JPH02155268A - Semiconductor integrated circuit - Google Patents

Semiconductor integrated circuit

Info

Publication number
JPH02155268A
JPH02155268A JP63310949A JP31094988A JPH02155268A JP H02155268 A JPH02155268 A JP H02155268A JP 63310949 A JP63310949 A JP 63310949A JP 31094988 A JP31094988 A JP 31094988A JP H02155268 A JPH02155268 A JP H02155268A
Authority
JP
Japan
Prior art keywords
ram
basic
cell group
cells
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63310949A
Other languages
Japanese (ja)
Inventor
Yoshihiro Mabuchi
義宏 間淵
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
NEC Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by NEC Corp filed Critical NEC Corp
Priority to JP63310949A priority Critical patent/JPH02155268A/en
Publication of JPH02155268A publication Critical patent/JPH02155268A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/02Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
    • H01L27/04Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body
    • H01L27/10Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being a semiconductor body including a plurality of individual components in a repetitive configuration
    • H01L27/118Masterslice integrated circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Semiconductor Integrated Circuits (AREA)
  • Design And Manufacture Of Integrated Circuits (AREA)
  • Semiconductor Memories (AREA)
  • Dram (AREA)

Abstract

PURPOSE:To improve integration density by incorporating a special functional cell group region in addition to a basic cell group in an inner functional cell region. CONSTITUTION:This circuit is a gate array type semiconductor integrated circuit having the following regions: peripheral buffer regions 2 which are aligned at the peripheral part of a semiconductor chip 1; and an inner cell region 3 which is surrounded with said peripheral buffer regions 2. The inner functional cell region 3 incorporates the following regions: a basic cell group region 4a wherein basic cells 4 are aligned in an array pattern; and a special cell group region 5 wherein functional cells for a RAM which are different from the basic cell 4 are aligned in order to form the RAM. The functional cells constituting the RAM can be realized in area less than 1/6 of the area of the basic cells 4. The integration density of the entire RAM is 1/6 X word number X bit number. Therefore, the more the word number and the bit number are increased, the larger the difference in integration densities between this RAM and a conventional device becomes.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 本発明は、ゲートアレー型の半導体集積回路のパターン
レイアウトに利用される。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention is utilized for pattern layout of a gate array type semiconductor integrated circuit.

本発明はゲートアレー型の半導体集積回路に関し、特に
、ROM (リード・オンリー・メモリ)、RAM (
ランダム・アクセス・メモリ)およびPLA(プログラ
マブル・ロジック・アレイ)等の特殊機能セルを含んだ
半導体集積回路に関する。
The present invention relates to gate array type semiconductor integrated circuits, and in particular to ROM (read only memory), RAM (
The present invention relates to semiconductor integrated circuits including special function cells such as random access memory (random access memory) and PLA (programmable logic array).

〔概要〕〔overview〕

本発明は、ゲートアレー型の半導体集積回路において、 論理回路を構成する基本セル群領域とは別に、ROMS
RAMおよびPLA等の特定の回路を構成する前記基本
セルとは異なる機能セルを配列した特殊機能セル群領域
を設けることにより、集積度の向上を図ったものである
The present invention provides that in a gate array type semiconductor integrated circuit, a ROMS is
The degree of integration is improved by providing a special functional cell group area in which functional cells different from the basic cells constituting specific circuits such as RAM and PLA are arranged.

〔従来の技術〕[Conventional technology]

従来、この種のゲートアレー型の半導体集積回路は、第
3図に示すように、ROM、RAMおよびPLA等の特
殊機能セルを論理回路を実現する基本セル4で構成して
いた。なお、第3図において、1は半導体チップ、2は
周辺バッファ領域、3は内部機能セル領域および4aは
基本セル群領域である。
Conventionally, this type of gate array type semiconductor integrated circuit, as shown in FIG. 3, has been constructed of basic cells 4 that implement special function cells such as ROM, RAM, and PLA to form logic circuits. In FIG. 3, 1 is a semiconductor chip, 2 is a peripheral buffer region, 3 is an internal functional cell region, and 4a is a basic cell group region.

〔発明が解決しようとする問題点〕[Problem that the invention seeks to solve]

前述した従来ゲートアレー型の半導体集積回路は、基本
セル4でROM、RAMおよびPLA等の特殊機能セル
を構成しているため、最適化されたRAM等に比べ、著
しく集積度が低下する欠点がある。
In the conventional gate array type semiconductor integrated circuit described above, the basic cell 4 constitutes special function cells such as ROM, RAM, and PLA, so it has the disadvantage that the degree of integration is significantly lower than that of optimized RAM, etc. be.

本発明の目的は、前記の欠点を除去することにより、集
積度の向上を図ったゲートアレー型の半導体集積回路を
提供することにある。
SUMMARY OF THE INVENTION An object of the present invention is to provide a gate array type semiconductor integrated circuit which improves the degree of integration by eliminating the above-mentioned drawbacks.

