JPH0215976A - Thin plate rotary tool with diamond film - Google Patents

Abstract

PURPOSE:To be able to obtain a rotary grindstone tool for fine processing which has a high density continuous cutting edge and high rigidity in spite of being thin by coatingly forming a diamond film on a thin plate material by a gaseous phase composite method. CONSTITUTION:On the surface of a core material 1 of thin ceramics or the like, diamond 2 is coatingly formed by a gaseous phase composite method. As a result, a tool surface on which single crystal diamond particles are densely distributed can be made, and apparent abrasive grain space in a grindstone with this cutting edge is made to be approximately the size of a diamond crystal grain (mum). Further, its Young's modulus can be 5-7X10<6>kg/cm<2>t, and the rigidity of the grindstone can be enhanced.

Description

[Detailed Description of the Invention] (Industrial Application Field) The present invention relates to a diamond-coated thin plate rotary tool for cutting hard and brittle materials such as glass, crystalline materials, and ceramics, and for forming narrow grooves. .

(Prior art) Conventionally, a diamond tool in which diamond abrasive grains are bonded with a metal, a glassy substance, or a resin material is rotated at high speed as a thin plate rotary tool for forming grooves, cutting, etc. in hard and brittle materials such as those mentioned above. The grinding process was then carried out.

When a bonded diamond tool is made by electrodeposition, the diameter of the abrasive grains is usually 10 μm or more, the arrangement interval is usually about 50 μm to 100 μm, and the thickness of the tool disk is 50 μm. That was it.

In addition, the diameter of the abrasive grains for diamond whetstones made using the firing method is 2μ.
It can be made as small as 20μm to 4μm, and the distance between them is 20μm.
There was one that could be set to ~30 μm.

(Problem to be Solved by the Invention) When manufacturing parts with a predetermined function by processing conventional crystalline materials, glassy or ceramic sintered bodies, etc., the above-mentioned parts are gradually required to have high performance and be miniaturized, and the size of the parts is several μm. It has become necessary to improve the processing accuracy of the unit and to ensure that there are no scratches on the machined part. However, these materials are highly hard and brittle, so they are prone to cracking, chipping, and other chipping. This not only degraded the functionality of the parts but also hindered improvements in machining accuracy. In addition, with conventional technology, it is impossible to form fine grooves of 50 μm or less with a grinding wheel using the electrodeposition method, and unavoidable lumps of abrasive grains may be formed during grinding wheel creation using the firing method, which may damage the machined surface. There were times when large chips remained. Therefore, in order to maintain a high-precision machined surface, it is necessary to reduce the machining resistance by making the grinding wheel into thin pieces and improve the processing ability of the grindstone. In addition, the distance at which the diamond abrasive grains involved in processing are arranged in a straight line parallel to the feeding direction is approximately 100 μm to 20,011 m at the minimum, and the rigidity of the grinding wheel is determined by the Young's modulus of the binder. So 1.5
X 10'Kf/cIL", 0.7~I with quartz glass
X I Q'Kg/an", 0.1 to 0 for synthetic resin type
．． Since it was 2 x 10' K4/crIL2, it could not be sliced. In addition, to address the problem of low material strength due to the large spacing between the blades of grindstones, grindstones made by cutting ceramics such as S15Na and SiC into thin slices of 10 am or less have been proposed, and are suitable for cutting and making fine grooves in some materials such as quartz and 81. Although it has been shown to be effective for machining, there is a problem in that the machining efficiency is low for materials with high hardness.

The purpose of the present invention is to use a thin plate material such as ceramics, which has high rigidity even when it is made into flakes, as a core material, and to coat the surface with a film of crystalline diamond obtained by vapor phase synthesis, thereby creating continuous cuts with extremely high density. An object of the present invention is to provide a rotary grindstone tool for fine machining of hard and brittle materials, which has a thin but highly rigid blade.

(Means for Solving the Problems) In order to achieve the above object, the present invention provides a thin plate rotary tool with a diamond film coated with a diamond film formed by vapor phase synthesis on a thin plate material. It is also possible to use a multi-layered diamond film produced by the method and a thin film material alternately to make the diamond layer slightly protrude from the thin plate material to make the diamond film multi-bladed. This is a thin plate rotary tool with a composite diamond film.

