin part is removed, and the endosperm part is crushed by a crushing roll to collect the desired wheat flour.
しかし上記従来の技術において精麦の工程は存在しない
。つまり、調質した小麦をロールで粉砕するとき多くの
胚乳部は皮部より破砕開放されるが、皮部と共に砕粒と
なるものが存在し、これらは数段階のロール機の最終工
程まで進み、ふるいによる分級の時に皮部についた粉部
分は皮部と共に機外に排出される。However, in the above-mentioned conventional technology, there is no wheat polishing process. In other words, when tempered wheat is crushed with rolls, most of the endosperm part is crushed and released from the skin part, but some of the endosperm part becomes crushed grains together with the skin part, and these go through several stages to the final process of the roll machine. The powder that adheres to the skin during classification using a sieve is discharged from the machine together with the skin.
したがって、上記従来の技術において皮部の混在が比較
的少ない小麦粉の採取率つまり歩留りは75%程度であ
り歩留りの向上が望まれるが、この歩留りの向上を目的
とした公知の技術として、挽砕工程前処理として精麦工
程を設けたものがある。たとえば、特許第86671号
に麦粒の外皮を柔軟にするため若干の水分を皮下に浸透
させる程度に与えた原料麦を直列連結した摩擦環白部を
通過せしめた方法であり、小麦に加水後、摩擦精麦する
ものである。また別の例としで、特許第205448号
には、1機又は複数機よりなる無水式研削系統の搗精の
後、1機又は数機よりなる混水式搗精機によって搗精す
るものである。更に特公昭33−64号公報には、研磨
除顛d付無水研削式!Q精機と研磨除糠備付混水摩擦1
q問機とを組合せ交互に繰返して循環させるようにした
ものである。以上のものは、挽砕■稈前にほとんどの皮
部だけを取除き、挽砕工程で粉砕しふるいで分級する際
、皮部の混入を減少さゼ挽砕工程での皮部を取り除くこ
との負担を軽減させることを目的とし、よって製粉の歩
留りの向上の効果を求めるものであった。Therefore, in the above-mentioned conventional technology, the collection rate of wheat flour with relatively few skin parts, that is, the yield, is about 75%, and it is desired to improve the yield. Some products include a barley polishing process as a pre-processing process. For example, in Japanese Patent No. 86671, there is a method in which the raw material wheat, which has been given a small amount of moisture to the extent that it permeates subcutaneously in order to soften the outer skin of the wheat grain, is passed through a friction ring connected in series. , which grinds and grinds barley. As another example, Japanese Patent No. 205448 discloses that after a waterless grinding system consisting of one or more machines grinds, the grinding is performed by a mixed water grinding machine consisting of one or more machines. Furthermore, in Japanese Patent Publication No. 33-64, there is a waterless grinding type with polishing remover d! Mixed water friction with Q Seiki and polishing bran removal equipment 1
This system is designed to alternately and repeatedly combine and circulate q-query machines. For the above items, remove most of the skin before grinding, reduce the amount of skin mixed in when crushing and classifying with a sieve in the grinding process, and remove the skin during the grinding process. The aim was to reduce the burden on milling, and therefore to improve the yield of flour milling.
従来技術の首記公知文献のものにおいて、摩擦搗精は研
削S精に比較して搗精室内の圧力が高く砕粒の発生が多
く、この砕粒には胚乳部が付着し前記−船釣な製粉の挽
砕工程のロール機での粉砕と同様の結果を招くものであ
った。これは無水であっても皮部に加水した小麦であっ
ても搗白部における圧力が高いため砕粒の発生は避けら
れないものである。また無水式研削機と混水摩擦式のV
(用または交Hに繰返して循環させるものは、まず無水
式研削機は研削室内の内圧が低く、硬い皮部表面の研;
堵は可能であっても皮部を取り除くにはその効果は認め
ず、逆に皮部に傷をつけたり小麦を砕いたりするに至る
ものである。また、混水摩擦式は前記に詳述した如くで
あり、摩擦搗精中の混水は搗精発熱の冷却効果はあるが
、それ以外の効果は望めないものである。そして、研削
・摩擦併用は、研削により小麦の表面に傷をつけ摩擦に
より皮部のはぎ取りを容易にすることを目的としたもの
であるが、米粒のように表面が軟質のろう質で内部の硬
度の高いものに効果が多大であることは周知の事実であ
るが、小麦のように外皮が硬く胚乳部が軟質のものには
不適である。In the prior art cited in the prior art document, friction milling has a higher pressure in the milling chamber than grinding S milling, and more crushed grains are generated, and the endosperm adheres to the crushed grains, resulting in the above-mentioned grinding process. The result was similar to that of crushing using a roll machine in the crushing process. This is because even if the wheat is anhydrous or has water added to the hull, the pressure in the milling part is high, so the occurrence of crushed grains is unavoidable. In addition, a waterless grinding machine and a mixed water friction type V
(First of all, waterless grinders have low internal pressure in the grinding chamber and are used for grinding hard leather surfaces.
