JPH02156658A - 熱伝導モジユール - Google Patents

熱伝導モジユール

Info

Publication number
JPH02156658A
JPH02156658A JP1271893A JP27189389A JPH02156658A JP H02156658 A JPH02156658 A JP H02156658A JP 1271893 A JP1271893 A JP 1271893A JP 27189389 A JP27189389 A JP 27189389A JP H02156658 A JPH02156658 A JP H02156658A
Authority
JP
Japan
Prior art keywords
piston
hat
cylindrical
tip
hole
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1271893A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0587183B2 (enExample
Inventor
Gary F Goth
グレイ・フランクリン・ゴス
Kevin P Moran
ケヴイン・パトリツク・モラン
Michael L Zumbrunnen
マイケル・リーン・ズンブルネン
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPH02156658A publication Critical patent/JPH02156658A/ja
Publication of JPH0587183B2 publication Critical patent/JPH0587183B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1271893A 1988-10-31 1989-10-20 熱伝導モジユール Granted JPH02156658A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US07/265,065 US5005638A (en) 1988-10-31 1988-10-31 Thermal conduction module with barrel shaped piston for improved heat transfer
US265065 1988-10-31

Publications (2)

Publication Number Publication Date
JPH02156658A true JPH02156658A (ja) 1990-06-15
JPH0587183B2 JPH0587183B2 (enExample) 1993-12-15

Family

ID=23008814

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1271893A Granted JPH02156658A (ja) 1988-10-31 1989-10-20 熱伝導モジユール

Country Status (4)

Country Link
US (1) US5005638A (enExample)
EP (1) EP0369115B1 (enExample)
JP (1) JPH02156658A (enExample)
DE (1) DE68921848T2 (enExample)

Families Citing this family (24)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5161089A (en) * 1990-06-04 1992-11-03 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels, and methods of manufacturing the same
US5170319A (en) * 1990-06-04 1992-12-08 International Business Machines Corporation Enhanced multichip module cooling with thermally optimized pistons and closely coupled convective cooling channels
DE69117891T2 (de) * 1990-11-20 1996-07-25 Sumitomo Electric Industries Verfahren zum Montieren von Halbleiterelementen
EP0529837B1 (en) * 1991-08-26 1996-05-29 Sun Microsystems, Inc. Method and apparatus for cooling multi-chip modules using integral heatpipe technology
FR2685816A1 (fr) * 1991-12-30 1993-07-02 Bull Sa Systeme de refroidissement pour module "multi-puces".
JPH06349989A (ja) * 1992-12-21 1994-12-22 Internatl Business Mach Corp <Ibm> 熱伝達冷却装置
JPH0786471A (ja) * 1993-09-20 1995-03-31 Hitachi Ltd 半導体モジュ−ル
US5983997A (en) * 1996-10-17 1999-11-16 Brazonics, Inc. Cold plate having uniform pressure drop and uniform flow rate
US5965937A (en) * 1997-12-15 1999-10-12 Intel Corporation Thermal interface attach mechanism for electrical packages
WO2000041448A1 (fr) * 1998-12-30 2000-07-13 Acqiris Sa Module electronique comportant des elements de refroidissement de composants electroniques
US6651988B2 (en) 2000-12-27 2003-11-25 General Dynamics Advanced Information Systems, Inc. Compact actuator with hydraulic seal
US6879486B1 (en) 2002-02-14 2005-04-12 Mercury Computer Systems, Inc. Central inlet circuit board assembly
US6781831B1 (en) 2002-02-14 2004-08-24 Mercury Computer Systems, Inc. Card-cage with integrated control and shaping of flow resistance curve for multiple plenum chambers
US6683787B1 (en) * 2002-02-14 2004-01-27 Mercury Computer Systems, Inc. Circuit board assembly with integrated air plenum chamber using self-aligning heat sinks
US6690575B1 (en) 2002-02-14 2004-02-10 Mercury Computer Systems, Inc. Digital data processor chassis with flow balanced air intake into multiple circuit board assemblies
US6759588B1 (en) 2002-02-14 2004-07-06 Mercury Computer Systems, Inc. Circuit board assembly with a combination thermal, shock, vibration, and/or electromagnetic compatibility cover
US20050018402A1 (en) * 2003-07-21 2005-01-27 Oman Todd P. Thermally enhanced electronic module
US7164587B1 (en) * 2004-01-14 2007-01-16 Sun Microsystems, Inc. Integral heatsink grounding arrangement
US20060221571A1 (en) * 2005-03-30 2006-10-05 Oberlin Gary E Thermal conductor and use thereof
US7589971B2 (en) * 2006-10-10 2009-09-15 Deere & Company Reconfigurable heat sink assembly
US9313923B2 (en) 2014-05-07 2016-04-12 Lenovo Enterprise Solutions (Singapore) Pte. Ltd. Multi-component heatsink with self-adjusting pin fins
JP6981637B2 (ja) * 2017-02-06 2021-12-15 日本電気株式会社 熱伝導装置および電子部品
US10980151B2 (en) * 2018-07-31 2021-04-13 Hewlett Packard Enterprise Development Lp Flexible heat transfer mechanism configurations
US11769710B2 (en) * 2020-03-27 2023-09-26 Xilinx, Inc. Heterogeneous integration module comprising thermal management apparatus