(Function) The present invention configured as described above realizes an ideal tool with short abrasive grain spacing and high rigidity by forming diamonds on the surface of a thin window material such as ceramics by vapor phase synthesis. By vapor phase synthesis, it is possible to create a tool surface with single-crystal diamond particles densely distributed over the entire surface, and a grinding wheel that uses this as a cutting edge has an apparent abrasive grain spacing about the size of a diamond crystal grain (a few μm) and Young's modulus of 5 to 7 x 10' Kg/♂t and 3
~5 times or more, and has very excellent properties.

Assuming that the actual cutting amount per abrasive grain is g, the larger the value, the greater the machining resistance of the abrasive grains to the workpiece, and the greater the chipping caused by heavy cutting. Now, if the depth of cut of the grindstone is t, the interval between continuous cutting edges is a1, the circumferential speed of the grindstone is V, the feed speed of the grindstone is τ, and the diameter of the grindstone is D, then g=
In order to reduce chipping, it is necessary to make the continuous cutting edge interval a (interval between abrasive grains) extremely dense, which is expressed as 2aev/V·(t/D). Also, when the grinding wheel's processing resistance increases, it causes the rotating tool to run out, causing chipping.

This resistance is proportional to the thickness of the tool, so it is necessary to make the tool as thin as possible. Furthermore, tool runout is also related to rigidity, so it is necessary to have high rigidity. From the above, the present invention is ideal as a thin tool with high abrasive grain density and high rigidity.

(Example) Examples of the present invention will be described below with reference to the drawings, including the structure of a tool, the arrangement of cutting edges, and the machining results.

1) Tool structure Figure 1 is an external view of a thin plate rotary tool. FIG. 2 is a cross-sectional view of a tool made of a thin plate material whose entire surface is coated with diamond, and 1 is a thin plate material that is extremely thin and advantageously has high rigidity.

WCT SiC* 5tsN<or At203 etc. can be considered.

2 is a diamond film coated by vapor phase synthesis.

FIG. 3(a) is a cross-sectional view of a tool in which diamond is deposited on the outer periphery of a thin plate material. Although the rigidity is slightly lower, warping of the substrate due to diamond deposition can be easily avoided, and it is advantageous in terms of smoothness of the tool fixing part, reduction of machining resistance, and discharge of chips.

It is possible to form a diamond film partially in this way by masking the substrate during deposition. Similarly, by forming a film only on the inner periphery of a thin plate material, it is possible to form a diamond film only on the inner periphery. can also be formed. Fig. 3(b) is an example of a grinding wheel in which a diamond film is grown in the outer radial direction on the outer edge of a highly rigid thin plate material 1. After growing a diamond layer on the outer periphery of a pipe-shaped substrate material, it is sliced Both sides are polished to create a thin piece tool. Similarly, an inner peripheral grindstone can be formed by growing diamond A on the inner surface of a rib-shaped substrate material.

FIG. 4 shows a cross-section of the tool tip of a multi-blade tool (a cross-section of the outer periphery of the thin-plate rotary tool of FIG. 1) having a diamond layer as a blade formed by alternately laminating 5iJ4 and diamond A3. As shown in this figure, by cutting into the ceramic material after lamination, it is possible to wear out the Si layer, which is softer than the diamond layer, preferentially, or to make the diamond layer protrude by slightly chemically etching the tip. By doing so, an extremely thin multi-edged tool can be constructed with high rigidity.

2) Formation of cutting edge Figure 5 is a cross-sectional view of an ultra-thin composite film formed on a thin plate. First, island-shaped crystalline diamonds are formed by vapor phase synthesis, and then amorphous diamond is added between them. By filling it, an extremely thin composite film can be formed and the rigidity of the tool itself can be increased.

Figure 6(a) is a front view of the cutting method of a crystalline diamond tool formed by vapor phase synthesis.
It can also be made into a continuous surface like this. Furthermore, crystals can be formed into various sizes depending on the growth conditions, and the orientation of the crystals can also be controlled.

FIG. 7 shows a tool using amorphous diamond as a bonding agent. This makes it possible to increase the rigidity.