Even if it is possible to remove the wheat, it is not effective in removing the skin, and instead ends up damaging the skin and crushing the wheat. Further, the mixed water friction type is as described in detail above, and although the mixed water during friction polishing has a cooling effect on the heat generated during polishing, no other effects can be expected. The purpose of the combination of grinding and friction is to damage the surface of the wheat by grinding and make it easier to remove the skin by friction, but unlike rice grains, the surface is soft and waxy, and the interior is soft. It is a well-known fact that wheat with high hardness has a great effect, but it is not suitable for wheat with a hard outer skin and soft endosperm.
以上のように挽砕工程前の精麦工程で皮部を取り除くこ
とに多大の効果を(qるものではなく、製粉の胚乳部の
歩留り向上に貢献する精麦方法の開発が望まれている。As described above, there is a desire to develop a wheat polishing method that is not only highly effective in removing the skin in the wheat milling process before the grinding process, but also contributes to improving the yield of the endosperm part during milling.
(問題解決の手段)
本発明は上記問題点の解決のために、麦粒に支粒重M比
で0.5%乃至4%の水分を加水した俊5分以上30分
以内の調質工程を加えその後前記麦粒を研削式精麦機で
搗精する麦粒の精麦方法により問題解決の手段とした。(Means for Solving Problems) In order to solve the above-mentioned problems, the present invention provides a tempering process in which 0.5% to 4% moisture is added to wheat grains based on the grain weight M ratio. The problem was solved by a wheat grain polishing method in which the wheat grains were milled using a grinding type miller.
さらに本発明において麦粒に麦粒型0比で0.5%乃至
4%の水分を加水する加水装置と、加水した麦粒を5分
以上経過後30分以内の調質を行う調71に貯留装置お
よび調質後粘麦を行う研削式精麦機とを協えたことによ
り問題解決の手段とした。Furthermore, in the present invention, there is provided a water adding device for adding 0.5% to 4% moisture to the wheat grain based on the wheat grain type 0 ratio, and a conditioning device 71 for tempering the watered wheat grain for at least 5 minutes and within 30 minutes. The problem was solved by combining a storage device and a grinding type milling machine that processes the malt after tempering.
小麦の皮部に0.5%乃至4%の水分を常温で加水・m
+¥すると、硬い皮部は水分を含んで軟かくなるが、少
量の水分を類時間で加水し5分以上30分以内の調質を
することで比較内軟かい胚乳部に水分はほとんど吸収さ
れないものである。よって皮部は軟かい状態で・搗精圧
の低い数機の研削式精麦機により徐々に取り除かれ精麦
歩留り90%で小麦の粒溝のみに筋状のふすまが残るこ
とになる。これは挽砕工程でのふすま等の灰分の混入率
が、大きく減少していることを意味するものである。こ
の皮部のほとんど取り除かれた小麦は含有水分の最適化
と水分の最適な粒内分布状態におくため少量の水分を加
え調質されて挽砕工程に送られる。挽砕工程においては
小麦の粒溝に残った筋状のふすまのみを、粉砕粒の中か
らふるいにより分級することになる。つまり、ふすまの
ない胚乳部は粒状になるが筋状のふすまはほぼ筋状のま
ま残り他の粒状の胚乳部とはっきり分級され、無駄のな
い胚乳部が回収される。Add 0.5% to 4% water to the wheat skin at room temperature.
If you add more than ¥, the hard skin part will absorb water and become soft, but by adding a small amount of water over a period of time and tempering for 5 minutes to 30 minutes, most of the water will be absorbed into the soft endosperm part. It is something that cannot be done. Therefore, the skin is gradually removed in a soft state using several grinding-type wheat milling machines with low milling pressure, resulting in a wheat yield of 90% and streak-like bran remaining only in the grain grooves of the wheat. This means that the mixing rate of ash such as bran during the grinding process is greatly reduced. The wheat from which most of the skin has been removed is tempered by adding a small amount of moisture to optimize the moisture content and the distribution of moisture within the grain, and then sent to the grinding process. In the grinding process, only the streaky bran remaining in the grain grooves of the wheat are separated from the ground grains using a sieve. In other words, the endosperm without bran becomes granular, but the streaky bran remains almost streak-like and is clearly classified from other granular endosperm, and the endosperm without waste is recovered.
まず本発明における精麦方法において、加水調質した麦
粒と無加水の麦粒とを研削式精麦機と摩擦式精麦機とそ
れぞれで精麦した場合の研削式と摩擦式の差を明らかに
する。つまり製粉歩留が向上しない原因に砕粒の発生を
前述したが、前記搗精方法の違いによる精麦における精
品中とぬか中の砕粒発生を精品中とぬか中の砕粒含有率
で第1表に示した。ここで試験に供した試Fl麦の銘柄
はり、N、S、搗精歩留りは90%とした。また加水調
質は原料重量比で1%の水分を加えた。First, in the wheat polishing method of the present invention, the difference between the grinding method and the friction method when water-tempered wheat grains and water-free wheat grains are polished using a grinding type wheat mill and a friction type wheat mill, respectively, will be clarified. In other words, as mentioned above, the generation of crushed grains is the reason why the milling yield does not improve, but Table 1 shows the occurrence of crushed grains in refined grains and bran in refined barley due to the difference in the milling method described above, in terms of the crushed grain content in refined grains and bran. . The grain yield of the sample Fl wheat used in the test was 90% for the brands of grain, N, S, and milling. In the hydrothermal refining, 1% water was added based on the weight of the raw material.
