JP2002127102A - Cutter - Google Patents
CutterInfo
- Publication number
- JP2002127102A JP2002127102A JP2000320176A JP2000320176A JP2002127102A JP 2002127102 A JP2002127102 A JP 2002127102A JP 2000320176 A JP2000320176 A JP 2000320176A JP 2000320176 A JP2000320176 A JP 2000320176A JP 2002127102 A JP2002127102 A JP 2002127102A
- Authority
- JP
- Japan
- Prior art keywords
- chips
- chip
- cutting
- cutter
- tips
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
Description
【0001】[0001]
【発明が属する技術分野】本発明は、主に木材や外装用
サイディングボードなどの建材、FRP(繊維強化プラ
スチックス)、大理石、カーボンなどの切断に用いられ
る切断カッターに関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a cutting cutter mainly used for cutting wood, building materials such as exterior siding boards, FRP (fiber reinforced plastics), marble, carbon and the like.
【0002】[0002]
【従来の技術】従来、この種の材料の切断には、超硬合
金のチップを用いたカッターが一般に使用されている。2. Description of the Related Art Conventionally, a cutter using a cemented carbide tip has been generally used for cutting this kind of material.
【0003】[0003]
【発明が解決しようとする課題】超硬合金のチップを用
いたカッターは、比較的軟質の材料の切断性能に優れて
いるが、硬質の材料の場合、チッピングが生じやすく、
またチップの摩耗により急激に切れ味が悪くなる。この
ため、焼結ダイヤモンドのチップ(以下、PCDチップ
と称する)を用いたカッターも使用されるが、刃先が欠
ける恐れがあり、刃先が欠けた場合超硬合金ほどではな
いにしても切れ味が悪くなり、刃先の寿命が短くなる問
題がある。A cutter using a cemented carbide tip is excellent in cutting performance of a relatively soft material, but in the case of a hard material, chipping easily occurs.
In addition, sharpness deteriorates sharply due to chip wear. For this reason, a cutter using a sintered diamond tip (hereinafter, referred to as a PCD tip) is also used, but there is a possibility that the cutting edge is chipped. And the life of the cutting edge is shortened.
【0004】また、PCDチップは加工性が悪く、コス
トが高くなるため、すべてのチップをPCDチップにせ
ず、一部のチップをPCDチップとし残りは超硬チップ
とするものも多い。PCDチップを比較的容易に加工す
るためには、例えば放電加工機を用いて行う場合がある
が、この方法では刃先を鋭利にすることはできず、被削
材の切り口が荒くなるという問題がある。[0004] Further, since PCD chips have poor workability and increase costs, many of the chips are not PCD chips, but some are PCD chips and the rest are carbide chips. In order to relatively easily process a PCD chip, for example, an electric discharge machine may be used. However, this method cannot sharpen the cutting edge, resulting in a problem that a cut edge of a work material becomes rough. is there.
【0005】さらに建材を切断する現場では、切断され
る材料が限定されず、様々な材料が同じカッターで切断
されることも多く、木材などに加えてトタンやブリキな
ども切断することがある。PCDチップの場合、これら
の材料を切断すると切刃が欠けてしまうという問題が生
じる。Further, at the site where building materials are cut, the material to be cut is not limited, and various materials are often cut by the same cutter. In addition to wood, tin and tin may be cut. In the case of a PCD chip, there is a problem that the cutting edge is chipped when these materials are cut.
【0006】これらの問題を解決するものとして、超砥
粒を電気メッキにより一層固着した電着砥石があり、例
えば実公平1−11414号公報に記載のものがある。
これは、鋼材などの研削には優れた効果を発揮するが、
切粉発生量の多い建材の切断に用いた場合、電着層によ
り砥粒の突出量が少ないこと及び砥粒間隔が狭いため、
目づまりが甚だしい上切断速度も遅く、実用的な切断作
業は困難であった。As a solution to these problems, there is an electrodeposition grindstone in which superabrasive grains are further fixed by electroplating, such as that described in Japanese Utility Model Publication No. 1-111414.
This is effective for grinding steel materials, etc.