FIGS. 8(a) and (b) are explanatory diagrams showing the method for forming a composite film, in which: ■ Forming crystalline diamond ■ Forming amorphous diamond on crystalline diamond ■ Dressing the upper surface to make it softer than crystal The amorphous layer is preferentially removed to form a composite film in the desired shape. In this case, the cutting edge of the crystalline diamond can be made to protrude slightly, and a smooth chip pocket is formed, making it easier for cutting waste generated during machining to be removed and reducing impact with the workpiece.

3) Ceramic material A with high processing characteristics, hardness and rigidity
t203. As a result of machining using a conventionally used SiC tool with a width of 35 mm to produce a narrow groove with a width of 4 ottm and a depth of 0.5 ott on TtC, both the machining ability and rigidity of the tool were superior to the above ceramic material. The tool was broken during machining because it was insufficient. When this was processed using a diamond tool according to the present invention, the processing was completed completely.

Furthermore, the results of similar processing on S%O glass were as follows.
Compared to the case of using a SiC tool, a smooth machined surface with fewer scratches and chips was obtained through more efficient work.

Figure 9 shows a perspective view of non-contact machining in which machining is performed while supplying machining fluid mixed with abrasive grains to a rotary tool. When using At203 diamond, the rotating tool itself wore out quickly and high machining accuracy could not be obtained.
By using diamond tools, these materials can be used as abrasive grains and processed with high precision and efficiency. By using these hard abrasive grains, it has become easy to apply this non-contact processing method to difficult-to-process materials such as lithium niobate or sintered bodies such as PLZT.

(Effects of the Invention) Since the present invention is configured as described above, it produces the effects described below.

It is possible to manufacture abrasive grains with a diameter of 1 μm, an arrangement interval of about 1 μm, and a tool thickness of about 10 μm to 20 μm, so the cutting edge spacing is small, the tool thickness is thin, and the tool is rigid. Moreover, this tool has optimal conditions for machining hard and brittle materials.

In addition, the spacing between the cutting edges, the shape of the cutting edges, and the hardness of the cutting edges can be controlled, making it possible to cut and groove crystals and ceramic materials with high efficiency without creating chips. be.

[Brief explanation of the drawing]

Figure 1 is an external perspective view of a thin plate rotary tool, Figure 2 is a sectional view of a tool in which the thin plate material is entirely coated with diamond, and Figure 3 (
,) is a cross-sectional view of a tool in which the outer periphery of a thin plate material is coated with diamond, Figure 3 (b) is a cross-sectional view of a tool in which a diamond film is formed on the outer edge, and Figure 4 is a cross-sectional view of the tip of a composite multi-blade tool. , Figure 5 is a cross-sectional view of the composite film formed on an ultra-thin plate, Figure 6 (,) is an explanatory diagram of the cutting edge on the tool surface, and Figure 6 (b) is a diagram of the cutting edge with a smoothed surface. An explanatory diagram, Fig. 7 is an explanatory diagram of a cutting edge using an amorphous material as a binding material, and Fig. 8 (,) and (b) show a cutting edge using a crystalline material and an amorphous material. FIG. 9 is a perspective view of a tool that performs non-contact processing using a rotary tool. l...Thin plate material, 2...Diamond, 3...Diamond layer, 4...Si layer, 5...Crystalline diamond, 6...Amorphous diamond, 7... Machining fluid supply nozzle, 8... Machining fluid mixed with abrasive grains, 9... Workpiece, lO... Tool. Figure 4 Figure 5 Figure 6 rl! J(0) Happy 6 Figure (b) wE7 Figure 3 (G) Figure 3 (b)

Claims (1)

[Scope of Claims] 1. A thin plate rotary tool with a diamond film, characterized in that a diamond film is coated on a thin plate material using a vapor phase synthesis method. 2. The tool according to claim 1, characterized in that a thin plate material and a vapor phase synthesized diamond film are alternately laminated in multiple layers, and a minute amount of the diamond layer protrudes from the thin plate material to provide multiple blades. 3. The tool according to claim 1, wherein the diamond film is polycrystalline or a composite of polycrystalline and amorphous.