〔問題点を解決するための手段〕[Means for solving problems]

本発明は、半導体チップの周辺に配列された周辺バッフ
ァ領域と、この周辺バッファ領域に囲まれた内部機能セ
ル領域とを備えたゲートアレー型の半導体集積回路にお
いて、前記内部機能セル領域は、基本セルがアレイ状に
並べられた基本セル群領域と、少なくとも一つの特定さ
れた回路を構成するために前記基本セルとは異なる機能
セルが配列された特殊機能セル群領域とを含むことを特
徴とする。
The present invention provides a gate array type semiconductor integrated circuit comprising a peripheral buffer region arranged around the periphery of a semiconductor chip and an internal functional cell region surrounded by the peripheral buffer region, in which the internal functional cell region basically It is characterized by comprising a basic cell group area in which cells are arranged in an array, and a special functional cell group area in which functional cells different from the basic cells are arranged to constitute at least one specified circuit. do.

また、本発明は、前記基本セル群領域に、前記基本セル
の拡散領域の2以下の高さの配線領域を含むことができ
る。
Further, in the present invention, the basic cell group region may include a wiring region having a height equal to or less than two times the diffusion region of the basic cell.

〔作用〕[Effect]

特殊機能セル群領域では、例えば、RAMをそれに適切
な構成の機能セルを用いて構成する。
In the special function cell group area, for example, a RAM is configured using function cells with an appropriate configuration.

ところで、RAMを構成する機能セルの面積は前記基本
セルより極めて小さく、例えば1/6の大きさである。
Incidentally, the area of the functional cells constituting the RAM is extremely smaller than the basic cell, for example, 1/6 of the size.

従って、RAMを前記基本セルを用いて構成する場合に
比べて所要チップ面積は小さくて済み、集積度を向上さ
せることが可能となる。
Therefore, the required chip area is smaller than when the RAM is configured using the basic cells, and the degree of integration can be improved.

〔実施例〕〔Example〕

以下、本発明の実施例について図面を参照して説明する
Embodiments of the present invention will be described below with reference to the drawings.

第1図は本発明の第一実施例を示す模式的パターンレイ
アウト図である。
FIG. 1 is a schematic pattern layout diagram showing a first embodiment of the present invention.

本実−実施例は、半導体チップ1の周辺に配列された周
辺バッファ領域2と、この周辺バッファ領域2に囲まれ
た内部機能セル領域3とを備えたゲートアレー型の半導
体集積回路において、内部機能セル領域3は、基本セル
4がアレイ状に並べられた基本セル群領域4aと、RA
Mを構成するために基本セル4とは異なるRAM用の機
能セルが配列された特殊機能セル群領域5とを含んでい
る。
This embodiment is a gate array type semiconductor integrated circuit including a peripheral buffer region 2 arranged around the periphery of a semiconductor chip 1 and an internal functional cell region 3 surrounded by the peripheral buffer region 2. The functional cell area 3 includes a basic cell group area 4a in which basic cells 4 are arranged in an array, and an RA
In order to configure M, a special function cell group area 5 is included in which RAM function cells different from the basic cells 4 are arranged.

本発明の特徴は、第1図において、RAMを構成する特
殊機能セル群領域5を設けたことにある。
The feature of the present invention is that, in FIG. 1, a special function cell group area 5 constituting the RAM is provided.

本実−実施例においては、RAMを構成する機能セルは
、基本セル4の176以下の面積で実現でき、RAM全
体では1/6Xワード数Xビツト数の集積度となる。よ
って、ワード数、ビット数が増えれば増えるほど、従来
例との集積度の差が大きくなる。
In this embodiment, the functional cells constituting the RAM can be realized with an area less than 176 of the basic cell 4, and the RAM as a whole has a degree of integration of 1/6 x the number of words x the number of bits. Therefore, as the number of words and bits increases, the difference in degree of integration from the conventional example becomes larger.

第2図は本発明の第二実施例の要部を示すパターンレイ
アウト図で、内部機能セル領域を示す。
FIG. 2 is a pattern layout diagram showing the main part of a second embodiment of the present invention, and shows an internal functional cell area.

本第二実施例は、4個の特殊機能セル群領域5a〜5d
を内部機能セル領域3内に配置して、その間を基本セル
群領域4aが埋める構成としたちのである。ここで、特
殊機能セル群領域5a ’−5b s5Cおよび5dに
は、それぞれ構成される回路に適切な形状の機能セルを
用いて、ROM、、RAM。
The second embodiment has four special function cell group regions 5a to 5d.
are arranged in the internal functional cell area 3, and the basic cell group area 4a fills in the space between them. Here, the special function cell group areas 5a' to 5b s5C and 5d are provided with ROM, RAM, using function cells having shapes appropriate for the respective configured circuits.

PLAおよびハードマクロが構成される。PLA and hard macro are configured.

本発明の特徴は、第2図において、特殊機能セル群領域
5a〜5dを設けたことにある。
The feature of the present invention is that, in FIG. 2, special function cell group regions 5a to 5d are provided.