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US423528A (en) * 1890-03-18 Registering toy savings bank or safe
CH440464A (de) * 1966-07-14 1967-07-31 Bbc Brown Boveri & Cie Kühlkörper für Halbleiterelemente
GB1598174A (en) * 1977-05-31 1981-09-16 Ibm Cooling electrical apparatus
US4235283A (en) * 1979-12-17 1980-11-25 International Business Machines Corporation Multi-stud thermal conduction module
US4462462A (en) * 1981-11-17 1984-07-31 International Business Machines Corporation Thermal conduction piston for semiconductor packages
US4639829A (en) * 1984-06-29 1987-01-27 International Business Machines Corporation Thermal conduction disc-chip cooling enhancement means
JPH063831B2 (ja) * 1987-04-08 1994-01-12 株式会社日立製作所 冷却装置及びそれを用いた半導体装置
US4765400A (en) * 1987-04-14 1988-08-23 International Business Machines Corp. Circuit module with pins conducting heat from floating plate contacting heat producing device

Also Published As

Publication number Publication date
EP0369115B1 (en) 1995-03-22
EP0369115A1 (en) 1990-05-23
US5005638A (en) 1991-04-09
DE68921848T2 (de) 1995-10-12
DE68921848D1 (de) 1995-04-27
JPH0587183B2 (enExample) 1993-12-15

Similar Documents

Publication Publication Date Title
JPH02156658A (ja) 熱伝導モジユール
US4765400A (en) Circuit module with pins conducting heat from floating plate contacting heat producing device
US4235283A (en) Multi-stud thermal conduction module
EP1607749B1 (en) Test probe assembly for IC chips
US4462462A (en) Thermal conduction piston for semiconductor packages
US7765693B2 (en) Electrically connecting two substrates using a resilient wire bundle captured in an aperture of an interposer by a retention member
US6278284B1 (en) Testing IC socket
US6695042B1 (en) Adjustable pedestal thermal interface
US6064573A (en) Method and apparatus for efficient conduction cooling of surface-mounted integrated circuits
US20030020179A1 (en) Methods and apparatus for aligning an integrated circuit package with an interface
JPH05190226A (ja) 電気コネクタ組立体
US20110159737A1 (en) Electrical connector capable of interconnecting electronic devices having different conductive leads arrangements
US6256202B1 (en) Integrated circuit intercoupling component with heat sink
US7064431B2 (en) Electronic assembly having select spacing of rows and columns of contacts to allow for routing of traces to the contacts
US8739392B2 (en) Cast grid array (CGA) package and socket
US7063542B2 (en) Compliant electrical probe device incorporating anisotropically conductive elastomer and flexible circuits
JP4309948B2 (ja) リードピン付き配線基板およびリードピン
US6625026B1 (en) Heat-activated self-aligning heat sink
TW202236752A (zh) 電氣連接結構
US6270357B1 (en) Mounting for high frequency device packages
KR200314140Y1 (ko) 다칩 프로브 프레임
US7140901B2 (en) BGA connector assembly
US9541577B2 (en) Current application device and manufacturing method of semiconductor element
JPH11214105A (ja) Ｉｃソケット
US7501314B2 (en) Heat sink and method for fabricating the same