When used for cutting building materials with a large amount of swarf, because the amount of protrusion of abrasive grains is small and the gap between abrasive grains is narrow due to the electrodeposition layer,
The cutting was severely clogged and the cutting speed was slow, making practical cutting work difficult.
【0007】また、電着に代え、超砥粒をろう材により
一層結合し、砥粒の突出量と結合力を増強したろう付け
砥石があり、例えば特公昭55−22194号公報に記
載のものがある。この砥石でサイディングボードを切断
した結果、電着砥石に比べて目づまりは減ったが、砥粒
間隔が狭いため切断速度が上がらず、実用上なお充分と
は言い難かった。There is also a brazing grindstone in which superabrasive grains are further bonded with a brazing material in place of electrodeposition to enhance the protruding amount and the bonding force of the abrasive grains, such as those described in Japanese Patent Publication No. 55-22194. There is. As a result of cutting the siding board with this grindstone, clogging was reduced as compared with the electrodeposited grindstone, but the cutting speed was not increased due to the narrow gap between the abrasive grains, and it was hardly sufficient for practical use.
【0008】[0008]
【課題を解決するための手段】本発明は以上のような問
題点を解決するものであり、その第一の特徴とするとこ
ろは、回転基板の外周縁に複数のチップが設けられた切
断カッターにおいて、前記チップは、ダイヤモンド粒子
と、WCを主体とする硬質相と、鉄系金属からなること
である。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and a first feature of the present invention is that a cutting cutter in which a plurality of chips are provided on an outer peripheral edge of a rotating substrate. In the above, the chip is made of diamond particles, a hard phase mainly composed of WC, and an iron-based metal.
【0009】また、上記に代わる特徴として、回転基板
の外周縁に複数のチップが設けられた切断カッターにお
いて、前記チップの一部のものは、ダイヤモンド粒子
と、WCを主体とする硬質相と、鉄系金属からなる結合
相金属を含む焼結体からなり、残りのチップはWCを主
体とする硬質相と、鉄系金属からなる結合相金属を含む
焼結体からなることである。[0009] Further, as a feature which is an alternative to the above, in a cutting cutter in which a plurality of chips are provided on the outer peripheral edge of a rotating substrate, some of the chips include diamond particles, a hard phase mainly composed of WC, and The remaining chip is made of a sintered body containing a binder phase metal made of an iron-based metal, and the remaining chips are made of a sintered body containing a binder phase metal made of an iron-based metal and a hard phase mainly composed of WC.
【0010】第二の特徴として、前記ダイヤモンド粒子
の含まれる割合は、体積比率で10〜50%としたこと
である。As a second feature, the content ratio of the diamond particles is 10 to 50% by volume.
【0011】第三の特徴として、前記焼結体は、前記回
転基板との接合部に近い領域ほど前記鉄系金属の割合が
高く、前記接合部から遠ざかるに従い前記WCの割合が
高くなることである。As a third feature, in the sintered body, the ratio of the iron-based metal is higher in a region closer to the joint with the rotating substrate, and the ratio of the WC increases as the distance from the joint increases. is there.
【0012】[0012]
【発明の実施の形態】本発明の切断カッターは、金属製
の回転基板の外周縁に複数のチップが設けられている。
このチップはWCを主体とする硬質相がCoなどの結合
相により結合され、この中にダイヤモンド粒子が分散し
ている。すなわち、超硬合金のマトリックス中にダイヤ
モンド粒子が分散した焼結体からなるものである。BEST MODE FOR CARRYING OUT THE INVENTION In a cutting cutter according to the present invention, a plurality of chips are provided on an outer peripheral edge of a metal rotary substrate.
In this chip, a hard phase mainly composed of WC is bonded by a bonding phase such as Co, and diamond particles are dispersed therein. That is, it is made of a sintered body in which diamond particles are dispersed in a matrix of a cemented carbide.
