JPH0215800U - - Google Patents
Info
- Publication number
- JPH0215800U JPH0215800U JP9389988U JP9389988U JPH0215800U JP H0215800 U JPH0215800 U JP H0215800U JP 9389988 U JP9389988 U JP 9389988U JP 9389988 U JP9389988 U JP 9389988U JP H0215800 U JPH0215800 U JP H0215800U
- Authority
- JP
- Japan
- Prior art keywords
- leaf spring
- spring holder
- leaf
- holds
- leaf springs
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000010586 diagram Methods 0.000 description 1
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389988U JPH0215800U (hr) | 1988-07-14 | 1988-07-14 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9389988U JPH0215800U (hr) | 1988-07-14 | 1988-07-14 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0215800U true JPH0215800U (hr) | 1990-01-31 |
Family
ID=31318378
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9389988U Pending JPH0215800U (hr) | 1988-07-14 | 1988-07-14 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0215800U (hr) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07276281A (ja) * | 1994-04-13 | 1995-10-24 | Sumitomo Metal Mining Co Ltd | 脆弱物のハンドリング装置 |
| JP2013008789A (ja) * | 2011-06-23 | 2013-01-10 | Fujitsu Ltd | 表面実装型部品の取り外し方法、表面実装型部品取り外し装置及び半導体パッケージの製造方法 |
-
1988
- 1988-07-14 JP JP9389988U patent/JPH0215800U/ja active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07276281A (ja) * | 1994-04-13 | 1995-10-24 | Sumitomo Metal Mining Co Ltd | 脆弱物のハンドリング装置 |
| JP2013008789A (ja) * | 2011-06-23 | 2013-01-10 | Fujitsu Ltd | 表面実装型部品の取り外し方法、表面実装型部品取り外し装置及び半導体パッケージの製造方法 |