第 1
表
第1表の通り、精麦における研削式と摩擦式との差は明
確であり、加水調質後に研削式精麦を行うことの有効性
が明らかになった。Table 1 As shown in Table 1, there is a clear difference between the grinding method and the friction method for wheat refining, and the effectiveness of grinding the wheat after water conditioning has been demonstrated.
次に研削式精麦における加水調質について、調質時間を
変えた原皮を研削式精麦機で精麦した場合の調質時間と
モータ出力(仕事量)の関係を第2表ないし第4表に示
す。Next, Tables 2 to 4 show the relationship between tempering time and motor output (work amount) when grain wheat grains with different tempering times are milled using a grinding type wheat mill. .
ここで試験に供した試料受は以下の通り。The sample containers used for testing here are as follows.
原皮の銘柄・・・・・・D、N、S
水分・・・・・・12%
灰分・・・・・・1.78%
また、参考として加水調質しない原皮の精麦も示す。更
に上記以外の条件は次の通り
モータ一定格・・・18,5K W 、 200V流
@−1000K (J / Hr(A
)加水調質しない原皮 第2表以上の3例はいずれ
も歩留り90%を目標に精麦したものである。これらを
まとめると第5表の如くなる。Brand of raw hide: D, N, S Moisture: 12% Ash content: 1.78% For reference, refined wheat from raw hide that is not tempered with water is also shown. Furthermore, the conditions other than the above are as follows: Motor rating: 18,5K W, 200V current @-1000K (J/Hr(A)
) Raw hides that are not tempered with water The three examples in Table 2 and above were all milled with the goal of achieving a yield of 90%. A summary of these results is shown in Table 5.
(B)1%加水後10分間の調質 第3表(C) 1
%加水後1時間の調質
第 4表
第5表において([3)の精麦が最も効率の良い条件と
なっている。これは加水後の調質において、短時間であ
れば麦の皮部は軟かくなり内部の胚乳部には水分は浸透
しないためである。(B) Tempering for 10 minutes after adding 1% water Table 3 (C) 1
% tempering for 1 hour after adding water In Table 4 and Table 5, the conditions for refined barley ([3)] are the most efficient. This is because during tempering after adding water, the skin of the wheat becomes soft for a short period of time, and moisture does not penetrate into the endosperm inside.
しかしくC)のように調質を長時間行うと、皮部に吸収
された水分は時間と共に内部胚乳部に浸入して、逆に皮
部は硬く胚乳部が軟かくなり精麦の条件には適さない原
皮となっている。ここにおいて加水調質は原皮に原皮重
固比1%の水分を加え、10分間の調質を行うことの有
効性が明らかになった。However, if tempering is carried out for a long time as in C), the moisture absorbed in the skin will penetrate into the internal endosperm over time, and conversely, the skin will become hard and the endosperm will become soft, which is not suitable for the conditions of refined barley. The raw hide is unsuitable. Here, it was revealed that the effectiveness of hydrothermal conditioning is to add 1% water to the raw hide to the raw hide weight solids ratio and conduct tempering for 10 minutes.
次に原皮に原皮重聞比1%の水分を加え10分間の調質
を行った後、研削式精麦機でM麦した精白麦を挽砕工程
で粉砕し、ふるいで分級した精品0中のふすま(灰分)
の含有率を各精品歩留りにおいて示したのが第6表のグ
ラフである。Next, water of 1% based on the weight of the hide was added to the hide and tempered for 10 minutes, and then the M barley was crushed in a grinding process using a grinding type wheat mill, and the refined product 0 was classified using a sieve. Bran (ash content)
The graph in Table 6 shows the content rate of each fine product yield.
この場合の供試原料の銘柄はW−Wであり、挽砕工程前
の通常のテンバリングはすべて施しである。ここでは、
■一般的製粉工場における麦の製粉歩留りに対する灰分
の混入率と■本実施例および0M ohsの精品歩留り
に対する灰分の混入率とを明記し比較した。In this case, the brand of the raw material to be tested was WW, and all the normal tensing before the grinding process was done. here,
(2) The mixing rate of ash to the milling yield of wheat in a general flour mill and (2) The mixing rate of ash to the refined product yield of this example and 0M ohs were specified and compared.
このグラフから明らかなように本実施例の灰分の混入率
は他のどの例よりも低く、vi麦工程によるふすまの除
去が大きく精品歩留りの向上に貢献していることが明ら
かである。As is clear from this graph, the ash contamination rate in this example is lower than in any other example, and it is clear that the removal of bran by the vii barley process greatly contributes to improving the refined product yield.
以上のように原皮の加水調質と研削式精麦は製粉の次工
程の挽砕工程に有効に作用し、粉砕した胚乳粒に混入す
るふすま(灰分)を減少させて純度の高い精品を歩留り
良く生産することができる。As mentioned above, the hydrothermal conditioning of the raw hide and grinding-type refined barley work effectively in the grinding process that follows the milling process, reducing the bran (ash) mixed in the ground endosperm grains and producing high-purity refined products with a high yield. can be produced.
以下、本発明の好適な精麦工程の実施例につき、図面を
参照しながら説明する。Hereinafter, preferred embodiments of the wheat polishing process of the present invention will be described with reference to the drawings.