【0013】チップにダイヤモンド粒子の分散した超硬
合金を使用することで、硬質材料などを切断する際に、
PCDのチップに比べチッピングが少なくなり、チップ
の摩耗も少なくなるので、良好な切味が長時間にわたっ
て持続される。By using a cemented carbide in which diamond particles are dispersed for a chip, when cutting a hard material or the like,
Since chipping is reduced and chip wear is reduced as compared with PCD chips, good sharpness is maintained for a long time.
【0014】また、ダイヤモンド粒子の分散した超硬合
金のチップは研削加工により仕上げられており、超硬合
金のチップと同様に鋭利な刃にすることができる。よっ
て切断した材料の切り口の精度が向上し、切断面の面粗
さも小さくなる。Further, the cemented carbide chip in which diamond particles are dispersed is finished by grinding, and a sharp blade can be formed like the cemented carbide chip. Therefore, the accuracy of the cut edge of the cut material is improved, and the surface roughness of the cut surface is also reduced.
【0015】PCDのチップと比較すると、よりじん性
が向上するので欠けにくくなり、すくい角を大きくする
ことができ、切味を向上させることができる。また、コ
ストも低減することができる。Compared with PCD chips, the toughness is further improved, so that chips are less likely to be chipped, the rake angle can be increased, and the sharpness can be improved. In addition, costs can be reduced.
【0016】ダイヤモンド粒子の含まれる割合について
は、耐摩耗性を向上させるために体積比率で10%以上
とし、じん性を確保するために50%以下とする。The content ratio of the diamond particles is set to 10% or more by volume in order to improve the wear resistance, and 50% or less in order to secure the toughness.
【0017】超硬合金の成分は全体にわたって均一であ
る必要はなく、ダイヤモンド粒子の分散量やWCとCo
の成分の比は場所により適宜異ならせることも出来る。
回転基板とチップの接合部においては、チップの成分は
Coの比率をより高めた方が、接合強度を向上させるこ
とが出来る。逆に刃先となる先端側では、WCの比率を
高くして耐摩耗性を向上させることが有効となる。[0017] The components of the cemented carbide need not be uniform over the whole, but the dispersion amount of diamond particles, WC and Co
The ratio of the components can be appropriately varied depending on the location.
At the junction between the rotating substrate and the chip, the chip strength can be improved by increasing the proportion of Co in the chip component. Conversely, on the tip side, which is the cutting edge, it is effective to increase the ratio of WC to improve wear resistance.
【0018】[0018]
【実施例】図1に本発明の切断カッターを示す。1はチ
ップ、2は基板、3はスリットである。回転基板2の直
径は100mm、厚みは1.2mmで、材質は工具鋼で
ある。1 shows a cutting cutter according to the present invention. 1 is a chip, 2 is a substrate, and 3 is a slit. The rotating substrate 2 has a diameter of 100 mm, a thickness of 1.2 mm, and is made of tool steel.
【0019】チップ1は、超硬合金の焼結体の中にダイ
ヤモンド粒子を体積比率で20%含んでいる。超硬合金
部分は、90重量%のWCと10重量%のCoからなる
焼結体であり、このチップ1のすくい面をラップ加工し
た後、逃げ面を研削により加工した。The tip 1 contains 20% by volume of diamond particles in a cemented carbide sintered body. The cemented carbide part is a sintered body composed of 90% by weight of WC and 10% by weight of Co. After the rake face of the chip 1 was lapped, the flank face was machined by grinding.
【0020】また比較のために、超硬合金からなるチッ
プ、及びPCDからなるチップも製作した。これらのす
くい面は、本発明のチップと同様にラップ加工し、その
後超硬合金のチップは逃げ面を研削により加工して刃付
けを行い、PCDのチップは逃げ面を放電加工により刃
付けを行った。For comparison, a chip made of cemented carbide and a chip made of PCD were also manufactured. These rake faces are lapped in the same manner as the inserts of the present invention, and then the cemented carbide tips are processed by grinding the flank by grinding, and the PCD tips are flared by the electrical discharge machining. went.
