JPH02156594A - Manufacture of printed wiring board - Google Patents
Manufacture of printed wiring boardInfo
- Publication number
- JPH02156594A JPH02156594A JP31093788A JP31093788A JPH02156594A JP H02156594 A JPH02156594 A JP H02156594A JP 31093788 A JP31093788 A JP 31093788A JP 31093788 A JP31093788 A JP 31093788A JP H02156594 A JPH02156594 A JP H02156594A
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- wiring board
- circuits
- circuit
- conductive ink
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 21
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 4
- 229910052802 copper Inorganic materials 0.000 claims abstract description 3
- 239000010949 copper Substances 0.000 claims abstract description 3
- 238000000034 method Methods 0.000 claims description 14
- 239000000758 substrate Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 abstract description 5
- 230000015572 biosynthetic process Effects 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000011253 protective coating Substances 0.000 description 1
- 230000001681 protective effect Effects 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
Description
【発明の詳細な説明】 ｉ粟上度机且光黙 本発明はプリント配線板の製造方法に関する。[Detailed description of the invention] i Awajo degree desk and light silence The present invention relates to a method for manufacturing a printed wiring board.
従来皇故逝
プリント配線板の製造方法において例えば実公昭５５−
２９２７６号に記載されるシールド層の被膜は絶縁層上
のほぼ全面被覆である。In the conventional manufacturing method of printed wiring boards, for example,
The coating of the shield layer described in No. 29276 is a substantially full coverage on the insulating layer.
プリント配線板の配線回路の設計上２回路の一部をワイ
ヤ及びジャンパー線で形成する必要が生ずる場合がある
。この回路は導線のはんだ付加工又はカーボンインキ又
は銀ペースト塗布によって形成する方法が実施されてい
るが何れの場合にも他の工程とは別個の工程によって行
うものである。Due to the design of the wiring circuit of a printed wiring board, it may be necessary to form part of two circuits using wires and jumper wires. This circuit is formed by soldering conductive wires or by applying carbon ink or silver paste, but in either case, it is performed in a separate process from other processes.
口 （”よ゛と る１−
本発明の目的は、従来別個の工程で行うワイヤ及びジャ
ンパー線の形成をプリント配線板の製造の固有の工程内
に組合せ、製造工程を短縮し、安価に製造可能としたプ
リント配線板の製造方法を提供するにある。1- It is an object of the present invention to combine the formation of wires and jumper wires, which have conventionally been performed in separate processes, into the unique process of manufacturing printed wiring boards, thereby shortening the manufacturing process and manufacturing at low cost. An object of the present invention is to provide a method for manufacturing a printed wiring board that makes it possible to manufacture a printed wiring board.
１・ ”° ・の
上述の目的を達するための本発明によるプリント配線板
の製造方法は、その製造工程における導電性インキによ
って形成するシールド層形成と同時にジャンパー回路等
の回路の一部を形成するものである。1. ``°・The method for manufacturing a printed wiring board according to the present invention to achieve the above-mentioned objective includes forming a part of a circuit such as a jumper circuit at the same time as forming a shield layer formed by conductive ink in the manufacturing process. It is something.
作ｌ−
本発明の上述の方法によって、プリント配線板製造の固
有の工程としての導電性インキによるシールド層形成と
同時にジャンパー回路等の回路を形成するため、従来の
別個のはんだ付等の工程が省することができるとともに
比較的長いジャンパー回路を正確に形成できるため回路
設計上の自由度が増し、プリント配線板の製造上に著し
く寄与する。Production I - By the above-described method of the present invention, circuits such as jumper circuits are formed simultaneously with the formation of a shield layer using conductive ink, which is an inherent process of printed wiring board manufacturing, so the conventional separate process such as soldering is replaced. Since the jumper circuit can be omitted and a relatively long jumper circuit can be formed accurately, the degree of freedom in circuit design increases, and this significantly contributes to the production of printed wiring boards.
裏施炭
本発明を例示とした実施例並びに図面について説明する
。Embodiments and drawings illustrating the present invention will be described.