本第二実施例によると、通常ランダムロジックを一つの
矩形ブロックで構成する場合に比べ、集積度が格段に向
上し、チップ寸法が小さくなる。
According to the second embodiment, the degree of integration is significantly improved and the chip size is reduced compared to the case where the random logic is normally configured with one rectangular block.

なお、前記第一および第二実施例において、基本セル群
領域には、基本セル4の拡散領域の2以下の高さの配線
領域を含み、配線領域を大きくとることなく、効率的な
配線を行うことができる。
In the first and second embodiments, the basic cell group area includes a wiring area with a height less than or equal to the diffusion area of the basic cell 4, so that efficient wiring can be achieved without taking up a large wiring area. It can be carried out.

〔発明の効果〕〔Effect of the invention〕

以上説明したように11本発明は、内部機能セル領域内
に、基本セル群を領域とは別に特殊機能セル群領域を含
むことにより、集積度を向上できる効果がある。
As explained above, the present invention has the effect of improving the degree of integration by including a special function cell group area within the internal function cell area, separate from the basic cell group area.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の第一実施例を示す模式的パターンレイ
アウト図。 第2図は本発明の第二実施例の要部を示す模式的パター
ンレイアウト図。 第3図は従来例を示す模式的パターンレイアウト図。 1・・・半導体チップ、2・・・周辺バッファ領域、3
・・・内部機能セル領域、4・・・基本セル、4a・・
・基本セル群領域、5.5a〜5d・・・特殊機能セル
群領域。 代理人  弁理士 井 出 直 孝 第二実施例
FIG. 1 is a schematic pattern layout diagram showing a first embodiment of the present invention. FIG. 2 is a schematic pattern layout diagram showing the main parts of a second embodiment of the present invention. FIG. 3 is a schematic pattern layout diagram showing a conventional example. 1... Semiconductor chip, 2... Peripheral buffer area, 3
...Internal functional cell area, 4...Basic cell, 4a...
- Basic cell group area, 5.5a to 5d...Special function cell group area. Agent Patent Attorney Nao Takashi Ide Second Example

Claims (1)

【特許請求の範囲】 1、半導体チップの周辺に配列された周辺バッファ領域
と、この周辺バッファ領域に囲まれた内部機能セル領域
とを備えたゲートアレー型の半導体集積回路において、 前記内部機能セル領域は、基本セルがアレイ状に並べら
れた基本セル群領域と、少なくとも一つの特定された回
路を構成するために前記基本セルとは異なる機能セルが
配列された特殊機能セル群領域とを含む ことを特徴とする半導体集積回路。
[Scope of Claims] 1. In a gate array type semiconductor integrated circuit comprising a peripheral buffer region arranged around the periphery of a semiconductor chip and an internal functional cell region surrounded by the peripheral buffer region, the internal functional cell The area includes a basic cell group area in which basic cells are arranged in an array, and a special function cell group area in which functional cells different from the basic cells are arranged to configure at least one specified circuit. A semiconductor integrated circuit characterized by:
JP63310949A 1988-12-07 1988-12-07 Semiconductor integrated circuit Pending JPH02155268A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63310949A JPH02155268A (en) 1988-12-07 1988-12-07 Semiconductor integrated circuit

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63310949A JPH02155268A (en) 1988-12-07 1988-12-07 Semiconductor integrated circuit

Publications (1)

Publication Number Publication Date
JPH02155268A true JPH02155268A (en) 1990-06-14

Family

ID=18011333

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63310949A Pending JPH02155268A (en) 1988-12-07 1988-12-07 Semiconductor integrated circuit

Country Status (1)

Country Link
JP (1) JPH02155268A (en)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122649A (en) * 1984-07-02 1986-01-31 Fujitsu Ltd Gate array lsi device
JPS61107741A (en) * 1984-10-31 1986-05-26 Hitachi Ltd Semiconductor integrated circuit device
JPS61258465A (en) * 1985-05-13 1986-11-15 Seiko Epson Corp Single chip microcomputer
JPS62238642A (en) * 1986-04-09 1987-10-19 Hitachi Ltd Master slice type semiconductor integrated circuit device
JPS63114418A (en) * 1986-10-31 1988-05-19 Hitachi Ltd Semiconductor integrated circuit device

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6122649A (en) * 1984-07-02 1986-01-31 Fujitsu Ltd Gate array lsi device
JPS61107741A (en) * 1984-10-31 1986-05-26 Hitachi Ltd Semiconductor integrated circuit device
JPS61258465A (en) * 1985-05-13 1986-11-15 Seiko Epson Corp Single chip microcomputer
JPS62238642A (en) * 1986-04-09 1987-10-19 Hitachi Ltd Master slice type semiconductor integrated circuit device
JPS63114418A (en) * 1986-10-31 1988-05-19 Hitachi Ltd Semiconductor integrated circuit device

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