【0021】以上のようにして製作したチップの逃げ面
の表面粗さRzを測定すると、本発明のダイヤモンド粒
子を含む超硬合金のチップは0.6μmであったのに対
し、比較例の超硬合金のチップでは0.5μm、PCD
のチップでは4μmであった。逃げ面の表面粗さは、そ
のまま刃先の精度に影響するため、本発明のものは従来
の超硬合金とほぼ同等の刃先が得られ、PCDのチップ
に比べて切味の良い鋭利な刃先とすることができた。When the surface roughness Rz of the flank of the chip manufactured as described above was measured, the chip of the cemented carbide containing diamond particles of the present invention was 0.6 μm, while the chip of the comparative example was 0.6 μm. 0.5 μm for hard alloy chips, PCD
It was 4 μm for the chip. Since the surface roughness of the flank directly affects the accuracy of the cutting edge, the cutting edge of the present invention can obtain a cutting edge almost equivalent to that of a conventional cemented carbide, and has a sharper cutting edge which is sharper than a PCD chip. We were able to.
【0022】これらのチップを図1に示す形状の基板2
の外周部にろう付けし、切断カッターを製作して、サイ
ディングボードの切断を行った。この切断カッターのチ
ップ1は、15ヶ設けられており、本発明のカッター
は、すべてのチップがダイヤモンド粒子を含む超硬合金
のチップとした。比較例の切断カッターとして、すべて
のチップが超硬合金のチップを設けたものと、PCDの
チップ3ヶを等間隔にろう付けし、残りの部分には超硬
合金のチップを設けたものの2種類を製作し、切断を行
った。These chips are mounted on a substrate 2 having the shape shown in FIG.
Was brazed to the outer periphery, a cutting cutter was manufactured, and the siding board was cut. Fifteen chips 1 of the cutting cutter were provided, and all the chips of the cutter of the present invention were cemented carbide chips containing diamond particles. As the cutting cutter of the comparative example, one in which all the tips were provided with cemented carbide tips and the other in which three PCD tips were brazed at equal intervals and the remaining portion was provided with cemented carbide tips were used. Types were made and cut.
【0023】この結果、本発明のカッターでは、チップ
の欠けもなく、切断面も綺麗な面が得られたのに対し、
すべてのチップが超硬合金からなるカッターは、本発明
のカッターよりも摩耗が大きくなった。また、PCDの
チップを含むカッターについては、すべてのチップが超
硬合金のカッターよりは摩耗が少なかったものの、PC
Dチップの一部に欠けが見られ、切断面には多数の切削
痕が見られた。As a result, with the cutter of the present invention, a chip was not chipped and a clean cut surface was obtained.
The cutter in which all the chips were made of cemented carbide had higher wear than the cutter of the present invention. As for cutters containing PCD tips, although all the tips had less wear than cemented carbide cutters,
A chip was found in a part of the D chip, and many cut marks were found on the cut surface.
【0024】[0024]
【発明の効果】以上、説明したように、本発明のカッタ
ーは、チップを研削により加工でき、刃先の加工時には
PCDチップより欠けにくいので、刃先を高精度に加工
でき、従来の超硬チップと同等のシャープな刃先が得ら
れる。この結果、本発明のチップを使ったカッターで切
断すると切断面が綺麗になる。また、超硬合金のチップ
より摩耗が少なくなり、切断カッターの寿命が向上す
る。さらに、PCDチップよりもじん性が高く欠けにく
いので、切断加工時のチッピングも少なくなり、チップ
の寿命が向上するとともに切断面が綺麗になるという効
果が得られる。As described above, the cutter of the present invention can machine the tip by grinding and is less likely to chip than the PCD tip when machining the cutting edge, so that the cutting edge can be machined with high precision and the conventional carbide tip can be machined. An equivalent sharp edge can be obtained. As a result, when cut with a cutter using the chip of the present invention, the cut surface becomes clean. In addition, wear is less than that of cemented carbide tips, and the life of the cutting cutter is improved. Further, since the toughness is higher than that of the PCD chip and the chip is less likely to be chipped, chipping at the time of cutting is reduced, and the life of the chip is improved and the cut surface is made clean.
【図1】本発明の切断カッターを示した説明図である。FIG. 1 is an explanatory view showing a cutting cutter of the present invention.