図は本発明によるプリント配線板の一部を示し絶縁基板
ｌの片面又は両面に銅箔を被着した銅張積層板を使用し
て１周知の方法によってプリント配線回路２を形成する
０回路導体２上の所要範囲即ち部品取付用ランド２′及
び所要部分を残して絶縁インキをシルク印刷等によって
被着して絶縁層３を形成する。絶縁層３の全面又は一部
上に銅ペースト等の導電性インキを同様にシルク印刷等
によって被着してシールド層４を形成する。The figure shows a part of a printed wiring board according to the present invention. A printed wiring circuit 2 is formed by a well-known method using a copper-clad laminate in which copper foil is coated on one or both sides of an insulating substrate 1.0 Circuit conductor The insulating layer 3 is formed by applying insulating ink by silk printing or the like, leaving the required area on the top 2, that is, the component mounting land 2' and the required portion. A conductive ink such as copper paste is similarly deposited on the entire surface or part of the insulating layer 3 by silk printing or the like to form the shield layer 4.
しかして、前記シルク印刷によるシールド層４の形成と
同時に導電性インキによってジャンパー回ＩＢ５を形成
する。この場合のジャンパー回路５は所要の端子６間を
接続する。端子６が接地端子の場合は線ジャンパー回路
５の一方の端子はシールド層４と電気的に接続して形成
する。At the same time as the shield layer 4 is formed by silk printing, the jumper circuit IB5 is formed using conductive ink. The jumper circuit 5 in this case connects the required terminals 6. When the terminal 6 is a ground terminal, one terminal of the line jumper circuit 5 is formed to be electrically connected to the shield layer 4.
所要に応じて、シールド層４とジャンパー回路５の上に
絶縁インキのシルク印刷によって保護液ＩＩ！７を形成
する。If necessary, the protective liquid II! form 7.
光豆塁盈求
本発明によって、導電性インキによるシルク印刷でのシ
ールド層形成と同時に所要のジャンパー回路等の回路を
印刷形成したためプリント配線板の製造工程の中で手作
業によるはんだ付工程が省略でき、製造過程が著しく簡
単正確になる。According to the present invention, necessary jumper circuits and other circuits are printed at the same time as the shield layer is formed by silk printing using conductive ink, so the manual soldering process is omitted in the printed wiring board manufacturing process. This makes the manufacturing process much easier and more accurate.
第１図は本発明によるプリント配線板の製造方法を示す
平面図、第２図は第１図の一部の拡大断面図である。
１．６絶縁基板 ２０１回路導体 ３１．絶縁層４０．
シールド層 ５１．ジャンパー回路６１．端子 ７．、
保護被膜FIG. 1 is a plan view showing a method for manufacturing a printed wiring board according to the present invention, and FIG. 2 is an enlarged sectional view of a part of FIG. 1. 1.6 Insulating substrate 201 Circuit conductor 31. Insulating layer 40.
Shield layer 51. Jumper circuit 61. Terminal 7. ,
protective coating
Claims (2)
配線回路の少なくとも一部上に絶縁層を被覆し，絶縁層
の少なくとも一部上に銅ペースト等の導電性インキを被
着してシールド層を形成する場合に， 上記導電性インキによってシールド層の形成と同時にジ
ャンパー回路等の回路を形成することを特徴とするプリ
ント配線板の製造方法。1. A printed wiring circuit is formed on an insulating substrate, an insulating layer is coated on at least a portion of the printed wiring circuit, and a conductive ink such as copper paste is coated on at least a portion of the insulating layer to form a shield layer. A method for manufacturing a printed wiring board, characterized in that a circuit such as a jumper circuit is formed using the conductive ink at the same time as forming a shield layer.
ー回路等の回路とする特許請求の範囲第１項記載のプリ
ント配線板の製造方法。2. 2. The method of manufacturing a printed wiring board according to claim 1, wherein the circuit formed with the conductive ink is a circuit such as a jumper circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31093788A JPH02156594A (en) | 1988-12-08 | 1988-12-08 | Manufacture of printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31093788A JPH02156594A (en) | 1988-12-08 | 1988-12-08 | Manufacture of printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02156594A true JPH02156594A (en) | 1990-06-15 |
Family
ID=18011183
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31093788A Pending JPH02156594A (en) | 1988-12-08 | 1988-12-08 | Manufacture of printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02156594A (en) |
-
1988
- 1988-12-08 JP JP31093788A patent/JPH02156594A/en active Pending
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