JPH0215864B2 - - Google Patents

Info

Publication number
JPH0215864B2
JPH0215864B2 JP58218207A JP21820783A JPH0215864B2 JP H0215864 B2 JPH0215864 B2 JP H0215864B2 JP 58218207 A JP58218207 A JP 58218207A JP 21820783 A JP21820783 A JP 21820783A JP H0215864 B2 JPH0215864 B2 JP H0215864B2
Authority
JP
Japan
Prior art keywords
group
general formula
polysiloxane
heat
ladder
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP58218207A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60108840A (ja
Inventor
Hiroshi Adachi
Osamu Hayashi
Kazuo Okabashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58218207A priority Critical patent/JPS60108840A/ja
Publication of JPS60108840A publication Critical patent/JPS60108840A/ja
Publication of JPH0215864B2 publication Critical patent/JPH0215864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004—Photosensitive materials
    • G03F7/075—Silicon-containing compounds
    • G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
JP58218207A 1983-11-18 1983-11-18 感光性耐熱材料 Granted JPS60108840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58218207A JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218207A JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Publications (2)

Publication Number Publication Date
JPS60108840A JPS60108840A (ja) 1985-06-14
JPH0215864B2 true JPH0215864B2 (cs) 1990-04-13

Family

ID=16716295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218207A Granted JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Country Status (1)

Country Link
JP (1) JPS60108840A (cs)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0549253U (ja) * 1991-11-29 1993-06-29 三菱マテリアル株式会社 半導体ウェーハの研磨機

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0549253U (ja) * 1991-11-29 1993-06-29 三菱マテリアル株式会社 半導体ウェーハの研磨機

Also Published As

Publication number Publication date
JPS60108840A (ja) 1985-06-14

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