精麦行程1は複数台の研削式精麦機5△〜5Dからなり
、各研削式精麦機5A〜5Dに麦粒を搬送する揚穀16
A〜6Dがそれぞれ付設しである。第2図、第3図は研
削式精麦機5△の正面図並びに一部破断の側断面図であ
り、機枠7内上部には多孔壁を有する除糠精白筒8が横
設され、除糠精白筒8内には一部中空状の主軸9に研削
精白転子10(例えば砥粒を焼成結合して成形したもの
)を回転自在に軸着して研削精白転子10と除糠精白筒
8との間隙(げき)を精白室11に形成しである。さら
に主軸9には、供給口12側に螺旋転子13が、排出口
14側に研麦転子15が軸着され、研麦転子15の周面
には突起16と突起1Gに添って穿設した噴風孔17が
形成される。そして、主軸9の研支転子15の軸者部を
中空となすとともにその周壁には通孔18を設け、除糠
精白筒8の下方に設けた送FAti119と前記主軸9
の中空部とを通風管20によって連通しである。また、
供給口12にはエヤーシリンダー21にって開閉づるシ
ャッター板22が、排出口14には精白室11側に向け
て付勢する抵抗板23が、主軸9の端部には図外の主電
動別とVベルト24によって連動連結されたプーリー2
5がそれぞれ装着しである。なお、供給口12に麦粒有
無検出ヒンサー26を設け、この麦粒有無検出センサ“
−26が「夛粒有」を検出した信号によってエヤーシリ
ンダー21を作動(収縮)させ、シャッター板22を開
くよう形成する場合もある。The wheat polishing process 1 consists of a plurality of grinding type wheat mills 5△ to 5D, and a fried grain 16 conveys the wheat grains to each of the grinding type wheat mills 5A to 5D.
A to 6D are attached respectively. Figures 2 and 3 are a front view and a partially cutaway side sectional view of the grinding type barley mill 5△, in which a bran removal and whitening cylinder 8 with a porous wall is installed horizontally in the upper part of the machine frame 7; In the bran polishing cylinder 8, a grinding and polishing trochanter 10 (for example, formed by firing and bonding abrasive grains) is rotatably attached to a partially hollow main shaft 9, and the grinding and polishing trochanter 10 and the bran removal polisher are attached. A gap with the cylinder 8 is formed in the whitening chamber 11. Further, on the main shaft 9, a spiral rotor 13 is attached to the supply port 12 side, and a grinding rotor 15 is attached to the discharge port 14 side. A drilled blowhole 17 is formed. The shaft part of the grinding rotor 15 of the main shaft 9 is made hollow, and a through hole 18 is provided in the peripheral wall thereof, and the feeding FAti 119 provided below the bran removing and polishing cylinder 8 and the main shaft 9 are made hollow.
It is in communication with the hollow part of the air pipe 20 through a ventilation pipe 20. Also,
The supply port 12 has a shutter plate 22 that is opened and closed by an air cylinder 21, the discharge port 14 has a resistance plate 23 that biases it toward the milling chamber 11, and the end of the main shaft 9 has a main electric motor (not shown). Another pulley 2 is interlocked and connected by a V-belt 24.
5 are each installed. In addition, a wheat grain presence/absence detection sensor 26 is provided at the supply port 12, and this wheat grain presence/absence detection sensor "
In some cases, the air cylinder 21 is actuated (contracted) and the shutter plate 22 is opened in response to a signal from which the -26 detects the presence of "dead particles".
機枠7内の除IIM白筒8下方には、集糠ポツパー27
A、27Bが除II室28に接続して設けられ、集糠ホ
ッパー27△、27Bの下端は、一端を吸風ファン2つ
に連結したダクト30に連結される。Below the IIM white cylinder 8 in the machine frame 7, there is a rice bran potsper 27.
A and 27B are provided connected to the removal II chamber 28, and the lower ends of the bran collecting hoppers 27Δ and 27B are connected to a duct 30 whose one end is connected to two suction fans.
再び第1図に戻って、精麦行程2の最初には水分添加装
置31Aおよび調質タンク5oが配設される。すなわち
、供給樋32と揚穀16△との間に、攪拌(かくはん)
螺旋33を内股した横送樋34を横設し、横送樋34に
は超音波ノズル35を臨ませた水分添加部36を形成し
、超音波ノズル35は配水管37を介して水タンク38
に連結される。配水管37にはヒーター39を装着する
場合もある。Returning to FIG. 1 again, at the beginning of the wheat polishing process 2, a water addition device 31A and a tempering tank 5o are provided. That is, stirring is performed between the supply gutter 32 and the fried grains 16△.
A transverse gutter 34 with a spiral 33 inside is installed horizontally, and a water addition section 36 with an ultrasonic nozzle 35 facing is formed in the transverse gutter 34, and the ultrasonic nozzle 35 is connected to a water tank 38 via a water pipe 37.
connected to. A heater 39 may be attached to the water pipe 37 in some cases.
また横送樋34は調質タンク50の上部にgz +tで
ある。調質タンク50の下部の排出口55にはシャッタ
ー板53を設けてあり、エアシリンダー54の作動によ
りシtlンタ−Fi53を聞くよう形成することもある
。調質タンク50下部の排出口55に、横送樋51を設
は揚穀改6Aに連絡しである。Further, the horizontal feed gutter 34 is located above the refining tank 50 at gz +t. A shutter plate 53 is provided at the discharge port 55 at the bottom of the tempering tank 50, and may be configured to listen to the shutter Fi 53 when the air cylinder 54 is operated. A cross-feeding gutter 51 is installed at the discharge port 55 at the bottom of the tempering tank 50, and is connected to the grain frying process 6A.
