JPH0216704U - - Google Patents
Info
- Publication number
- JPH0216704U JPH0216704U JP9609488U JP9609488U JPH0216704U JP H0216704 U JPH0216704 U JP H0216704U JP 9609488 U JP9609488 U JP 9609488U JP 9609488 U JP9609488 U JP 9609488U JP H0216704 U JPH0216704 U JP H0216704U
- Authority
- JP
- Japan
- Prior art keywords
- adhesive tape
- electronic components
- adhesive
- mount
- sequentially
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000002390 adhesive tape Substances 0.000 claims description 3
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 238000007789 sealing Methods 0.000 claims 1
- 238000002788 crimping Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Packaging Frangible Articles (AREA)
- Packages (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
第１図は本考案の実施例１を示す斜視図、第２
図は本考案による実施例１の詳細図、第３図ａに
本考案による実施例２を示す斜視図、第３図ｂは
同平面図、第４図は従来の実施例を示す斜視図、
第５図は従来例の動作を示す詳細図である。
１…電子部品、２…台紙、３…粘着テープ、４
…圧着ブロツク、５〜８…バネ、９…圧着ローラ
、１０…リード。
Fig. 1 is a perspective view showing the first embodiment of the present invention; Fig. 2 is a perspective view showing the first embodiment of the present invention;
The figure is a detailed view of the first embodiment according to the present invention, FIG. 3a is a perspective view showing the second embodiment according to the present invention, FIG. 3b is a plan view of the same, and FIG. 4 is a perspective view showing the conventional embodiment.
FIG. 5 is a detailed diagram showing the operation of the conventional example. 1... Electronic parts, 2... Mounting paper, 3... Adhesive tape, 4
...Crimping block, 5-8...Spring, 9...Crimping roller, 10...Lead.
Claims (1)
ける電子部品テーピング装置において、電子部品
の接着部間の粘着テープを順次個別に押しつける
圧着ブロツクを有することを特徴とする電子部品
テーピング装置用ヒートシールユニツト。 A heat-sealing unit for an electronic component taping device for pasting electronic components, etc. onto a mount using adhesive tape, characterized by having a pressure bonding block that sequentially and individually presses the adhesive tape between the adhesive parts of the electronic components. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609488U JPH0216704U (en) | 1988-07-20 | 1988-07-20 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9609488U JPH0216704U (en) | 1988-07-20 | 1988-07-20 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0216704U true JPH0216704U (en) | 1990-02-02 |
Family
ID=31320902
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9609488U Pending JPH0216704U (en) | 1988-07-20 | 1988-07-20 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0216704U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06286715A (en) * | 1993-03-30 | 1994-10-11 | Rohm Co Ltd | Method and device for forming carrier tape |
-
1988
- 1988-07-20 JP JP9609488U patent/JPH0216704U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH06286715A (en) * | 1993-03-30 | 1994-10-11 | Rohm Co Ltd | Method and device for forming carrier tape |
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