1 チップ 2 基板 3 スリット 1 chip 2 substrate 3 slit
───────────────────────────────────────────────────── フロントページの続き (72)発明者 大西 峰夫 大阪府堺市鳳北町2丁80番地 大阪ダイヤ モンド工業株式会社内 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Mineo Onishi 2-80, Hokita-cho, Sakai-shi, Osaka Inside Osaka Diamond Industry Co., Ltd.
Claims (4)
られた切断カッターにおいて、 前記チップは、ダイヤモンド粒子と、WCを主体とする
硬質相と、鉄系金属からなる結合相金属を含む焼結体か
らなることを特徴とする切断カッター。1. A cutting cutter in which a plurality of chips are provided on an outer peripheral edge of a rotary substrate, wherein the chips include diamond particles, a hard phase mainly composed of WC, and a binder phase metal composed of an iron-based metal. A cutting cutter characterized by being formed of a unity.
られた切断カッターにおいて、 前記チップの一部のものは、ダイヤモンド粒子と、WC
を主体とする硬質相と、鉄系金属からなる結合相金属を
含む焼結体からなり、残りのチップはWCを主体とする
硬質相と、鉄系金属からなる結合相金属を含む焼結体か
らなることを特徴とする切断カッター。2. A cutting cutter in which a plurality of chips are provided on an outer peripheral edge of a rotating substrate, wherein a part of the chips includes diamond particles and WC.
And a sintered body including a hard phase mainly composed of WC and a binder phase metal composed of an iron-based metal, and the remaining chips are a sintered body containing a hard phase mainly composed of WC and a binder phase metal composed of an iron-based metal. A cutting cutter comprising:
は、体積比率で10〜50%であることを特徴とする請
求項1又は2記載の切断カッター。3. The cutting cutter according to claim 1, wherein the content of the diamond particles is 10 to 50% by volume.
に近い領域ほど前記鉄系金属の割合が高く、前記接合部
から遠ざかるに従い前記WCの割合が高くなることを特
徴とする請求項1、2又は3記載の切断カッター。4. The sintered body according to claim 1, wherein the ratio of the iron-based metal is higher in a region closer to the joint with the rotating substrate, and the ratio of the WC is higher as the sintered body is farther from the joint. Item 6. The cutting cutter according to item 1, 2 or 3.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000320176A JP2002127102A (en) | 2000-10-20 | 2000-10-20 | Cutter |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2000320176A JP2002127102A (en) | 2000-10-20 | 2000-10-20 | Cutter |
Publications (1)
Publication Number | Publication Date |
---|---|
JP2002127102A true JP2002127102A (en) | 2002-05-08 |
Family
ID=18798497
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2000320176A Pending JP2002127102A (en) | 2000-10-20 | 2000-10-20 | Cutter |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP2002127102A (en) |
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010142947A (en) * | 2008-12-18 | 2010-07-01 | Sandvik Intellectual Property Ab | Rotary cutter knife |
JP2017052020A (en) * | 2015-09-07 | 2017-03-16 | 株式会社チップトン | Grinding device for siding board |
KR101809877B1 (en) * | 2017-11-06 | 2017-12-18 | 이주왕 | Antibiosis filler composition for artificial lawn containing loess |
WO2018103205A1 (en) * | 2016-12-05 | 2018-06-14 | 江苏友和工具有限公司 | Diamond woodworking saw blade having welded single crystals |
-
2000
- 2000-10-20 JP JP2000320176A patent/JP2002127102A/en active Pending
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2010142947A (en) * | 2008-12-18 | 2010-07-01 | Sandvik Intellectual Property Ab | Rotary cutter knife |
JP2017052020A (en) * | 2015-09-07 | 2017-03-16 | 株式会社チップトン | Grinding device for siding board |
WO2018103205A1 (en) * | 2016-12-05 | 2018-06-14 | 江苏友和工具有限公司 | Diamond woodworking saw blade having welded single crystals |
KR101809877B1 (en) * | 2017-11-06 | 2017-12-18 | 이주왕 | Antibiosis filler composition for artificial lawn containing loess |
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