研削式精115B〜5Dにはそれぞれ水分添加装置31
Bが付設しである。すなわち、中空状の主軸9 (rJ
HilJfif白U子11 、!:li転子15との境
目付近に閉塞部を設けである)のブーリ−251111
間口端部には超音波ノズル40を臨ませ、超音波ノズル
40は配水管46を介して水タンク42に、エヤー管4
3を介して空気加圧144にそれぞれ連結しである。研
削精白転子10には適宜に噴風輪溝59が形成され、噴
風輪溝59は、主軸9に多数穿設した通孔(図示せず)
に連通する。Moisture addition device 31 is installed in each of the grinding type precision 115B to 5D.
B is attached. That is, the hollow main shaft 9 (rJ
HilJfif White Uko 11,! :Bouley-251111 (with a closed part near the boundary with the li trochanter 15)
An ultrasonic nozzle 40 faces the end of the frontage, and the ultrasonic nozzle 40 is connected to a water tank 42 via a water pipe 46 and to an air pipe 4.
3 to the air pressurization 144, respectively. A blow ring groove 59 is appropriately formed in the ground and polished trochanter 10, and the blow ring groove 59 is formed by a large number of through holes (not shown) drilled in the main shaft 9.
communicate with.
また、研削式精麦機5A〜5Dの各供給口12上部には
供給ホッパー45がそれぞれ設けられ、各供給ホッパー
45と揚穀16A〜6Dとはシュートバイブ46A〜4
6Dによって連結される。In addition, a supply hopper 45 is provided above each supply port 12 of the grinding type barley mills 5A to 5D, and each supply hopper 45 and fried grains 16A to 6D are connected to chute vibrators 46A to 46D.
Connected by 6D.
次に、本実施例における作用製ついて説明する。Next, the operation of this embodiment will be explained.
異物や夾γを物が除去された原料麦(大きさ別に分級す
ることもある)、例えば小麦は供給樋32を介して水分
添加装置31Aの横送樋34内に供給され、水分添加部
36において超音波ノズル35から微粒子の水分添加を
受け、攪拌されながら調質タンク50に至る。横送樋3
4内で水分を添加された原料麦は調質タンク5゜内で麦
粒子の皮部だけに水分が浸透して湿潤軟化される。なお
、ヒーター39をONL、て温湿風とした場合は、水分
量を減らしても短時間に、かつより確実に表皮部が軟化
する。調質タンク50内で原Fl麦は5分乃至30分の
闇ねかじを行ない麦粒皮部の水分の均一化を計る。Raw material wheat (sometimes classified according to size) from which foreign substances and foreign particles have been removed, for example, wheat, is fed into the transverse feed gutter 34 of the water addition device 31A through the feed gutter 32, and is fed into the water addition section 36. In the step, water is added to the fine particles from the ultrasonic nozzle 35, and the fine particles reach the tempering tank 50 while being stirred. Cross feed gutter 3
The raw barley to which water has been added in step 4 is moistened and softened in a tempering tank 5° as moisture permeates only the skin of the wheat grains. In addition, when the heater 39 is ONL and the hot and humid air is used, the epidermis is softened more reliably in a short time even if the amount of moisture is reduced. In the tempering tank 50, the raw Fl wheat is subjected to dark stirring for 5 to 30 minutes to homogenize the moisture content of the wheat grain skin.
表皮部だけが湿潤軟化した麦粒は、揚穀116Aの排出
部からシュ7トパイプ46Aを経て供給ホッパー45に
流入し、これにより麦粒有無検出センサー26が[麦粒
有Jを検出すると、エヤーシリンダー21が収縮動作し
てシャッター板22が開く。供給口12から流下する麦
粒は螺旋転子13によって精白室11内へ送り込まれ、
高速に回転する研削M白転子10によって湿潤軟化した
麦粒表皮部が剥離される。精白室11内の麦粒は、機枠
7の壁部に形成した空気取入部60から取入れられる空
気が除稠精白筒8の一側底部から流入して他側底部付近
に流出することによって精白室上方への流動を助勢し、
精白室11底部にたまりがちな麦粒を精白〒11全体に
均等的に流動させ、研削精白転子10の研削作用を効率
的、かつむらなく施す。The wheat grains whose skin has been moistened and softened flow from the discharge part of the fried grains 116A through the stop pipe 46A into the supply hopper 45, and when the wheat grain presence detection sensor 26 detects the presence of wheat grains, the air The cylinder 21 contracts and the shutter plate 22 opens. Wheat grains flowing down from the supply port 12 are sent into the milling chamber 11 by the spiral trochanter 13,
The moistened and softened skin of the wheat grain is peeled off by the grinding M white trochanter 10 rotating at high speed. The wheat grains in the milling chamber 11 are milled as air taken in from the air intake part 60 formed on the wall of the machine frame 7 flows in from the bottom of one side of the milling tube 8 and flows out near the bottom of the other side. Facilitates upward flow of the chamber,
Wheat grains that tend to accumulate at the bottom of a whitening chamber 11 are uniformly flowed throughout the whitening chamber 11, and the grinding action of a grinding whitening trochanter 10 is efficiently and evenly applied.
研削精白転子10によって麦粒表皮部の剥離を行った後
、麦粒は研麦転子15の突起76によって攪拌されなか
ら噴用孔17からの噴風によって麦粒表面の付着顛が除
去される。こうして剥離された糠粉は、吸風ファン29
によって起用される前記気流によって除糠精白筒8から
除帥室28へ漏出し、集糠ホッパー27A、27Bから
ダクト30を経て、図外のサイクロンによって空気と分
離されて糠室等に収集される。After the skin of the wheat grain is peeled off by the grinding and whitening trochanter 10, the grains are not stirred by the protrusions 76 of the grinding trochanter 15, and the adhering particles on the surface of the wheat grain are removed by the blast from the injection hole 17. be done. The bran powder peeled off in this way is removed by the suction fan 29
Due to the air flow generated by the above, the rice bran leaks from the rice bran polishing cylinder 8 to the waste removal chamber 28, passes through the duct 30 from the rice bran collection hoppers 27A and 27B, is separated from the air by a cyclone (not shown), and is collected in the rice bran room, etc. .
研削式精麦機5△の排出口14から吐出した麦粒は、揚
穀16B及びシュートバイブ46Bを介して研削式精麦
1f15Bの供給ホッパー45に供給される。そして、
研削式v1麦機5△と同様に精白¥11内において麦粒
の表皮部がさらに剥離されるのであるが、研削式精麦1
5B〜5Dには水分添加装置31Bが付設してあり、超
音波ノズル40から噴射される湿風は主軸9の中空部を
経て主軸9に設けた通孔から流出し、さらに研削精白転
子10の噴風幅面59から精白室11内に噴出し、精白
室11内を流動する麦粒の表面に加水し、その表皮部が
湿潤軟化した時点ですぐに研削精白転子10によって前
記表皮部を剥離するので、水分が麦粒内質深層まで浸透
することがなく、容易に剥離された表皮部は糠粉として
添加水分と共に機外に排除される。研削式精麦115B
〜5Dにおいても、ヒーター39によって温湿風とした
場合は表皮部の湿潤軟化時間を短縮できる。Wheat grains discharged from the discharge port 14 of the grinding type wheat mill 5Δ are supplied to the supply hopper 45 of the grinding type wheat 1f15B via the fried grains 16B and the chute vibrator 46B. and,
Similar to the grinding type v1 barley machine 5△, the epidermis of the wheat grain is further peeled off in the milling process ¥11, but the grinding type barley machine 1
5B to 5D are equipped with a moisture adding device 31B, and the wet air jetted from the ultrasonic nozzle 40 flows out from the through hole provided in the main shaft 9 through the hollow part of the main shaft 9, and is further added to the grinding and refined trochanter 10. Water is ejected into the milling chamber 11 from the jet width surface 59, and water is added to the surface of the wheat grains flowing in the milling chamber 11. As soon as the surface of the wheat grains becomes moist and softened, the surface of the grain is immediately removed by the grinding milling trochanter 10. Since the wheat grain is peeled off, water does not penetrate deep into the inner layer of the wheat grain, and the easily peeled skin part is removed from the machine as bran powder along with the added water. Grinding type wheat 115B
-5D as well, when the heater 39 generates warm and humid air, the time for moistening and softening the epidermis can be shortened.
このようにして、研削式精11’5Dまでを通過した麦
粒は、その表皮部がほとんど除去された精白麦となる。In this way, the wheat grains that have passed through the grinding process 11'5D become polished wheat from which most of the skin has been removed.
上記実施例においては、精麦行程1を全て研削式精麦機
5A〜5Dによって構成したが、最終の研削式精麦機5
Dの後、あるいは研削式精、115Dに代えて、多孔壁
を有する除糠精白筒61の内部に中空状となした主軸6
2を回転自在に掛は渡すとともに(第4図参照)、主4
162には攪拌転子63及び螺旋転子64を固着して形
成した摩擦式精麦機65を配置する場合がある。摩擦式
精麦機65は、攪拌転子63の長手方向に攪拌突起63
aを形成するとともに前記攪拌突起63aに添って噴風
溝66を開口して攪拌転子63と除糠精白筒61との間
隙を精白ff76となし、中空状の主軸62の周面には
通孔67を多数設け、さらに主軸62の開口端部(他端
は閉口しである)には水分添加装置1ff31Bの超音
波ノズル40を臨ませである。また、供給部68にはエ
ヤーシリンダー69と連動するシャッター板70及び供
給ホッパー75が、排出部71には自動抵抗制御装置7
2に連結した抵抗板73がそれぞれ装着され、除a粘白
筒61の下方には集糠ホッパー74が設【プである。In the above embodiment, the wheat polishing process 1 was entirely composed of the grinding type wheat mills 5A to 5D, but the final grinding type wheat machine 5
After D, or in place of the grinding method 115D, a main shaft 6 made hollow inside a bran removal polishing cylinder 61 having a porous wall.
2 can be rotated freely (see Figure 4), and the main 4
At 162, a friction type wheat mill 65 formed by fixing a stirring rotor 63 and a spiral rotor 64 may be disposed. The friction type barley mill 65 has stirring protrusions 63 in the longitudinal direction of the stirring trochanter 63.
a, and a blowing groove 66 is opened along the stirring protrusion 63a to make the gap between the stirring trochanter 63 and the bran removal polishing cylinder 61 a polishing ff76, and the circumferential surface of the hollow main shaft 62 has a through hole. A large number of holes 67 are provided, and the ultrasonic nozzle 40 of the water addition device 1ff31B is exposed to the open end of the main shaft 62 (the other end is closed). Further, the supply section 68 includes a shutter plate 70 and a supply hopper 75 that operate in conjunction with the air cylinder 69, and the discharge section 71 includes an automatic resistance control device 7.
A resistive plate 73 connected to each of the two is installed, and a bran collecting hopper 74 is installed below the atomizer cylinder 61.
この場合は、研削式m麦R5A 、 5 B・・・によ
って表皮部がほぼ除去された麦粒が供給ホッパー75.
供給部68を経て流下し、螺旋転子64によって精白室
76に送られ、比較的低圧に調整した精白室76内にお
いて、攪拌突起63aによって攪拌されながら水分添加
部ff131Bからの湿風による水分添加を受iノ、粒
々摩擦作用によって麦粒表面の付着顛および残存麩部を
完全に払拭するものである。In this case, the wheat grains from which the epidermis has been almost completely removed by the grinding type wheat R5A, 5B, etc. are fed to the supply hopper 75.
It flows down through the supply section 68, is sent to the milling chamber 76 by the spiral trochanter 64, and in the milling chamber 76, which is adjusted to a relatively low pressure, water is added by wet air from the moisture addition section ff131B while being stirred by the stirring protrusion 63a. The grain-by-grain friction action completely wipes away the adhesion and remaining grains on the surface of the wheat grains.
〔発明の効果)
本発明によると、vi選された小麦は精麦の前工程にお
いて少量の水分で加水・調質され皮部のみが軟かくなる
。次に数機の研削式精麦様において搗精圧力の低い搗精
室内で徐々に皮部は取り除かれる。精麦された小麦は粒
溝のふすまだけを残し、挽砕工程に送られる。[Effects of the Invention] According to the present invention, vi-selected wheat is hydrated and tempered with a small amount of water in the pre-polishing process, so that only the skin part becomes soft. Next, in several grinding machines, the skin is gradually removed in the milling chamber where the milling pressure is low. The refined wheat is sent to the grinding process, leaving only the bran in the grain grooves.
つまり、一般の製粉工程のように皮部の残されたまま挽
砕工程に送られる小麦に比較し、粒溝のふすまだ()を
残した搗精麦は、ロール機においてロール機のロール間
隙は粉砕粒度の管理が主業務となり皮部の破砕開放のた
めのロール間隙の管理は不要となる。またロール機にお
いて発生する砕粒にふすまが付着することもなく無駄な
胚乳粒が発生することもない。よってふすまと共に機外
に排出される胚乳がなく歩留りの向上に多大の効果があ
る。In other words, compared to wheat that is sent to the grinding process with the skin remaining as in the general flour milling process, milled barley with the bran () in the grain grooves remaining is The main task is to control the grinding particle size, and there is no need to control the gap between the rolls for crushing and opening the skin. In addition, bran does not adhere to the crushed grains generated in the roll machine, and no wasteful endosperm grains are generated. Therefore, there is no endosperm that is discharged outside the machine together with the bran, which has a great effect on improving the yield.
第1図は本発明の精麦工程実施例の正面図、第2図は第
1図の一部拡大正面図、第3図は第2図の一部破断側面
図、第4図は別の実施例の一部拡大正面図である。
1・・・精麦行程、5A〜5D・・・研削式精麦様、6
A〜6D・・・揚穀機、7・・・別枠、8・・・除糠精
白筒、9・・・主軸、10・・・研削精白転子、11・
・・蹟白卒、12・・・供給口、13・・・螺旋転子、
14・・・排出口、15・・・研麦転子、16・・・突
起、17・・・噴風孔、18・・・通孔、19・・・送
風機、20・・・通風管、21・・・エヤーシリンダー
、22・・・シャッター板、23・・・抵抗板、24・
・・Vベルト、25・・・プーリー 26・・・麦粒有
無検出センサー 27.27△、27B・・・集糠ホッ
パー、28・・・除糠室、29・・・吸風ファン、30
・・・ダクト、31A、31B・・・水分添加装置、3
2・・・供給樋、33・・・攪拌螺旋、34・・・横送
樋、35・・・超音波ノズル、36・・・水分添加部、
37・・・配水管、38・・・水タンク、3つ・・・ヒ
ーター、40・・・超音波ノズル、41・・・配水管、
42・・・水タンク、43・・・エヤー管、44・・・
空気加圧機、45・・・供給ホッパー、46A〜46D
・・・シュートバイブ、50・・・調質タンク、51・
・・横送樋、53・・・シャッター板、54・・・エア
シリンダー、55・・・排出口、59・・・噴風輪溝、
60・・・空気取入部、61・・・除糠精白筒、62・
・・主軸、63・・・攪拌転子、64・・・螺旋転子、
65・・・摩擦式精麦機、66・・・噴用溝、67・・
・通孔、68・・・供給部、69・・・エヤーシリンダ
ー、70・・・シャッター板、71・・・排出部、72
・・・自動抵抗制御装置、73・・・抵抗板、74・・
・集糠ホッパー、75・・・供給ホッパー 76・・・
精白室。Fig. 1 is a front view of an embodiment of the wheat polishing process of the present invention, Fig. 2 is a partially enlarged front view of Fig. 1, Fig. 3 is a partially cutaway side view of Fig. 2, and Fig. 4 is a different embodiment. It is a partially enlarged front view of an example. 1... Refined barley process, 5A-5D... Grinding type barley, 6
A to 6D... Grain lifting machine, 7... Separate frame, 8... Bran removal polishing tube, 9... Main shaft, 10... Grinding and polishing trochanter, 11.
・・Silver white graduate, 12・・Supply port, 13・・Spiral trochanter,
14... Discharge port, 15... Grinding trochanter, 16... Protrusion, 17... Blower hole, 18... Ventilation hole, 19... Air blower, 20... Ventilation pipe, 21... Air cylinder, 22... Shutter plate, 23... Resistance plate, 24...
... V-belt, 25... Pulley 26... Wheat grain presence detection sensor 27.27△, 27B... Bran collecting hopper, 28... Bran removing room, 29... Air suction fan, 30
...Duct, 31A, 31B...Moisture addition device, 3
2... Supply gutter, 33... Stirring spiral, 34... Traverse gutter, 35... Ultrasonic nozzle, 36... Moisture addition section,
37... Water pipe, 38... Water tank, 3... Heater, 40... Ultrasonic nozzle, 41... Water pipe,
42...Water tank, 43...Air pipe, 44...
Air pressurizer, 45... Supply hopper, 46A to 46D
... Shoot vibe, 50... Conditioning tank, 51.
... Horizontal gutter, 53 ... Shutter plate, 54 ... Air cylinder, 55 ... Discharge port, 59 ... Blower ring groove,
60... Air intake part, 61... Bran removal polishing cylinder, 62...
...Main shaft, 63... Stirring trochanter, 64... Spiral trochanter,
65... Friction type barley mill, 66... Spraying groove, 67...
・Through hole, 68... Supply section, 69... Air cylinder, 70... Shutter plate, 71... Discharge section, 72
...Automatic resistance control device, 73...Resistance plate, 74...
- Bran hopper, 75... Supply hopper 76...
Semen room.
Claims (2)
加水した後5分以上30分以内の調質工程を加え、その
後前記麦粒を研削式精麦機で搗精することを特徴とする
麦粒の加水精麦方法。(1) After adding water of 0.5% to 4% by weight of the wheat grains to the wheat grains, a tempering process is applied for 5 minutes to 30 minutes, and then the wheat grains are polished using a grinding type wheat mill. A method for hydrating and refining barley grains.
加水する加水装置と、加水した麦粒を5分以上30分以
内の調質を行う調質貯留装置および調質後精麦を行う研
削式精麦機とを備えたことを特徴とする麦粒の加水精麦
装置。(2) A water adding device that adds 0.5% to 4% water by weight of the wheat grain to wheat grains, a tempering storage device that tempers the watered wheat grains for 5 minutes to 30 minutes, and A hydrating barley milling device for wheat grains, characterized in that it is equipped with a grinding-type milling machine for milling barley after quality.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32236488A JPH02169045A (en) | 1988-12-20 | 1988-12-20 | Method and device for moistening and milling barley grains |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP32236488A JPH02169045A (en) | 1988-12-20 | 1988-12-20 | Method and device for moistening and milling barley grains |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02169045A true JPH02169045A (en) | 1990-06-29 |
Family
ID=18142819
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP32236488A Pending JPH02169045A (en) | 1988-12-20 | 1988-12-20 | Method and device for moistening and milling barley grains |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02169045A (en) |
Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63171647A (en) * | 1987-01-10 | 1988-07-15 | 株式会社 サタケ | Method of milling wheat |
JPS63178852A (en) * | 1987-01-17 | 1988-07-22 | 株式会社 サタケ | Wheat milling apparatus |
JPS63185458A (en) * | 1987-01-26 | 1988-08-01 | 株式会社 サタケ | Wheat refining method and apparatus |
JPS63190656A (en) * | 1987-02-03 | 1988-08-08 | 株式会社 サタケ | Wheat milling apparatus |
JPS63190657A (en) * | 1987-01-29 | 1988-08-08 | 株式会社 サタケ | Wheat milling apparatus |
-
1988
- 1988-12-20 JP JP32236488A patent/JPH02169045A/en active Pending
Patent Citations (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS63171647A (en) * | 1987-01-10 | 1988-07-15 | 株式会社 サタケ | Method of milling wheat |
JPS63178852A (en) * | 1987-01-17 | 1988-07-22 | 株式会社 サタケ | Wheat milling apparatus |
JPS63185458A (en) * | 1987-01-26 | 1988-08-01 | 株式会社 サタケ | Wheat refining method and apparatus |
JPS63190657A (en) * | 1987-01-29 | 1988-08-08 | 株式会社 サタケ | Wheat milling apparatus |
JPS63190656A (en) * | 1987-02-03 | 1988-08-08 | 株式会社 サタケ | Wheat milling apparatus |
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